Coupling agent evaporation structure for chemical vapor deposition equipment
By designing a coupling agent evaporation structure for chemical vapor deposition equipment in the CVD process, and using vacuum atomization technology to uniformly adhere the coupling agent to the substrate, the problem of coupling agent not being able to uniformly adhere in the prior art is solved, and the adhesion and effect are improved.
Patent Information
- Application Number
- CN202421667672.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-07-15
AI Technical Summary
In the existing CVD process, the coupling agent cannot reach the substrate uniformly and synchronously with the solvent in a vacuum environment, resulting in the coupling agent being unable to adhere uniformly on the substrate, affecting its effect.
A coupling agent evaporation structure for chemical vapor deposition equipment is designed, and the coupling agent is entered into the deposition chamber through vacuum atomization and rapid diffusion, so that it is evenly deposited on the substrate. The structure includes a raw material silo, a heating structure and a thin tube, and the heating and thin tube structure form atomization effect released after the pressure is increased.
The uniform adhesion of the coupling agent on the substrate is achieved, and the adhesion between the substrate and the film layer is improved, ensuring that the coupling agent fully exerts its role in enhancing the adhesion effect.
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Figure CN222821637U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of chemical vapor deposition, and in particular relates to a coupling agent evaporation structure for chemical vapor deposition equipment. Background Art
[0002] CVD (Chemical Vapor Deposition), full name chemical vapor deposition, is a chemical reaction process. It heats one or more gases (called precursors) to decompose them, produce polymerization reactions, and deposit on the substrate surface to form the desired thin film. CVD has the characteristics of low deposition temperature, easy control of film composition, film thickness proportional to deposition time, good uniformity, good repeatability, and excellent step coverage.
[0003] In the CVD process, there is a process of spraying a coupling agent on the surface of the substrate to improve the adhesion between the substrate and the film. In the prior art, this process is generally performed by diluting the coupling agent with a solvent (such as alcohol), and then spraying the coupling agent into a deposition chamber through a spray gun in a vacuum environment, and attaching it to the substrate. However, in a vacuum environment, the coupling agent and the solvent cannot reach the surface of the substrate evenly and synchronously (generally the solvent arrives first, and the coupling agent arrives later), which results in the coupling agent not being able to adhere evenly to the substrate, affecting its function.
[0004] In view of this, the utility model aims to provide a coupling agent evaporation structure for chemical vapor deposition equipment, which, through ingenious structural design, can allow the coupling agent to enter the deposition chamber in a vacuum atomized and rapidly diffused manner, so that the coupling agent can be evenly deposited on the substrate, thereby fully playing the role of increasing the adhesion between the substrate and the film layer. Utility Model Content
[0005] The purpose of the utility model is to provide a coupling agent evaporation structure for chemical vapor deposition equipment to address the deficiencies of the prior art. Through its ingenious structural design, the coupling agent can be introduced into the deposition chamber in a vacuum atomized and rapidly diffused manner, so that the coupling agent can be evenly deposited on the substrate, thereby fully playing the role of increasing the adhesion between the substrate and the film layer.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A coupling agent evaporation structure for chemical vapor deposition equipment includes a raw material bin, a feed port is provided on the raw material bin, and the side wall of the raw material bin is connected to a deposition chamber through a connecting bin, a first heating structure is provided on the raw material bin, a second heating structure is provided on the connecting bin, and a thin tube connecting the raw material bin and the deposition chamber and through which the coupling agent passes is provided in the connecting bin.
[0008] As an improvement of the coupling agent evaporation structure for the chemical vapor deposition equipment of the utility model, one end of the capillary is connected to the raw material bin through a connecting port, and the other end of the capillary is connected to the discharge port of the connecting bin, the diameter of the connecting port is larger than the diameter of the capillary, and the size of the discharge port is larger than the size of the connecting port.
[0009] As an improvement of the coupling agent evaporation structure for chemical vapor deposition equipment of the utility model, the first heating structure is specifically a first heating ring sleeved outside the raw material bin.
[0010] As an improvement of the coupling agent evaporation structure for chemical vapor deposition equipment of the utility model, the second heating structure is specifically a second heating ring sleeved outside the connecting chamber.
[0011] As an improvement of the coupling agent evaporation structure for chemical vapor deposition equipment of the utility model, the deposition chamber is also connected with a vacuum pumping mechanism.
[0012] As an improvement of the coupling agent evaporation structure for the chemical vapor deposition equipment of the utility model, a sensor is also provided in the deposition chamber, and the sensor is connected to the control device. When the sensor detects that the vacuum value in the deposition chamber reaches a set value, the first heating structure and the second heating structure are started.
[0013] As an improvement of the coupling agent evaporation structure for chemical vapor deposition equipment of the utility model, the feed inlet is arranged at the top of the raw material bin.
[0014] As an improvement of the coupling agent evaporation structure for chemical vapor deposition equipment of the utility model, the feed port is matched with a cover body.
[0015] Compared with the prior art, the present invention, through ingenious structural design, can allow the coupling agent to enter the deposition chamber in the form of vacuum atomization, rapid diffusion, and uniform diffusion, so that the coupling agent can be evenly deposited on the substrate, allowing it to fully play the role of increasing the adhesion between the substrate and the film layer.
[0016] When in use, the coupling agent is added into the raw material bin from the feed port. When the sensor senses that the vacuum degree in the deposition chamber reaches the requirement, the first heating structure and the second heating structure are started, the raw material bin is heated and pressurized, the coupling agent evaporates and enters the deposition chamber from the capillary. In this process, due to the small aperture of the capillary, the pressure of the coupling agent entering it is further increased, and then it is suddenly released from the discharge port, forming an atomization effect, so that the coupling agent quickly diffuses into the deposition chamber in the form of mist. This form of coupling agent can form a coupling agent adhesion layer of uniform thickness on the substrate, thereby improving its adhesion effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1This is one of the three-dimensional structural schematic diagrams of the utility model.
[0018] Figure 2 This is the second schematic diagram of the three-dimensional structure of the utility model.
[0019] Figure 3 It is one of the three-dimensional structural schematic diagrams of part of the structure in the utility model.
[0020] Figure 4 This is the second three-dimensional structural schematic diagram of part of the structure of the utility model.
[0021] Figure 5 It is a schematic cross-sectional view of part of the structure of the utility model. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the components under a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0024] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0025] Example
[0026] like Figure 1-5As shown, this embodiment provides a coupling agent evaporation structure for chemical vapor deposition equipment, including a raw material warehouse 1, a feed port 11 is provided on the raw material warehouse 1, and the side wall of the raw material warehouse 1 is connected to the deposition chamber 3 through the connecting warehouse 2, a first heating structure 4 is provided on the raw material warehouse 1, a second heating structure 5 is provided on the connecting warehouse 2, and a capillary 6 is provided in the connecting warehouse 2 for connecting the raw material warehouse 1 and the deposition chamber 3 and for the coupling agent to pass through. The first heating structure 4 and the second heating structure 5 can heat the coupling agent, so that it evaporates into a gaseous state and the pressure increases. The setting of the capillary 6 further increases the pressure, and then it is suddenly released from the connecting warehouse 2, so that the coupling agent can diffuse into the deposition chamber 3 in an atomized form.
[0027] One end of the capillary 6 is connected to the raw material bin 1 through the connecting port 7, and the other end of the capillary 6 is connected to the discharge port 21 of the connecting bin 2. The diameter of the connecting port 7 is larger than the diameter of the capillary 6, and the size of the discharge port 21 is larger than the size of the connecting port 7. The entire structure is small in the middle and large on both sides. This structure can increase the pressure rapidly.
[0028] The first heating structure 4 is specifically a first heating ring sleeved outside the raw material bin, which is convenient to control and low in cost.
[0029] The second heating structure 5 is specifically a second heating ring sleeved outside the connecting chamber, which is convenient to control and low in cost.
[0030] The deposition chamber 3 is also connected to a vacuum pumping mechanism for evacuating the deposition chamber 3 .
[0031] A sensor is also provided in the deposition chamber 3, and the sensor is connected to the control device. When the sensor detects that the vacuum value in the deposition chamber 3 reaches a set value, the first heating structure 4 and the second heating structure 5 are started, which is energy-saving and environmentally friendly.
[0032] The feed port 11 is arranged at the top of the raw material bin 1. The feed port 11 is matched with a cover. When the coupling agent needs to be poured in, the cover is opened. After pouring, the cover is closed again.
[0033] Through the ingenious structural design, the utility model can allow the coupling agent to enter the deposition chamber 3 in a vacuum atomized, rapidly diffused and uniformly diffused manner, so that the coupling agent can be uniformly deposited on the substrate, allowing it to fully play the role of increasing the adhesion between the substrate and the film layer.
[0034] When in use, the coupling agent is added into the raw material bin 1 from the feed port. When the sensor senses that the vacuum degree in the deposition chamber reaches the requirement, the first heating structure 4 and the second heating structure 5 are started, the raw material bin 1 is heated and pressurized, the coupling agent volatilizes and enters the deposition chamber 3 from the capillary 6. In this process, due to the small aperture of the capillary 6, the pressure of the coupling agent entering therein is further increased, and then it is suddenly released from the discharge port, which can form an atomization effect, so that the coupling agent quickly diffuses into the deposition chamber 3 in the form of mist. This form of coupling agent can form a coupling agent adhesion layer of uniform thickness on the substrate, thereby improving its adhesion effect.
[0035] According to the disclosure and teaching of the above description, the technicians in the field of the utility model can also make appropriate changes and modifications to the above implementation. Therefore, the utility model is not limited to the specific implementation methods disclosed and described above, and some modifications and changes to the utility model should also fall within the scope of protection of the claims of the utility model. In addition, although some specific terms are used in this specification, these terms are only for the convenience of description and do not constitute any limitation to the utility model.
Claims
1. A coupling agent evaporation structure for chemical vapor deposition equipment, characterized in that: It includes a raw material bin, which is provided with a feed port, and the side wall of the raw material bin is connected to the deposition chamber through a connecting bin, the raw material bin is provided with a first heating structure, the connecting bin is provided with a second heating structure, and a thin tube connecting the raw material bin and the deposition chamber and for the coupling agent to pass through is provided in the connecting bin.
2. The coupling agent evaporation structure for chemical vapor deposition equipment according to claim 1, characterized in that: One end of the capillary is connected to the raw material bin via a connecting port, and the other end of the capillary is connected to a discharge port of the connecting bin. The diameter of the connecting port is larger than the diameter of the capillary, and the size of the discharge port is larger than the size of the connecting port.
3. The coupling agent evaporation structure for chemical vapor deposition equipment according to claim 1, characterized in that: The first heating structure is specifically a first heating ring sleeved outside the raw material bin.
4. The coupling agent evaporation structure for chemical vapor deposition equipment according to claim 1, characterized in that: The second heating structure is specifically a second heating ring sleeved outside the connecting chamber.
5. The coupling agent evaporation structure for chemical vapor deposition equipment according to claim 1, characterized in that: The deposition chamber is also connected to a vacuum pumping mechanism.
6. The coupling agent evaporation structure for chemical vapor deposition equipment according to claim 1, characterized in that: A sensor is also provided in the deposition chamber, and the sensor is connected to the control device. When the sensor detects that the vacuum value in the deposition chamber reaches a set value, the first heating structure and the second heating structure are started.
7. The coupling agent evaporation structure for chemical vapor deposition equipment according to claim 1, characterized in that: The feed inlet is arranged at the top of the raw material bin.
8. The coupling agent evaporation structure for chemical vapor deposition equipment according to claim 1 or 7, characterized in that: The feed port is matched with a cover body.
Citation Information
Cited By
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