Chip detection jig

Abstract

The embodiment of the utility model discloses a chip detection jig, which comprises a first shell, a second shell and a heat dissipation structure, the second shell is used for placing a chip, and the second shell is rotatably connected with the first shell. The heat dissipation structure is movably arranged on the first shell in the preset direction, the heat dissipation structure is provided with an attaching face, and the attaching face can be attached to the chip in the process that the heat dissipation structure rotates along with the first shell. The heat dissipation structure is convexly provided with an abutting piece towards the second shell, one end of the abutting piece is arranged close to the rotating shaft of the first shell, and in the process that the heat dissipation structure rotates along with the first shell, the second shell can extrude the end, close to the first shell, of the abutting piece so as to drive the end, close to the rotating shaft of the first shell, of the heat dissipation structure to move back to the chip. The fitting surface is lifted through cooperation between the second shell and the abutting piece, it is guaranteed that the fitting surface and the chip are only in a complete fitting state in the movement process, and then it can be guaranteed that the chip is not damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of chip detection, in particular to a chip detection fixture. Background Art

[0002] The chip detection fixture can clamp the chip in order to test the performance of the chip. In a sense, the chip detection fixture is a connector that meets certain testing requirements of the chip. It is a static connector between the PCB and the IC, which makes the replacement and testing of the chip more convenient. The chip detection fixture in the related art has two upper and lower shells, which are usually connected together by a rotating shaft. When clamping, the chip is placed in the lower shell, and the two shells are covered together by relative rotation between the two shells, and the chip is clamped by the two shells.

[0003] When the chip detection fixture of the related technology clamps the chip, the upper shell has a fitting portion for abutting the end face of the chip. However, when the upper shell is rotated to drive the fitting portion to abut the chip, a scissor angle is formed between the end face of the chip and the chip, that is, the fitting portion often contacts partially with the chip. In the process of continuing to rotate the upper shell, the fitting portion and the chip will change from "partial contact-full fitting". However, the result is that the chip will be partially subjected to a large extrusion force during the process from the initial contact with the fitting portion to the full fitting, which can easily cause damage to some stress-bearing parts of the chip, resulting in the chip being scrapped. Utility Model Content

[0004] Based on this, it is necessary to propose a chip detection fixture to ensure that the chip is not damaged in response to the above problems.

[0005] The present invention provides a chip detection tool, comprising:

[0006] a first shell;

[0007] A second shell, used for placing a chip, the second shell being rotatably connected to the first shell;

[0008] A heat dissipation structure is movably disposed on the first housing along a predetermined direction, the heat dissipation structure has a bonding surface, and the bonding surface can be bonded to the chip during the rotation of the heat dissipation structure with the first housing;

[0009] The heat dissipation structure is provided with an abutment protruding toward the second shell, and one end of the abutment is arranged close to the rotating shaft of the first shell. When the heat dissipation structure rotates with the first shell, the second shell can squeeze the end of the abutment close to the first shell to drive the end of the heat dissipation structure close to the rotating shaft of the first shell to move away from the chip.

[0010] In some embodiments, a through slot is formed on the abutment member along the predetermined direction, a positioning pin is passed through the through slot, the positioning pin can be screwed onto the heat dissipation structure, and the positioning pin can clamp the abutment member onto the heat dissipation structure.

[0011] In some embodiments, the end surface where the abutment member abuts against the second shell is configured as an arc surface.

[0012] In some embodiments, the heat dissipation structure includes a heat conducting part and a heat dissipating part connected together, the end surface of the heat conducting part facing away from the heat dissipating part is provided with a fitting, the end surface of the fitting facing away from the heat conducting part is provided as the fitting surface, the abutment part is connected to the heat conducting part, the first shell passes through a limiting groove along a predetermined direction, and the heat conducting part moves in the limiting groove.

[0013] In some embodiments, a limiting member is further provided on the heat dissipation portion, and the limiting member can abut against the first housing to limit the heat conduction portion from staying at a predetermined position when moving toward the chip along a predetermined direction.

[0014] In some embodiments, the heat dissipation structure is further provided with a receiving groove, a heating element is provided in the receiving groove, and a cover plate for covering the receiving groove is detachably connected to the heat dissipation structure.

[0015] In some embodiments, a plurality of heat dissipation columns are protruding from the heat dissipation portion, and the plurality of heat dissipation columns are arranged at intervals on the heat dissipation portion.

[0016] In some embodiments, an elastic structure is also included, which includes a connecting portion connected to the first shell and an elastic portion connected to the connecting portion, the elastic portion can abut against the heat dissipation structure, and the elastic portion can provide a force for the heat dissipation structure to move toward the chip.

[0017] In some embodiments, a buckle block is protruding from the first shell, and a buckle hole for buckling with the buckle block is penetrated through the connecting portion.

[0018] In some embodiments, a buckling member is disposed on the first shell, and a buckling rod is disposed on the second shell on a rotation path of the buckling member, and the buckling member can be buckled to the buckling rod.

[0019] The following beneficial effects are achieved by using the embodiments of the present invention:

[0020] According to the chip detection jig in the above embodiment, by setting an abutment piece, in the process of rotating the first shell to drive the fitting surface to rotate toward the chip, the end of the abutment piece close to the rotating shaft can first abut on the second shell to hinder the rotation of the first shell. However, since the heat dissipation structure can move in a predetermined direction relative to the first shell, when the first shell continues to rotate, the second shell can squeeze the abutment piece, thereby driving the end of the heat dissipation structure close to the rotating shaft of the first shell to move away from the chip.

[0021] In this way, the fitting surface can be lifted through the cooperation between the second shell and the abutment, so that the vertical distance between the fitting surface and the rotation axis of the first shell (the distance in the direction perpendicular to the fitting surface) is equal to the vertical distance between the chip end face and the rotation axis of the first shell (the distance in the direction perpendicular to the chip end face), so that the scissor angle between the fitting surface and the chip end face can be eliminated during the rotation of the first shell, and the phenomenon of partial abutment with the chip before full abutment will not occur, which ensures that the fitting surface is only in a state of full abutment with the chip during the movement, thereby ensuring that the chip is not damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] in:

[0024] Figure 1 A schematic diagram of the structure of a chip detection fixture provided by the utility model is shown;

[0025] Figure 2 Another structural schematic diagram of a chip detection fixture provided according to the utility model is shown;

[0026] Figure 3 An exploded view of a chip detection fixture provided according to the utility model is shown.

[0027] Description of main component symbols:

[0028] 1. First shell; 11. Fastener; 12. Fastener block; 13. Limiting groove; 2. Second shell; 21. Fastener rod; 3. Heat dissipation structure; 31. Heat-conducting part; 311. Fitting part; 32. Heat dissipation part; 321. Limiting part; 322. Heat dissipation column; 33. Abutment part; 331. Through groove; 332. Positioning pin; 34. Accommodating groove; 4. Elastic structure; 41. Connecting part; 411. Fastener hole; 42. Elastic part; 50. Cover plate; 60. Heating element. DETAILED DESCRIPTION

[0029] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0032] The utility model provides a chip detection fixture for clamping a chip to detect the performance of the chip. Figures 1 to 3 The chip detection fixture includes a first shell 1, a second shell 2 and a heat dissipation structure 3. The second shell 2 has a placement groove, and the chip can be adapted to fit in the placement groove. The second shell 2 is rotatably connected to the first shell 1. The first shell 1 and the second shell 2 have a rotation state and a locking state. The first shell 1 and the second shell 2 can be temporarily fixed by the connection structure. The connection structure that can fix the first shell 1 and the second shell 2 will be described in detail below. It should be noted that it will be mentioned below that during the rotation of the first shell 1, the bonding surface can be bonded to the end surface of the chip. It can be foreseen that when the bonding surface is bonded to the end surface of the chip, the first shell 1 and the second shell 2 will be locked.

[0033] The heat dissipation structure 3 is movably disposed on the first housing 1 along a predetermined direction. The heat dissipation structure 3 has a fitting surface. When the heat dissipation structure 3 rotates with the first housing 1 , the fitting surface can fit on the chip.

[0034] It is worth mentioning that the predetermined direction is a relative direction, and its reference standard is the bonding surface, that is, the movement direction of the heat dissipation structure 3 is preferably perpendicular to the bonding surface. It should be noted that when the first shell 1 and the second shell 2 are locked, the bonding surface is bonded to the chip end surface, and the bonding surface is facing the chip end surface. At this time, if an external force is applied to the heat dissipation structure 3 to make it move in the predetermined direction, it can move toward or away from the chip.

[0035] The heat dissipation structure 3 is provided with an abutment 33 protruding toward the second shell 2, and one end of the abutment 33 is arranged close to the rotating shaft of the first shell 1. When the heat dissipation structure 3 rotates with the first shell 1, the second shell 2 can squeeze the end of the abutment 33 close to the first shell 1 to drive the end of the heat dissipation structure 3 close to the rotating shaft of the first shell 1 to move away from the chip.

[0036] The abutment member 33 is configured such that its end can preferentially abut against the second housing 2. The premise of such a configuration is that when the end of the abutment member 33 that can abut against the second housing 2 is not abutting against the second housing 2, the distance between the end of the abutment member 33 and the rotation axis of the first housing 1 in the moving direction of the heat dissipation structure 3 is greater than the distance between the rotation axis of the first housing 1 and the end surface of the second housing 2 (the end surface abutting against the abutment member 33). Figure 1 , Figure 1 The figure shows the state when the first housing 1 is rotated until the abutment member 33 just abuts against the second housing 2. Figure 1 H indicates the distance between the end of the abutment member 33 and the rotation axis of the first housing 1 , and L indicates the distance between the end surface of the second housing 2 abutting against the abutment member 33 and the rotation axis of the first housing 1 .

[0037] The specific distance between the abutment member 33 and the rotation axis of the first housing 1 can be determined according to actual conditions and is not limited here.

[0038] By setting the abutment 33, in the process of rotating the first shell 1 to drive the fitting surface to rotate toward the chip, the end of the abutment 33 close to the rotation axis can first abut on the second shell 2 to hinder the rotation of the first shell 1. However, since the heat dissipation structure 3 can move in a predetermined direction relative to the first shell 1, when the first shell 1 continues to rotate, the second shell 2 can squeeze the abutment 33, thereby driving the end of the heat dissipation structure 3 close to the rotation axis of the first shell 1 to move away from the chip.

[0039] In this way, the fitting surface can be lifted through the cooperation between the second shell 2 and the abutment 33, so that the vertical distance between the fitting surface and the rotation axis of the first shell 1 (the distance in the direction perpendicular to the fitting surface) is equal to the vertical distance between the chip end face and the rotation axis of the first shell 1 (the distance in the direction perpendicular to the chip end face), so that the scissor angle between the fitting surface and the chip end face can be eliminated during the rotation of the first shell 1, and the phenomenon of partial abutment with the chip first and then full abutment will not occur, which ensures that the fitting surface is in a state of full abutment with the chip only during the movement, thereby ensuring that the chip is not damaged.

[0040] In one embodiment, see Figures 1 to 3 In order to adapt to chips of different thicknesses, the position of the abutment member 33 relative to the heat dissipation structure 3 can also be adjusted.

[0041] Specifically, a through slot 331 is penetrated on the abutment member 33 along a predetermined direction, and the predetermined direction is preferably the moving direction of the heat dissipation structure 3. A positioning pin 332 is penetrated in the through slot 331, and the positioning pin 332 can be screwed on the heat dissipation structure 3. Tightening the positioning pin 332 can clamp the abutment member 33 on the heat dissipation structure 3, and loosening the positioning pin 332 can move the abutment member 33 along the path of the through slot 331 to adjust the position of the abutment member 33 relative to the heat dissipation structure 3, thereby adjusting the protruding size of the abutment member 33.

[0042] It should be noted that, in order to ensure the stability of the moving direction of the abutting member 33 , a plurality of through slots 331 may be provided on the abutting member 33 , and the positioning pins 332 in the plurality of through slots 331 jointly limit the position of the abutting member.

[0043] Preferably, a recessed groove communicating with the through groove 331 may be provided on the abutment member 33, and the size of the recessed groove is larger than the size of the through groove 331, that is, the recessed groove is arranged around the through groove 331. The positioning pin 332 is abutted against the abutment member 33 by its head, and the recessed groove can provide a placement space for the head of the positioning pin 332.

[0044] It is worth mentioning that the end surface of the abutment 33 facing the second shell 2 is a plane. When the first shell 1 rotates to fit the bonding surface with the chip end surface, the end surface of the abutment 33 facing the second shell 2 is parallel to the end surface of the second shell 2 facing the abutment 33.

[0045] Since different chips have different thicknesses, or the same chip may have different thicknesses due to errors, if the position of the abutment member 33 relative to the second housing 2 is relatively single, it cannot be adapted to the clamping of multiple chips.

[0046] For example, if the chip is thicker, then in order to prevent the bonding surface from partially contacting the chip during the rotation of the first housing 1, the position of the contact member 33 relative to the second housing 2 needs to be set so that the second housing 2 can drive the bonding surface to move a larger distance by pressing the contact member 33. If the chip is thinner, this distance will be relatively smaller. The distance to drive the bonding surface to move needs to be coordinated with the relative position between the contact member 33 and the second housing 2.

[0047] This relative position can be described by the angle between the first shell 1 and the second shell 2 when the end of the abutment member 33 and the second shell 2 just abut. If the angle between the first shell 1 and the second shell 2 is large when the end of the abutment member 33 and the second shell 2 just abut, it means that when the first shell 1 continues to rotate, the distance that the contact surface moves away from the chip is also large, otherwise it is small.

[0048] Therefore, by setting a through groove 331 on the abutment 33 and utilizing the tightening and loosening of the positioning pin 332, the position of the abutment 33 relative to the second shell 2 can be controlled, thereby being able to adapt to chips of different thicknesses. When clamping chips of different thicknesses, the bonding surface can be adjusted according to the thickness of the chip to prevent a situation in which part of the structure of the bonding surface is bonded to the chip first.

[0049] In addition, since the end of the abutment member 33 abuts on the second shell 2 and can move relative to the end surface of the second shell 2, the end surface where the abutment member 33 and the second shell 2 abut can be set as an arc surface. By setting it as an arc surface, the wear between the abutment member 33 and the second shell 2 can be reduced.

[0050] In one embodiment, see Figures 1 to 3 The heat dissipation structure 3 includes a heat conducting part 31 and a heat dissipation part 32 connected together. The end surface of the heat conducting part 31 facing away from the heat dissipation part 32 is provided with a bonding member 311, and the end surface of the bonding member 311 facing away from the heat conducting part 31 is provided as a bonding surface. The abutment member 33 is connected to the heat conducting part 31, and the specific connection position may be not fixed, and may be connected to the end surface of the heat conducting part 31 facing away from the heat dissipation part 32, or may be connected to the side surface of the heat conducting part 31.

[0051] The first housing 1 passes through the limiting groove 13 along the moving direction of the heat dissipation structure 3 , and the heat conducting portion 31 moves in the limiting groove 13 . The shape and size of the heat conducting portion 31 match those of the limiting groove 13 .

[0052] In a specific embodiment, a limiting member 321 is further provided on the heat dissipation portion 32, and the limiting member 321 can abut against the first housing 1 to limit the heat conducting portion 31 to stay at a predetermined position when it moves toward the chip in a predetermined direction. The predetermined position needs to be determined according to actual conditions, and the heat conducting portion 31 can move in the limiting groove 13. When the first housing 1 and the second housing 2 are in a locked state, the fitting surface is directly opposite to the end surface of the chip, and the heat conducting portion 31 can move toward or away from the chip at this time. When it moves toward the chip, the limiting member 321 can abut against the first housing 1 to limit the heat conducting portion 31 from continuing to move toward the chip, so as to limit the position of the fitting surface relative to the chip.

[0053] In order to increase the heat dissipation effect, a plurality of heat dissipation columns 322 are protruding from the heat dissipation portion 32. The plurality of heat dissipation columns 322 are arranged at intervals on the heat dissipation portion 32, and the plurality of heat dissipation columns 322 are arranged in a matrix. By providing the heat dissipation columns 322, the contact area between the heat dissipation portion 32 and the air can be increased to increase the heat dissipation effect.

[0054] It should be noted that the heat dissipation structure 3 is also provided with a receiving groove 34, in which a heating element 60 is provided, and a cover plate 50 for covering the receiving groove 34 can be detachably connected to the heat dissipation structure 3, and the cover plate 50 is detachably connected to the heat dissipation structure 3 by screws. The heating element 60 can heat the chip, and the heat dissipation structure 3 can not only fix the chip on the second housing 2 through the bonding surface, but also transfer the excess heat on the chip to the heat dissipation part 32 for release through the heat conduction part 31, and can also be used to conduct the heat of the heating element 60.

[0055] The chip needs to be heated during the detection process to simulate the ambient temperature when it is working, so the heating element 60 is used to achieve this. However, the heating temperature of the heating element 60 cannot exceed the maximum temperature that the chip can withstand, so it is necessary to control the temperature balance while heating. The heat dissipation structure 3 can play a role in balancing the chip temperature. Therefore, the heating element 60 can be directly set on the heat dissipation structure 3.

[0056] In one embodiment, see Figures 1 to 3 The detection fixture further includes an elastic structure 4, which includes a connecting portion 41 connected to the first shell 1 and an elastic portion 42 connected to the connecting portion 41. The elastic structure 4 is provided with two spaced connecting portions 41, and the two spaced connecting portions 41 can be respectively connected to the opposite sides of the first shell 1. Specifically, a buckle block 12 is also protruding on the opposite sides of the first shell 1, and a buckle hole 411 is penetrated on the connecting portion 41 to buckle with the buckle block 12. Through the cooperation of the buckle block 12 and the buckle hole 411, the connecting portion 41 can be connected to the first shell 1.

[0057] In addition, the elastic part 42 is disposed between the two connecting parts 41, and both ends of the elastic part 42 are fixedly connected to the two connecting parts 41, or in a preferred embodiment, the elastic part 42 and the connecting part 41 are integrally formed. The elastic part 42 and the two connecting parts 41 form a whole.

[0058] The interval between the connecting portions 41 is adapted to the spacing between the two opposite sides of the first housing 1 , so that the two connecting portions 41 can fit on the side wall of the first housing 1 .

[0059] The elastic part 42 is a structure made of elastic material, and the elastic material can be but not limited to plastic. The middle position of the elastic part 42 can abut against the end surface of the heat dissipation part 32 facing away from the heat conduction part 31, and the elastic part 42 can provide a force for the heat dissipation structure 3 to move toward the chip, that is, when the heat dissipation structure 3 has a tendency to move away from the chip, the elastic part 42 can apply an elastic force toward the chip to the heat dissipation structure 3, and applying a sufficiently large external force opposite to the elastic force to the heat dissipation structure 3 can drive the heat dissipation structure 3 to move away from the chip. When the external force is removed, the heat dissipation structure 3 can return to its original position under the drive of the elastic part 42.

[0060] The elastic structure 4 can cooperate with the limiting member 321 to fix the position of the heat dissipation structure 3 , so that the heat dissipation structure 3 is fixed relative to the first housing 1 when no external force is applied.

[0061] In one embodiment, a fastener 11 is provided at one end of the first housing 1 away from the connection with the second housing 2, one end of the fastener 11 is rotatably connected to the first housing 1, a hook is provided at the other end of the fastener 11, and a fastener rod 21 is provided at one end of the second housing 2 away from the connection with the first housing 1, and the fastener rod 21 is located on the moving path of the hook. The hook of the fastener 11 can be fastened to the fastener rod 21, so that the first housing 1 and the second housing 2 are relatively fixed and in a locked state.

[0062] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A chip detection fixture, characterized in that: include: a first shell; A second shell, used for placing a chip, the second shell being rotatably connected to the first shell; A heat dissipation structure is movably disposed on the first housing along a predetermined direction, the heat dissipation structure has a bonding surface, and the bonding surface can be bonded to the chip during the rotation of the heat dissipation structure with the first housing; The heat dissipation structure is provided with an abutment protruding toward the second shell, and one end of the abutment is arranged close to the rotating shaft of the first shell. When the heat dissipation structure rotates with the first shell, the second shell can squeeze the end of the abutment close to the first shell to drive the end of the heat dissipation structure close to the rotating shaft of the first shell to move away from the chip.

2. The chip detection fixture according to claim 1, characterized in that: A through slot is penetrated through the abutment member along the predetermined direction, and a positioning pin is passed through the through slot. The positioning pin can be screwed on the heat dissipation structure, and the positioning pin can clamp the abutment member on the heat dissipation structure.

3. The chip detection fixture according to claim 2, characterized in that: The end surface where the abutting member abuts against the second shell is configured as an arc surface.

4. The chip detection fixture according to claim 1, characterized in that: The heat dissipation structure includes a heat conducting part and a heat dissipating part connected together, the end surface of the heat conducting part facing away from the heat dissipating part is provided with a fitting, the end surface of the fitting facing away from the heat conducting part is provided as the fitting surface, the abutment part is connected to the heat conducting part, the first shell passes through a limiting groove along a predetermined direction, and the heat conducting part moves in the limiting groove.

5. The chip detection jig according to claim 4, characterized in that: A limiting member is also provided on the heat dissipation portion, and the limiting member can abut against the first housing to limit the heat conduction portion from staying at a predetermined position when moving toward the chip along a predetermined direction.

6. The chip detection jig according to claim 4, characterized in that: The heat dissipation structure is also provided with a receiving groove, in which a heating element is provided, and the heat dissipation structure is also detachably connected with a cover plate for covering the receiving groove.

7. The chip detection jig according to claim 4, characterized in that: A plurality of heat dissipation columns are protruding from the heat dissipation portion, and the plurality of heat dissipation columns are arranged at intervals on the heat dissipation portion.

8. The chip detection fixture according to any one of claims 1 to 7, characterized in that: It also includes an elastic structure, which includes a connecting portion connected to the first shell and an elastic portion connected to the connecting portion. The elastic portion can abut against the heat dissipation structure, and the elastic portion can provide a force for the heat dissipation structure to move toward the chip.

9. The chip detection jig according to claim 8, characterized in that: A buckle block is also protruding from the first shell, and a buckle hole for buckling with the buckle block is penetrated through the connecting portion.

10. The chip detection jig according to claim 1, characterized in that: A buckling member is disposed on the first shell, and a buckling rod is disposed on the second shell on a rotation path of the buckling member, and the buckling member can be buckled to the buckling rod.

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