PCB element program burning identification device

Abstract

The utility model discloses a PCB element program burning identification device which comprises a vertical support, side plates perpendicular to the vertical support are arranged on the two sides of the vertical support respectively, a guide block is arranged between the two side plates, protrusions are arranged on the two sides of the guide block respectively, inclined guide grooves are formed in the two side plates respectively, and the inclined guide grooves are arranged on the two sides of the guide block respectively. The protrusions located on the two sides of the guide block are installed in the inclined guide grooves of the two side plates respectively, and one end of each side plate is connected with one end of the corresponding inclined guide groove through an elastic piece. A driving part is arranged on the vertical bracket; a marking head is connected to the bottom of the guide block, a horizontal discharging port is formed in the bottom of the marking head, a material injection port is formed in the top of the guide block, and a communicating cavity is formed in the guide block and used for connecting the material injection port and the horizontal discharging port; wherein the driving part is used for applying force to one end of the guide block, so that the guide block can move back and forth along the inclined guide groove until the horizontal discharge port is in contact with the surface of the chip. According to the utility model, the braiding efficiency of the PCB element can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB component production, in particular to a PCB component program burning identification device. Background Art

[0002] With the widespread application of programmable chips, the requirements for IC burning automation and reliability are becoming increasingly higher. Generally, after the chip is burned by the burner, it is necessary to make corresponding marks on the surface. Most of the tape burners directly set a dotting mechanism on the tape device, and the dotting mechanism directly performs dotting operations on the chips that have been burned and adhered to the film tape. During the dotting, the chips adhered to the film tape stop under the dotting mechanism one by one, and the dotting mechanism dots the chips in turn. However, the writing of the chip program has no effect on the appearance of the chip body, and it is impossible to visually distinguish whether the chip has been burned, especially in the process of taping multiple types of chips and not needing to burn all chips. It is necessary to record the position of the unmarked chip entering the taping device, and then control the dotting. This method requires an additional control system and may require an additional image acquisition system, which is not conducive to efficient taping and transportation.

[0003] Therefore, the existing chip burning and marking method has the problem of affecting the efficiency of PCB component taping. Utility Model Content

[0004] The utility model aims to provide a PCB component program burning and marking device to solve the problem in the prior art that the efficiency of PCB component taping is affected due to the existing chip burning and marking method.

[0005] In order to solve the above technical problems, the utility model specifically provides the following technical solutions:

[0006] A PCB component program burning and marking device, comprising a vertical bracket, side panels perpendicular to the vertical bracket are arranged on both sides of the vertical bracket, a guide block is arranged between the two side panels, protrusions are arranged on both sides of the guide block, oblique guide grooves are arranged on the two side panels, the protrusions located on both sides of the guide block are respectively installed in the oblique guide grooves of the two side panels, one end of the side panel is connected to one end of the oblique guide groove through an elastic member; a driving part is arranged on the vertical bracket;

[0007] The bottom of the guide block is connected with a marking head, the bottom of the marking head is provided with a horizontal discharge port, the top of the guide block is provided with an injection port, and the inside of the guide block is provided with a connecting cavity, and the connecting cavity is used to connect the injection port and the horizontal discharge port;

[0008] The driving part is used to apply force to one end of the guide block so that the guide block can reciprocate along the inclined guide groove until the horizontal discharge port contacts the chip surface.

[0009] As a preferred solution of the utility model, an adjustment plate is provided on the vertical bracket, the two side panels are respectively provided on both sides of the adjustment plate, a guide groove matching the side panel is provided on the vertical bracket, and an adjustment knob is provided on the back side of the vertical bracket, and the adjustment knob is used to fix the position of the side panel after moving in the guide groove.

[0010] As a preferred solution of the utility model, the side plate is provided with an angle plate, the side plate is provided with a rotating groove cooperating with the angle plate, the angle plate can be rotatably installed in the rotating groove, and the oblique guide groove is provided on a certain diameter of the angle plate.

[0011] As a preferred solution of the utility model, a buffer cavity is provided inside the guide block, one end of the buffer cavity is connected to the connecting cavity, and an air control port is provided on the guide block, the air control port is connected to an external air supply source, and the air supply source is used to provide positive pressure and negative pressure states in the buffer cavity.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] The utility model can mark the burned and unburned chip components of various PCB patch components before taping. The oblique displacement driving mode of the guide block and the marking head of the utility model can mark the chip after it is placed in the taping groove, and is not limited to a continuously moving taping machine or a taping machine selected in sequence, thereby improving the applicability in chip marking. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the implementation of the utility model or the technical solution in the prior art, the following is a brief introduction to the drawings required for the implementation or the prior art description. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0015] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of an embodiment of the utility model provided with an angle plate;

[0017] Figure 3 This is a schematic diagram of the cross-sectional structure of a guide block according to an embodiment of the utility model;

[0018] Figure 4 It is a schematic diagram of the back side of the vertical bracket according to an embodiment of the utility model.

[0019] The numbers in the figure represent the following:

[0020] 1-vertical bracket; 2-side plate; 3-protrusion; 4-guide block; 5-oblique guide groove; 6-elastic member; 7-driving part; 8-marking head; 9-injection port; 10-connecting cavity; 11-horizontal discharge port; 12-adjusting plate; 13-guide groove; 14-adjusting knob; 15-angle disk; 16-rotation groove; 17-buffer cavity; 18-gas control port. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] like Figures 1 to 4 As shown, the utility model provides a PCB component program burning and marking device, including a vertical bracket 1, side panels 2 perpendicular to the vertical bracket 1 are arranged on both sides of the vertical bracket 1, a guide block 4 is arranged between the two side panels 2, protrusions 3 are arranged on both sides of the guide block 4, and oblique guide grooves 5 are arranged on the two side panels 2. The protrusions 3 located on both sides of the guide block 4 are respectively installed in the oblique guide grooves 5 of the two side panels 2, and one end of the side panel 2 is connected to one end of the oblique guide groove 5 through an elastic member 6. A driving part 7 is arranged on the vertical bracket 1.

[0023] The bottom of the guide block 4 is connected to the identification head 8, the bottom of the identification head 8 is provided with a horizontal discharge port 11, the top of the guide block 4 is provided with an injection port 9, and the inside of the guide block 4 is provided with a connecting cavity 10, which is used to connect the injection port 9 and the horizontal discharge port 11.

[0024] This embodiment is mainly aimed at marking different burning states of chips during the burning and taping process of PCB components, that is, marking whether the chip is burned or not.

[0025] During the burning and taping process of PCB components, it is necessary to use a vacuum automatic picking device and a multi-degree-of-freedom robotic arm or a multi-directional displacement mechanism to drive the vacuum automatic picking device to transfer the components after burning. In this embodiment, when the PCB components are transferred to the tape slot (the groove for placing a single PCB component or a patch chip) of the taping machine, the PCB components are marked as burned or not.

[0026] The connection with the vacuum automatic pickup device is achieved through the side plate 2 (i.e., it moves following the vacuum automatic pickup device), and the vacuum automatic pickup device places the PCB components in the belt grooves. In this embodiment, it is assumed that the vacuum automatic pickup device has a vertical displacement during the process of picking up and placing the chip, so during the placement of the PCB components, the corresponding position in the vertical direction is occupied.

[0027] To this end, in this embodiment, the marking head 8 contacts the horizontal discharge port 11 of the chip and contacts the surface of the chip through an oblique displacement.

[0028] That is, in the process of vertical displacement of the chip from the belt groove after the vacuum automatic picking device places it, the driving unit 7 is used to apply force to one end of the guide block 4, so that the guide block 4 can move back and forth along the inclined guide groove 5 until the horizontal discharge port 11 contacts the chip surface. At this time, the horizontal discharge port 11 is located directly below the adsorption head of the vacuum automatic picking device.

[0029] The driving part 7 is specifically a pneumatic cylinder or a servo, and a wedge-shaped surface kinematic pair is formed between the driving part 7 and the guide block 4, that is, the vertical movement of the driving part 7 is converted into the movement of the protrusion 3 of the guide block 4 along the oblique guide groove 5, so that the guide block 4 as a whole has horizontal and vertical displacements. At this time, the marking head 8 is specifically a hollow columnar structure, and there is an angle between the marking head 8 and the guide block 4 (designed according to actual needs).

[0030] Then, when the guide block 4 moves along the oblique guide groove 5 until the horizontal discharge port 11 reaches the horizontal discharge port 11 directly below the adsorption head of the vacuum automatic picking device, the marking of the surface of the PCB component is completed.

[0031] In this embodiment, the identification device is set on the vacuum automatic picking device, so that when picking up, it is determined whether the current chip is burned, that is, the corresponding indication of burning or not can be made after placement, reducing the steps of determining the burning of chip components.

[0032] Of course, in this embodiment, the device can also be installed on the guide rail of the taping machine through the side panel 2 to achieve a fixed connection with the tape conveying track of the taping machine, and mark the PCB components that have been transferred to the tape slot of the taping machine. However, in this process, the PLC control system is required to record the position of the unburned PCB components transferred to the tape slot and then control the marking.

[0033] Among them, the marking head 8 and the guide block 4 are detachably connected, so different marking heads 8 can be replaced, which means that the present application can achieve a change in the angle between the marking head 8 and the guide block 4 by replacing the marking head 8.

[0034] Furthermore, in order to be able to adjust the accuracy of the vertical displacement of the guide block 4, or to be able to adjust the initial position of the guide block 4 according to actual work requirements, an adjustment plate 12 is provided on the vertical bracket 1 in this embodiment, and the two side panels 2 are respectively arranged on both sides of the adjustment plate 12, and a guide groove 13 matching the side panel 2 is provided on the vertical bracket 1, and an adjustment knob 14 is provided on the back side of the vertical bracket 1, and the adjustment knob 14 is used to fix the position of the side panel 2 after moving in the guide groove 13.

[0035] Among them, the adjustment knob 14 is specifically a screw threadedly connected to the vertical bracket 1, the screw is perpendicular to the surface of the vertical bracket 1, and one end of the screw passes through the vertical bracket 1 and contacts the surface of the adjustment plate 12. The position locking between the vertical bracket 1 and the adjustment plate 12 is achieved by rotating the screw.

[0036] Of course, there are many other implementations of the adjustment knob 14 in this embodiment, and no specific limitation is made.

[0037] Furthermore, in this embodiment, an angle disc 15 is provided on the side plate 2 , a rotation groove 16 cooperating with the angle disc 15 is provided on the side plate 2 , the angle disc 15 is rotatably installed in the rotation groove 16 , and an inclined guide groove 5 is provided on a certain diameter of the angle disc 15 .

[0038] That is, in this embodiment, it is desired to adjust the inclination angle of the guide block 4 relative to the side plate so that the guide block 4 can adapt to the final position of the chip placed by the suction piece or the gripper of different patch chips.

[0039] Furthermore, the present embodiment provides a method for controlling the injection state of the marking head 8, namely, by providing a buffer chamber 17 inside the guide block 4, one end of the buffer chamber 17 is connected to the connecting chamber 10, the buffer chamber 17 is close to the guide block 4, and an air control port 18 is provided on the guide block 4. The air control port 18 is connected to an external air supply source, and the air supply source is used to provide positive pressure and negative pressure states in the buffer chamber 17.

[0040] When marking the identification part, the marking head 8 coats the marking material on the surface of the chip. At this time, the air supply source provides positive pressure to the buffer chamber 17. The positive pressure is just enough to prevent the coating in the marking head 8 from entering the buffer chamber 17. When the marking head 8 completes the marking of the chip surface, the air supply source provides a negative pressure state to the buffer chamber 17, that is, a suction action is performed in the buffer chamber 17. The amount of gas sucked is small, so that part of the material in the marking head 8 can enter the buffer chamber, thereby avoiding the possibility of leakage of the coating material of the marking head 8 during movement.

[0041] When the marking head 8 contacts the chip surface next time, the gas supply source injects positive pressure gas into the buffer chamber 17 again, and this process is repeated to control the amount of material coated by the marking head 8 each time.

[0042] The above embodiments are only exemplary embodiments of the present application and are not intended to limit the present application. The protection scope of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and protection scope of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present application.

Claims

1. A PCB component program burning and marking device, characterized in that: The invention comprises a vertical bracket (1), side plates (2) perpendicular to the vertical bracket (1) are arranged on both sides of the vertical bracket (1), a guide block (4) is arranged between the two side plates (2), protrusions (3) are arranged on both sides of the guide block (4), oblique guide grooves (5) are arranged on the two side plates (2), the protrusions (3) on both sides of the guide block (4) are respectively installed in the oblique guide grooves (5) of the two side plates (2), and one end of the side plate (2) is connected to one end of the oblique guide groove (5) through an elastic member (6); a driving part (7) is arranged on the vertical bracket (1); The bottom of the guide block (4) is connected to a marking head (8), the bottom of the marking head (8) is provided with a horizontal discharge port (11), the top of the guide block (4) is provided with an injection port (9), and a connecting cavity (10) is provided inside the guide block (4), and the connecting cavity (10) is used to connect the injection port (9) and the horizontal discharge port (11); The driving part (7) is used to apply force to one end of the guide block (4) so ​​that the guide block (4) can move back and forth along the inclined guide groove (5) until the horizontal discharge port (11) contacts the chip surface.

2. A PCB component program burning and marking device according to claim 1, characterized in that: The vertical support (1) is provided with an adjustment plate (12), the two side plates (2) are respectively provided on both sides of the adjustment plate (12), the vertical support (1) is provided with a guide groove (13) matched with the side plate (2), and the back side of the vertical support (1) is provided with an adjustment knob (14), and the adjustment knob (14) is used to fix the position of the side plate (2) after moving in the guide groove (13).

3. A PCB component program burning and marking device according to claim 2, characterized in that: The side plate (2) is provided with an angle disc (15), the side plate (2) is provided with a rotation groove (16) matched with the angle disc (15), the angle disc (15) is rotatably mounted in the rotation groove (16), and the oblique guide groove (5) is provided on a certain diameter of the angle disc (15).

4. A PCB component program burning and marking device according to claim 3, characterized in that: A buffer chamber (17) is provided inside the guide block (4), one end of the buffer chamber (17) is connected to the connecting chamber (10), and an air control port (18) is provided on the guide block (4), the air control port (18) is connected to an external air supply source, and the air supply source is used to provide positive pressure and negative pressure states in the buffer chamber (17).

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