Intelligent temperature control and speed regulation device for key components of server and server
By designing an intelligent temperature control and speed control device in the server, monitoring and adjusting the fan speed in real time, the problem that traditional heat dissipation methods cannot effectively balance heat dissipation effects and energy consumption under complex load conditions is solved, and the server's stable operation and energy consumption optimization effect is achieved.
Patent Information
- Application Number
- CN202421838471.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2034-07-31
AI Technical Summary
Traditional server cooling methods are unable to handle complex and changeable load situations and cannot effectively balance the cooling effect and energy consumption, resulting in the server being overheated under high loads, causing hardware damage or performance degradation.
An intelligent temperature control and speed control device for key server components is designed, including BMC module, CPLD module, power consumption detection components, fan detection circuit and fan module. By monitoring CPU temperature, power consumption and fan speed in real time, and intelligently adjusting the fan speed according to preset conditions to achieve the best heat dissipation effect and energy consumption balance.
Effectively ensure that the temperature of key components of the server is within a normal working range, ensure the stable operation of the server, improve the stability and reliability of the system, and achieve energy conservation and emission reduction while ensuring the stable operation of the system.
Smart Images

Figure CN222813113U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of server temperature control, and in particular relates to an intelligent temperature control and speed regulation device for key components of a server and a server. Background Art
[0002] During the operation of the server, each electronic component inside the server consumes power and dissipates heat. For example, as the core processing unit, the power consumption and heat generation of the CPU often determine the cooling requirements of the entire server. Traditional cooling methods usually rely on fixed fan speeds or simple temperature response mechanisms, which are inadequate when dealing with complex and changing load conditions. On the one hand, if the fan speed is set too high, although it can effectively dissipate heat, it will increase unnecessary energy consumption and noise; on the other hand, if the fan speed is set too low, it may not be able to remove heat in time, causing the server to overheat.
[0003] As the integration of server hardware continues to increase, the power consumption and heat generation of key components such as CPUs and hard disks are also increasing, which puts higher requirements on the server's cooling system. Therefore, a more intelligent and efficient cooling control solution is needed that can dynamically adjust the fan speed according to the actual load and temperature conditions of the server to achieve the best balance between cooling effect and energy consumption.
[0004] As server processing power improves and power consumption increases, ensuring that the server can maintain a stable operating temperature under high load and preventing hardware damage or performance degradation due to overheating has become a technical problem that needs to be solved urgently. Utility Model Content
[0005] The utility model provides an intelligent temperature control and speed regulation device for key components of a server. The device effectively ensures that the temperature of the key components of the server is within a normal working range, thereby ensuring stable operation of the server.
[0006] The intelligent temperature control and speed regulation device of key server components includes: BMC module, CPLD module, power consumption detection component, fan detection circuit and fan module installed on CPU;
[0007] The BMC module obtains CPU temperature information by communicating with the PCH south bridge module;
[0008] The power consumption detection component detects the power consumption of the CPU and the hard disk;
[0009] The BMC module obtains the power consumption of the CPU and hard disk by connecting to the power consumption detection component;
[0010] The BMC module is connected to the fan module through a fan detection circuit to obtain the fan module speed information. The BMC module is also connected to the fan module through a CPLD module. According to the obtained CPU temperature information and CPU power consumption information, when the CPU temperature information is greater than a preset temperature threshold, the fan module speed is controlled to increase to a first speed.
[0011] Or, when the CPU power consumption information is greater than a preset power consumption threshold and the CPU temperature information is lower than a preset temperature threshold, the fan module speed is controlled to increase to a second speed.
[0012] It should be further explained that the power consumption detection component includes: a current acquisition module, a voltage detection module, an amplifier operational amplifier circuit, an AD conversion circuit, a single-chip microcomputer, and a serial port to network card module;
[0013] The single chip microcomputer obtains the current information and voltage information of the overall operation of the server through the current acquisition module and the voltage detection module in turn, and obtains the power consumption of the server based on the current information and voltage information;
[0014] The single-chip microcomputer communicates with the BMC module through the serial port to network card module and sends the power consumption of the server to the BMC module.
[0015] It should be further explained that the BMC module communicates with the hard disk and the PCIe external device respectively to obtain the power consumption of the hard disk and the PCIe external device, and obtains the CPU power consumption information based on the power consumption of the server as a whole, the power consumption of the hard disk, the power consumption of the PCIe external device and the power consumption of the fan module.
[0016] It should be further explained that a thermal diode is installed on the CPU, and the BMC module obtains the temperature information of the CPU by connecting to the thermal diode.
[0017] It should be further explained that it also includes: a timing module;
[0018] The BMC module communicates with the timing module to obtain the monitoring time period for the CPU temperature.
[0019] It should be further explained that it also includes: a PID control module;
[0020] The BMC module is also connected to the fan module through the CPLD module and the PID control module to control the speed of the fan module.
[0021] It should be further explained that it also includes: a power monitor, a detection resistor, a CRPS power module and a 12V to 3.3V conversion circuit;
[0022] The detection resistor is set on the power supply line between the CRPS power module and the server power module.
[0023] The BMC module is connected to the detection resistor through the power monitor to obtain the power supply voltage information;
[0024] The power monitor is connected to the BMC module and the CPLD module through a 12V to 3.3V conversion circuit to supply power to the BMC module and the CPLD module respectively.
[0025] It should be further explained that it also includes: a current monitoring chip; the current monitoring chip is connected to the CPU to detect the current information of the CPU;
[0026] The BMC module communicates with the current monitoring chip through the SPI interface to obtain the current information of the CPU, and then calculates the power consumption of the CPU in combination with the operating voltage value of the CPU.
[0027] It is further necessary to explain that the CPLD module is connected to the BMC module via an I2C interface;
[0028] The PID control module adopts MLC9000+ 1-32-channel PID temperature control module, or IDAQ-8098 multi-channel PID temperature control module, or C500-PID01 Omron PID temperature control module.
[0029] This embodiment also provides a server, including an intelligent temperature control and speed regulation device which is a key component of the server.
[0030] It can be seen from the above technical solutions that the utility model has the following advantages:
[0031] The intelligent temperature control and speed regulation device for key server components provided in the present application can effectively control the temperature inside the server by real-time monitoring of CPU temperature, power consumption and fan module speed, and intelligently adjust the fan speed according to preset conditions, thereby preventing hardware damage or performance degradation caused by overheating, thereby improving the stability and reliability of the entire system.
[0032] The intelligent temperature control and speed regulation device can flexibly adjust the fan speed according to the actual CPU temperature and power consumption while ensuring the stable operation of the system. When the CPU temperature and power consumption are low, unnecessary energy consumption can be reduced by reducing the fan speed, thereby achieving energy conservation and emission reduction. The BMC module of the present application can automatically collect and process various hardware status information, including CPU temperature, power consumption, and fan speed, etc., reducing the workload of operation and maintenance personnel. The CPLD module is used to accurately control the fan speed, making the adjustment of the fan speed smoother and more accurate, which can optimize the heat dissipation effect and energy consumption of the server.
[0033] The energy consumption monitoring of this application includes CPU, hard disk, PCIe external devices, etc., so that the device has good scalability and compatibility, and can adapt to server environments with different configurations and requirements. It can also obtain and process hardware status information in real time, and quickly respond and adjust according to preset conditions to improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS
[0034] In order to more clearly illustrate the technical solution of the utility model, the drawings required for use in the description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0035] Figure 1 This is a schematic diagram of the intelligent temperature control and speed regulation device for key components of the server;
[0036] Figure 2 This is a schematic diagram of an embodiment of an intelligent temperature control and speed regulation device for key components of a server. DETAILED DESCRIPTION
[0037] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical scheme of the utility model will be clearly and completely described below in combination with the drawings in the specific embodiment. Obviously, the embodiments described below are only part of the embodiments of the utility model, not all of them. Based on the embodiments in this patent, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this patent.
[0038] like Figure 1 As shown, the intelligent temperature control and speed regulation device for key components of a server provided in this embodiment includes: a BMC module, a CPLD module, a power consumption detection component, a fan detection circuit, and a fan module installed on the CPU.
[0039] Specifically, this embodiment mainly acquires the power consumption of key components in the server, monitors the power consumption of key components in real time, and adjusts the speed of the fan module based on the temperature information and power consumption information of the key components. In this way, by recording the power consumption and temperature information of the key components of the server, the corresponding fan module speed is matched, and the fan module speed can be automatically adjusted, effectively cooling the key components of the server and ensuring the stable operation of the server.
[0040] Key server components may include but are not limited to CPU, memory, hard disk, motherboard, network card, disk and fan.
[0041] This embodiment takes CPU temperature control as an example, and the BMC module obtains CPU temperature information by communicating with the PCH south bridge module.
[0042] Optionally, a thermal diode is installed on the CPU, and the BMC module obtains the temperature information of the CPU by connecting to the thermal diode. The BMC module can determine the current operating temperature information of the CPU based on the temperature detected by the PCH south bridge module (Platform Controller Hub, PCH) or the thermal diode, and adjust the fan module speed to cool the CPU.
[0043] The power consumption detection component of this embodiment can detect the power consumption of the entire server, the CPU power consumption and the hard disk power consumption.
[0044] Specifically, the power consumption detection components include: current acquisition module, voltage detection module, amplifier circuit, AD conversion circuit, single chip microcomputer and serial port to network card module.
[0045] The single chip microcomputer obtains the current information and voltage information of the overall operation of the server through the current acquisition module and the voltage detection module in turn, and obtains the power consumption of the whole server based on the current information and voltage information.
[0046] The current acquisition module and voltage detection module can detect the current information and voltage information of the server power input side respectively, and then the overall power consumption of the server can be obtained. The single-chip microcomputer communicates with the BMC module through the serial port to network card module and sends the power consumption of the server to the BMC module.
[0047] It should be noted that the memory power consumption of the server can be obtained. For example, taking a memory stick with a power consumption of 8 W as an example, the power consumption of 5 memory sticks can reach 40 W.
[0048] The BMC module reads the current information of the current monitoring chip CPU through the SPI interface, and then obtains the voltage value. Based on the read current and voltage values, the BMC module can calculate the power consumption of the CPU.
[0049] The BMC module obtains the CPU power consumption and the hard disk power consumption by connecting to the power consumption detection component. The hard disk power consumption can obtain the corresponding power consumption information based on the operating parameters of the hard disk.
[0050] The BMC module is connected to the fan module through the fan detection circuit to obtain the fan module speed information. The fan module speed information obtained here is real-time speed information. Of course, the fan module can run at a fixed speed when running.
[0051] The BMC module is also connected to the fan module through the CPLD module, and controls the fan module speed to increase to a first speed when the CPU temperature information is greater than a preset temperature threshold according to the acquired CPU temperature information and CPU power consumption information.
[0052] For this embodiment, the preset CPU temperature threshold is 75° C. to 85° C., and can be set to 75° C. according to actual work needs.
[0053] The BMC module can collect CPU temperature by communicating with the timing module to obtain the monitoring time period of the CPU temperature. For example, the BMC module monitors the change of CPU temperature, sets the CPU temperature threshold, and can pre-match different speeds of the fan module according to different CPU operating temperature ranges. The CPU temperature can be collected every t seconds and matched with the corresponding fan module speed.
[0054] The CPLD module uses I 2 The C interface is connected to the BMC module to process the fan speed control instructions. Optionally, a PID control module can also be configured. The BMC module is also connected to the fan module through the CPLD module and the PID control module to control the speed of the fan module. The PID control module implements closed-loop control of the fan module speed.
[0055] The PID control module can adopt MLC9000+ 1-32-channel PID temperature control module, IDAQ-8098 multi-channel PID temperature control module, C500-PID01 Omron PID temperature control module.
[0056] This embodiment also controls the fan module rotation speed in combination with the CPU power consumption information.
[0057] When the CPU is running, as the amount of data processed increases, the power consumption information also increases, and of course the operating temperature will also increase. When the BMC module determines that the CPU power consumption information is greater than the preset power consumption threshold and the CPU temperature information is lower than the preset temperature threshold, the fan module speed is controlled to increase to the second speed.
[0058] In this embodiment, the first speed and the second speed may be the same speed information, or different speeds may be set as needed.
[0059] As for the fan module speed of this embodiment, the fan module includes multiple fans; the output power of each fan is 3~20W, and the output air volume is 100~240 CFM / kW; the BMC module controls the air supply volume and speed of the fan according to the CPU temperature information and CPU power consumption.
[0060] For example, the BMC module sets the fan module speed based on the CPU temperature information. The real-time power consumption of the CPU is P, and the rated power consumption of the CPU is P. 额 The BMC module controls the air flow F of the fan module, which can be configured as F=AP 额 .
[0061] Where A is the air supply volume, which can be set to 90~180 CFM / kW.
[0062] The speed Z can be configured as Z=P / P 额 .
[0063] In this embodiment, the device further includes: a power monitor, a detection resistor, a CRPS power module, and a 12V to 3.3V voltage conversion circuit; the detection resistor is arranged on the power supply line between the CRPS power module and the server power module, and the BMC module is connected to the detection resistor through the power monitor to obtain power supply voltage information; the power monitor is connected to the BMC module and the CPLD module through the 12V to 3.3V voltage conversion circuit to supply power to the BMC module and the CPLD module respectively. In this way, the power supply requirements of the BMC module and the CPLD module can be met.
[0064] Based on the above-mentioned intelligent temperature control and speed regulation device, this embodiment also provides a server, and the server includes the intelligent temperature control and speed regulation device, which is a key component of the server.
[0065] In this embodiment, the key components of the server, such as the CPU status, can be automatically identified through the configuration file. The CPU can be stress-tested by calling different stress-testing tools. The CPU power consumption can be increased and the corresponding temperature changes can be achieved, and the fan speed can be adjusted.
[0066] Optionally, the BMC module can obtain the power consumption of key components in the server based on the raw command and store it. The fan speed of the server can be obtained. The power consumption of the components is monitored in real time, and the raw command is called cyclically to monitor the power consumption value of the key components in real time to determine whether the power consumption value reaches the stored power consumption value of the key components. Combined with the control of fan speed regulation, the temperature of the monitored key components can be adjusted. The intelligent pre-judgment speed regulation function of the key components can be automatically realized.
[0067] The techniques described in this embodiment may be implemented in hardware, software, firmware, or any combination thereof. The various features described as modules, units, or components may be implemented together in an integrated logic device or separately as discrete but interoperable logic devices or other hardware devices. In some cases, the various features of the electronic circuit may be implemented as one or more integrated circuit devices, such as an integrated circuit chip or chipset.
[0068] If implemented in hardware, the present invention relates to a device, such as a processor or an integrated circuit device, such as an integrated circuit chip or chipset. Alternatively or additionally, if implemented in software or firmware, the technology may be implemented at least in part by a computer-readable data storage medium, including instructions that, when executed, cause a processor to perform one or more of the above methods. For example, a computer-readable data storage medium may store instructions such as those executed by a processor.
[0069] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the utility model described here can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions.
[0070] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. An intelligent temperature control and speed regulation device for key components of a server, characterized in that: include: BMC module, CPLD module, power consumption detection component, fan detection circuit and fan module installed on CPU; The BMC module obtains CPU temperature information by communicating with the PCH south bridge module; The power consumption detection component detects the power consumption of the CPU and the hard disk; The BMC module obtains the power consumption of the CPU and hard disk by connecting to the power consumption detection component; The BMC module is connected to the fan module through a fan detection circuit to obtain the fan module speed information. The BMC module is also connected to the fan module through a CPLD module. According to the obtained CPU temperature information and CPU power consumption information, when the CPU temperature information is greater than a preset temperature threshold, the fan module speed is controlled to increase to a first speed. Or, when the CPU power consumption information is greater than a preset power consumption threshold and the CPU temperature information is lower than a preset temperature threshold, the fan module speed is controlled to increase to a second speed.
2. The intelligent temperature control and speed regulation device for key components of a server according to claim 1, characterized in that: The power consumption detection components include: current acquisition module, voltage detection module, amplifier circuit, AD conversion circuit, single chip microcomputer and serial port to network card module; The single chip microcomputer obtains the current information and voltage information of the overall operation of the server through the current acquisition module and the voltage detection module in turn, and obtains the power consumption of the server based on the current information and voltage information; The single-chip microcomputer communicates with the BMC module through the serial port to network card module and sends the power consumption of the server to the BMC module.
3. The intelligent temperature control and speed regulation device for key components of a server according to claim 2, characterized in that: The BMC module communicates with the hard disk and the PCIe external device respectively to obtain the power consumption of the hard disk and the PCIe external device, and obtains the CPU power consumption information based on the power consumption of the server as a whole, the power consumption of the hard disk, the power consumption of the PCIe external device, and the power consumption of the fan module.
4. The intelligent temperature control and speed regulation device for key components of a server according to claim 1, characterized in that: The CPU is equipped with a thermal diode, and the BMC module obtains the temperature information of the CPU by connecting to the thermal diode.
5. The intelligent temperature control and speed regulation device for key components of a server according to claim 1, characterized in that: Also includes: Timing module; The BMC module communicates with the timing module to obtain the monitoring time period for the CPU temperature.
6. The intelligent temperature control and speed regulation device for key components of a server according to claim 1, characterized in that: Also includes: PID control module; The BMC module is also connected to the fan module through the CPLD module and the PID control module to control the speed of the fan module.
7. The intelligent temperature control and speed regulation device for key components of a server according to claim 1, characterized in that: Also includes: Power monitor, detection resistor, CRPS power module and 12V to 3.3V conversion circuit; The detection resistor is set on the power supply line between the CRPS power module and the server power module. The BMC module is connected to the detection resistor through the power monitor to obtain the power supply voltage information; The power monitor is connected to the BMC module and the CPLD module through a 12V to 3.3V conversion circuit to supply power to the BMC module and the CPLD module respectively.
8. The intelligent temperature control and speed regulation device for key components of a server according to claim 1, characterized in that: Also includes: Current monitoring chip: The current monitoring chip is connected to the CPU to detect the current information of the CPU; The BMC module communicates with the current monitoring chip through the SPI interface to obtain the current information of the CPU, and then calculates the power consumption of the CPU in combination with the operating voltage value of the CPU.
9. The intelligent temperature control and speed regulation device for key components of a server according to claim 6, characterized in that: The CPLD module uses I 2 C interface is connected to the BMC module; The PID control module adopts MLC9000+ 1-32-channel PID temperature control module, or IDAQ-8098 multi-channel PID temperature control module, or C500-PID01 Omron PID temperature control module.
10. A server, characterized in that: It comprises the intelligent temperature control and speed regulation device for key components of a server as claimed in any one of claims 1 to 9.