Efficient heat dissipation 800G SR8 optical module

Abstract

The utility model relates to an efficient heat dissipation 800G SR8 optical module, which is characterized in that heat dissipation holes distributed in an array are arranged below a copper sheet arranged on the upper surface of a PCB (printed circuit board), copper is plated in the heat dissipation holes firstly, then resin is adopted to fill the holes, an electric chip is fixed on the copper sheet, a strip-shaped through groove penetrating through the upper surface and the lower surface of the PCB is arranged in an area, not covered with the copper sheet, of the PCB, a heat dissipation block is fixed in the through groove, and the heat dissipation block is arranged in the through groove. The upper surface of the heat dissipation block is flush with the upper surface of the copper sheet, and an optical chip coupled with the electric chip is fixed on the upper surface of the heat dissipation block. The beneficial effects are that the optical chip is not fixed on the copper sheet, but is fixed on the additional heat dissipation block, so heat dissipation can be carried out on the optical chip through the heat dissipation block, the sectional area of a single heat dissipation block is larger than copper plated on the inner walls of a plurality of heat dissipation holes, namely, the heat dissipation sectional area is large, the heat dissipation effect on the optical chip is very large, and the heat dissipation efficiency is greatly improved. The temperature of the optical chip can be greatly reduced after the additional heat dissipation channel is adopted, and the high-temperature performance and the high-temperature yield of the optical chip are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, and in particular to an efficient heat dissipation 800G SR8 optical module. Background Art

[0002] Traditional 800G SR8 optical modules have 8 transmit and 8 receive channels, and are usually divided into two groups, each with a 4-channel transmit channel and a 4-channel receive channel. To solve the heat dissipation problem, traditional mainstream solutions such as Figure 1 As shown, it includes: opening a plurality of heat dissipation holes on a PCB board to form a heat dissipation hole array, first copper-plating the heat dissipation holes and then filling the holes with resin, then grinding and copper-plating the area where the heat dissipation holes are opened on the PCB board, the copper-plated thickness of the inner wall of the heat dissipation hole is 35um to 70um (due to the spacing requirements of the heat dissipation holes, and the thicker the copper on the inner wall of the hole, the higher the copper plating cost, so this range is usually selected), the copper-plated thickness on the PCB board is 35um, because the copper skin will be uneven after the holes are opened, and the optical chip must ensure the flatness of the optical path, so the optical chip can only be fixed on the copper skin in the area not corresponding to the heat dissipation hole, and the electric chip can be fixed on the copper skin in the area facing the heat dissipation hole. This method can only effectively dissipate the heat of the electric chip, but cannot effectively dissipate the heat of the optical chip, so the heat dissipation effect of the optical chip is poor, the high temperature performance is reduced, and the yield is low. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide an 800G SR8 optical module with high efficiency in heat dissipation, so as to overcome the deficiencies in the above-mentioned prior art.

[0004] The utility model provides a technical solution to the above technical problems as follows: an efficient heat dissipation 800G SR8 optical module, comprising: a PCB board, wherein heat dissipation holes distributed in an array are provided below the copper sheet on the upper surface of the PCB board, the heat dissipation holes are first copper-plated and then filled with resin, an electric chip is fixed on the copper sheet, and a long strip-shaped through groove penetrating the upper and lower surfaces of the PCB board is provided in an area not covered with the copper sheet, a heat dissipation block is fixed in the through groove, the upper surface of the heat dissipation block is flush with the upper surface of the copper sheet, and an optical chip coupled to the electric chip is fixed on the upper surface of the heat dissipation block.

[0005] The beneficial effect of the utility model is that the optical chip is not fixed on the copper sheet, but fixed on an additional heat sink, so the heat dissipation of the optical chip can be carried out through the heat sink. Since the cross-sectional area of ​​a single heat sink is larger than the copper-plated inner wall of multiple heat dissipation holes, that is, the heat dissipation cross-sectional area is large, the heat dissipation effect on the optical chip is very large and very efficient. That is, after adopting this additional heat dissipation channel, the temperature of the optical chip can be greatly reduced, and its high-temperature performance and high-temperature yield can be improved.

[0006] On the basis of the above technical solution, the present invention can also be improved as follows.

[0007] Furthermore, the heat sink is made of aluminum nitride, and its thermal conductivity is greater than 170W / mk.

[0008] The above further beneficial effect is: good thermal conductivity, so the optical chip can be efficiently cooled via the heat sink.

[0009] Furthermore, the width of the heat dissipation block is greater than 1.5 mm, and the length of the heat dissipation block is 1.1 mm to 1.3 mm.

[0010] The above further beneficial effects are: the heat dissipation cross-sectional area is large, which can effectively reduce the temperature of the optical chip.

[0011] Furthermore, the heat sink block is fixed in the through groove by gluing.

[0012] Furthermore, the lower surface of the heat sink is in contact with the housing through the thermal conductive paste.

[0013] The above method has the further beneficial effect that the heat of the optical chip is transferred to the heat sink, and then the heat sink transfers the heat to the housing via the thermal paste to improve the heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a structural diagram of an 800G SR8 optical module in the prior art;

[0015] Figure 2 This is a structural diagram of the 800G SR8 optical module with high efficiency heat dissipation in the utility model.

[0016] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0017] 1. PCB board, 110. Copper sheet, 120. Heat dissipation holes, 130. Through slots, 2. Electrical chip, 3. Heat sink, 4. Optical chip. DETAILED DESCRIPTION

[0018] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0019] Example 1

[0020] like Figure 2As shown, an efficient heat dissipation 800G SR8 optical module includes: a PCB board 1, a heat dissipation hole 120 penetrating the upper and lower surfaces of the PCB board 1 and distributed in an array, the heat dissipation hole 120 is firstly plated with copper and then filled with resin, and then the area where the heat dissipation hole 120 is opened on the PCB board 1 is polished and plated with copper skin 110, the copper plated thickness of the inner wall of the heat dissipation hole 120 is 35um-70um (because the heat dissipation hole 120 has a spacing requirement and the thicker the copper on the inner wall of the hole, the higher the copper plating cost, so this range is usually selected), the copper skin 110 plated on the PCB board 1 is 35um thick, and because the copper skin 110 will be uneven after the hole is opened, the electric chip 2 is fixed on the copper skin 110 only in the area directly facing the heat dissipation hole 120;

[0021] The main improvements of this embodiment are as follows:

[0022] A long strip-shaped through groove 130 is provided on the PCB board 1 in an area not covered by the copper sheet 110, which runs through the upper and lower surfaces thereof. A heat sink 3 is fixed in the through groove 130, that is, the heat sink 3 is also in a long strip shape, and the upper surface of the heat sink 3 is flush with the upper surface of the copper sheet 110, that is, the upper end of the heat sink 3 extends out of the through groove 130, and an optical chip 4 coupled to the electrical chip 2 is fixed on the upper surface of the heat sink 3. The optical chip 4 is not fixed on the copper sheet 110, but on an additional heat sink 3, so the heat dissipation of the optical chip 4 can be carried out through the heat sink 3. Since the cross-sectional area of ​​a single heat sink 3 is larger than that of the inner walls of multiple heat dissipation holes 3 with copper plating, that is, the heat dissipation cross-sectional area is large, the heat dissipation effect on the optical chip 4 is very large and very efficient, that is, the use of this additional heat dissipation channel can greatly reduce the temperature of the optical chip 4, and improve its high temperature performance and high temperature yield.

[0023] Example 2

[0024] like Figure 2 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0025] The heat dissipation block 3 is made of aluminum nitride, which has a thermal conductivity greater than 170 W / mk and good thermal conductivity, so the heat dissipation block 3 can dissipate heat for the optical chip 4 .

[0026] Furthermore: the width of the heat sink 3 is above 1.5 mm. The width of the heat sink 3 is based on the length direction of the PCB board 1. The length of the heat sink 3 is 1.1 mm to 1.3 mm. The heat dissipation cross-sectional area is large, which can effectively reduce the temperature of the optical chip 4. The heat sink 3 is preferably fixed in the through groove 130 by glue. Since the heat sink 3 is fixed in the through groove 130, the width of the through groove 130 is also above 1.5 mm.

[0027] Example 3

[0028] like Figure 2As shown, this embodiment is a further improvement on the basis of Embodiment 1 or 2, and the details are as follows:

[0029] The lower surface of the heat sink 3 is in contact with the housing through the thermal paste, that is, the lower end of the heat sink 3 extends out of the through slot 130, and the heat of the optical chip 4 is transferred to the heat sink 3, and then the heat sink 3 transfers the heat to the housing through the thermal paste to improve the heat dissipation capacity.

[0030] The end surface of the copper sheet 110 close to the heat sink 3 is in contact with the heat sink 3 , and the copper sheet 110 can also conduct heat with the heat sink 3 , thereby further accelerating the heat dissipation of the electric chip 2 .

[0031] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An efficient heat dissipation 800G SR8 optical module, comprising: A PCB board (1), wherein heat dissipation holes (120) distributed in an array are provided below a copper sheet (110) on the upper surface of the PCB board (1), wherein the heat dissipation holes (120) are first copper plated and then filled with resin, and an electric chip (2) is fixed on the copper sheet (110), and wherein a long strip-shaped through groove (130) penetrating the upper and lower surfaces of the PCB board (1) is provided in an area not covered with the copper sheet (110), wherein a heat dissipation block (3) is fixed in the through groove (130), wherein the upper surface of the heat dissipation block (3) is flush with the upper surface of the copper sheet (110), and an optical chip (4) coupled to the electric chip (2) is fixed on the upper surface of the heat dissipation block (3).

2. According to claim 1, an efficient heat dissipation 800G SR8 optical module is characterized in that: The heat dissipation block (3) is made of aluminum nitride, and its thermal conductivity is greater than 170 W / mk.

3. An efficient heat dissipation 800G SR8 optical module according to claim 1 or 2, characterized in that: The width of the heat dissipation block (3) is greater than 1.5 mm, and the length of the heat dissipation block (3) is 1.1 mm to 1.3 mm.

4. According to claim 3, an efficient heat dissipation 800G SR8 optical module is characterized in that: The heat dissipation block (3) is fixed in the through groove (130) by gluing.

5. The high-efficiency heat dissipation 800G SR8 optical module according to claim 1, characterized in that: The lower surface of the heat dissipation block (3) is in contact with the outer shell via heat conductive paste.

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