High-power COB paster support and LED lamp

Abstract

The utility model discloses a high power COB paster support and LED lamp, including the substrate and the glue layer and the accommodation part that are arranged on the substrate, the glue layer is also provided with at least one stress release cavity, the stress release cavity is located above the glue layer, the stress release cavity is located outside the accommodation part, and the stress release cavity is located above the glue layer and outside the accommodation part. The stress release cavity is in an inward concave shape relative to the upper portion of the glue layer, and the containing part is used for containing LED lamp beads. Aiming at the problem of insufficient heat dissipation of the traditional aluminum substrate and ceramic substrate in high-power application, a unique stress release cavity structure is designed, and the stress release cavity is positioned above the adhesive layer and is concave inwards, so that the contact area between the substrate and the environment is effectively increased, the heat management is optimized, the heat is more effectively dispersed, and the service life of the substrate is prolonged. And the working efficiency and the service life of the LED chip are improved, and excellent performance can still be maintained under a high-power operation condition.

Description

Technical Field

[0001] The utility model relates to the technical field of COB, in particular to a high-power COB patch bracket and an LED lamp using the high-power COB patch bracket. Background Art

[0002] In the field of LED packaging, COB (Chip On Board) technology is to directly package multiple LED chips onto a substrate. Traditional COB packaging usually uses aluminum substrates and ceramic substrates. Whether it is an aluminum substrate or a ceramic substrate, the LED chips are densely arranged on the substrate and directly connected to the substrate through a conductive adhesive or solder.

[0003] However, both aluminum and ceramic substrates have some limitations in their use in COB packaging. First, these substrates are usually not adaptable to more efficient patch manufacturing processes because the densely arranged LED chips need to be connected to the substrates by manual soldering. This process is not only labor-intensive but also difficult to achieve high automation. Secondly, although aluminum and ceramic substrates provide certain heat dissipation performance, their heat dissipation effect is still unsatisfactory in high-power-intensive applications, resulting in reduced LED performance or shortened life. In addition, the cost of aluminum and ceramic substrates is relatively high, which increases the cost of the overall package, making it difficult for products to maintain cost-effectiveness in a highly competitive market. Utility Model Content

[0004] In order to solve the technical defects raised in the above-mentioned background technology, the utility model provides a high-power COB patch bracket, including a substrate and a glue layer and a receiving portion arranged on the substrate, and at least one stress release cavity is also provided on the glue layer, and the stress release cavity is located above the glue layer, and the stress release cavity is located outside the receiving portion, and the stress release cavity is concave relative to the top of the glue layer, and the receiving portion is used to place LED lamp beads.

[0005] The stress release cavity is in the shape of a triangle, a circle, a square, or a curved triangle.

[0006] At least one of the stress release cavities is provided with a positioning groove.

[0007] The number of the stress relief cavities is eight.

[0008] The eight stress release cavities are relatively arranged around the adhesive layer.

[0009] The upper portion of the accommodating portion is in a shape of a circle or a square.

[0010] The adhesive layer extends from both sides of the substrate to the bottom of the substrate to form a welding portion, and the welding portion is located at the center of the bottom of the substrate;

[0011] The adhesive layer extends from both sides of the substrate to the bottom of the substrate, the electrode part is distributed around the bottom of the substrate, and the electrode part is physically isolated from the welding part.

[0012] The electrode portion includes a positive electrode and a negative electrode, and the positive electrode and the negative electrode are relatively located at the four corners of the bottom of the substrate;

[0013] The number of the electrode parts is four, wherein the number of positive electrodes and the number of negative electrodes are two each.

[0014] The welding part is also provided with a fixing piece, and the fixing piece is used to strengthen the connection between the welding part and the substrate.

[0015] On the other hand, an LED lamp including the above technical features is provided.

[0016] In summary, the beneficial effects of the utility model are:

[0017] In order to solve the problem of insufficient heat dissipation of traditional aluminum substrates and ceramic substrates in high-power applications, the utility model designs a unique stress relief cavity structure. The stress relief cavity is located above the glue layer and is concave in shape, which effectively increases the contact area between the glue layer and the environment, thereby optimizing thermal management, helping to disperse heat more effectively, and improving the working efficiency and life of the LED chip, ensuring that excellent performance can still be maintained under high-power operating conditions.

[0018] In addition, the design of the utility model reduces the changes in structural dimensions caused by thermal deformation and shrinkage of plastic through the stress release cavity structure, reduces the internal stress of the lamp beads, avoids the failure of the lamp beads, and effectively controls the production cost, making the new high-power COB patch bracket more cost-effective in the fierce market competition.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a top view of an embodiment of the utility model;

[0021] Figure 2 It is a bottom view of an embodiment of the utility model.

[0022] Description of reference numerals in the figures:

[0023] 1. Welding part;

[0024] 2. Adhesive layer;

[0025] 3. Substrate;

[0026] 4. Electrode; 41. Positive electrode; 42. Negative electrode;

[0027] 5. Stress relief cavity;

[0028] 6. Positioning slot;

[0029] 7. Fixing parts;

[0030] 8. Accommodation part. DETAILED DESCRIPTION

[0031] In order to make the content of the utility model more clearly understood, the utility model is further described below based on specific embodiments in combination with the accompanying drawings.

[0032] It should be noted that the terms "center", "upper", "lower", "front", "back", "left", "right", "inner", "outer" and the like used herein to indicate directions or positional relationships are based on directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. Unless otherwise specified, "plurality" means two or more.

[0033] Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood by specific circumstances.

[0034] like Figure 1 to Figure 2 As shown, an embodiment of the present application provides a high-power COB patch bracket, including a substrate 3 and an adhesive layer 2 and a receiving portion 8 arranged on the substrate 3, characterized in that at least one stress release cavity 5 is also provided on the adhesive layer 2, and the stress release cavity 5 is located above the adhesive layer 2, and the stress release cavity 5 is located outside the receiving portion 8, and the stress release cavity 5 is concave relative to the top of the adhesive layer 2, and the receiving portion 8 is used to place LED lamp beads.

[0035] In order to solve the problem of insufficient heat dissipation of traditional aluminum substrates and ceramic substrates in high-power applications, the utility model designs a unique stress relief cavity structure. The stress relief cavity is located above the glue layer and is concave inward, which effectively increases the contact area between the substrate and the environment, thereby optimizing thermal management, helping to disperse heat more effectively, and improving the working efficiency and life of the LED chip, ensuring that excellent performance can still be maintained under high-power operating conditions.

[0036] In addition, the design of the utility model reduces the changes in structural dimensions caused by thermal deformation and shrinkage of plastic through the stress release cavity structure, reduces the internal stress of the lamp beads, avoids the failure of the lamp beads, and effectively controls the production cost, making the new high-power COB patch bracket more cost-effective in the fierce market competition.

[0037] In this embodiment, the adhesive layer is provided with a receiving portion specifically for placing LED lamp beads, thereby ensuring accurate positioning and fixation of the LED lamp beads on the substrate and improving the consistency and accuracy of assembly.

[0038] In addition, the presence of the accommodating portion reduces the risk of movement of the LED lamp beads during operation and transportation, increases the stability of the entire device, optimizes the optical performance of the lamp beads, ensures the uniform distribution and efficiency of the light source, and thus improves the overall lighting effect.

[0039] The stress release cavity is in the shape of a triangle, a circle, a square, or a curved triangle.

[0040] In this embodiment, the stress relief cavity adopts a variety of geometric shapes, including triangle, circle, square and curved triangle. These different shapes can be selected according to the specific stress distribution and application requirements of the component, so as to effectively disperse and reduce the material stress concentration, and improve the structural stability and durability of the component.

[0041] At least one of the stress release cavities (5) is provided with a positioning groove (6).

[0042] The positioning groove set on the stress release cavity described in this embodiment provides additional assistance for the precise installation of the LED chip, ensures the correct position and stable fixation of the chip, significantly improves the accuracy and reliability of assembly, reduces functional failures and quality problems caused by position deviations during the production process, and further improves the overall product performance and manufacturing efficiency.

[0043] Optionally, the number of the stress relief cavities 5 is eight.

[0044] In this embodiment, the use of eight stress relief cavities can more evenly and effectively disperse the heat generated by the operation of the LED chip, optimize the overall heat dissipation efficiency, reduce the risk of overheating, and ensure the stability and long-term reliability of the LED chip in high-power applications. At the same time, the use of multiple stress relief cavities also helps to improve the performance and durability of the product in various working environments.

[0045] Optionally, the eight stress release cavities 5 are relatively arranged around the adhesive layer 2 .

[0046] In this embodiment, eight stress relief cavities are arranged around the adhesive layer (2), which helps to evenly distribute stress around the adhesive layer, reduce damage or failure of the adhesive layer due to local excessive stress, and thus improve the reliability and durability of the overall structure.

[0047] Optionally, the upper portion of the accommodating portion 8 is circular or square.

[0048] In this embodiment, the upper part of the accommodating portion 8 is designed to be either circular or square. Such a design provides structural flexibility so that the accommodating portion can better adapt to different component shapes and sizes. The circular design helps to reduce stress concentration and improve structural strength, while the square shape facilitates assembly and docking with other components, which not only optimizes the assembly efficiency of the components, but also enhances the functionality and reliability of the overall structure to meet diverse application requirements.

[0049] Optionally, the adhesive layer 2 extends from both sides of the substrate 3 to the bottom of the substrate 3 to form a welding portion 1, and the welding portion 1 is located at the center of the bottom of the substrate 3.

[0050] In this embodiment, the adhesive layer extends from both sides of the substrate to the bottom of the substrate and forms a welding portion, which is located in the center of the bottom of the substrate, providing a dedicated welding area. This area enhances the connection strength and stability between the substrate and other components, ensuring the mechanical integrity and electrical reliability of the entire component.

[0051] Additionally, a centrally located weld helps maintain balance across the baseplate, improving overall product durability and performance.

[0052] Optionally, the adhesive layer 2 extends from both sides of the substrate 3 to the bottom of the substrate 3 , the electrode 4 is distributed around the bottom of the substrate 3 , and the electrode 4 is physically isolated from the welding part 1 .

[0053] In this embodiment, the glue layer extends from both sides of the substrate to the bottom, and is physically isolated from the electrodes located around the bottom of the substrate. This configuration reduces electrical interference and potential short circuit risks. At the same time, physical isolation ensures the safety and reliability of electrical connections and improves the stability of the overall circuit. This design not only enhances the durability of the product, but also improves its performance in complex electrical environments.

[0054] Optionally, the electrode 4 includes a positive electrode 41 and a negative electrode 42 , and the positive electrode 41 and the negative electrode 42 are relatively located at four corners of the bottom of the substrate 3 .

[0055] In this embodiment, the electrode part is designed with the positive and negative electrodes located at the four corners of the bottom of the substrate. This layout enhances the stability of the circuit and the ability to evenly distribute current. By placing the positive and negative electrodes symmetrically, electrical interference can be effectively reduced and the response speed can be improved, thereby optimizing the supply and distribution of electricity.

[0056] In addition, this symmetrical design also helps to improve the reliability and durability of the overall circuit, ensuring long-term stable operation.

[0057] Optionally, the number of the electrodes 4 is four, wherein the number of the positive electrodes 41 and the number of the negative electrodes 42 are two each.

[0058] In this embodiment, there are four electrode parts, including two positive electrodes and two negative electrodes, which are evenly distributed at the four corners of the bottom of the substrate, providing better current balance and distribution, enhancing the overall efficiency and stability of the circuit, and the balanced layout of the four electrodes helps to reduce voltage fluctuations and electromagnetic interference, thereby improving the operating performance and reliability of the electronic equipment, and also makes the circuit connection more convenient and flexible to meet various application requirements.

[0059] Optionally, a fixing piece 7 is further provided on the welding portion 1 , and the fixing piece 7 is used to reinforce the connection between the welding portion 1 and the substrate 3 .

[0060] In this embodiment, a fixing piece is provided on the welding part to reinforce the connection between the welding part and the substrate, which significantly enhances the stability and mechanical strength of the structure and ensures that the connection is not easily broken or loosened during long-term use or when subjected to physical impact.

[0061] In addition, the use of fixings improves the durability and reliability of the entire device, thereby extending the service life of the product and reducing maintenance costs.

[0062] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A high-power COB patch bracket, comprising a substrate (3), and an adhesive layer (2) and a receiving portion (8) arranged on the substrate (3), characterized in that: At least one stress release cavity (5) is further provided on the adhesive layer (2), the stress release cavity (5) is located above the adhesive layer (2), the stress release cavity (5) is located outside the accommodating portion (8), the stress release cavity (5) is concave relative to the top of the adhesive layer (2), and the accommodating portion (8) is used to place LED lamp beads.

2. A high-power COB patch bracket according to claim 1, characterized in that: The stress release cavity is in the shape of a triangle, a circle, a square, or a curved triangle.

3. A high-power COB patch bracket according to claim 1, characterized in that: At least one of the stress release cavities (5) is provided with a positioning groove (6).

4. A high-power COB patch bracket according to claim 1, characterized in that: The number of the stress relief cavities (5) is eight.

5. A high-power COB patch bracket according to claim 4, characterized in that: The eight stress release cavities (5) are relatively arranged around the adhesive layer (2).

6. A high-power COB patch bracket according to claim 1, characterized in that: The upper portion of the accommodating portion (8) is in a shape of either a circle or a square.

7. The high-power COB patch bracket according to claim 1, characterized in that: The adhesive layer (2) extends from both sides of the substrate (3) to the bottom of the substrate (3) to form a welding portion (1), and the welding portion (1) is located at the center of the bottom of the substrate (3); The adhesive layer (2) extends from both sides of the substrate (3) to the bottom of the substrate (3), the electrode (4) portion is distributed around the bottom of the substrate (3), and the electrode (4) portion is physically isolated from the welding portion (1).

8. A high-power COB patch bracket according to claim 7, characterized in that: The electrode (4) portion comprises a positive electrode (41) and a negative electrode (42), wherein the positive electrode (41) and the negative electrode (42) are relatively located at the four corners of the bottom of the substrate (3); The number of the electrode (4) parts is four, wherein the number of the positive electrode (41) and the number of the negative electrode (42) are two each.

9. A high-power COB patch bracket according to claim 7, characterized in that: The welding portion (1) is also provided with a fixing piece (7), and the fixing piece (7) is used to reinforce the connection between the welding portion (1) and the substrate (3).

10. An LED lamp, characterized in that: An LED lamp with a high-power COB patch bracket as claimed in any one of claims 1 to 9.

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