Silicon wafer liquid drop removing device based on multi-stage adsorption transmission

Abstract

The utility model discloses a silicon wafer liquid drop removing device based on multistage adsorption transmission, which belongs to the technical field of solar cell preparation, and comprises an adsorption transmission mechanism, a liquid drop removing mechanism, a liquid drop removing mechanism, a liquid drop removing mechanism, a liquid drop removing mechanism and a liquid drop removing mechanism, the conveying belt is used for conveying silicon wafers, and a plurality of adsorption holes are formed in the conveying belt; the adsorption unit comprises an adsorption chamber and at least two stages of adsorption table boards which are sequentially arranged at the top of the adsorption chamber from bottom to top, a plurality of through holes are formed in each stage of adsorption table board, and the through holes are communicated with the adsorption chamber and the adsorption holes; the adsorption chamber is communicated with the air exhaust unit; and the heating clearing mechanism is arranged above the adsorption transmission mechanism and is arranged corresponding to the liquid drop clearing area of the silicon wafer on the conveying belt. According to the utility model, the multistage adsorption units are arranged below the conveyor belt, so that the silicon wafers can be prevented from deviating in the conveying process, and meanwhile, the silicon wafers are prevented from deviating when the hot air impulsive force of the heating and removing mechanism acts on the silicon wafers in the liquid drop cleaning process.

Description

Technical Field

[0001] The utility model belongs to the technical field of solar cell preparation, and in particular relates to a silicon wafer droplet removing device based on multi-stage adsorption transmission. Background Art

[0002] During the production process of solar cell modules, due to the production process requirements, it is necessary to use lasers to split the cell silicon wafers into neat small-sized cell silicon wafers. Laser splitting adopts the principle of thermal stress controlled fracture, using local laser irradiation and synchronous liquid mist cooling to produce regional temperature differences, and then generate special tensile and compressive stress fields to control the crack expansion process.

[0003] After laser slicing, the liquid mist will remain on the silicon wafer in the form of droplets, which will reduce the yield of the silicon wafer and increase the defective rate of products produced at the back-end station, greatly affecting the product quality of the production line. Therefore, a device for removing the droplets needs to be set at the conveying station after laser slicing.

[0004] When using wind power to remove liquid droplets, if the wind force acting on the silicon wafer is too strong, the position of the silicon wafer will be shifted due to the impact force during the process of removing the liquid droplets, causing the silicon wafer to be transported tilted. Utility Model Content

[0005] In response to one or more of the above defects or improvement needs in the prior art, the utility model provides a silicon wafer droplet removal device based on multi-stage adsorption transmission, which can prevent the position of the silicon wafer from shifting during the transmission process, and at the same time prevent the position of the silicon wafer from shifting when the hot air impact of the heating and cleaning mechanism acts on the silicon wafer during the process of cleaning the droplets.

[0006] In order to achieve the above-mentioned purpose, the utility model provides a silicon wafer droplet removal device based on multi-stage adsorption transmission, comprising:

[0007] The adsorption transmission mechanism comprises a conveyor belt, an adsorption unit arranged below the conveyor belt, and an exhaust unit; the conveyor belt is used to transport silicon wafers, and the conveyor belt is provided with a plurality of adsorption holes; the adsorption unit comprises an adsorption chamber and at least two levels of adsorption tables arranged on the top of the conveyor belt in sequence from bottom to top, and each level of the adsorption table is provided with a plurality of through holes, each through hole is connected to the adsorption chamber and the adsorption holes; the adsorption chamber is connected to the exhaust unit;

[0008] The heating and removing mechanism is arranged above the adsorption transmission mechanism and is arranged corresponding to the liquid droplet removing area of ​​the silicon wafer on the conveyor belt.

[0009] As a further improvement of the utility model, the top of the adsorption chamber is provided with a first-level adsorption table and a second-level adsorption table in sequence from bottom to top; the first-level adsorption table is provided with a plurality of first through holes, and the second-level adsorption table is provided with a plurality of second through holes;

[0010] The hole area of ​​the first through hole is greater than the hole area of ​​the second through hole; and / or the number of the first through holes is less than the number of the second through holes.

[0011] As a further improvement of the present invention, the heating and removing mechanism includes a transverse guide rail assembly and at least one heating and blowing assembly arranged below it and capable of moving laterally in a direction perpendicular to the belt conveying direction; the transverse guide rail assembly is used to drive the heating and blowing assembly to move above the droplet removing area.

[0012] As a further improvement of the present invention, the transverse guide rail assembly includes a transverse guide rail, a transmission slider, a drag chain and a mounting bracket; the transverse guide rail is arranged on the guide rail bracket, the transmission slider is arranged on the transverse guide rail, one end of the drag chain is connected to the guide rail bracket, and the other end is connected to the transmission slider; the bottom of the transmission slider is connected to the heating and blowing assembly through the mounting bracket.

[0013] As a further improvement of the present invention, a surrounding chamber is provided inside the heating and blowing assembly;

[0014] A heating pipe is provided in the surrounding chamber;

[0015] The heating and blowing assembly is provided with a plurality of air inlet holes, each of which is in communication with the surrounding chamber;

[0016] An air outlet is provided at the bottom of the heating and blowing assembly, the air outlet is communicated with the surrounding chamber, and the air outlet is in the shape of a long strip extending along the direction of silicon wafer splitting.

[0017] As a further improvement of the present invention, a temperature sensor is further provided in the surrounding chamber; and / or,

[0018] Heat insulation boards are installed around the periphery of the chamber.

[0019] As a further improvement of the present invention, a wind direction adjustment plate is provided at the bottom of the heating and blowing assembly, and the wind direction adjustment plate is arranged corresponding to the air outlet, and the angle between the wind direction adjustment plate and the bottom of the heating and blowing assembly is adjustable.

[0020] As a further improvement of the utility model, two air outlets are provided at the bottom of the heating and blowing assembly; along the direction of silicon wafer splitting, the air outlets are arranged on both sides of the bottom of the heating and blowing assembly, and each air outlet corresponds to one wind direction adjustment plate, and the bottoms of the two wind direction adjustment plates are respectively located above the two laser slicing sides after the silicon wafer is split.

[0021] As a further improvement of the present invention, the adsorption transmission mechanism further includes a driving wheel and a driven wheel, the driving wheel and the driven wheel are connected via the conveyor belt transmission, wherein the driving wheel is connected to the driving motor via a coupling; and / or,

[0022] The adsorption transmission mechanism further includes a brush arranged corresponding to the conveyor belt; and / or,

[0023] The adsorption transmission mechanism also includes a base, and the driving wheel, the driven wheel and the adsorption unit are all installed on the base.

[0024] In general, the above technical solution conceived by the utility model has the following beneficial effects compared with the prior art:

[0025] (1) The silicon wafer droplet removal device based on multi-stage adsorption transmission of the utility model can evenly disperse the adsorption gas by arranging a multi-stage adsorption table under the conveyor belt, so that the silicon wafer on the conveyor belt is subjected to uniform adsorption force, so that the silicon wafer is smoothly transported by the conveyor belt, and the position of the silicon wafer can be prevented from being shifted during the transportation process. At the same time, the position of the silicon wafer can be prevented from being shifted when the hot air impact force of the heating and cleaning mechanism acts on the silicon wafer during the process of cleaning the droplets.

[0026] (2) In the silicon wafer droplet removal device based on multi-stage adsorption transmission of the utility model, the gas is heated in the surrounding chamber and then transmitted out of the surrounding chamber through the gas outlet, which can increase the flow path of the gas, ensure that the gas reaches the preset temperature before being transmitted out of the surrounding chamber, and acts on both sides of the laser scriber through the wind direction adjustment plate, thereby releasing high-pressure hot air to both sides of the laser scriber, breaking up the residual droplets on the silicon wafer and drying them. The droplet removal effect is good, and the angle of the wind direction adjustment plate relative to the bottom of the heating and blowing assembly can be adjusted, which can also have a good droplet removal effect when the silicon wafer position deviates.

[0027] (3) The silicon wafer droplet removal device based on multi-stage adsorption transmission of the utility model can remove droplets on multiple silicon wafers at the same time by setting multiple heating and blowing components, and the removal efficiency is higher. In addition, the heating and blowing components are arranged on the transverse guide rail component, so that the lateral position of the heating and removing mechanism can be adjusted to adapt to silicon wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic diagram of the overall structure of a silicon wafer droplet removal device based on multi-stage adsorption transmission according to an embodiment of the utility model;

[0029] Figure 2 It is a schematic diagram of the three-dimensional structure of the adsorption and transmission mechanism involved in the silicon wafer droplet removal device based on multi-stage adsorption and transmission according to an embodiment of the utility model;

[0030] Figure 3 It is a schematic diagram of the planar structure of the adsorption and transmission mechanism involved in the silicon wafer droplet removal device based on multi-stage adsorption and transmission according to an embodiment of the utility model;

[0031] Figure 4 It is a schematic diagram of the structure of the heating and removing mechanism involved in the silicon wafer droplet removing device based on multi-stage adsorption transmission according to an embodiment of the utility model;

[0032] Figure 5 It is a structural schematic diagram of the first viewing angle of the heating and blowing assembly structure involved in the heating and cleaning mechanism of the embodiment of the utility model;

[0033] Figure 6 This is a structural schematic diagram of the second viewing angle of the heating and blowing component structure involved in the heating and cleaning mechanism of an embodiment of the utility model.

[0034] In all the drawings, the same reference numerals represent the same technical features, specifically: 1. adsorption and conveying mechanism; 2. transverse guide rail assembly; 3. heating and blowing assembly;

[0035] 11. Conveyor belt; 12. Driving wheel; 13. Driven wheel; 14. Driving motor; 15. Primary adsorption table; 16. Secondary adsorption table; 17. Base; 18. Brush; 21. Transverse guide rail; 22. Transmission slider; 23. Drag chain; 24. Mounting bracket; 31. Air inlet; 32. Surrounding chamber; 33. Heat insulation board; 34. Air outlet; 35. Wind direction adjustment plate. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. In addition, the technical features involved in each embodiment of the utility model described below can be combined with each other as long as they do not conflict with each other.

[0037] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] The embodiment of the utility model provides a silicon wafer droplet removal device based on multi-stage adsorption transmission, including an adsorption transmission mechanism and a heating removal mechanism. The adsorption transmission mechanism includes a conveyor belt, an adsorption unit arranged below it, and an exhaust unit. The conveyor belt is used to transport silicon wafers, and the conveyor belt is provided with a plurality of adsorption holes; the adsorption unit includes an adsorption chamber and at least two levels of adsorption tables arranged on the top from bottom to top in sequence, and each level of the adsorption table is provided with a plurality of through holes, each through hole is connected to the adsorption chamber and the adsorption hole; at the same time, the adsorption chamber is connected to the exhaust unit.

[0042] See also Figures 1 to 3As shown, in the specific embodiment provided by the utility model, the adsorption transmission mechanism 1 includes a conveyor belt 11, and an adsorption unit and an exhaust unit are arranged below the conveyor belt 11; the adsorption unit includes an adsorption chamber and a first-level adsorption table 15 and a second-level adsorption table 16 arranged on the top from bottom to top. The first-level adsorption table 15 and the second-level adsorption table 16 are preferably arranged in a stacked manner, and the second-level adsorption table 16 is preferably arranged at intervals below the conveyor belt 11, so that the adsorption table does not affect the transmission of the conveyor belt 11. The conveyor belt 11 is used to transport silicon wafers, and is provided with a plurality of adsorption holes, the first-level adsorption table 15 is provided with a first through hole, and the second-level adsorption table 16 is provided with a second through hole, each through hole is connected to the adsorption chamber and the adsorption hole of the conveyor belt, and the adsorption chamber is provided with at least one exhaust hole, which is connected to the exhaust unit.

[0043] A negative pressure is generated in the adsorption chamber through the vacuum unit, and the negative pressure is transmitted to the adsorption holes through the first through holes and the second through holes in sequence, thereby sucking the silicon wafers on the conveyor belt. The setting of the multi-stage adsorption table can evenly transmit the negative pressure to the adsorption holes, so that the silicon wafers are subjected to a uniform downward adsorption force.

[0044] The heating and removing mechanism is arranged above the adsorption transmission mechanism 1, and is arranged corresponding to the liquid droplet removing area of ​​the silicon wafer on the conveyor belt. The heating and removing mechanism includes a transverse guide rail assembly 2 and a heating and blowing assembly 3 arranged below the transverse guide rail assembly 2 and capable of moving laterally in a direction perpendicular to the belt conveying direction. The transverse guide rail assembly 2 is used to drive the heating and blowing assembly 3 to move above the liquid droplet removing area. It should be noted that the liquid droplet removing area described in the utility model refers to the area on the side close to each other in the middle of the two silicon wafers after being sliced, and the side close to each other refers to the side of the laser slicing.

[0045] Preferably, the hole area of ​​the first through hole is larger than the hole area of ​​the second through hole, and / or the number of the first through holes is less than the number of the second through holes, so that the gas is dispersed into multiple second through holes through the first through holes, making the final adsorption force acting on the conveyor belt more uniform.

[0046] In the process of conveying the silicon wafer and removing the liquid droplets in this embodiment, the silicon wafer is always subjected to a downward adsorption force, which can prevent the silicon wafer from shifting during the conveying process and the process of removing the liquid droplets. It can be understood that the downward adsorption force on the silicon wafer should not affect the conveying of the silicon wafer and will not damage the silicon wafer.

[0047] In a non-limiting manner, Figure 2 As shown, the primary adsorption table 15 is provided with four first through holes, the secondary adsorption table 16 is provided with a plurality of second through holes arranged in an array, and the conveyor belt 11 is provided with a plurality of elliptical adsorption holes arranged in an array.

[0048] By setting the above-mentioned multi-stage adsorption and dispersion device, under the action of the exhaust unit, the adsorption airflow is transmitted to the second through hole on the second-stage adsorption table 16 through the first through hole on the first-stage adsorption table 15, or further transmitted to the through hole on the next-stage adsorption table, and finally transmitted to the adsorption hole on the conveyor belt 11. After the adsorption airflow is divided by multiple stages, the adsorption area is increased, and the silicon wafer is subjected to a uniform downward adsorption force, which effectively prevents the position deviation caused by the hot air impact when the heating and cleaning mechanism removes the droplets on the silicon wafer and the position deviation during the silicon wafer transmission process.

[0049] It can also be understood that in the above technical solution, the adsorption unit is located below the conveyor belt 11, which means it is located below the silicon wafer conveying surface on the top of the conveyor belt 11, that is, between the annular conveyor belts 11, and is used to transport silicon wafers under the action of adsorption.

[0050] In a preferred embodiment, the air extraction unit includes but is not limited to air extraction equipment in the prior art such as a blower or a vacuum generator, as long as it can generate negative pressure in the adsorption chamber so that the silicon wafer is adsorbed on the conveyor belt. The air extraction unit is further preferably a blower with controllable wind power, which is used to adjust the adsorption air volume. By controlling the air volume of the blower, the strength of silicon wafer adsorption can be adjusted, so as to adapt to silicon wafers of different specifications and prevent the occurrence of undesirable effects such as hidden cracks in the silicon wafer due to inappropriate adsorption strength.

[0051] In a preferred embodiment, the adsorption transmission mechanism 1 further includes a driving wheel 11 and a driven wheel 12, and the driving wheel 11 and the driven wheel 12 are connected through a transmission belt 11, wherein the driving wheel 12 is connected to a driving motor 14 through a coupling, and is used to provide power for the movement of the conveyor belt 11, so that it can achieve the effect of reciprocating transmission of silicon wafers. Further preferably, according to the tensioning principle of the driving wheel and the driven wheel in the prior art, the driving wheel 12 and the driven wheel 13 of the utility model can perform fine adjustment of the tension of the conveyor belt 11 to ensure the transmission smoothness of the conveyor belt 11.

[0052] In a preferred embodiment, the surface of the conveyor belt 11 is made of a high temperature resistant material, which can improve the high temperature resistance of the conveyor belt 11. Exemplarily, the conveyor belt 11 includes a polyester canvas layer and a heat-resistant rubber layer vulcanized on both sides thereof, and the conveyor belt 11 can be formed by high temperature vulcanization bonding of polyester canvas covered with heat-resistant rubber on the top and bottom.

[0053] In a preferred embodiment, in the adsorption transmission mechanism 1, the conveyor belt 11 is provided with a brush 18, and the inclination direction of the brush 18 is preferably opposite to the moving direction of the conveyor belt 11, so as to facilitate automatic cleaning of the conveyor belt 11 during its operation. The brush 18 is further preferably arranged below the conveyor belt 11, and automatic cleaning is achieved when the conveyor belt 11 moves below and passes through the brush 18.

[0054] The utility model can clean the dirt remaining on the conveyor belt 11 after the dripping liquid is blown away and dried by adding a brush 18, and can realize automatic cleaning of the conveyor belt 11 during the transmission process. Therefore, there is no need for manual processing, which reduces the manual maintenance time, and there is no need to frequently replace the conveyor belt, which increases the long-term operation time of the conveyor belt 11.

[0055] More preferably, the adsorption transmission mechanism 1 further includes a base 17, and the driving wheel 12, the driven wheel 13 and the adsorption unit are all mounted on the base 17 and supported by the base 17. Specifically, they can be mounted on the base 17 through corresponding mounting structures, and those skilled in the art can design them according to specific actual conditions, which is not limited here.

[0056] Furthermore, in order to make the lateral position of the heating and cleaning mechanism adjustable to accommodate silicon wafers of different sizes, the heating and cleaning mechanism of the utility model comprises a heating and blowing assembly 3 and a transverse guide rail assembly 2 for realizing lateral movement thereof in a direction perpendicular to the belt conveying direction.

[0057] Specifically, Figure 4 As shown, the transverse guide rail assembly 2 includes a transverse guide rail 21, a transmission slider 22, a drag chain 23 and a mounting bracket 24. The transverse guide rail 21 is arranged on the guide rail bracket, the transmission slider 22 is arranged on the transverse guide rail 21, one end of the drag chain 23 is connected to the guide rail bracket, and the other end is connected to the transmission slider 22. The bottom of the transmission slider 22 is connected to the heating and blowing assembly 3 through the mounting bracket 24, and the bottom of the transverse guide rail assembly 2 is preferably connected to multiple heating and blowing assemblies 3 at the same time through the corresponding mounting bracket 24. By manually adjusting the movement of the transmission slider 22 and the drag chain 23, the heating and blowing assembly 3 is controlled to move horizontally along the conveyor belt 11, so that the heating and blowing assembly 3 is located above the silicon wafer removal area, thereby adapting to silicon wafers of different sizes, which can increase the efficiency of silicon wafer production and effectively improve the effect of liquid mist removal.

[0058] In a preferred embodiment, the heating and cleaning mechanism includes a plurality of heating and blowing components 3, one heating and blowing component 3 is used to clean the liquid droplets on a silicon wafer, and by setting a plurality of heating and blowing components, the liquid droplets on multiple silicon wafers can be cleaned at the same time, and the cleaning efficiency is higher. In a specific embodiment shown in the drawings of the utility model, two heating and blowing components 3 are arranged under the transverse guide rail component 2, which can heat and blow the liquid droplets in the cleaning area of ​​four silicon wafers after slicing at the same time.

[0059] like Figure 5 and 6As shown, the heating and blowing assembly 3 specifically includes a surrounding chamber 32, which is arranged inside the heating and blowing assembly 3, and the surrounding chamber 32 includes a circuitous channel for gas flow; the gas transmission path is extended by the circuitous channel in the surrounding chamber 32, which can ensure that the gas is heated to a preset temperature before being transmitted out of the surrounding chamber 32. The heating and blowing assembly 3 is provided with a plurality of air inlet holes 31, each of which is connected to the surrounding chamber 32 for air intake to generate air volume. The air inlet holes 31 are preferably arranged at the top of the surrounding chamber 32.

[0060] A heating tube is provided in the surrounding chamber 32, and preferably a temperature sensor is also provided, and the heating tube and the temperature sensor are vertically inserted in the surrounding chamber 32. The heating tube is used to heat the inside of the surrounding chamber 32, thereby heating the gas flowing in the circuitous channel of the surrounding chamber 32; the temperature sensor is used to detect the real-time temperature in the surrounding chamber 32, and the temperature feedback by the temperature sensor forms a closed-loop control through a PID controller, which is convenient for controlling the temperature in the surrounding chamber 32, ensuring that the temperature in the surrounding chamber 32 is in a controllable state, thereby making the blowing temperature generated by the heating and blowing assembly 3 when removing droplets controllable.

[0061] An air outlet 34 is provided at the bottom of the heating and blowing assembly 3, and the air outlet 34 is connected to the surrounding chamber 32. The air outlet is in the shape of a long strip extending in the direction of the silicon wafer splitting, so that the blown gas is in the shape of a water curtain. A wind direction adjustment plate 35 is provided corresponding to the air outlet 34, and the wind direction adjustment plate 35 corresponds to the laser scribing side in the middle of the silicon wafer. The gas reaching the drying temperature in the surrounding chamber 32 is transmitted out of the surrounding chamber 32 through the air outlet 34 and guided by the wind direction adjustment plate 35, so that the generated high-pressure hot air acts on the laser scribing side, breaks up and dries the droplets on the silicon wafer, so that the droplets on the surface of the silicon wafer are cleaned.

[0062] In a preferred embodiment, two air outlets 34 are provided at the bottom of the heating and blowing assembly 3. Along the direction of silicon wafer splitting, the air outlets 34 are provided on both sides of the bottom of the heating and blowing assembly 3, and each air outlet 34 is provided with a corresponding wind direction adjustment plate 35. The bottoms of the two wind direction adjustment plates 35 are respectively located above the two laser scribing sides after the silicon wafer is split. The gas in the surrounding chamber 32 is transmitted through the air outlets 34 and guided through the wind direction adjustment plates 35, so that the gas can act on the two laser scribing sides.

[0063] In the embodiment of the utility model, the angle between the wind direction adjustment plate 35 and the bottom of the heating and blowing assembly is adjustable, and the deviation of different positions of the silicon wafer can be easily adapted by adjusting the corresponding blowing position.

[0064] When the heating and blowing assembly 3 moves to above the droplet removal area of ​​the silicon wafer, the angle between the wind direction adjustment plate 35 and the bottom of the heating and blowing assembly 3 is adjusted according to the position of the laser scribing side of the silicon wafer, so that the bottoms of the two wind direction adjustment plates 35 can face the two sides of the laser scribing, so that the high-pressure hot air blown out from the surrounding chamber 32 can just act on the droplet existence area of ​​the silicon wafer, so that the droplet removal effect is better.

[0065] In a preferred embodiment, a heat insulation board 33 is installed around the periphery of the chamber 32, which can effectively isolate the temperature around the chamber 32 and ensure that the temperature inside it is not easy to spread, thereby avoiding heat loss.

[0066] In the heating and blowing assembly 3 of the utility model embodiment, gas enters the interior of the surrounding chamber 32 from the air inlet 31, circulates through the circuitous channel of the surrounding chamber 32 to reach the bottom outlet, passes through the heating tube during the circulation process to ensure that the gas can reach the temperature required for drying, and then blows out from the air outlet 34, and finally passes through the wind direction adjustment plate 35 to make the heated gas act on the cleaning area of ​​the silicon wafer, thereby blowing away and drying the droplets in the droplet cleaning area.

[0067] It is easy for those skilled in the art to understand that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer droplet removal device based on multi-stage adsorption transmission, characterized in that: include: The adsorption transmission mechanism comprises a conveyor belt, an adsorption unit arranged below the conveyor belt, and an exhaust unit; the conveyor belt is used to transport silicon wafers, and the conveyor belt is provided with a plurality of adsorption holes; the adsorption unit comprises an adsorption chamber and at least two levels of adsorption tables arranged on the top of the conveyor belt in sequence from bottom to top, and each level of the adsorption table is provided with a plurality of through holes, each through hole is connected to the adsorption chamber and the adsorption holes; the adsorption chamber is connected to the exhaust unit; The heating and removing mechanism is arranged above the adsorption transmission mechanism and is arranged corresponding to the liquid droplet removing area of ​​the silicon wafer on the conveyor belt.

2. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to claim 1 is characterized in that: The top of the adsorption chamber is provided with a primary adsorption table and a secondary adsorption table in sequence from bottom to top; the primary adsorption table is provided with a plurality of first through holes, and the secondary adsorption table is provided with a plurality of second through holes; The hole area of ​​the first through hole is greater than the hole area of ​​the second through hole; and / or the number of the first through holes is less than the number of the second through holes.

3. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to claim 1 is characterized in that: The heating and cleaning mechanism includes a transverse guide rail assembly and at least one heating and blowing assembly arranged below the transverse guide rail assembly and capable of moving laterally in a direction perpendicular to the belt conveying direction; the transverse guide rail assembly is used to drive the heating and blowing assembly to move above the droplet cleaning area.

4. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to claim 3 is characterized in that: The transverse guide rail assembly includes a transverse guide rail, a transmission slider, a drag chain and a mounting bracket; the transverse guide rail is arranged on the guide rail bracket, the transmission slider is arranged on the transverse guide rail, one end of the drag chain is connected to the guide rail bracket, and the other end is connected to the transmission slider; the bottom of the transmission slider is connected to the heating and blowing assembly through the mounting bracket.

5. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to claim 3 is characterized in that: The interior of the heating and blowing assembly is provided with a surrounding chamber; A heating pipe is provided in the surrounding chamber; The heating and blowing assembly is provided with a plurality of air inlet holes, each of which is in communication with the surrounding chamber; An air outlet is provided at the bottom of the heating and blowing assembly, the air outlet is communicated with the surrounding chamber, and the air outlet is in the shape of a long strip extending along the direction of silicon wafer splitting.

6. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to claim 5 is characterized in that: A temperature sensor is also provided in the surrounding chamber; and / or, Heat insulation boards are installed around the periphery of the chamber.

7. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to claim 5 is characterized in that: A wind direction adjustment plate is provided at the bottom of the heating and blowing assembly. The wind direction adjustment plate is arranged corresponding to the air outlet, and the angle between the wind direction adjustment plate and the bottom of the heating and blowing assembly is adjustable.

8. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to claim 7 is characterized in that: Two air outlets are provided at the bottom of the heating and blowing assembly; along the direction of silicon wafer splitting, the air outlets are arranged on both sides of the bottom of the heating and blowing assembly, and each air outlet is correspondingly provided with a wind direction adjustment plate, and the bottoms of the two wind direction adjustment plates are respectively located above the two laser slicing sides after the silicon wafer is split.

9. The silicon wafer droplet removal device based on multi-stage adsorption transmission according to any one of claims 1 to 8, characterized in that: The adsorption transmission mechanism further comprises a driving wheel and a driven wheel, wherein the driving wheel and the driven wheel are connected to each other through the conveyor belt transmission, wherein the driving wheel is connected to the driving motor through a coupling; and / or, The adsorption transmission mechanism further includes a brush arranged corresponding to the conveyor belt; and / or, The adsorption transmission mechanism also includes a base, and the driving wheel, the driven wheel and the adsorption unit are all installed on the base.

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