Heat dissipation shell for memory bank and storage device

Abstract

The utility model discloses a heat dissipation shell used for a memory bank and a storage device, and relates to the technical field of storage device.The heat dissipation shell comprises a first shell, a second shell and a heat conduction piece, a cavity is defined by the first shell and the second shell, the cavity is used for containing at least part of the memory bank, and the first shell and the second shell are connected through a fastener; the clamp is used for clamping the memory bank; the heat-conducting fin is arranged on the inner wall of the first shell and used for being in heat-conducting fit with a memory chip of the memory bank. The first shell and the second shell are connected through the fastener, the fastener can apply pressure to the memory bank through the first shell and the second shell so as to clamp and fix the memory bank, and heat-conducting glue does not need to be arranged between the memory bank and the first shell and between the memory bank and the second shell, so that the problem that the heat-conducting glue is heated, melted and loosened can be avoided; and the assembling stability of the memory bank and the heat dissipation shell is improved.

Description

Technical Field

[0001] The present application relates to the technical field of storage devices, and in particular to a heat dissipation housing for a memory stick and a storage device. Background Art

[0002] The memory module is crucial to the performance of the computer. It not only provides the necessary data storage space, but also affects the computer's processing speed and multi-tasking capabilities. Since the memory module generates a certain amount of heat during operation, the heat dissipation performance of the memory module will directly affect the performance of the memory module.

[0003] In the related art, a heat dissipation housing is provided outside the memory stick to improve the heat dissipation efficiency of the memory stick, and the heat dissipation housing and the memory stick are bonded and fixed by thermal conductive adhesive. However, when the memory stick is in a high-temperature working environment for a long time, the thermal conductive adhesive is prone to melt and loosen, causing the heat dissipation housing to fall off the memory stick. Utility Model Content

[0004] The present application discloses a heat dissipation housing and a storage device for a memory stick, so as to solve the problem in the related art that the melting and loosening of the thermal conductive adhesive easily causes the heat dissipation housing to fall off the memory stick.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application discloses a heat dissipation housing for a memory stick, the heat dissipation housing comprising a first housing, a second housing and a heat conductive sheet, the first housing and the second housing enclose a cavity, the cavity is used to accommodate at least part of the memory stick, and the first housing and the second housing are connected by a fastener to clamp the memory stick;

[0007] The heat conducting sheet is arranged on the inner wall of the first shell and is used for heat conducting cooperation with the storage chip of the memory stick.

[0008] In a second aspect, an embodiment of the present application discloses a storage device, which includes a memory stick and the above-mentioned heat dissipation shell, and at least a portion of the memory stick is disposed in the cavity surrounded by the first shell and the second shell.

[0009] The technical solution adopted in this application can achieve the following technical effects:

[0010] The heat dissipation shell disclosed in the embodiment of the present application improves the related art. The disclosed heat dissipation shell includes a first shell, a second shell and a heat conductive sheet. The first shell and the second shell form a cavity, and the cavity is used to accommodate at least part of the memory stick. The first shell and the second shell are connected by fasteners to clamp the memory stick. The heat conductive sheet is arranged on the inner wall of the first shell to cooperate with the memory chip of the memory stick for heat conduction. The first shell and the second shell are connected by fasteners. The fasteners can apply pressure to the memory stick through the first shell and the second shell to clamp and fix the memory stick. Since there is no need to set thermal conductive glue between the memory stick and the first shell and the second shell, the problem of thermal conductive glue melting and loosening due to heat can be avoided, and the stability of the assembly of the memory stick and the heat dissipation shell is improved. In addition, the heat conductive sheet can conduct the heat generated by the memory chip to the first shell and the second shell in time, thereby improving the heat dissipation efficiency of the memory stick, and then improving the working performance of the memory stick. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is one of the exploded views of the storage device disclosed in the embodiment of the present application;

[0012] Figure 2 A schematic diagram of the front structure of a storage device disclosed in an embodiment of the present application;

[0013] Figure 3 A schematic diagram of the back structure of the storage device disclosed in the embodiment of the present application;

[0014] Figure 4 This is the second exploded diagram of the storage device disclosed in the embodiment of the present application;

[0015] Figure 5 This is the third exploded diagram of the storage device disclosed in the embodiment of the present application;

[0016] Figure 6 This is the fourth exploded diagram of the storage device disclosed in the embodiment of the present application;

[0017] Figure 7 A schematic diagram of the side structure of a storage device disclosed in an embodiment of the present application;

[0018] Figure 8 This is the fifth exploded diagram of the storage device disclosed in the embodiment of the present application;

[0019] Fig. 9 This is the sixth exploded diagram of the storage device disclosed in the embodiment of the present application;

[0020] Fig.10 An exploded view of the second housing and the second gasket disclosed in the embodiment of the present application;

[0021] Fig.11This is an assembly diagram of the second shell and the second gasket disclosed in an embodiment of the present application.

[0022] Description of reference numerals:

[0023] 100-heat dissipation housing, 110-first housing, 111-first boss, 112-groove, 120-second housing, 121-second boss, 130-heat conducting sheet, 140-fastener, 150-clamping portion, 151-clamping teeth, 160-first gasket, 170-second gasket, 180-heat spreader, 190-heat dissipation grille;

[0024] 200 - memory bar, 201 - first surface, 202 - second surface, 210 - storage chip. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0026] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more.

[0027] The technical solutions disclosed in various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0028] Please refer to Figures 1 to 11The embodiment of the present application discloses a heat dissipation housing 100 for a memory stick 200. The heat dissipation housing 100 can assist in dissipating heat for the memory stick 200 to improve the heat dissipation efficiency of the memory stick 200. The heat dissipation housing 100 can be made of materials with good heat dissipation performance such as stainless steel and aluminum alloy. The memory stick 200 can include U-DIMM (Unbuffered Dual In-Line Memory Modules or unregistered Dual In-Line Memory Modules), SO-DIMM (Small Outline Dual In-line Memory Module), etc., and a storage chip 210 is provided on the memory stick 200.

[0029] In order to improve the heat dissipation efficiency of the memory stick 200, the above-mentioned heat dissipation shell 100 may include a first shell 110, a second shell 120 and a heat conductive sheet 130. The first shell 110 and the second shell 120 form a cavity, and the cavity is used to accommodate at least part of the memory stick 200. The cavity is provided with an opening, and the non-plugging area of ​​the memory stick 200 can extend into the cavity through the opening. It should be noted that the memory stick 200 is provided with a plug connector and is connected to the motherboard of an electronic device (such as a computer) through the plug connector. The non-plugging area of ​​the memory stick 200 refers to other areas outside the plug connector, and electrical components such as a memory chip 210 are arranged on the non-plugging area.

[0030] like Figure 1 As shown, the first housing 110 and the second housing 120 can be connected by a fastener 140, and the fastener 140 can include screws, rivets, etc. The fastener 140 can apply a force to the first housing 110 and the second housing 120 so that the first housing 110 and the second housing 120 are assembled and formed into the above-mentioned cavity. When the non-plug-in area of ​​the memory stick 200 extends into the cavity, the fastener 140 can also apply a clamping force to the memory stick 200 through the first housing 110 and the second housing 120 to clamp and fix the memory stick 200. Exemplarily, when the first housing 110 and the second housing 120 are connected to each other by screws, bolt holes can be respectively provided at the edges of the first housing 110 and the second housing 120, and fastening can be achieved by the cooperation between the screws and the bolt holes.

[0031] The heat conducting sheet 130 can be made of materials such as graphene, carbon nanotubes, copper, and silver. The heat conducting sheet 130 is disposed on the inner wall of the first housing 110. Considering that the memory chip 210 is the main heat generating component of the memory stick 200, the heat dissipation efficiency of the memory chip 210 will directly affect the working performance of the memory stick 200. The heat conducting sheet 130 can cooperate with the memory chip 210 of the memory stick 200 to improve the heat dissipation efficiency of the memory chip 210. The heat conducting sheet 130 can be clamped between the first housing 110 and the memory stick 200 by the force applied by the fastener 140; the heat conducting sheet 130 can also be assembled with the first housing 110 by means of clamping, bolting, etc.

[0032] As described above, it can be known that the heat dissipation housing 100 disclosed in the embodiment of the present application improves the related art. The first housing 110 and the second housing 120 are connected by a fastener 140. The fastener 140 can apply pressure to the memory stick 200 through the first housing 110 and the second housing 120 to clamp and fix the memory stick 200. Since there is no need to set thermal conductive glue between the memory stick 200 and the first housing 110 and the second housing 120, the problem of the thermal conductive glue melting and loosening due to heat can be avoided, thereby improving the stability of the assembly of the memory stick 200 and the heat dissipation housing 100; and, the thermal conductive sheet 130 can conduct the heat generated by the memory chip 210 to the first housing 110 and the second housing 120 in a timely manner, thereby improving the heat dissipation efficiency of the memory stick 200, and further improving the working performance of the memory stick 200.

[0033] like Figures 1 to 9 As shown, in order to further improve the reliability of assembly of the first shell 110 and the second shell 120, a clamping portion 150 can be respectively provided on the first shell 110 and the second shell 120. The clamping portion 150 can be provided at the edge area where the first shell 110 and the second shell 120 are butted against each other. While the first shell 110 and the second shell 120 are connected by the fastener 140, they can also be clamped to each other by the clamping portion 150. Under the double fixing method, the first shell 110 and the second shell 120 are less likely to slip or loosen, and the stability is better.

[0034] The above-mentioned clamping portion 150 may include a combination of elastic buckles. In an optional embodiment of the present application, as Figures 7 to 9As shown, the clamping portion 150 may include a clamping tooth 151, and the clamping tooth 151 provided on the first housing 110 and the clamping tooth 151 provided on the second housing 120 are clamped with each other, so that the first housing 110 and the second housing 120 can be limited from at least two directions of the heat dissipation housing 100. Exemplarily, an inclined clamping tooth 151 is provided on the first housing 110, and an inclined clamping tooth 151 is also provided on the second housing 120. The clamping teeth 151 provided on the first housing 110 and the clamping teeth 151 provided on the second housing 120 are inclined in opposite directions. When the first housing 110 and the second housing 120 are assembled, the above-mentioned clamping teeth 151 can overlap with each other to achieve clamping and limiting.

[0035] like Figure 1 and Figure 6 As shown, the memory stick 200 has a first surface 201 and a second surface 202 facing each other, and a large number of electrical components are arranged on the first surface 201 and the second surface 202. In order to avoid contact interference between the electrical components and the inner walls of the first shell 110 and the second shell 120, a first boss 111 can be arranged on the inner wall of the first shell 110. The first boss 111 can contact the first surface 201 of the memory stick 200 to support the memory stick 200, so that the first surface 201 of the memory stick 200 and the inner wall of the first shell 110 have a first gap, and the first gap is used to accommodate the electrical components on the first surface 201.

[0036] Similarly, the inner wall of the second shell 120 is provided with a second boss 121, and the second boss 121 can contact the second surface 202 of the memory stick 200 to support the memory stick 200, so that the second surface 202 of the memory stick 200 and the inner wall of the second shell 120 have a second gap, and the second gap is used to accommodate the electrical components on the second surface 202. It should be noted that the number of the first boss 111 and the second boss 121 can be one, two or more than two respectively. If the memory stick 200 requires more supporting points, the number of the first boss 111 and the second boss 121 can be increased accordingly. For example, Figure 1 and Figure 6 As shown, two first bosses 111 are respectively provided at opposite ends of the first shell 110 , and two second bosses 121 are respectively provided at opposite ends of the second shell 120 , which can respectively support the memory stick 200 at positions close to the ends.

[0037] In addition, the fastener 140 can also apply a clamping force to the memory bar 200 through the first boss 111 and the second boss 121 , so that the memory bar 200 is stably clamped in the cavity.

[0038] like Figure 1 , Figure 5 , Figure 6 , Fig.10 , Fig.11 As shown, the heat dissipation housing 100 further includes a first gasket 160 and a second gasket 170, and the first gasket 160 and the second gasket 170 can be made of elastic materials such as silicone and rubber. The first gasket 160 can be arranged on the surface of the first boss 111 for contacting the memory stick 200, and the second gasket 170 can be arranged on the surface of the second boss 121 for contacting the memory stick 200. By arranging the above-mentioned first gasket 160 and second gasket 170, a certain elastic buffering effect can be played, and the first boss 111 and the second boss 121 can be prevented from rigidly contacting the memory stick 200 when clamping the memory stick 200, thereby preventing the memory stick 200 from being damaged.

[0039] like Figure 6 and Fig.11 As shown, in order to increase the contact friction between the first gasket 160, the second gasket 170 and the memory stick 200 and prevent the memory stick 200 from sliding relative to the first gasket 160 and the second gasket 170, a plurality of protrusions can be provided on the surface of the first gasket 160 for contacting the memory stick 200 and the surface of the second gasket 170 for contacting the memory stick 200, and the protrusions can provide greater friction when contacting the surface of the memory stick 200. The shape of the protrusions can be columnar, serrated, etc.

[0040] like Figure 1 and Figure 5 As shown, the heat generated by the memory chip 210 of the memory stick 200 will be transferred to the first housing 110 through the heat conductive sheet 130. Since the memory chip 210 generates more heat than other components of the memory stick 200, the temperature of the first housing 110 will be higher than that of the second housing 120 during the heat dissipation process of the memory chip 210. When the temperature of the first housing 110 is high, the heat dissipation efficiency of the memory chip 210 will be affected. Based on this situation, a heat spreader 180 can be arranged between the first housing 110 and the second housing 120. The heat spreader 180 is respectively thermally coordinated with the first housing 110 and the second housing 120. The heat spreader 180 can be made of materials such as graphene, carbon nanotubes, copper, and silver. When the temperature of the first shell 110 is high, part of the heat can be transferred to the second shell 120 through the heat spreader 180. Similarly, when the temperature of the second shell 120 is high, part of the heat can be transferred to the first shell 110 through the heat spreader 180, so that the first shell 110 and the second shell 120 can dissipate heat evenly, thereby improving the heat dissipation efficiency.

[0041] As for the installation method of the heat spreader 180, the heat spreader 180 can be assembled with the first shell 110 or the second shell 120 by means of clamping, bolt connection, etc. In an optional embodiment of the present application, a groove 112 can be provided in at least one of the first shell 110 and the second shell 120, and the heat spreader 180 can be provided in the groove 112 for installation. The heat spreader 180 can be clamped by the first shell 110 and the second shell 120 to have an interference fit with the groove 112. The groove 112 can be provided separately in the first shell 110 or the second shell 120, or two sub-grooves can be provided at the docking positions of the first shell 110 and the second shell 120, and the two sub-grooves can be spliced ​​into the above-mentioned groove 112.

[0042] like Figures 1 to 9 As shown, in order to further improve the heat dissipation efficiency of the heat dissipation housing 100, a heat dissipation grille 190 may be provided on at least one of the first housing 110 and the second housing 120. The shape of the heat dissipation grille 190 may be strip-shaped, mesh-shaped, or the like.

[0043] Please refer to Figures 1 to 11 As shown, an embodiment of the present application further provides a storage device. The disclosed storage device may include a memory stick 200 and the above-mentioned heat dissipation shell 100 , and at least a portion of the memory stick 200 is disposed in a cavity surrounded by the first shell 110 and the second shell 120 .

[0044] From the above description, it can be known that the heat dissipation housing 100 disclosed in the embodiment of the present application improves the related technology. The disclosed heat dissipation housing 100 includes a first housing 110, a second housing 120 and a heat conductive sheet 130. The first housing 110 and the second housing 120 form a cavity, and the cavity is used to accommodate at least a part of the memory stick 200. The first housing 110 and the second housing 120 are connected by a fastener 140 to clamp the memory stick 200. The heat conductive sheet 130 is arranged on the inner wall of the first housing 110, and is used to cooperate with the storage chip 210 of the memory stick 200 for thermal conductivity. The first shell 110 and the second shell 120 are connected by a fastener 140, and the fastener 140 can apply pressure to the memory stick 200 through the first shell 110 and the second shell 120 to clamp and fix the memory stick 200. Since there is no need to set thermal conductive glue between the memory stick 200 and the first shell 110 and the second shell 120, the problem of the thermal conductive glue melting and loosening due to heat can be avoided, thereby improving the stability of the assembly of the memory stick 200 and the heat dissipation shell 100; and the thermal conductive sheet 130 can conduct the heat generated by the memory chip 210 to the first shell 110 and the second shell 120 in time, thereby improving the heat dissipation efficiency of the memory stick 200, and further improving the working performance of the memory stick 200.

[0045] The above embodiments of the present application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0046] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A heat dissipation housing for a memory stick, characterized in that: The heat dissipation housing (100) comprises a first housing (110), a second housing (120) and a heat conductive sheet (130); the first housing (110) and the second housing (120) form a cavity, the cavity is used to accommodate at least a portion of the memory bar (200); and the first housing (110) and the second housing (120) are connected via a fastener (140) to clamp the memory bar (200); The heat conducting sheet (130) is arranged on the inner wall of the first housing (110) and is used for heat conducting cooperation with the memory chip (210) of the memory bar (200).

2. The heat dissipation housing according to claim 1, characterized in that: The first shell (110) and the second shell (120) are respectively provided with a clamping portion (150), and are clamped to each other via the clamping portion (150).

3. The heat dissipation housing according to claim 2, characterized in that: The clamping portion (150) comprises a clamping tooth (151), and the clamping tooth (151) provided on the first shell (110) and the clamping tooth (151) provided on the second shell (120) are clamped with each other.

4. The heat dissipation housing according to claim 1, characterized in that: The inner wall of the first shell (110) is provided with a first boss (111), and the first boss (111) is used to contact the first surface (201) of the memory stick (200), so that a first gap exists between the first surface (201) and the inner wall of the first shell (110); The inner wall of the second shell (120) is provided with a second boss (121), and the second boss (121) is used to contact the second surface (202) of the memory stick (200), so that a second gap exists between the second surface (202) and the inner wall of the second shell (120); The first surface (201) and the second surface (202) are two opposite surfaces of the memory bar (200).

5. The heat dissipation housing according to claim 4, characterized in that: The heat dissipation housing (100) further comprises a first gasket (160) and a second gasket (170), wherein the first gasket (160) is arranged on a surface of the first boss (111) for contacting the memory bar (200), and the second gasket (170) is arranged on a surface of the second boss (121) for contacting the memory bar (200).

6. The heat dissipation housing according to claim 5, characterized in that: A surface of the first gasket (160) used for contacting the memory bar (200) and a surface of the second gasket (170) used for contacting the memory bar (200) are both provided with a plurality of protrusions.

7. The heat dissipation housing according to claim 1, characterized in that: The heat dissipation housing (100) further comprises a heat spreader (180), wherein the heat spreader (180) is disposed between the first housing (110) and the second housing (120), and is thermally coordinated with the first housing (110) and the second housing (120), respectively.

8. The heat dissipation housing according to claim 7, characterized in that: At least one of the first shell (110) and the second shell (120) is provided with a groove (112), and the heat spreader (180) is arranged in the groove (112).

9. The heat dissipation housing according to claim 1, characterized in that: At least one of the first shell (110) and the second shell (120) is provided with a heat dissipation grille (190).

10. A storage device, characterized in that: It comprises a memory bar (200) and the heat dissipation housing (100) according to any one of claims 1 to 9, wherein at least a portion of the memory bar (200) is disposed in the cavity surrounded by the first housing (110) and the second housing (120).

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