Circuit board assembly, battery module and electronic equipment

Abstract

The utility model discloses a circuit board assembly, battery module and electronic equipment, the disclosed circuit board assembly comprises a circuit board, an electronic component and a plastic package part, the electronic component comprises a device body and connecting terminals, the connecting terminals are arranged at the two opposite end parts of the device body, and the plastic package part is arranged on the circuit board. The connecting terminals are arranged at the two opposite end parts of the device body, the connecting terminals at the two opposite end parts of the device body are arranged at the same side of the device body, one side, deviating from the device body, of each connecting terminal is electrically connected with the circuit board, and the plastic package part wraps the electronic component and is connected with the circuit board. According to the scheme, the problem that the overall thickness of a circuit board assembly in the prior art is relatively thick, so that the light and thin design of the electronic equipment is not facilitated can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of batteries, and in particular to a circuit board assembly, a battery module and an electronic device. Background Art

[0002] In the related technologies applied to battery modules, the electronic components and the circuit board in the circuit board assembly are usually assembled in different processes. Therefore, the electronic components usually need to be provided with protective parts on the opposite sides to protect the electronic components. After the electronic components and the circuit board are assembled, the electronic components are sealed in the circuit board by plastic sealing adhesive. However, since the circuit board assembly in the related technology adopts a structure in which protective parts are provided on the opposite sides of the electronic components and the circuit board is sealed in the circuit board by plastic sealing adhesive, the overall thickness of the circuit board assembly is relatively thick, which is not conducive to the lightweight design of electronic equipment. Utility Model Content

[0003] The utility model discloses a circuit board assembly, a battery module and an electronic device, so as to solve the problem in the related art that the overall thickness of the circuit board assembly is relatively thick and is not conducive to the lightweight and thin design of the electronic device.

[0004] In order to solve the above technical problems, the utility model is achieved as follows:

[0005] In a first aspect, the present application discloses a circuit board assembly, which includes a circuit board, electronic components and a plastic sealing part, wherein the electronic components include a device body and connecting terminals, the connecting terminals are provided at two opposite ends of the device body, the connecting terminals located at the two opposite ends of the device body are located on the same side of the device body, the side of the connecting terminals facing away from the device body is electrically connected to the circuit board, and the plastic sealing part covers the electronic components and is connected to the circuit board.

[0006] In a second aspect, the present application discloses a battery module, which includes a battery body and the circuit board assembly described in the first aspect, wherein the circuit board assembly is disposed on the battery body.

[0007] In a third aspect, the present application discloses an electronic device, and the disclosed electronic device includes the battery module described in the second aspect.

[0008] The technical solution adopted by the utility model can achieve the following technical effects:

[0009] The circuit board assembly disclosed in the embodiment of the present application is configured such that the connecting terminals of the electronic components are arranged at two opposite ends of the device body, and the connecting terminals at the two opposite ends of the device body are both arranged at the same side of the device body, so that the device body is electrically connected to the circuit board through the connecting terminals, and then the electronic components are covered by the plastic sealing part, and connected to the circuit board, so that the electronic components and the circuit board form an integral structure. Since the plastic sealing part covers the electronic components immediately after the electronic components are electrically connected to the circuit board, the electrical connection and the plastic sealing are performed in the same process, and the circuit board assembly is directly finished as an integral structure, and the various components do not need to be transported and reassembled. Therefore, there is no need to set protective parts on the opposite sides of the device body, so that the circuit board assembly disclosed in the embodiment of the present application omits the protective parts in the circuit board assembly in the related art, which is conducive to the thinning of the circuit board assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A schematic diagram of the structure of a circuit board assembly disclosed in an embodiment of the utility model;

[0011] Figure 2 It is a structural schematic diagram of a circuit board assembly in the related art.

[0012] Description of reference numerals:

[0013] 100-circuit board, 110-circuit pad,

[0014] 200-electronic components, 210-device body, 220-connection terminals, 230-insulating base,

[0015] 300-molding part, 310-first heat-equalizing filling part, 320-second heat-equalizing filling part,

[0016] 400-Solder layer. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0018] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0019] Please refer to Figure 1The utility model embodiment discloses a circuit board assembly. The disclosed circuit board assembly may be a protection circuit composed of electronic components such as a control IC, a precision resistor, a transistor switch, a filter capacitor, a power meter, etc., which can be used to protect the battery body of a battery module.

[0020] The disclosed circuit board assembly includes a circuit board 100, an electronic component 200, and a plastic sealing part 300. The electronic component 200 includes a device body 210 and a connection terminal 220. The electronic component 200 may include a chip, a socket, a resistor, an inductor, a capacitor, a diode, a triode, etc. The embodiment of the present application achieves the purpose of the invention of the present application by designing and modifying the common characteristic structures of various types of electronic components 200, such as connection terminals and external packaging layers. The material of the device body 210 may be an alloy. Of course, the material of the device body 210 is not limited to alloy materials. The connection terminal 220 is used to realize the electrical connection of the device body 210.

[0021] The two opposite ends of the device body 210 are provided with connection terminals 220, and the connection terminals 220 located at the two opposite ends of the device body 210 are located on the same side of the device body 210, and the side of the connection terminals 220 away from the device body 210 is electrically connected to the circuit board 100. The plastic sealing part 300 covers the electronic component 200 and is connected to the circuit board 100.

[0022] The circuit board assembly disclosed in the embodiment of the present application is configured such that the connection terminals 220 of the electronic components 200 are arranged at two opposite ends of the device body 210, and the connection terminals 220 at the two opposite ends of the device body 210 are all located on the same side of the device body 210, so that the device body 210 is electrically connected to the circuit board 100 through the connection terminals 220, and then the electronic components 200 are covered by the plastic sealing part 300, and connected to the circuit board 100, so that the electronic components 200 and the circuit board 100 form an integral structure. Since the plastic sealing part 300 covers the electronic components 200 immediately after the electronic components 200 are electrically connected to the circuit board 100, the electrical connection and the plastic sealing are performed in the same process, and the circuit board assembly is directly finished as an integral structure, and the components do not need to be transported and reassembled. Therefore, there is no need to set protective parts on the opposite sides of the device body 210, so that the circuit board assembly disclosed in the embodiment of the present application omits the protective parts in the circuit board assembly in the related art, which is conducive to the thinning of the circuit board assembly.

[0023] refer to Figure 2 , the connection terminals in the circuit board assembly in the related art are covered at the two ends of the device body, for example Figure 2b in the figure represents a connecting terminal, and the circuit board assembly disclosed in the embodiment of the present application is advantageous for a lightweight and thin design of the circuit board assembly by arranging the connecting terminals on the same side of the device body. Figure 2 The a in the figure represents a protective part provided on the electronic components, but the present application does not need to provide a protective part, which is conducive to the lightweight design of the circuit board assembly.

[0024] Optionally, the plastic sealing part 300 can be a good thermal conductive material, and the heat emitted by the electronic component 200 can be evenly distributed through the plastic sealing glue, thereby reducing the situation where the electronic component 200 is damaged by a high temperature during operation, and also reducing the risk of thermal failure of the product. Of course, the plastic sealing part 300 can also be made of other materials, and the embodiment of the present application does not specifically limit the material of the plastic sealing part 300.

[0025] Since the device body 210 and the circuit board 100 are electrically connected through the connection terminal 220, there is a certain gap between the device body 210 and the circuit board 100. In order to further protect the device body 210 without affecting the thickness of the circuit board assembly, the electronic component 200 may optionally include an insulating base 230, which may be provided on the device body 210 and located on the side where the connection terminal 220 is located. The thickness of the insulating base 230 may be less than or equal to the thickness of the connection terminal 220, so that the circuit board assembly can be thinned better. Of course, the thickness of the insulating base 230 may also be greater than the thickness of the connection terminal 220, and the difference in thickness between the insulating base 230 and the connection terminal 220 is less than the thickness of the protective member in the circuit board assembly in the related art.

[0026] The circuit board assembly disclosed in the embodiment of the present application is provided with an insulating base 230 on one side of the device body 210 where the connection terminal 220 is located, so that the insulating base 230 can strengthen and protect the device body 210 without affecting the thickness of the circuit board assembly.

[0027] In order to further enhance the overall strength of the electronic component 200 , optionally, the insulating base 230 is located between the two connection terminals 220 and connected to the two connection terminals 220 .

[0028] The circuit board assembly disclosed in the embodiment of the present application arranges the insulating base 230 between the two connecting terminals 220 and connects to the two connecting terminals 220, thereby making the connection between the device body 210, the insulating base 230 and the connecting terminals 220 tighter, thereby enhancing the overall strength of the electronic component 200.

[0029] Optionally, there is a heat dissipation gap between the insulating base 230 and the circuit board 100, that is, the thickness of the insulating base 230 is less than the thickness of the connecting terminal 220, so that a heat dissipation gap is formed between the insulating base 230 and the circuit board 100, which is beneficial to the heat dissipation of the electronic component 200.

[0030] Further, the heat dissipation gap may be filled with a first heat-dissipating filling part 310 , and the plastic sealing part 300 may include the first heat-dissipating filling part 310 .

[0031] The circuit board assembly disclosed in the embodiment of the present application fills the heat dissipation gap with the first heat-equalizing filling part 310, so that part of the heat generated by the electronic component 200 can be heat-equalized through the first heat-equalizing filling part 310, thereby facilitating reducing the temperature of the electronic component 200 during operation.

[0032] In an optional embodiment, the circuit board 100 may include a circuit pad 110, which may be disposed on the surface of the circuit board 100, and the connecting terminal 220 may be soldered to the circuit pad 110 through the solder layer 400, thereby achieving electrical connection between the electronic component 200 and the circuit board 100.

[0033] Of course, the circuit board 100 may also be provided with a sinking groove, and the circuit pad 110 may be provided in the sinking groove, and the circuit pad 110 may be lower than the surface of the circuit board 100 , and then the thickness of the circuit board assembly may be further reduced by welding the connecting terminal 220 to the circuit pad 110 .

[0034] Optionally, when the circuit pads 110 are disposed on the surface of the circuit board 100 , a second heat-equalizing filling portion 320 may be filled between two circuit pads 110 corresponding to two connection terminals 220 , and the plastic sealing portion 300 includes the second heat-equalizing filling portion 320 .

[0035] The circuit board assembly disclosed in the embodiment of the present application is filled with a second heat-equalizing filling part 320 between two circuit pads 110 corresponding to two connection terminals 220, so that part of the heat generated by the electronic component 200 can be heat-equalized by the second heat-equalizing filling part 320, thereby facilitating the reduction of the temperature of the electronic component 200 during operation.

[0036] The present application also discloses a battery module, which includes a battery body and the circuit board assembly disclosed in the above embodiment, wherein the circuit board assembly is arranged on the battery body.

[0037] The battery module disclosed in the embodiment of the present application can omit the protective component in the circuit board assembly in the related art by disposing the circuit board assembly disclosed in the above embodiment, which is conducive to the thinning of the circuit board assembly.

[0038] The present application also discloses an electronic device, and the disclosed electronic device includes the battery module disclosed in the above embodiment.

[0039] The electronic device disclosed in the embodiment of the present application can omit the protective component in the circuit board assembly in the related art by disposing the battery module disclosed in the above embodiment, which is conducive to the thinning of the circuit board assembly.

[0040] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0041] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, all of which are within the protection of the utility model.

Claims

1. A circuit board assembly, characterized in that: The invention comprises a circuit board (100), an electronic component (200) and a plastic sealing part (300), wherein the electronic component (200) comprises a device body (210) and a connecting terminal (220), the connecting terminals (220) are provided at two opposite ends of the device body (210), the connecting terminals (220) located at the two opposite ends of the device body (210) are located on the same side of the device body (210), the side of the connecting terminal (220) facing away from the device body (210) is electrically connected to the circuit board (100), and the plastic sealing part (300) covers the electronic component (200) and is connected to the circuit board (100).

2. The circuit board assembly according to claim 1, characterized in that: The electronic component (200) further comprises an insulating base (230), wherein the insulating base (230) is arranged on the device body (210) and is located on the side where the connecting terminal (220) is located.

3. The circuit board assembly according to claim 2, characterized in that: The insulating base (230) is located between the two connection terminals (220) and is connected to the two connection terminals (220).

4. The circuit board assembly according to claim 2, characterized in that: A heat dissipation gap is provided between the insulating base (230) and the circuit board (100).

5. The circuit board assembly according to claim 4, characterized in that: The heat dissipation gap is filled with a first heat-equalizing filling portion (310), and the plastic sealing portion (300) comprises the first heat-equalizing filling portion (310).

6. The circuit board assembly according to claim 2, characterized in that: The thickness of the insulating base (230) is less than or equal to the thickness of the connecting terminal (220).

7. The circuit board assembly according to claim 1, characterized in that: The circuit board (100) comprises a circuit pad (110), the circuit pad (110) being arranged on the surface of the circuit board (100), and the connection terminal (220) being soldered to the circuit pad (110) via a soldering layer (400).

8. The circuit board assembly according to claim 7, characterized in that: A second heat-equalizing filling portion (320) is filled between the two circuit pads (110) corresponding to the two connection terminals (220), and the plastic sealing portion (300) includes the second heat-equalizing filling portion (320).

9. A battery module, characterized in that: It comprises a battery body and the circuit board assembly according to any one of claims 1 to 8, wherein the circuit board assembly is arranged on the battery body.

10. An electronic device, characterized in that: A battery module comprising the battery module described in claim 9.

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