Data storage unit assembling structure

By introducing pad plates and buffer columns into the data storage unit of the solid-state drive, the problem of SSDs being easily damaged when facing external vibration is solved, significantly improving vibration resistance and reducing the risk of data loss.

CN222813314UActive Publication Date: 2025-04-29CHANGCHUN YUANJI GRAPHIC DESIGN CO LTD
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Patent Information

Application Number
CN202421768049.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-25
Publication Date
2025-04-29
Estimated Expiration
2034-07-25

AI Technical Summary

Technical Problem

The data storage unit of a solid-state drive is easily damaged when facing external mechanical vibrations, resulting in data loss.

Method used

A data storage unit assembly structure is designed. By adding a pad plate inside the shell as an inner support structure, and setting a buffer column between the pad plate and the shell, the shell is buffered by using a rubber ring to ensure that the flash memory chip does not directly contact the shell, thereby improving vibration resistance.

Benefits of technology

It effectively improves the vibration resistance of the data storage unit and reduces the risk of damage and data loss caused by external vibration.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a data storage unit assembly structure, and belongs to the technical field of electric appliance assembly. According to the assembling structure, a linear groove is formed in a buffer column, an embracing ring is fixed to the linear groove in an embracing mode, a rubber ring is arranged outside the buffer column in a sleeving mode and pressed on the embracing ring, a ring body is arranged outside the buffer column, an external expansion plate is arranged on the outer side of the ring body, a plurality of fixing columns are arranged on the external expansion plate, and the lower side of a shell is fixed to a supporting plate. The upper side of the shell is pressed on the rubber ring, the fixing column is supported on the lower side of the flash memory chip, and the cache particles are located between the base plate and the flash memory chip. According to the technical innovation, the base plate serving as an inner support is additionally arranged in the shell, the framework supporting effect is achieved, the buffering column is arranged between the base plate and the shell, and the buffering effect on the shell is achieved through the rubber ring on the buffering column. Meanwhile, the flash memory chip is not in direct contact with the shell and is stabilized by adopting the fixing columns. And the cache particles are arranged between the flash memory chip and the base plate, so that a more reliable protection effect is achieved.
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Description

Technical Field

[0001] The utility model belongs to the technical field of electrical appliance assembly, in particular to a data storage unit assembly structure. Background Art

[0002] Flash-based SSDs are the main category of SSDs, and their core components include the main control chip, cache particles, and flash memory chips. The main control chip is the core of the SSD. Its functions are to reasonably allocate the data load on each flash memory chip and to undertake the entire data transfer, connecting the flash memory chip and the external SATA interface. The capabilities of different main controls vary greatly, and there will be very large differences in data processing capabilities, algorithms, and read and write control of flash memory chips, which will directly lead to a performance gap of several times between SSD products. Cache particles are generally located next to the main control chip. SSDs, like traditional hard drives, require high-speed cache to assist the main control chip for data processing. Cache particles are relatively fragile components and are easily damaged by vibration. In addition to the main control chip and cache chip, most of the remaining positions on the PCB board are NAND Flash chips. NAND Flash chips are divided into four specifications: SLC, MLC, TLC, and QLC. The more unit layers there are, the higher the performance is, but the corresponding vibration resistance is worse. At present, the packaging structure of solid-state drives is already sufficiently reliable in terms of dust resistance, but its vibration resistance has yet to be improved, especially when used as a mobile storage device. Data storage units including cache particles and flash memory chips are easily damaged by external mechanical vibrations. Once data is damaged, the loss is difficult to estimate. Summary of the invention

[0003] The technical problem to be solved by the utility model is: how to improve the vibration resistance of the data storage unit.

[0004] In order to achieve the above technical objectives, the utility model adopts the following technical solutions:

[0005] A data storage unit assembly structure includes a support plate, a main control chip, a pad, a flash memory chip, a positioning rod, a data line connector, a buffer column, an rubber ring, a ring body, an outer expansion plate, a fixing column, a linear groove, a holding ring, a fixing sheet, a threaded hole, and a shell; the main control chip is fixed to the support plate by bolts, a plurality of convex points are provided on the support plate at a position outside the main control chip, the pad is fixed on the convex points, the pad is maintained on the upper side of the main control chip, a plurality of positioning rods are provided on the pad, the flash memory chip is fixedly mounted on the plurality of positioning rods, the data line connector of the flash memory chip is located on the upper side thereof, and the buffer column is provided with a plurality of positioning rods. The bottom side is provided with a fixing plate, a threaded hole is provided on the fixing plate, and the fixing plate is fixed to the pad with screws through the threaded hole, a linear groove is provided on the buffer column, and the holding ring is fixed on the linear groove, the rubber ring is sleeved on the outside of the buffer column and pressed on the holding ring, and a ring body is provided on the outside of the buffer column, an outer expansion plate is provided on the outer side of the ring body, and a plurality of fixing columns are provided on the outer expansion plate, the lower side of the shell is fixed on the support plate, the upper side of the shell is pressed on the rubber ring, the fixing column is supported on the lower side of the flash memory chip, the data line connector of the flash memory chip is maintained on the surface of the shell, and the cache particles are located between the pad and the flash memory chip.

[0006] Preferably, a plurality of parallel concave lines are provided on the surface of the outer shell, and a rubber layer is lined in the concave lines.

[0007] Preferably, an inner recess is provided on the outer shell, and the inner recess is maintained at the side of the data line connector.

[0008] Preferably, a rubber skin is provided on the upper side of the protrusion, and the pad is in direct contact with the rubber skin.

[0009] Preferably, the outer expansion plate is rectangular, and the fixing column is located between two adjacent vertical sides of the outer expansion plate.

[0010] Preferably, a flange is provided at the end point of the holding ring, and a hole is provided on the flange.

[0011] Preferably, the cache particles are arranged in multiple rows, and a partition is provided between two adjacent rows, and the partition is made of silica gel.

[0012] Preferably, the connection point between the bolt and the support plate is located at the edge of the support plate.

[0013] In the assembly structure of the utility model, the support plate is the basic bearing structure and forms a closed structure with the shell. The main control chip is located at the bottom and fixed with the support plate to ensure the stability of the main control chip installation structure. The pad serves as the supporting structure in the middle. Its lower side is subjected to force with the support plate through the convex point, and its upper side is subjected to force with the shell through the buffer column. When the shell or the support plate is hit by external force, the pad plays an internal support role from the middle. The flash memory chip is located above the pad and does not directly contact the shell. Therefore, when an external force hits, the impact on the flash memory chip is relatively small. The positioning rod plays an installation role for the flash memory chip. The data line connector is the original structure of the flash memory chip and is maintained on the surface of the shell. The linear groove on the buffer column is installed with a holding ring as a fixing position for the rubber ring. The rubber ring is directly supported on the lower side of the shell to play a buffering role. The ring body plays a fixing role for the external expansion plate, and the fixed column on the external expansion plate is supported under the flash memory chip to play a stabilizing role. The fixing plate and its threaded hole play an installation role for the buffer column.

[0014] The utility model discloses a data storage unit assembly structure. This technical innovation adds a pad as an internal support inside the shell to play a role of skeleton support, and a buffer column is arranged between the pad and the shell, and the rubber ring on the buffer column plays a buffering role on the shell. At the same time, the flash memory chip does not directly contact the shell and is stabilized by a fixed column. The cache particles are installed between the flash memory chip and the pad to achieve a more reliable protection effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is an axonometric drawing of the utility model;

[0016] Figure 2 An axonometric view of the utility model excluding the housing;

[0017] Figure 3 It is an axonometric view of the utility model excluding the housing and the flash memory chip;

[0018] Figure 4 It is the axonometric drawing of the ring body, expansion plate and other parts;

[0019] Figure 5 It is an axonometric view of the buffer column, rubber ring and other parts;

[0020] in:

[0021] 1. Support plate 2. Main control chip 3. Pad 4. Flash memory chip

[0022] 5. Positioning rod 6. Data line connector 7. Buffer column 8. Rubber ring

[0023] 9. Ring body 10. Outward expansion plate 11. Fixed column 12. Linear groove

[0024] 13. Ring 14. Fixing plate 15. Threaded hole 16. Shell

[0025] 17. Concave line 18. Inner concave part. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application. In addition, ordinary technicians in this field know that with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0027] In the description of the present application, it should be understood that, unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as those commonly understood by those skilled in the art of the present application. In addition, any terminology used is only for the purpose of describing specific embodiments and is not intended to limit the present application.

[0028] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0029] Example 1

[0030] A data storage unit assembly structure, see Figures 1 to 5, including a support plate 1, a main control chip 2, a pad 3, a flash memory chip 4, a positioning rod 5, a data line connector 6, a buffer column 7, an rubber ring 8, a ring body 9, an outer expansion plate 10, a fixing column 11, a linear groove 12, a ring 13, a fixing plate 14, a threaded hole 15, and a shell 16; the main control chip 2 is fixed to the support plate 1 by bolts, and a plurality of protrusions are provided on the support plate 1 at a position outside the main control chip 2, the pad 3 is fixed on the protrusions, the pad 3 is maintained on the upper side of the main control chip 2, a plurality of positioning rods 5 are provided on the pad 3, the flash memory chip 4 is fixedly installed on the plurality of positioning rods 5, the data line connector 6 of the flash memory chip 4 is located on its upper side, a fixing plate 14 is provided on the bottom side of the buffer column 7, and a plurality of positioning rods 5 are provided on the pad 3. The fixing plate 14 is provided with a threaded hole 15, and the screw fixes the fixing plate 14 to the pad 3 through the threaded hole 15. The buffer column 7 is provided with a linear groove 12, and the holding ring 13 is fixed to the linear groove 12. The rubber ring 8 is sleeved on the outside of the buffer column 7 and pressed on the holding ring 13. The buffer column 7 has a ring body 9 outside, and an outer expansion plate 10 is provided outside the ring body 9. There are multiple fixing columns 11 on the outer expansion plate 10. The lower side of the shell 16 is fixed on the support plate 1, and the upper side of the shell 16 is pressed on the rubber ring 8. The fixing column 11 is supported on the lower side of the flash memory chip 4. The data line connector 6 of the flash memory chip 4 is maintained on the surface of the shell 16, and the cache particles are located between the pad 3 and the flash memory chip 4. The support plate 1 is a basic bearing structure and forms a closed structure with the shell 16. The main control chip 2 is located at the bottom and is fixed to the support plate 1 to ensure the stability of the installation structure of the main control chip 2. The pad 3 serves as a supporting structure in the middle. Its lower side is subjected to force through the convex point and the support plate 1, and its upper side is subjected to force through the buffer column 7 and the shell 16. When the shell 16 or the support plate 1 is hit by external force, the pad 3 plays an internal supporting role from the middle. The flash memory chip 4 is located above the pad 3 and is not directly in contact with the shell 16. Therefore, when an external force hits, the impact on the flash memory chip 4 is relatively small. The positioning rod 5 plays a role in installing the flash memory chip 4. The data line connector 6 is the original structure of the flash memory chip 4 and is maintained on the surface of the shell 16. The linear groove 12 on the buffer column 7 is installed with a holding ring 13 as a fixing position for the rubber ring 8. The rubber ring 8 is directly supported on the lower side of the shell 16 to play a buffering role. The ring body 9 plays a fixing role on the external expansion plate 10. The fixed column 11 on the external expansion plate 10 is supported under the flash memory chip 4 to play a stabilizing role. The fixing plate 14 and its threaded hole 15 play a role in installing the buffer column 7.

[0031] Example 2

[0032] A data storage unit assembly structure, see Figures 1 to 5, including a support plate 1, a main control chip 2, a pad 3, a flash memory chip 4, a positioning rod 5, a data line connector 6, a buffer column 7, an rubber ring 8, a ring body 9, an outer expansion plate 10, a fixing column 11, a linear groove 12, a ring 13, a fixing plate 14, a threaded hole 15, and a shell 16; the main control chip 2 is fixed to the support plate 1 by bolts, and a plurality of protrusions are provided on the support plate 1 at a position outside the main control chip 2, the pad 3 is fixed on the protrusions, the pad 3 is maintained on the upper side of the main control chip 2, a plurality of positioning rods 5 are provided on the pad 3, the flash memory chip 4 is fixedly installed on the plurality of positioning rods 5, the data line connector 6 of the flash memory chip 4 is located on its upper side, a fixing plate 14 is provided on the bottom side of the buffer column 7, and a plurality of positioning rods 5 are provided on the pad 3. The fixing plate 14 is provided with a threaded hole 15, and the screw fixes the fixing plate 14 to the pad 3 through the threaded hole 15. The buffer column 7 is provided with a linear groove 12, and the holding ring 13 is fixed to the linear groove 12. The rubber ring 8 is sleeved on the outside of the buffer column 7 and pressed on the holding ring 13. The buffer column 7 has a ring body 9 on the outside, and an outer expansion plate 10 is provided on the outer side of the ring body 9. There are multiple fixing columns 11 on the outer expansion plate 10. The lower side of the shell 16 is fixed on the support plate 1, and the upper side of the shell 16 is pressed on the rubber ring 8. The fixing column 11 is supported on the lower side of the flash memory chip 4. The data line connector 6 of the flash memory chip 4 is maintained on the surface of the shell 16, and the cache particles are located between the pad 3 and the flash memory chip 4. A plurality of parallel concave lines 17 are provided on the surface of the shell 16, and a rubber layer is lined in the concave line 17. An inner concave portion 18 is provided on the shell 16, and the inner concave portion 18 is maintained on the side of the data line connector 6. A rubber skin is provided on the upper side of the protrusion, and the pad 3 is in direct contact with the rubber skin. The outer expansion plate 10 is rectangular, and the fixing column 11 is located between two adjacent vertical sides of the outer expansion plate 10. A flange is provided at the end point of the ring 13, and a hole is provided on the flange. The cache particles are arranged in multiple rows, and a partition is provided between two adjacent rows, and the partition is made of silicone. The connection point between the bolt and the support plate 1 is at the edge of the support plate 1.

[0033] In summary, after reading this detailed disclosure, it will be apparent to those skilled in the art that the aforementioned detailed disclosure may be presented only by way of example and may not be restrictive. Although not explicitly stated herein, it will be appreciated by those skilled in the art that this application is intended to encompass various reasonable changes, improvements and modifications to the embodiments. These changes, improvements and modifications are intended to be proposed by this application and are within the spirit and scope of the exemplary embodiments of this application.

[0034] It should be understood that in the foregoing description of the embodiments of the present application, in order to help understand a feature and to simplify the present application, the present application combines various features in a single embodiment, drawing or description thereof. However, this does not mean that the combination of these features is necessary, and it is entirely possible for those skilled in the art to extract some of the features and understand them as separate embodiments when reading the present application.

[0035] It should be understood that the embodiments disclosed herein are illustrations of the principles of the present application. Other modified embodiments are also within the scope of the present application. The embodiments disclosed herein are merely examples and not limitations, and the embodiments of the present application are not limited to the embodiments precisely described above.

Claims

1. A data storage unit assembly structure, characterized in that: The invention comprises a support plate (1), a main control chip (2), a pad (3), a flash memory chip (4), a positioning rod (5), a data line connector (6), a buffer column (7), a rubber ring (8), a ring body (9), an expansion plate (10), a fixing column (11), a linear groove (12), a ring (13), a fixing plate (14), a threaded hole (15), and a shell (16); the main control chip (2) is fixed to the support plate (1) by bolts, a plurality of protrusions are provided on the support plate (1) at a position outside the main control chip (2), the pad (3) is fixed on the protrusions, the pad (3) is maintained on the upper side of the main control chip (2), a plurality of positioning rods (5) are provided on the pad (3), the flash memory chip (4) is fixedly mounted on the plurality of positioning rods (5), the data line connector (6) of the flash memory chip (4) is located on the upper side thereof, and a fixing plate (14) is provided on the bottom side of the buffer column (7). A threaded hole (15) is provided on the fixing plate (14), and a screw is used to fix the fixing plate (14) on the pad (3) through the threaded hole (15). A linear groove (12) is provided on the buffer column (7), and a ring (13) is fixed to the linear groove (12). A rubber ring (8) is sleeved on the outside of the buffer column (7) and pressed on the ring (13). A ring body (9) is provided on the outside of the buffer column (7), and an outer expansion plate (10) is provided on the outer side of the ring body (9). A plurality of fixing columns (11) are provided on the outer expansion plate (10). The lower side of the outer shell (16) is fixed on the support plate (1), and the upper side of the outer shell (16) is pressed on the rubber ring (8). The fixing columns (11) are supported on the lower side of the flash memory chip (4), and the data line connector (6) of the flash memory chip (4) is maintained on the surface of the outer shell (16). The cache particles are located between the pad (3) and the flash memory chip (4).

2. A data storage unit assembly structure according to claim 1, characterized in that: A plurality of parallel concave lines (17) are arranged on the surface of the outer shell (16), and a rubber layer is lined in the concave lines (17).

3. A data storage unit assembly structure according to claim 1, characterized in that: An inner recess (18) is provided on the outer shell (16), and the inner recess (18) is retained on the side of the data line connector (6).

4. A data storage unit assembly structure according to claim 1, characterized in that: A rubber skin is provided on the upper side of the protrusion, and the pad (3) is in direct contact with the rubber skin.

5. The data storage unit assembly structure according to claim 1, characterized in that: The outer expansion plate (10) is rectangular, and the fixing column (11) is located between two adjacent vertical sides of the outer expansion plate (10).

6. A data storage unit assembly structure according to claim 1, characterized in that: A flange is arranged at the end point of the embracing ring (13), and a hole is arranged on the flange.

7. A data storage unit assembly structure according to claim 1, characterized in that: The cache particles are arranged in multiple rows, and a partition is provided between two adjacent rows, and the partition is made of silica gel.

8. The data storage unit assembly structure according to claim 1, characterized in that: The connection point between the bolt and the support plate (1) is located at the edge of the support plate (1).