Circuit board and battery

Abstract

The utility model discloses a circuit board and a battery, the disclosed circuit board comprises a first function module and a second function module, the first function module comprises a first circuit substrate and a first function device, the first circuit substrate comprises a first part and a second part which are connected, and the first function device comprises a second function device and a second function device. The first functional device is arranged on the first part and is electrically connected with the first part, the second part is provided with a concave part, and at least part of the second functional module is arranged in the concave part and is electrically connected with the first functional module. According to the scheme, the problem that the circuit board is relatively thick and is not beneficial to the capacity design of the battery in the prior art can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board design, in particular to a circuit board and a battery. Background Art

[0002] The circuit board is a crucial component in the battery. With the development of technology, the functions of the battery are increasing. Therefore, the circuit board needs to realize the corresponding functions by setting multiple functional modules. In the related art, since the multiple functional modules of the circuit board are set in a stacked manner, the thickness of the circuit board in the related art is relatively large, which is not conducive to the capacity design of the battery in the related art. Utility Model Content

[0003] The utility model discloses a circuit board and a battery, so as to solve the problem in the related art that the circuit board is thick and is not conducive to the capacity design of the battery.

[0004] In order to solve the above technical problems, the utility model is achieved as follows:

[0005] In a first aspect, the present application discloses a circuit board, which includes a first functional module and a second functional module, wherein the first functional module includes a first circuit substrate and a first functional device, the first circuit substrate includes a first part and a second part connected, the first functional device is arranged in the first part and is electrically connected to the first part, the second part is provided with a recess, and at least part of the second functional module is arranged in the recess and is electrically connected to the first functional module.

[0006] In a second aspect, the present application further discloses a battery, wherein the disclosed battery comprises the circuit board described in the first aspect.

[0007] The technical solution adopted by the utility model can achieve the following technical effects:

[0008] The circuit board disclosed in the embodiment of the present application sets the first functional module to a structure including a first circuit substrate and a first functional device, so that the first functional device can be arranged in a first part of the first circuit substrate and electrically connected to the first part, and at least a part of the second functional module is arranged in a recessed part of the first circuit substrate. Compared with the circuit board in the related art in which the first functional module and the second functional module 200 are directly stacked, the thickness of the circuit board can be reduced, which is beneficial to the design of increasing the capacity of the battery when the circuit board is applied to the battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram of the overall structure of the circuit board disclosed in the embodiment of the utility model;

[0010] Figure 2It is a structural schematic diagram of the second functional module disclosed in the embodiment of the utility model;

[0011] Figure 3 A schematic diagram of the structure of a first circuit substrate disclosed in an embodiment of the utility model;

[0012] Figure 4 This is a schematic diagram of a structure in which a second functional module disclosed in an embodiment of the utility model is arranged in a first functional module;

[0013] Figure 5 This is a schematic diagram of a circuit board disclosed in an embodiment of the utility model after being packaged by a plastic packaging part.

[0014] Description of reference numerals:

[0015] 100 - first functional module, 110 - first circuit substrate, 111 - first portion, 112 - second portion, 112a - recessed portion, 120 - first functional device,

[0016] 200 - second functional module, 210 - second circuit substrate, 220 - second functional device,

[0017] 300-Plastic sealing department,

[0018] 400-Flexible substrate,

[0019] 500-welding lugs. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] The technical solutions disclosed in various embodiments of the present utility model are described in detail below in conjunction with the accompanying drawings.

[0022] Please refer to Figures 1 to 5 The embodiment of the utility model discloses a circuit board, and the disclosed circuit board includes a first functional module 100 and a second functional module 200. Specifically, the first functional module 100 may be a power module, and the second functional module 200 may be a control module. Of course, the first functional module 100 and the second functional module 200 may also be other functional modules, and the embodiment of the application does not specifically limit the first functional module 100 and the second functional module 200.

[0023] The first functional module 100 includes a first circuit substrate 110 and a first functional device 120. The first circuit substrate 110 includes a first portion 111 and a second portion 112 connected to each other. It should be noted that the first portion 111 and the second portion 112 may be connected in the length direction of the first circuit substrate 110, for example, Figure 3 The direction from left to right in the figure may be the length direction of the first circuit substrate 110. Of course, the first portion 111 and the second portion 112 may also be connected in the width direction of the first circuit substrate 110, and the embodiment of the present application does not specifically limit the connection direction of the first portion 111 and the second portion 112.

[0024] The first functional device 120 is disposed in the first portion 111 and electrically connected to the first portion 111. The second portion 112 is provided with a recess 112a, and at least part of the second functional module 200 is disposed in the recess 112a and electrically connected to the first functional module (100).

[0025] The circuit board disclosed in the embodiment of the present application is configured such that the first functional module 100 is configured to include a first circuit substrate 110 and a first functional device 120, so that the first functional device 120 can be disposed in the first part 111 of the first circuit substrate 110 and electrically connected to the first part 111, and at least a part of the second functional module 200 is disposed in the recessed portion 112a of the first circuit substrate 110. Compared with the circuit board in the related art in which the first functional module 100 and the second functional module 200 are directly stacked, the thickness of the circuit board can be reduced, which is beneficial to the capacity design of the battery when the circuit board is applied to the battery.

[0026] It should be noted that the first circuit substrate 110 is equivalent to a PCB (Printed Circuit Board, rigid circuit board), and the first circuit substrate 110 and the first functional device 120 as a whole are equivalent to a PCBA (Printed Circuit Board Assembly, a PCB blank board undergoes SMT assembly, or the entire process of DIP plug-in).

[0027] Optionally, the second functional module 200 may include a second circuit substrate 210 and a second functional device 220. The first surface of the second circuit substrate 210 may be connected to the bottom of the recessed portion 112a, and the second functional device 220 may be disposed on the second surface of the second circuit substrate 210, wherein the first surface of the second circuit substrate 210 and the second surface of the second circuit substrate 210 are opposite to each other.

[0028] The circuit board disclosed in the embodiment of the present application discloses a specific structure of the second functional module 200, so that at least a portion of the second functional module 200 including the second circuit substrate 210 and the second functional device 220 is disposed in the recessed portion 112a.

[0029] It should be noted that the second circuit substrate 210 is equivalent to a PCB (Printed Circuit Board, rigid circuit board), and the second circuit substrate 210 and the second functional device 220 as a whole are equivalent to a PCBA (Printed Circuit Board Assembly, a PCB blank board that undergoes the entire process of SMT assembly or DIP plug-in).

[0030] Of course, in another embodiment, the second functional module 200 may also be other structures. For example, the second functional module 200 may also only include one of the second circuit substrate 210 and the second functional device 220. The embodiment of the present application does not limit the specific structure of the second functional module 200.

[0031] Furthermore, a first solder pad may be provided at the bottom of the recessed portion 112a, and the first surface of the second circuit substrate 210 may be electrically connected to the first functional module 100 through the first solder pad, thereby enabling electrical connection between the first functional module 100 and the second functional module 200, and further enabling information transmission between the first functional module 100 and the second functional module 200.

[0032] In the process of manufacturing the circuit board, since it is necessary to first solder the second functional device 220 to the second circuit substrate 210, and then solder the second functional device 220 and the second circuit substrate 210 as a whole to the first solder pad, since the second functional device 220 and the second circuit substrate 210 are soldered as a whole to the first solder pad and the first functional device 120 are soldered to the first portion 111 in the same process, in order to avoid the second functional device 220 and the second circuit substrate 210 being soldered as a whole to the first solder pad and the first functional device 120 being soldered, The welding part of the substrate 210 melts and causes damage to the circuit board. Optionally, the first functional device 120 can be welded to the first part 111 through the first welding part, and the second functional device 220 can be welded to the second circuit substrate 210 through the second welding part, wherein the melting point of the second welding part is greater than the melting point of the first welding part, thereby avoiding the second welding part between the second functional device 220 and the second circuit substrate 210 melting and causing damage to the circuit board when the whole formed by the second functional device 220 and the second circuit substrate 210 is welded to the first welding pad and the first functional device 120 is welded.

[0033] Since the first circuit substrate 110 is distributed with a copper wire layer, in order to facilitate the layout of the copper wire layer, optionally, the recessed portion 112a can be opened at the edge of the first circuit substrate 110. It should be noted that the recessed portion 112a can be opened at one end of the first circuit substrate 110 in the length direction (i.e., the edge in the length direction). Of course, the recessed portion 112a can be opened at one end of the first circuit substrate 110 in the width direction (i.e., the edge in the width direction), and the embodiment of the present application does not limit the specific position of the recessed portion 112a.

[0034] Furthermore, the circuit board may further include a plastic packaging part 300 , which may cover the first functional device 120 and the second functional module 200 , thereby protecting the first functional device 120 and the second functional module 200 and facilitating modularization of the circuit board.

[0035] The first circuit substrate 110 usually needs to be electrically connected to other circuit structures. In order to avoid interference when the first circuit substrate 110 is electrically connected to other circuit structures, optionally, the second functional module 200 and the first functional device 120 can be located on the same side of the first circuit substrate 110, which is beneficial to avoid interference when the first circuit substrate 110 is electrically connected to other circuit structures.

[0036] It should be noted that the second functional module 200 and the first functional device 120 are located on the same side of the first circuit substrate 110 in the thickness direction. The thickness direction of the first circuit substrate 110 can be as shown in the attached figure. Figure 1 In the direction of extending up and down.

[0037] In order to further reduce the thickness of the circuit board, optionally, the height of the second functional module 200 may be less than or equal to the height of the first functional device 120 .

[0038] It should be noted that the height of the second functional module 200 and the height of the first functional device 120 can be determined based on the first portion 111 as a reference, and of course, can also be determined based on other parts such as the bottom of the recessed portion 112a.

[0039] The circuit board disclosed in the embodiment of the present application can further reduce the thickness of the circuit board by setting the height of the second functional module 200 to be less than or equal to the height of the first functional device 120 .

[0040] In order to facilitate the electrical connection between the circuit board and other circuit structures, the circuit board may optionally further include a flexible substrate 400, and the first circuit substrate 110 may be electrically connected to the flexible substrate 400, so that the first circuit substrate 110 is electrically connected to other structures through the flexible substrate 400, thereby facilitating the electrical connection between the circuit board and other circuit structures. Specifically, the flexible substrate 400 may be connected to a side of the first circuit substrate 110 that is away from the second functional module 200.

[0041] For example, when the circuit board is used in a battery device, since the circuit board needs to be electrically connected to the welding tab 500 of the battery device, the electrical connection between the circuit board and the battery device is facilitated by the electrical connection between the flexible substrate 400 and the welding tab 500 .

[0042] In a specific process of manufacturing a circuit board, first, the second functional device 220 is soldered on the second circuit substrate 210, wherein when there are multiple second functional devices 220, the spacing between the multiple second functional devices 220 can be between 0.05mm-0.15mm, the line width of the copper wire arranged on the second circuit substrate 210 can be 0.05mm, the thickness can be between 0.2mm-0.3mm, the overall structure formed by the second circuit substrate 210 and the second functional device 220 can be between 0.5mm-0.8mm thick, and can be between 2.8mm-4.5mm wide. Then, a recessed portion 112a is opened on the first circuit substrate 110, and the sinking depth of the recessed portion 112a can be between 0.2-0.5mm, and the overall thickness of the first functional module 100 can be between 0.6mm-0.9mm, and the width can be between 2.8mm-4.5mm. Next, the whole structure formed by the second circuit substrate 210 and the second functional device 220 is welded to the first pad at the bottom of the recessed portion 112a, and the first functional device 120 can be welded to the first portion 111. Next, the plastic sealing portion 300 is used for packaging, so that the plastic sealing portion 300 covers the first functional device 120 and the second functional module 200. Next, the whole structure formed by the first functional module 100 and the second functional module 200 is welded to the flexible substrate 400.

[0043] The present application also discloses a battery, wherein the disclosed battery comprises the circuit board disclosed in the above embodiment, wherein the battery further comprises a battery cell, and the battery cell is electrically connected to the circuit board disclosed in the above embodiment.

[0044] The battery disclosed in the embodiment of the present application can reduce the thickness of the circuit board by setting the circuit board disclosed in the above embodiment, which is beneficial to the capacity design of the battery when the circuit board is applied to the battery, and can effectively reduce the thickness of the battery, so that the battery cell can be designed to be larger to increase the battery capacity.

[0045] It should be noted that the embodiments of the present application do not limit the specific type of battery.

[0046] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0047] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, all of which are within the protection of the utility model.

Claims

1. A circuit board, characterized in that: The invention comprises a first functional module (100) and a second functional module (200), wherein the first functional module (100) comprises a first circuit substrate (110) and a first functional device (120), the first circuit substrate (110) comprises a first part (111) and a second part (112) connected to each other, the first functional device (120) is arranged in the first part (111) and is electrically connected to the first part (111), the second part (112) is provided with a recessed portion (112a), and at least a part of the second functional module (200) is arranged in the recessed portion (112a) and is electrically connected to the first functional module (100).

2. The circuit board according to claim 1, characterized in that: The second functional module (200) comprises a second circuit substrate (210) and a second functional device (220), wherein a first surface of the second circuit substrate (210) is connected to the bottom of the recessed portion (112a), and the second functional device (220) is arranged on the second surface of the second circuit substrate (210), wherein the first surface of the second circuit substrate (210) and the second surface of the second circuit substrate (210) are opposite to each other.

3. The circuit board according to claim 2, characterized in that: A first soldering pad is provided at the bottom of the recessed portion (112a), and the first surface of the second circuit substrate (210) is electrically connected to the first functional module (100) via the first soldering pad.

4. The circuit board according to claim 3, characterized in that: The first functional device (120) is welded to the first part (111) via a first welding portion, and the second functional device (220) is welded to the second circuit substrate (210) via a second welding portion, wherein the melting point of the second welding portion is greater than the melting point of the first welding portion.

5. The circuit board according to claim 1, characterized in that: The recessed portion (112a) is opened at the edge of the first circuit substrate (110).

6. The circuit board according to claim 1, characterized in that: The circuit board further comprises a plastic encapsulation portion (300), wherein the plastic encapsulation portion (300) covers the first functional device (120) and the second functional module (200).

7. The circuit board according to claim 1, characterized in that: The second functional module (200) and the first functional device (120) are located on the same side of the first circuit substrate (110).

8. The circuit board according to claim 7, characterized in that: The height of the second functional module (200) is less than or equal to the height of the first functional device (120).

9. The circuit board according to claim 1, characterized in that: The circuit board further comprises a flexible substrate (400), and the first circuit substrate (110) is electrically connected to the flexible substrate (400).

10. A battery, characterized in that: A circuit board comprising any one of claims 1 to 9.

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