Movable wafer cleaning and detecting device

Abstract

The utility model discloses a mobile wafer cleaning detection device, which comprises a detection box, the detection box comprises a detection box body, a drawing box and a box cover, an adjusting cylinder is arranged in the detection box body, a connecting plate connected with the drawing box is arranged at the end part of the adjusting cylinder, a split wafer placing plate is arranged in the drawing box, and the wafer placing plate is connected with the box cover. A movable sliding table cylinder is arranged on the opposite surfaces of the detection box body, a movable rod is arranged on the movable sliding table cylinder, and a supporting rail is arranged on the inner surface of the bottom end of the detection box body; under the action of an adjusting air cylinder, a drawing box enters a detection box body, under the action of a movable sliding table air cylinder, a movable rod drives a wafer placing plate to move slowly, laser beams emitted by an A particle laser emitter irradiate wafers on the surface of the wafer placing plate, scattered light is emitted when particles exist, and the scattered light is received by a corresponding a scattered light photoelectric receiver; and the particle laser emitters with different position distribution irradiate different positions on the wafer, so that the different positions on the wafer can be detected.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafers, and in particular relates to a mobile wafer cleaning and detection device. Background Art

[0002] Wafer cleaning is a key step in the semiconductor manufacturing process. It aims to remove contaminants such as organic matter, particles and metals attached to the surface, sides and back of the wafer to ensure the purity and yield of the wafer. In order to ensure that the wafer cleaning meets the standards, the cleaned wafer needs to be inspected. The impurity particles on the surface of the wafer cannot be observed by the naked eye, so a laser particle detection device is required for detection. The laser particle size analyzer is one of the laser particle detection devices, which is used to measure and analyze the size and shape of object particles. The laser particle size analyzer uses the principle of laser scattering to determine the particle size distribution by measuring the intensity and angle of scattered light. When the laser beam passes through the particle, scattering occurs. The scattering angle is inversely proportional to the size of the particle, and the particle position and size on the wafer surface are displayed as a wafer map.

[0003] After the wafer is cleaned, the wafer workpiece is manually placed on the detection platform. Using the principle of laser scattering, a laser beam is emitted by a particle laser emitter, and a scattered light photoelectric receiver receives the scattered light. The position of the wafer needs to be manually changed during the detection process. The detection process is relatively complicated and not convenient enough. The wafer position cannot be automatically moved so that the laser beam can be shot at different positions on the wafer for detection. When the wafer workpiece is detected after cleaning, there is a design problem of not moving the wafer position. For this reason, the present application proposes a mobile wafer cleaning detection device. Utility Model Content

[0004] The utility model aims to provide a mobile wafer cleaning and testing device to solve the problem in the background art that the wafer workpiece is not moved when being tested after cleaning.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a mobile wafer cleaning and detection device, comprising a detection box, the detection box comprising a detection box body and a pull-out box, and a box cover, an adjusting cylinder is provided inside the detection box body, a connecting plate connected to the pull-out box is provided at the end of the adjusting cylinder, a split wafer placement plate is provided inside the pull-out box, a movable slide cylinder is provided on the opposite surface of the detection box body, a movable slide cylinder is provided on the movable slide cylinder, a support rail is provided on the inner surface of the bottom end of the detection box body, and equidistantly distributed scattered light photoelectric receivers are provided on the opposite inner side walls of the detection box body, a mounting plate is provided on the surface inside the box cover, a particle laser emitter is provided on the mounting plate, a laser sensor is provided at the corner position inside one end of the detection box body, a fixed box is provided on the surface of one end of the detection box body, a lifting electric push rod, a connecting rod and a sealing plate are provided on the fixed box, the lifting electric push rod is installed inside the fixed box, and the two ends of the connecting rod are respectively connected to the lifting electric push rod and the sealing plate, and the sealing plate is inserted into the interior of the detection box body.

[0006] Preferably, a rectangular slide groove for a pull-out box to pass through is provided on the surface of the detection box, the pull-out box is slidably connected to the detection box, the bottom surface of the wafer placement plate is flush with the surface surface H of the support rail, and a support plate is provided on the side of the detection box.

[0007] Preferably, the movable slide cylinder is parallel to the support rail, the movable rod is perpendicular to the movable slide cylinder, the bottom surface of the movable rod is curved, and the bottom end of the movable rod is tangent to the surface of the pull-out box.

[0008] Preferably, the connecting rod is an "L"-shaped structure, the connecting rod is slidably connected to the fixed box, the sealing plate is slidably connected to the detection box, a discharge port is provided on the side of the detection box, a movable groove that cooperates with the gap of the sealing plate is provided on the side surface of the detection box, and the discharge port is connected to the movable groove.

[0009] Preferably, equidistantly distributed partition plates are respectively provided on opposite surfaces of the detection box, the partition plates are perpendicular to the detection box, and the partition plates and the scattered light photoelectric receivers are alternately distributed.

[0010] Preferably, the particle laser emitters on the box cover are marked as A particle laser emitter, B particle laser emitter, C particle laser emitter and D particle laser emitter in sequence, A particle laser emitter and D particle laser emitter are opposite, and B particle laser emitter and C particle laser emitter are staggered.

[0011] Preferably, the scattered light photoelectric receivers on the detection box are marked in sequence as a scattered light photoelectric receiver, b scattered light photoelectric receiver, c scattered light photoelectric receiver and d scattered light photoelectric receiver, and a scattered light photoelectric receiver, b scattered light photoelectric receiver, c scattered light photoelectric receiver and d scattered light photoelectric receiver correspond one by one to A particle laser emitter, B particle laser emitter, C particle laser emitter and D particle laser emitter, respectively.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] In the utility model, under the action of the regulating cylinder, the pull-out box enters the detection box body, and under the action of the moving slide cylinder, the moving rod drives the wafer placement plate to move slowly. The laser beam emitted by the A particle laser emitter is irradiated on the wafer part on the surface of the wafer placement plate. When there are particles, scattered light is emitted. The scattered scattered light is received by the corresponding a scattered light photoelectric receiver. Particle laser emitters with different position distributions irradiate different positions on the wafer part, and different positions on it can be detected. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the structure of the utility model;

[0015] Figure 2 It is a schematic diagram of the top view structure of the detection box of the utility model;

[0016] Figure 3 It is a cross-sectional structural schematic diagram of the detection box of the utility model;

[0017] Figure 4 For the utility model Figure 1 A schematic diagram of the enlarged structure of the middle part A;

[0018] In the figure: 1. Detection box; 2. Pull-out box; 3. Box cover; 4. Particle laser emitter; 5. Adjustment cylinder; 6. Support rail; 7. Moving slide cylinder; 8. Scattered light photoelectric receiver; 9. Fixed box; 11. Support plate; 12. Partition plate; 13. Laser sensor; 21. Wafer placement plate; 31. Mounting plate; 51. Connecting plate; 71. Moving rod; 101. Lifting electric push rod; 102. Connecting rod; 103. Sealing plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Example

[0021] See also Figures 1 to 4The utility model provides a technical solution: a mobile wafer cleaning and testing device, including a testing box, the testing box including a testing box body 1, a pull-out box 2, and a box cover 3, the testing box body 1, the pull-out box 2, and the box cover 3 are sealed inside to prevent the tested wafers from being disturbed by the outside world, an adjusting cylinder 5 is arranged inside the testing box body 1, and a connecting plate 51 connected to the pull-out box 2 is arranged at the end of the adjusting cylinder 5, the adjusting cylinder 5 is combined with the testing box body 1 by a conventional method, the connecting plate 51 is combined with the adjusting cylinder 5 and the pull-out box 2 by a conventional method, a split wafer placing plate 21 is arranged inside the pull-out box 2, wafers are placed on the wafer placing plate 21, and the wafer placing plate 21 is placed inside the pull-out box 2, and under the action of the adjusting cylinder 5, the wafers are placed on the pull-out box 2. The placement plate 21 slides with the pull-out box 2 into the enclosed space of the detection box 1; a moving slide cylinder 7 is provided on the opposite surface of the detection box 1, and a moving rod 71 is provided on the moving slide cylinder 7. The moving slide cylinder 7 is combined with the detection box 1 and the moving rod 71 by a conventional method. When the slide on the moving slide cylinder 7 moves, the moving rod 71 is slowly driven by the slide, and the moving rod 71 drives the wafer placement plate 21 to move slowly. The sliding wafer placement plate 21 is supported by a support rail 6, and a support rail 6 is provided on the inner surface of the bottom end of the detection box 1; equidistantly distributed scattered light photoelectric receivers 8 are provided on the opposite inner side walls of the detection box 1, and the scattered light photoelectric receivers 8 receive scattered light emitted by the particle laser transmitter 4 arranged on the surface of the wafer, and a mounting plate 8 is provided on the surface inside the box cover 3. A mounting plate 31 is provided with a particle laser emitter 4. The mounting plate 31 is combined with the box cover 3 and the particle laser emitter 4 by a conventional method. The particle laser emitter 4 emits a laser beam. The laser beam detects the surface of the wafer placed on the surface of the wafer placing plate 21. If there are impurity particles on the wafer surface, the laser beam will be scattered, and the scattered light photoelectric receiver 8 will receive the scattered light. The method of detecting particles using the laser scattering principle is a conventional technical means and will not be described in detail in this application. A laser sensor 13 is provided at a corner position inside one end of the detection box 1. The laser sensor 13 is combined with the detection box 1 by a conventional method. The laser sensor 13 plays a role in detecting the position of the wafer on the wafer placing plate 21. When the position of the wafer is detected, the electric push rod is raised and lowered 101 is running; a fixed box 9 is provided on the surface of one end of the detection box 1, and a lifting electric push rod 101, a connecting rod 102 and a sealing plate 103 are provided on the fixed box 9. The fixed box 9 is combined with the detection box 1 and the lifting electric push rod 101 by a conventional method. The lifting electric push rod 101 is installed inside the fixed box 9, and the two ends of the connecting rod 102 are respectively connected with the lifting electric push rod 101 and the sealing plate 103. The connecting rod 102 is combined with the lifting electric push rod 101 and the sealing plate 103 by a conventional method, and the sealing plate 103 is inserted into the interior of the detection box 1. The sealing plate 103 seals the discharge port provided on one side of the detection box 1. When the lifting electric push rod 101 is started, the sealing plate 103 moves vertically upward without affecting the removal of the wafer placement plate 21 from the interior of the detection box 1.

[0022] In this embodiment, a rectangular slide groove is provided on the surface of the detection box 1 for the pull-out box 2 to pass through. The pull-out box 2 is slidably connected to the detection box 1. Under the action of the adjusting cylinder 5, the pull-out box 2 slides back and forth in the rectangular slide groove to realize the pulling and pulling of the pull-out box 2. When the pull-out box 2 is pulled out, the wafer placement plate 21 can be placed inside the pull-out box 2 to facilitate the placement of wafer parts. The bottom surface of the wafer placement plate 21 is flush with the surface surface H of the support rail 6. When the wafer placement plate 21 moves horizontally under the action of the moving slide cylinder 7 and the moving rod 71, the support rail 6 supports the wafer placement plate 21 to make it in a horizontal state. A support plate 11 is provided on the side of the detection box 1. The support plate 11 is perpendicular to the side of the detection box 1. When the wafer placement plate 21 slides out from the inside of the detection box 1, the support plate 11 supports the wafer placement plate 21.

[0023] In this embodiment, the moving slide cylinder 7 is parallel to the support rail 6, and the moving rod 71 is perpendicular to the moving slide cylinder 7. The bottom surface of the moving rod 71 is curved, and the bottom end of the moving rod 71 is tangent to the surface of the pull-out box 2. The moving slide cylinder 7 is started, and the slide on the moving slide cylinder 7 moves back and forth. The slide drives the moving rod 71 to move back and forth, and the moving rod 71 drives the wafer placement plate 21 on the pull-out box 2 to move. There is a distance between the moving rod 71 and the bottom inner surface of the detection box 1, and the pull-out box 2 is tangent to the bottom end of the moving rod 71. The pull-out box 2 does not affect the movement of the moving rod 71.

[0024] In this embodiment, the connecting rod 102 is an "L"-shaped structure, the connecting rod 102 is slidably connected to the fixed box 9, the sealing plate 103 is slidably connected to the detection box 1, and the sealing plate 103 moves vertically upward under the drive of the lifting electric push rod 101, so as to change the height position of the sealing plate 103. A discharge port is provided on the side of the detection box 1, which is conducive to the movement of the wafer placement plate 21 out of the discharge port. The side surface of the detection box 1 is provided with a movable groove which is gap-matched with the sealing plate 103. The discharge port is connected to the movable groove, and the sealing plate 103 seals the discharge port to prevent external dust and impurities from entering the interior of the detection box 1.

[0025] In this embodiment, equally spaced partition plates 12 are respectively provided on opposite surfaces of the detection box 1. The partition plates 12 and the detection box 1 are combined by conventional methods. The partition plates 12 are perpendicular to the detection box 1. The partition plates 12 and the scattered light photoelectric receivers 8 are alternately distributed. The partition plates 12 disperse adjacent scattered light photoelectric receivers 8.

[0026] In this embodiment, the particle laser emitters 4 on the box cover 3 are marked as A particle laser emitter 4, B particle laser emitter 4, C particle laser emitter 4 and D particle laser emitter 4 in sequence, the A particle laser emitter 4 and the D particle laser emitter 4 are opposite, the B particle laser emitter 4 and the C particle laser emitter 4 are staggered, the A particle laser emitter 4, the B particle laser emitter 4, the C particle laser emitter 4 and the D particle laser emitter 4 irradiate different positions on the wafer and can detect different positions thereon, and the scattered light photoelectric receivers 8 on the detection box 1 are marked as a scattered light photoelectric receiver 8, b scattered light photoelectric receiver 8, c scattered light photoelectric receiver 8 and d scattered light photoelectric receiver in sequence. Receiver 8, a scattered light photoelectric receiver 8, b scattered light photoelectric receiver 8, c scattered light photoelectric receiver 8 and d scattered light photoelectric receiver 8 correspond to A particle laser emitter 4, B particle laser emitter 4, C particle laser emitter 4 and D particle laser emitter 4 respectively. The laser beam emitted by A particle laser emitter 4 is irradiated on the wafer on the surface of wafer placement plate 21, and scattered light is emitted when there are particles. The scattered scattered light is received by the corresponding a scattered light photoelectric receiver 8. Similarly, the laser scattered light emitted by B particle laser emitter 4, C particle laser emitter 4 and D particle laser emitter 4 is received by the corresponding b scattered light photoelectric receiver 8, c scattered light photoelectric receiver 8 and d scattered light photoelectric receiver 8.

[0027] The working principle and use process of this utility model:

[0028] When testing the cleaned wafer, the wafer is placed inside the wafer placement plate 21, and the wafer placement plate 21 is placed inside the pull-out box 2;

[0029] The regulating cylinder 5 is started, and under the action of the regulating cylinder 5, the wafer placement plate 21 slides along with the drawer box 2 into the enclosed space of the detection box 1;

[0030] The moving slide cylinder 7 is started, and under the action of the moving slide cylinder 7, the moving rod 71 moves, and the moving rod 71 drives the wafer placement plate 21 to move slowly, and the sliding wafer placement plate 21 is supported by the support rail 6;

[0031] The laser beam emitted by the A particle laser emitter 4 is directed to the wafer on the surface of the wafer placement plate 21, and scattered light is emitted when there are particles, and the scattered light is received by the corresponding a scattered light photoelectric receiver 8;

[0032] The A particle laser emitter 4 and the D particle laser emitter 4 are opposite to each other, and the B particle laser emitter 4 and the C particle laser emitter 4 are staggered and distributed. The A particle laser emitter 4, the B particle laser emitter 4, the C particle laser emitter 4 and the D particle laser emitter 4 irradiate different positions on the wafer, and can detect different positions thereon;

[0033] The laser sensor 13 detects the position of the wafer on the wafer placement plate 21. When the position of the wafer is detected, the lifting electric push rod 101 operates, the connecting rod 102 and the sealing plate 103 move vertically upward, and the wafer placement plate 21 slides out from the inside of the detection box 1;

[0034] To sum up: under the action of the adjusting cylinder 5, the wafer part and the wafer placement plate 21 slide together with the pull-out box 2 into the enclosed space of the detection box 1. Under the action of the moving slide cylinder 7, the moving rod 71 moves, and the moving rod 71 drives the wafer placement plate 21 to move slowly. The laser beam emitted by the A particle laser emitter 4 is directed at the wafer part on the surface of the wafer placement plate 21. When there are particles, scattered light is emitted. The scattered scattered light is received by the corresponding a scattered light photoelectric receiver 8. The particle laser emitters 4 with different position distributions irradiate different positions on the wafer part, and different positions on it can be detected.

[0035] Although the embodiments of the present invention have been shown and described (see the above detailed description for details), it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mobile wafer cleaning and testing device, comprising a testing box, characterized in that: The detection box comprises a detection box body (1), a drawer box (2), and a box cover (3); an adjusting cylinder (5) is provided inside the detection box body (1); a connecting plate (51) connected to the drawer box (2) is provided at the end of the adjusting cylinder (5); a split wafer placement plate (21) is provided inside the drawer box (2); a movable slide cylinder (7) is provided on the opposite surface of the detection box body (1); a movable slide cylinder (7) is provided on the movable slide cylinder (7); a support rail (6) is provided on the inner surface of the bottom end of the detection box body (1); scattered light photoelectric receivers (8) are equidistantly distributed on the opposite inner side walls of the detection box body (1); A mounting plate (31) is provided on the inner surface of the box cover (3), and a particle laser emitter (4) is provided on the mounting plate (31). A laser sensor (13) is provided at a corner position inside one end of the detection box (1). A fixing box (9) is provided on the surface of one end of the detection box (1), and a lifting electric push rod (101), a connecting rod (102) and a sealing plate (103) are provided on the fixing box (9). The lifting electric push rod (101) is installed inside the fixing box (9), and the two ends of the connecting rod (102) are respectively connected to the lifting electric push rod (101) and the sealing plate (103), and the sealing plate (103) is inserted into the inside of the detection box (1).

2. A mobile wafer cleaning and testing device according to claim 1, characterized in that: The surface of the detection box (1) is provided with a rectangular slide groove for the pull-out box (2) to pass through, the pull-out box (2) is slidably connected to the detection box (1), the bottom surface of the wafer placement plate (21) is flush with the surface H of the support rail (6), and the side of the detection box (1) is provided with a support plate (11).

3. The mobile wafer cleaning and testing device according to claim 1, characterized in that: The movable slide cylinder (7) is parallel to the support rail (6), the movable rod (71) is perpendicular to the movable slide cylinder (7), the bottom surface of the movable rod (71) is curved, and the bottom end of the movable rod (71) is tangent to the surface of the drawer box (2).

4. The mobile wafer cleaning and testing device according to claim 1, characterized in that: The connecting rod (102) is of an "L"-shaped structure. The connecting rod (102) is slidably connected to the fixing box (9). The sealing plate (103) is slidably connected to the detection box (1). A discharge port is provided on the side of the detection box (1). A movable groove that is clearance-matched with the sealing plate (103) is provided on the side surface of the detection box (1). The discharge port is communicated with the movable groove.

5. The mobile wafer cleaning and testing device according to claim 1, characterized in that: The detection box (1) has equidistantly distributed partition plates (12) on opposite surfaces thereof. The partition plates (12) are perpendicular to the detection box (1), and the partition plates (12) and the scattered light photoelectric receivers (8) are alternately distributed.

6. The mobile wafer cleaning and testing device according to claim 1, characterized in that: The particle laser emitters (4) on the box cover (3) are marked as A particle laser emitter (4), B particle laser emitter (4), C particle laser emitter (4) and D particle laser emitter (4) in sequence; the A particle laser emitter (4) and the D particle laser emitter (4) are opposite to each other, and the B particle laser emitter (4) and the C particle laser emitter (4) are staggered.

7. The mobile wafer cleaning and testing device according to claim 6, characterized in that: The scattered light photoelectric receivers (8) on the detection box (1) are marked as scattered light photoelectric receiver a (8), scattered light photoelectric receiver b (8), scattered light photoelectric receiver c (8) and scattered light photoelectric receiver d (8) in sequence, and the scattered light photoelectric receiver a (8), scattered light photoelectric receiver b (8), scattered light photoelectric receiver c (8) and scattered light photoelectric receiver d (8) correspond one by one to the A particle laser emitter (4), the B particle laser emitter (4), the C particle laser emitter (4) and the D particle laser emitter (4), respectively.

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