Thermoelastic heat dissipation device and equipment based on shape memory alloy

Abstract

The utility model relates to the technical field of shape memory alloy, in particular to a thermoelastic heat dissipation device and equipment based on shape memory alloy. Comprising a heat dissipation device and further comprises a first shape memory alloy set and a thermoelastic shape memory alloy set. The first shape memory alloy group is in thermal contact with the heat source and used for absorbing heat emitted by the heat source; the thermoelastic shape memory alloy group is in thermal contact with the heat dissipation equipment, in a first state, the thermoelastic shape memory alloy group is in thermal contact with the first shape memory alloy group, in a second state, the thermoelastic shape memory alloy group is not in thermal contact with the first shape memory alloy group, and the thermoelastic shape memory alloy group is used for transferring heat of the first shape memory alloy group to the heat dissipation equipment; and when the heat of the heat source is not absorbed, the internal microstructures of the first shape memory alloy group and the thermoelastic shape memory alloy group are martensite or coexistence of martensite and austenite. The heat dissipation device provided by the utility model improves the heat dissipation efficiency of a heat source, and effectively inhibits the temperature rise of the heat source or cools the heat source to a proper working temperature.

Description

Technical Field

[0001] The utility model relates to the technical field of shape memory alloys, in particular to a thermoelastic heat dissipation device and equipment based on shape memory alloys. Background Art

[0002] Shape memory alloys are thermoelastic alloy materials composed of two or more metal elements that have shape memory effect through martensitic phase transformation and its reverse phase transformation. At present, shape memory alloys have been successfully applied in electronic equipment, aerospace, medicine and other fields.

[0003] The application of shape memory alloys in electronic devices is mainly based on the characteristics of shape memory alloys that deform after absorbing heat and restore their shape after dissipating heat. For example: a 5G mobile phone ceramic backplane structure that is easy to dissipate heat. In this structure, the heat sink is made of shape memory alloy. After being heated, it deforms, causing the heat sink to tilt toward the inside of the heat dissipation cavity, exposing the heat dissipation port and accelerating the heat dissipation efficiency. A 5G base station AAU heat sink based on shape memory alloy, in which the fins are made of shape memory alloy. The fins are deformed by the heat generated by the 5G base station AAU system. After deformation, the heat dissipation area is increased, so that the chip temperature remains within the normal working range.

[0004] Based on the above application situations, shape memory alloys use the characteristics of shape memory alloys that they deform when heated and restore their shape when dissipated, ignoring the fact that the phase change of the shape memory alloy itself can absorb a large amount of latent heat, and there is no technology that simultaneously utilizes the thermoelastic deformation and phase change of shape memory alloys to absorb a large amount of latent heat as a heat dissipation device. Utility Model Content

[0005] In view of the above technical problems, the utility model provides a thermoelastic heat dissipation device and equipment based on shape memory alloy, which simultaneously utilizes the thermoelastic deformation and phase change of shape memory alloy to absorb a large amount of latent heat as a heat dissipation device.

[0006] In order to solve the above technical problems, the embodiment of the utility model adopts the following technical solutions:

[0007] In a first aspect, an embodiment of the utility model provides a thermoelastic heat dissipation device based on shape memory alloy, comprising a heat dissipation device, and further comprising a first shape memory alloy group and a thermoelastic shape memory alloy group;

[0008] The first shape memory alloy group is in thermal contact with a heat source, and is used to absorb heat emitted by the heat source;

[0009] The thermoelastic shape memory alloy group is in thermal contact with the heat dissipation device. In a first state, the group is in thermal contact with the first shape memory alloy group. In a second state, the group is not in thermal contact with the first shape memory alloy group. The thermoelastic shape memory alloy group is used to transfer heat from the first shape memory alloy group to the heat dissipation device.

[0010] When the heat from the heat source is not absorbed, the internal microstructures of the first shape memory alloy group and the thermoelastic shape memory alloy group are martensite or martensite and austenite coexist.

[0011] In the present invention, the heat source may be a chip, a graphics card, a central processing unit, water, or other structure or object that needs to dissipate heat.

[0012] The first state of the thermoelastic shape memory alloy group is the state before absorbing the heat of the first shape memory alloy group, and the second state is the state after absorbing the heat of the first shape memory alloy group; and / or, the austenite phase transformation termination temperature of the first shape memory alloy group is ≤ the limit working temperature of the heat source; and / or, the austenite phase transformation initial temperature of the first shape memory alloy group is ≥ the suitable working temperature of the heat source. In some possible implementations, the austenite phase transformation termination temperature of the first shape memory alloy group (the characteristic temperature at which martensite is completely transformed into austenite) is ≤ the limit working temperature of the heat source; and / or, the austenite phase transformation initial temperature of the first shape memory alloy group (the characteristic temperature at which martensite begins to transform into austenite) is ≥ the suitable working temperature of the heat source. The limit working temperature of the heat source can be the highest temperature when the chip, graphics card, central processing unit, etc. maintain a normal working state, or it can be the highest temperature of the heat dissipation temperature that a heat source such as water wants to achieve. The austenite phase transformation termination temperature of the shape memory alloy layer is ≤ the maximum operating temperature of the heat source, which can ensure that when the internal microstructure of the shape memory alloy layer is completely transformed into austenite, the heat source has not yet reached the maximum operating temperature or has just reached the maximum operating temperature. The suitable operating temperature of the heat source can be the temperature of the best working state of the chip, graphics card, central processing unit, etc., or it can be the best temperature that a heat source such as water can reach. The austenite phase transformation initial temperature of the shape memory alloy layer is ≥ the suitable operating temperature of the heat source, which can ensure that when the heat source reaches the upper limit of the suitable operating temperature, the internal microstructure of the shape memory alloy layer begins to transform from martensite to austenite.

[0013] In some possible implementations, the thermoelastic shape memory alloy group includes a thermoelastic shape memory alloy and a second shape memory alloy group. The thermoelastic shape memory alloy is located between the first shape memory alloy group and the second shape memory alloy group, and is in thermal contact with the second shape memory alloy group. In a first state, the thermoelastic shape memory alloy is in thermal contact with the first shape memory alloy group, and in a second state, the thermoelastic shape memory alloy is not in thermal contact with the first shape memory alloy group. The second shape memory alloy group is in thermal contact with the heat dissipation device, and when heat from a heat source is not absorbed, the internal microstructures of the thermoelastic shape memory alloy and the second shape memory alloy group are martensite or coexistence of martensite and austenite; the first state of the thermoelastic shape memory alloy is a state before the heat from the first shape memory alloy group is not absorbed, and the second state is a state after the heat from the first shape memory alloy group is absorbed.

[0014] In some possible implementations, the number of shape memory alloys in the first shape memory alloy group, the second shape memory alloy group, and the thermoelastic shape memory alloy is ≥1.

[0015] In some possible implementations, the deformation direction of the shape memory alloy layer does not affect the normal operation of the heat source and heat sink. In the present invention, the deformation direction of the shape memory alloy layer can be adjusted so that the main deformation direction of the shape memory alloy does not affect the normal operation of the heat source and heat sink, and the influence of deformation in other directions other than the main deformation direction on the heat source and heat sink can be ignored.

[0016] In some possible implementations, when the number of shape memory alloys in the first shape memory alloy group, the second shape memory alloy group, and the thermoelastic shape memory alloy is greater than 1, the martensitic transformation termination temperature (characteristic temperature at which austenite is completely transformed into martensite) of the shape memory alloy near the heat source side in the first shape memory alloy group, the second shape memory alloy group, and the thermoelastic shape memory alloy is ≤ the martensitic transformation termination temperature of the shape memory alloy near the heat dissipation device side. Considering that the temperature of the shape memory alloy near the heat dissipation device side is not higher than (lower than or equal to) the temperature of the shape memory alloy near the heat source side, this can ensure that during the heat dissipation and cooling process, the shape memory alloy near the heat dissipation device side completes the transformation from austenite to martensite or the initial state of coexistence of martensite and austenite before the shape memory alloy near the heat source side, thereby achieving cyclic heat absorption and heat dissipation. Considering that the phase change process of austenite to martensite in the shape memory alloy near the heat source side will release latent heat, the shape memory alloy layer near the heat dissipation device side can continue to absorb the heat of the shape memory alloy layer near the heat source side to realize the phase change from martensite to austenite. This phase change process needs to absorb a large amount of latent heat, and can be further dissipated to the outside through the heat dissipation device, thereby greatly reducing the heat released by the phase change process of austenite to martensite in the shape memory alloy layer near the heat source side and transferring toward the heat source.

[0017] In some possible implementations, the shape memory alloys in the first shape memory alloy group and the thermoelastic shape memory alloy group are selected from one or more of nickel-titanium alloy, nickel-titanium-copper alloy, nickel-titanium-copper-cobalt alloy, nickel-titanium-copper-vanadium alloy, nickel-iron-gallium alloy, copper-aluminum-zinc alloy, copper-aluminum-manganese alloy or copper-aluminum-nickel alloy. Shape memory alloys include but are not limited to nickel-titanium alloy, nickel-titanium-copper alloy, nickel-titanium-copper-cobalt alloy, nickel-titanium-copper-vanadium alloy, nickel-iron-gallium alloy, copper-aluminum-zinc alloy, copper-aluminum-manganese alloy or copper-aluminum-nickel alloy, as long as they can absorb the heat emitted by the heat source and have an internal microstructure of martensite or a coexistence of martensite and austenite.

[0018] In some possible implementations, the heat dissipation device includes one of a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat sink or an annular cold pump, and graphite / graphene. The heat dissipation device includes but is not limited to a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat sink or an annular cold pump, and graphite / graphene, as long as the heat dissipation device can transfer the heat absorbed by the shape memory alloy layer.

[0019] In some possible implementations, the heat dissipation device further includes a one-way heat conduction device located between the heat source and the first shape memory alloy group, for one-way transfer of heat emitted by the heat source to the first shape memory alloy group; the one-way heat conduction device is in thermal contact with the heat source and the first shape memory alloy group. The one-way heat conduction device is provided between the first shape memory alloy group and the heat source, and the one-way device is in thermal contact with the heat source and the first shape memory alloy group, so that when the heat of the first shape memory alloy group is transferred to the thermoelastic shape memory alloy group, the heat from the heat source will not be transferred back to the heat source, thereby ensuring the normal operation of the heat source.

[0020] In some possible implementations, the one-way heat-conducting device includes one or more of thermally conductive silicone, one-way heat-conducting carbon fiber, one-way heat-conducting graphite or graphene. The one-way heat-conducting device includes but is not limited to thermally conductive silicone, one-way heat-conducting carbon fiber, one-way heat-conducting graphite or graphene, as long as it can satisfy the requirement of not transferring heat from the heat source back to the heat source.

[0021] In a second aspect, the utility model also provides a device including the above-mentioned thermoelastic heat dissipation device based on shape memory alloy.

[0022] In the utility model, the device adopts the above-mentioned heat dissipation device based on memory alloy to achieve heat dissipation of the heat source. The device includes but is not limited to mobile phones, computer hosts, IT equipment, data centers, water cups, air conditioners or fans.

[0023] Compared with the prior art, the utility model has one of the following beneficial effects:

[0024] The heat dissipation device provided by the utility model utilizes the characteristics that the internal microstructure of the shape memory alloy can absorb a large amount of latent heat when it transforms from martensite to austenite and that deformation occurs when martensite transforms to austenite, thereby improving the heat dissipation efficiency of the heat source, effectively suppressing the increase in the temperature of the heat source or cooling the heat source to a desired temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic side view of a thermoelastic heat dissipation device based on a shape memory alloy provided in an embodiment of the present application;

[0027] Figure 2A schematic side view of a thermoelastic heat dissipation device based on a shape memory alloy provided in an embodiment of the present application;

[0028] Figure 3 A schematic side view of a thermoelastic heat dissipation device based on a shape memory alloy provided in an embodiment of the present application;

[0029] Figure 4 A schematic side view of a thermoelastic heat dissipation device based on a shape memory alloy provided in an embodiment of the present application;

[0030] Figure 5 A schematic side view of a thermoelastic heat dissipation device based on a shape memory alloy provided in an embodiment of the present application;

[0031] Among them, 1-heat source; 2-heat dissipation device; 3-first shape memory alloy group; 4-unidirectional heat conduction device; 5-thermoelastic shape memory alloy; 6-second shape memory alloy group. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail in combination with specific embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not used to limit the utility model.

[0033] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0034] The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.

[0035] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0036] In the heat dissipation device based on shape memory alloy provided in the embodiment of the present application, the heat dissipation device is selected from one of a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat sink or an annular cold pump, and graphite / graphene. It should be noted that these heat dissipation devices can be adaptively adjusted according to the different heat sources 1 to achieve the purpose of dissipating heat from the heat source 1 or cooling the heat source 1 to a desired temperature.

[0037] In the thermoelastic heat dissipation device based on shape memory alloy provided in the embodiment of the present application, thermal contact means that the heat transfer effect between the two is good and the heat conduction efficiency is high.

[0038] In order to further illustrate the technical solution of the present invention, the technical solution of the present invention is described in detail below in conjunction with the accompanying drawings:

[0039] See also Figure 1 In the first state, that is, when the first shape memory alloy group does not absorb the heat emitted by the heat source, the first shape memory alloy group is in thermal contact with the heat source, the thermoelastic shape memory alloy group is in thermal contact with the first shape memory alloy group, the thermoelastic shape memory alloy group includes a thermoelastic shape memory alloy and a second shape memory alloy group, and the number of shape memory alloys in the first shape memory alloy group, the thermoelastic shape memory alloy and the second shape memory alloy group is one, and the internal microstructure is martensite or martensite and austenite coexist. Taking the heat source as a chip as an example, the chip generates heat when it works, the first shape memory alloy group absorbs the heat generated by the chip, and the thermoelastic shape memory alloy absorbs the heat of the first shape memory alloy group and begins to deform and shrink toward the heat dissipation device, see Figure 2 , that is, the second state, after the thermoelastic shape memory alloy contracts, it is not in thermal contact with the first shape memory alloy group. The first shape memory alloy group only absorbs the heat emitted by the heat source, and the second shape memory alloy group absorbs the heat of the thermoelastic shape memory alloy. The heat dissipation device (air-cooled heat dissipation device) absorbs the heat of the second shape memory alloy group. When the heat of the thermoelastic shape memory alloy is absorbed by the second shape memory alloy group, the thermoelastic shape memory alloy returns to the first state and begins to absorb the heat of the first shape memory alloy group for cyclic heat dissipation.

[0040] Furthermore, when the first shape memory alloy group absorbs the heat dissipated by the chip, the temperature of the first shape memory alloy group continues to rise to the austenite transformation termination temperature of the first shape memory alloy group, and the internal microstructure of the first shape memory alloy group is completely transformed from martensite to austenite, it is necessary to satisfy the austenite transformation termination temperature of the first shape memory alloy group ≤ the maximum operating temperature of the chip to prevent the first shape memory alloy group from absorbing the heat dissipated by the chip too late, causing the temperature of the chip to exceed its maximum operating temperature and causing damage to the chip.

[0041] Furthermore, when the first shape memory alloy group absorbs the heat dissipated by the chip, the temperature of the first shape memory alloy group rises to the initial temperature of the austenite transformation of the first shape memory alloy group, and the internal microstructure of the first shape memory alloy group begins to transform from martensite to austenite, it is necessary to satisfy the requirement that the initial temperature of the austenite transformation of the first shape memory alloy group ≥ the suitable operating temperature of the chip, so that the first shape memory alloy group can absorb more heat when the temperature exceeds the suitable operating temperature range of the chip.

[0042] When the chip is running at low power (generating less heat) or stops working (generating no heat), the heat dissipation device (air-cooled heat dissipation device) will still transfer the heat absorbed by the first shape memory alloy group, the thermoelastic shape memory alloy and the second shape memory alloy group to the air, and the temperature of the first shape memory alloy group, the thermoelastic shape memory alloy and the second shape memory alloy group will slowly decrease. Furthermore, when the number of shape memory alloys in the first shape memory alloy group and the second shape memory alloy group is greater than 1, the martensitic transformation termination temperature (characteristic temperature at which austenite is completely transformed into martensite) of the shape memory alloy near the heat source side in the first shape memory alloy group, the second shape memory alloy group and the thermoelastic shape memory alloy is less than the martensitic transformation termination temperature of the shape memory alloy near the heat dissipation device side, considering that the temperature of the shape memory alloy near the heat dissipation device side is not higher than (lower than or equal to) the temperature of the shape memory alloy near the heat source side, this can ensure that in the heat dissipation and cooling process, the shape memory alloy near the heat dissipation device side completes the transformation of austenite into martensite or the initial state of coexistence of martensite and austenite before the shape memory alloy near the heat source side, thereby realizing cyclic heat absorption and heat dissipation. At this time, the phase change process of the shape memory alloy from austenite to martensite near the heat dissipation device will release latent heat, and the shape memory alloy layer near the heat dissipation device can continue to absorb the heat of the shape memory alloy layer near the heat source to achieve the phase change from martensite to austenite, and this phase change process needs to absorb a large amount of latent heat, and can further dissipate heat outward through the heat dissipation device, thereby greatly reducing the heat released by the phase change process of the shape memory alloy layer near the heat source to the heat source. Further, as the temperature gradually decreases to room temperature, the internal microstructure of the thermoelastic shape memory alloy changes from austenite to martensite or the initial state of coexistence of martensite and austenite, and returns to the first state; and the internal microstructure of the shape memory alloy in the first shape memory alloy group and the second shape memory alloy group gradually changes from austenite to martensite or the initial state of coexistence of martensite and austenite, and the heat source can be cyclically absorbed and dissipated, so that the first shape memory alloy group, the thermoelastic shape memory alloy and the second shape memory alloy group can be used as part of the heat dissipation device of the utility model for recycling.

[0043] See also Figure 3In the first state, that is, when the first shape memory alloy group does not absorb the heat emitted by the heat source, the first shape memory alloy group is in thermal contact with the heat source, the thermoelastic shape memory alloy group is in thermal contact with the first shape memory alloy group, the thermoelastic shape memory alloy group includes a thermoelastic shape memory alloy and a second shape memory alloy group, and the number of shape memory alloys in the first shape memory alloy group, the thermoelastic shape memory alloy and the second shape memory alloy group is two, and the internal microstructure is martensite or martensite and austenite coexist. Take boiling water as an example of the heat source. The heat of boiling water (100°C) is reduced to a direct drinking temperature (35°C), and the boiling water is directly in thermal contact with the shape memory alloy on the side close to the heat source in the first shape memory alloy group, and the shape memory alloy on the side far from the heat source in the first shape memory alloy group is in thermal contact with the shape memory alloy on the side close to the heat source in the first shape memory alloy group and the shape memory alloy on the side close to the heat source in the thermoelastic shape memory alloy, and the shape memory alloy on the side close to the heat source in the thermoelastic shape memory alloy is in thermal contact with the shape memory alloy on the side close to the heat source in the thermoelastic shape memory alloy and the shape memory alloy on the side close to the heat source in the second shape memory alloy group, and the shape memory alloy on the side close to the heat source in the second shape memory alloy group is in thermal contact with the shape memory alloy on the side close to the heat source in the second shape memory alloy group and the heat dissipation device. When the shape memory alloy near the heat source in the first shape memory alloy group transfers the heat absorbed from the boiling water to the shape memory alloy far from the heat source in the first shape memory alloy group, the shape memory alloy near the heat source in the thermoelastic shape memory alloy group absorbs the heat transferred from the shape memory alloy far from the heat source in the first shape memory alloy group, and after the shape memory alloy far from the heat source in the thermoelastic shape memory alloy group absorbs the heat transferred from the shape memory alloy near the heat source in the thermoelastic shape memory alloy group, the thermoelastic shape memory alloy begins to deform toward the heat dissipation device, see Figure 4 , that is, the second state, the shape memory alloy on the side close to the heat source in the second shape memory alloy group absorbs the heat transferred from the shape memory alloy on the side far away from the heat source in the thermoelastic shape memory alloy, the shape memory alloy on the side far away from the heat source in the second shape memory alloy group absorbs the heat of the shape memory alloy on the side close to the heat source in the second shape memory alloy group, and the heat dissipation device (air-cooled heat dissipation device) absorbs the heat transferred from the shape memory alloy on the side far away from the heat source in the second shape memory alloy group to complete the heat dissipation.

[0044] Furthermore, when the boiled water is cooled to a temperature that can be directly drunk, the heat dissipation device (air-cooled heat dissipation device) will still transfer the heat absorbed by the first shape memory alloy group, the thermoelastic shape memory alloy, and the second shape memory alloy group to the air, and the temperature of the first shape memory alloy group, the thermoelastic shape memory alloy, and the second shape memory alloy group will slowly decrease. The martensitic transformation termination temperature (characteristic temperature at which austenite is completely transformed into martensite) of the shape memory alloy near the heat source in the first shape memory alloy group, the second shape memory alloy group, and the thermoelastic shape memory alloy is less than the martensitic transformation termination temperature of the shape memory alloy near the heat dissipation device, so that the shape memory alloy on the side away from the heat source in the second shape memory alloy group changes its internal microstructure from austenite to martensite or the initial state of coexistence of martensite and austenite before the shape memory alloy on the side near the heat source in the second shape memory alloy group, and further the shape memory alloy on the side away from the heat source in the second shape memory alloy group can absorb the heat emitted by the shape memory alloy on the side near the heat source in the second shape memory alloy group, thereby reducing the heat transfer of the shape memory alloy on the side near the heat source in the second shape memory alloy group toward the heat source. When the shape memory alloy on the side away from the heat source in the thermoelastic shape memory alloy changes its internal microstructure from austenite to martensite or the initial state of coexistence of martensite and austenite before the shape memory alloy on the side close to the heat source in the thermoelastic shape memory alloy, the shape memory alloy on the side away from the heat source in the thermoelastic shape memory alloy can further absorb the heat emitted by the shape memory alloy on the side close to the heat source in the thermoelastic shape memory alloy, thereby reducing the heat transfer of the shape memory alloy on the side close to the heat source in the thermoelastic shape memory alloy toward the heat source. When the shape memory alloy on the side away from the heat source in the first shape memory alloy group changes its internal microstructure from austenite to martensite or the initial state of coexistence of martensite and austenite before the shape memory alloy on the side close to the heat source in the first shape memory alloy group, the shape memory alloy on the side away from the heat source in the first shape memory alloy group can further absorb the heat emitted by the shape memory alloy on the side close to the heat source in the first shape memory alloy group, thereby reducing the heat transfer of the shape memory alloy on the side close to the heat source in the first shape memory alloy group toward the heat source. Furthermore, as the temperature gradually decreases to room temperature, the internal microstructure of the thermoelastic shape memory alloy changes from austenite to martensite or the initial state in which martensite and austenite coexist, and returns to the first state; and the internal microstructure of the shape memory alloys in the first shape memory alloy group and the second shape memory alloy group gradually changes from austenite to martensite or the initial state in which martensite and austenite coexist, and the heat source can be cyclically absorbed and dissipated, so that the first shape memory alloy group, the thermoelastic shape memory alloy and the second shape memory alloy group can be cyclically used as part of the heat dissipation device of the utility model.

[0045] See also Figure 5In the first state, that is, when the first shape memory alloy group does not absorb the heat emitted by the heat source, the first shape memory alloy group is in thermal contact with the heat source, the thermoelastic shape memory alloy is in thermal contact with the first shape memory alloy group, the second shape memory alloy group is in thermal contact with the thermoelastic shape memory alloy and the heat dissipation device, and the number of shape memory alloys in the first shape memory alloy group, the thermoelastic shape memory alloy and the second shape memory alloy group is one, the internal microstructure is martensite or martensite and austenite coexist, and the unidirectional heat conduction device is located between the heat source and the first shape memory alloy group, and is in thermal contact with them. The unidirectional heat conduction device is provided between the first shape memory alloy group and the heat source, and the unidirectional heat conduction device is in thermal contact with the heat source and the first shape memory alloy group, so that when the heat of the first shape memory alloy group is transferred to the thermoelastic shape memory alloy, the heat from the heat source will not be transferred back to the heat source, thereby ensuring the normal operation of the heat source.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modification, equivalent substitution or improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A thermoelastic heat dissipation device based on shape memory alloy, comprising a heat dissipation device, characterized in that: Also included is a first shape memory alloy group and a thermoelastic shape memory alloy group; The first shape memory alloy group is in thermal contact with a heat source, and is used to absorb heat emitted by the heat source; The thermoelastic shape memory alloy group is in thermal contact with the heat dissipation device. In a first state, the group is in thermal contact with the first shape memory alloy group. In a second state, the group is not in thermal contact with the first shape memory alloy group. The thermoelastic shape memory alloy group is used to transfer heat from the first shape memory alloy group to the heat dissipation device. When the heat from the heat source is not absorbed, the internal microstructures of the first shape memory alloy group and the thermoelastic shape memory alloy group are martensite or the coexistence of martensite and austenite.

2. The thermoelastic heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The first state of the thermoelastic shape memory alloy group is a state before absorbing the heat of the first shape memory alloy group, and the second state is a state after absorbing the heat of the first shape memory alloy group; and / or, The austenite transformation termination temperature of the first shape memory alloy group is ≤ the limiting operating temperature of the heat source; and / or, The austenite transformation initial temperature of the first shape memory alloy group is ≥ the suitable working temperature of the heat source.

3. The thermoelastic heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The thermoelastic shape memory alloy group includes a thermoelastic shape memory alloy and a second shape memory alloy group. The thermoelastic shape memory alloy is located between the first shape memory alloy group and the second shape memory alloy group, and is in thermal contact with the second shape memory alloy group. In a first state, the thermoelastic shape memory alloy is in thermal contact with the first shape memory alloy group. In a second state, the thermoelastic shape memory alloy group is not in thermal contact with the first shape memory alloy group. The second shape memory alloy group is in thermal contact with the heat dissipation device. When the heat source is not absorbed, the internal microstructures of the thermoelastic shape memory alloy and the second shape memory alloy group are martensite or martensite and austenite coexist. The first state of the thermoelastic shape memory alloy is a state before absorbing the heat of the first shape memory alloy group, and the second state is a state after absorbing the heat of the first shape memory alloy group.

4. The thermoelastic heat dissipation device based on shape memory alloy according to claim 2, characterized in that: The number of shape memory alloys in the first shape memory alloy group, the second shape memory alloy group and the thermoelastic shape memory alloy is ≥1.

5. The thermoelastic heat dissipation device based on shape memory alloy according to claim 4, characterized in that: When the number of shape memory alloys in the first shape memory alloy group, the second shape memory alloy group and the thermoelastic shape memory alloy is greater than 1, the martensitic phase transformation termination temperature of the shape memory alloy close to the heat source in the first shape memory alloy group, the second shape memory alloy group and the thermoelastic shape memory alloy is less than or equal to the martensitic phase transformation termination temperature of the shape memory alloy close to the heat dissipation device.

6. The thermoelastic heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The heat dissipation device is selected from a water-cooled heat dissipation device, an air-cooled heat dissipation device, a VC heat sink, a ring cold pump, graphite or graphene.

7. The thermoelastic heat dissipation device based on shape memory alloy according to claim 1, characterized in that: The heat dissipation device further comprises a unidirectional heat conduction device located between the heat source and the first shape memory alloy group, for unidirectionally transferring the heat emitted by the heat source to the first shape memory alloy group; The one-way heat conducting device is in thermal contact with the heat source and the first shape memory alloy group.

8. The thermoelastic heat dissipation device based on shape memory alloy according to claim 7, characterized in that: The one-way heat conducting device includes one or more of heat conducting silica gel, one-way heat conducting carbon fiber, one-way heat conducting graphite or graphene.

9. A device comprising the shape memory alloy-based thermoelastic heat dissipation device according to any one of claims 1 to 8.

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