Liquid crystal display module and flexible circuit board

Abstract

The embodiment of the utility model provides a liquid crystal display module and a flexible circuit board, and the liquid crystal display module comprises a thin film transistor panel which is provided with a binding area and a display area; the flexible circuit board is provided with a flexible base layer and a metal pattern layer arranged on the flexible base layer, the metal pattern layer comprises a stripping blocking pattern and a circuit pattern, and the stripping blocking pattern comprises an anti-tearing edge; and the conductive adhesive is arranged between the thin film transistor panel and the flexible circuit board and is used for connecting the thin film transistor panel and the flexible circuit board. According to the technical scheme provided by the embodiment of the invention, the stripping blocking pattern can be designed into the pattern with the anti-tearing edge, so that an angle which easily causes stress concentration is eliminated, the stress can be dispersed in the linear direction which is basically vertical to the stripping blocking pattern, and the stripping of the film layer caused by tearing is prevented.

Description

Technical Field

[0001] The present application relates to the technical field of display panels, and in particular to a liquid crystal display module and a flexible circuit board. Background Art

[0002] In the existing display panel manufacturing process, flexible circuit boards are often used to connect thin-film transistor panels and printed circuit boards due to their bendable properties, and to achieve conduction between the two. In actual production, as performance requirements increase, the circuit structure inside the display panel becomes more complex, and the flexible circuit board needs to withstand the greater gravity pull of the printed circuit board. During the pulling process, the part of the flexible circuit board that is connected to the thin-film transistor panel through conductive glue is prone to tearing. When tearing occurs, the metal pattern layer on the flexible circuit board will also be affected, causing display signal transmission failure. Utility Model Content

[0003] The embodiments of the present application provide a liquid crystal display module and a flexible circuit board to solve the problem that the connection portion between the flexible circuit board and the thin film transistor panel is easily torn, resulting in display signal transmission failure.

[0004] As one aspect of an embodiment of the present application, an embodiment of the present application provides a liquid crystal display module, including:

[0005] A thin film transistor panel comprises a binding area and a display area, wherein the thin film transistor panel has a first edge and a second edge opposite to each other on both sides of the binding area, and the thin film transistor panel has a third edge close to one side of the binding area;

[0006] A flexible circuit board comprises a flexible base layer and a metal pattern layer disposed on the flexible base layer, wherein the flexible circuit board is connected to the thin film transistor panel in a binding area, and an orthographic projection of the metal pattern layer on the thin film transistor panel is located in the binding area;

[0007] Conductive adhesive, disposed between the thin film transistor panel and the flexible circuit board, for connecting the thin film transistor panel and the flexible circuit board;

[0008] Among them, the metal pattern layer includes a peeling barrier pattern and a circuit pattern. The peeling barrier pattern is located on the side of the binding area close to the first edge and / or the second edge. The peeling barrier pattern includes an anti-tear edge. The anti-tear edge has an angle with the third edge, and the angle is greater than 0° and less than 90°.

[0009] In one embodiment, the angle is greater than or equal to 15° and less than or equal to 75°.

[0010] In one embodiment, the stripping barrier pattern is an alignment mark pattern.

[0011] In one embodiment, the flexible circuit board is rectangular, and there are a plurality of peeling barrier patterns, which are respectively arranged near the top corners of the flexible circuit board.

[0012] In one embodiment, the lift-off barrier pattern is rectangular, triangular, or pentagonal.

[0013] In one embodiment, the peeling barrier pattern includes a plurality of strip patterns arranged at intervals, and the length directions of the plurality of strip patterns are substantially parallel to the tear-proof edge.

[0014] In one embodiment, the thin film transistor panel has a stacked glass substrate, a device layer formed on the glass substrate, and a transparent conductive pattern layer, the transparent conductive pattern layer includes a marking pattern, and the marking pattern is configured to cover a corresponding peeling barrier pattern.

[0015] In one embodiment, the area of ​​the marking pattern is greater than or equal to that of the peeling barrier pattern.

[0016] In one embodiment, the marking pattern is a rectangle, a triangle, or a pentagon.

[0017] In one embodiment, the flexible circuit board further has a covering layer disposed on one side of the flexible base layer.

[0018] In one embodiment, an integrated circuit electrically connected to the circuit pattern is disposed on the flexible circuit board.

[0019] As another aspect of an embodiment of the present application, an embodiment of the present application provides a flexible circuit board, including:

[0020] Flexible base layer;

[0021] A metal pattern layer is disposed on the flexible base layer, and the metal pattern layer includes a peeling barrier pattern and a circuit pattern;

[0022] The flexible circuit board has a connection area for connecting with a thin film transistor panel or a printed circuit board, and has at least one vertex in the connection area. The metal pattern layer includes a peeling barrier pattern and a circuit pattern, and the peeling barrier pattern has an anti-tearing edge.

[0023] The embodiment of the present application adopts the above-mentioned technical solution to design the peeling barrier pattern into a pattern with tear-proof edges, thereby eliminating corners that are prone to cause stress concentration, dispersing the stress in a linear direction basically perpendicular to it, and preventing film peeling caused by tearing.

[0024] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0026] Figure 1 A cross-sectional schematic diagram showing the connection position between the liquid crystal display module and the flexible circuit board in the prior art;

[0027] Figure 2 A schematic cross-sectional view of a flexible circuit board in the prior art is shown;

[0028] Figure 3 A schematic diagram showing a metal pattern of a flexible circuit board in the prior art is shown;

[0029] Figure 4 A schematic diagram showing the area of ​​the flexible circuit board affected by film peeling in the prior art;

[0030] Figure 5 A schematic diagram showing the location of the area affected by film peeling in the liquid crystal display module in the prior art;

[0031] Figure 6 A schematic diagram showing the position of the tearing direction in the liquid crystal display module in the prior art;

[0032] Figure 7 A cross-sectional schematic diagram showing the connection position between the liquid crystal display module and the flexible circuit board according to an embodiment of the present application;

[0033] Figure 8 A schematic cross-sectional view of a flexible circuit board according to an embodiment of the present application is shown;

[0034] Fig. 9 A cross-sectional schematic diagram showing a position where an alignment mark is provided on a liquid crystal display module according to an embodiment of the present application and where the flexible circuit board is connected;

[0035] Fig.10 A cross-sectional schematic diagram showing a position where a liquid crystal display module without an alignment mark is connected to a flexible circuit board according to an embodiment of the present application;

[0036] Fig.11 A schematic diagram showing the position of the binding area in the liquid crystal display module according to an embodiment of the present application;

[0037] Fig.12 A schematic diagram showing a metal pattern located on a flexible circuit board according to an embodiment of the present application is shown;

[0038] Fig.13Another schematic diagram of a metal pattern on a flexible circuit board according to an embodiment of the present application is shown;

[0039] Fig.14 Another schematic diagram of a metal pattern on a flexible circuit board according to an embodiment of the present application is shown;

[0040] Fig.15 Another schematic diagram of a metal pattern on a flexible circuit board according to an embodiment of the present application is shown;

[0041] Fig.16 A schematic diagram of a transparent conductive pattern located on a thin film transistor panel according to an embodiment of the present application is shown.

[0042] Description of reference numerals:

[0043] 1, 1'-thin film transistor panel; 11-transparent conductive pattern layer; 111-marking pattern; 12, 12'-binding area; 13-first edge; 14-second edge; 15-third edge; 2, 2'-flexible circuit board; 21, 21'-covering layer; 22, 22'-flexible base layer; 23, 23'-metal pattern layer; 231-peeling barrier pattern; 2311-anti-tear edge; 231'-first marking pattern; 232, 232'-circuit pattern; 3, 3'-conductive adhesive; 4-printed circuit board. DETAILED DESCRIPTION

[0044] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0045] Figure 1 FIG. 1 is a cross-sectional view of the connection position between the liquid crystal display module and the flexible circuit board in the prior art. Figure 1 As shown, the liquid crystal display module includes a thin film transistor panel 1', a flexible circuit board 2' and a conductive adhesive 3'. The conductive adhesive 3' is arranged between the thin film transistor panel 1' and the flexible circuit board 2' to connect the thin film transistor panel 1' and the flexible circuit board 2'.

[0046] The thin film transistor panel 1' includes a binding area 12' and a display area, and the flexible circuit board 2' is connected to the thin film transistor panel 1' in the binding area 12'. Alignment marks are set at corresponding positions of the flexible circuit board 2' and the thin film transistor panel 1', and the contours of the marking patterns of the alignment marks are similar and the positions correspond to each other, so as to ensure that different panel components can be accurately aligned during the production process and ensure product performance quality.

[0047] Figure 2FIG. 2 shows a cross-sectional schematic diagram of a flexible circuit board in the prior art. Figure 2 As shown, the flexible circuit board 2' includes a covering layer 21', a flexible base layer 22' and a metal pattern layer 23' disposed on the flexible base layer 22'. The covering layer 21' is disposed on one side of the flexible base layer, and can be used to protect the flexible base layer and the metal pattern layer 23' from environmental factors. For the marking pattern of the alignment mark, the marking pattern of the metal pattern layer 23' disposed in the flexible circuit board 2' is referred to as the first marking pattern 231', and the marking pattern disposed in the thin film transistor panel 1' is referred to as the second marking pattern, wherein the circuit pattern 232' is also disposed in the metal pattern layer 23'. In the prior art, the alignment mark is a fixed alignment mark. The shape of the marking pattern is a cross or a T-shape, with a relatively square right angle.

[0048] Figure 3 FIG. 2 shows a schematic diagram of a metal pattern of a flexible circuit board in the prior art. Figure 3 As shown, taking the first marking pattern 231' arranged at the lower left corner of the flexible circuit board 2' as an example, its outline is T-shaped. When subjected to external force, the stress on the flexible circuit board 2' is concentrated on the right angle of the lower left part of the first marking pattern 231', so that the film layer peeling phenomenon occurs between the flexible circuit board 2' and the thin film transistor panel 1', that is, the first marking pattern 231' and part of the circuit pattern 232' on the flexible circuit board 2' are separated from the corresponding second marking pattern and other conductive patterns on the thin film transistor panel 1', resulting in a failure in display signal transmission.

[0049] By observing the tearing conditions of multiple defective products, it was found that when film peeling occurred, the tearing direction extended from the top corner of the flexible circuit board 2' near the first marking pattern 231' in the binding area 12' to the middle part of the edge of the binding area 12', so that the flexible circuit board 2' was partially separated from the thin film transistor panel 1'.

[0050] Figure 4 A schematic diagram showing the area of ​​the flexible circuit board affected by film peeling in the prior art is shown. Figure 5 FIG. 1 is a schematic diagram showing the location of the area affected by film peeling in the liquid crystal display module in the prior art. Figure 4-Figure 5 As shown, the film peeling phenomenon occurs at the position where the binding area 12' is close to the edge of the thin film transistor panel 1'. For the left part of the binding area 12', the film peeling occurs at the lower left corner of the left metal pattern layer 23'; for the right part of the binding area 12', the film peeling occurs at the lower right corner of the right metal pattern layer 23'. Taking the first marking pattern 231' set at the lower left corner of the flexible circuit board 2' as an example, Figure 4As shown, the tearing direction is the direction extending from the top corner to the middle part of the edge of the binding area 12'. At this time, the lower left corner of the T-shaped first marking pattern 231' is exactly a right angle, so that the stress is concentrated at the right angle. The flexible circuit board 2' is difficult to withstand excessive local stress. The first marking pattern 231' and part of the circuit pattern 232' in the shaded part are separated from the thin film transistor panel 1', and the film layer peeling occurs.

[0051] Figure 6 FIG. 1 is a schematic diagram showing the position of the tearing direction in the liquid crystal display module in the prior art. Figure 6 As shown, the arrow direction is the tearing direction. It can be understood that the tearing direction is the direction extending from the two vertices of the binding area 12' close to the first marking pattern 231' to the middle part of the binding area 12' close to the edge of one side of the thin film transistor panel 1'.

[0052] Figure 7 A cross-sectional schematic diagram of the connection position between the liquid crystal display module and the flexible circuit board according to an embodiment of the present application is shown, Figure 8 FIG. 2 shows a cross-sectional schematic diagram of a flexible circuit board according to an embodiment of the present application. Figure 7 As shown, the liquid crystal display module includes a thin film transistor panel 1, a flexible circuit board 2 and a conductive adhesive 3. Figure 8 As shown, the flexible circuit board 2 includes a cover layer 21, a flexible base layer 22, and a metal pattern layer 23 disposed on the flexible base layer 22. The cover layer 21 is disposed on one side of the flexible base layer, and can be used to protect the flexible base layer and the metal pattern layer 23 from environmental factors. However, it should be understood that in some embodiments, the cover layer 21 may not be disposed, that is, the flexible circuit board 2 may include the flexible base layer 22 and the metal pattern layer 23.

[0053] The cross-sectional structures of the flexible circuit board 2 and the thin film transistor panel 1 are different in the areas where the alignment marks are provided and the areas where the alignment marks are not provided.

[0054] Fig. 9 The cross-sectional view of the connection position between the alignment mark and the flexible circuit board of the liquid crystal display module according to the embodiment of the present application is shown. Fig. 9 As shown, the liquid crystal display module is provided with an alignment mark, and in the cross-sectional structure of the portion connected to the flexible circuit board 2, the upper flexible circuit board 2 includes a cover layer 21, a flexible base layer 22 and a metal pattern layer 23, and the lower thin film transistor panel 1 includes a transparent conductive pattern layer 11, a first passivation layer, a second passivation layer, a gate insulating layer, a gate pad layer and a glass substrate, and a gold ball is provided in the conductive glue 3 between the flexible circuit board 2 and the thin film transistor panel 1, so that the flexible circuit board 2 is electrically connected to the thin film transistor panel 1. Among them, the first passivation layer, the second passivation layer, the gate insulating layer, and the gate pad layer of the thin film transistor panel 1 are device layers, and according to actual conditions, they can also be composed of other structures.

[0055] Fig.10 A cross-sectional view of the connection position between the liquid crystal display module without alignment mark and the flexible circuit board according to an embodiment of the present application is shown. Fig.10 As shown, no alignment mark is set for the liquid crystal display module. In its cross-sectional structure, the upper flexible circuit board 2 includes a covering layer 21 and a flexible base layer 22, and the lower thin film transistor panel 1 includes a glass substrate. The flexible circuit board 2 and the thin film transistor panel 1 are connected by a conductive adhesive 3.

[0056] Fig.11 A schematic diagram showing the position of the binding area in the liquid crystal display module according to an embodiment of the present application is shown. Figure 12-Figure 15 Schematic diagram showing metal patterns of different shapes on a flexible circuit board according to an embodiment of the present application. Fig.11 As shown, the thin film transistor panel 1 includes a binding area 12 and a display area, and has a first edge 13 and a second edge 14 opposite to each other on both sides of the binding area 12, and has a third edge 15 on the side close to the binding area 12. A plurality of flexible circuit boards 2 connect the thin film transistor panel 1 and the printed circuit board 4, and the metal pattern layer 23 is arranged inside the corresponding area of ​​the flexible circuit board 2 and the binding area 12, and its orthographic projection on the thin film transistor panel 1 is located in the binding area 12. The thin film transistor panel 1 is provided with a conductive pattern and an alignment mark pattern in the binding area 12, wherein the conductive pattern can be a binding terminal in some embodiments, and the alignment mark pattern is arranged on both sides of the binding terminal. Figure 12-Figure 15 As shown, the metal pattern layer 23 includes a peeling barrier pattern 231 and a circuit pattern 232. The peeling barrier pattern 231 is used to disperse the stress of tearing and prevent peeling from occurring. The circuit pattern 232 corresponds to the binding terminal, and an integrated circuit electrically connected to the circuit pattern 232 is provided on the flexible circuit board 2 to realize the transmission of the display signal.

[0057] The peeling barrier pattern 231 may also be an alignment mark pattern provided on one side of the flexible circuit board 2, that is, an alignment mark pattern having an anti-peeling shape. When peeling occurs, the alignment mark pattern can achieve peeling barrier to prevent peeling from extending to the circuit pattern 232 area corresponding to the binding terminal. The peeling barrier pattern 231 is located on one side of the binding area 12 close to the first edge 13 and / or the second edge 14. For example, for a single flexible circuit board 2, the peeling barrier pattern 231 may be provided in the area corresponding to the binding area 12, and located on both sides of the corresponding area close to the first edge 13 and the second edge 14. While achieving peeling barrier, the peeling barrier pattern 231 is also used to correspond to the marking pattern 111 of the transparent conductive pattern layer 11 in the manufacturing process, and to accurately align different panel components, which can not only avoid film peeling caused by tearing, but also ensure product quality and reduce costs.

[0058] The peeling barrier pattern 231 has an anti-tear edge 2311, and the anti-tear edge 2311 has an angle with the third edge 15. The size of the angle is greater than 0° and less than 90°, and further, it can also be greater than or equal to 15° and less than or equal to 75°. When tearing occurs, the tearing direction extends from the top corner of the flexible circuit board 2 in the binding area 12 near the peeling barrier pattern 231 to the middle part of the edge of the binding area 12. For example, for the peeling barrier pattern 231 located in the lower left part, the tearing direction is the direction extending to the upper right. According to actual conditions, the anti-tear edge 2311 of the peeling barrier pattern 231 can be perpendicular to the tearing direction, or it can be basically perpendicular to the tearing direction, that is, the angle between the anti-tear edge 2311 and the third edge 15 can be an acute angle close to a right angle.

[0059] The stripping barrier pattern 231 is set as a pattern with an anti-tear edge 2311, which can eliminate the corner in the tearing direction that causes stress concentration, and disperse the stress propagating along the tearing direction to a linear direction substantially perpendicular to it, that is, in the direction of one side of the stripping barrier pattern 231 substantially perpendicular to the tearing direction. When the stress of tearing is generated, the stress first propagates to the side of the stripping barrier pattern 231 that is closest to the stress in the tearing direction, that is, the anti-tear edge 2311 substantially perpendicular to the tearing direction, so that the stress cannot be concentrated. After being blocked by the anti-tear edge 2311, the stress propagation direction is changed to a direction offset to the direction of the edge, thereby achieving stress dispersion and preventing the film layer peeling caused by tearing from extending to the corresponding position of the binding terminal and the circuit pattern 232, thereby affecting signal transmission.

[0060] The peeling barrier pattern 231 may also include a plurality of strip patterns arranged at intervals, and the length direction of the plurality of strip patterns is substantially parallel to the tear-proof edge 2311. When tearing stress is generated, a strip pattern of the peeling barrier pattern 231 close to the tear-proof edge 2311 can disperse the stress propagating along the tearing direction to the linear direction where the tear-proof edge 2311 is located, and the stress that is not completely dispersed and still propagates along the tearing direction encounters the next strip pattern adjacent thereto, and is dispersed again by it to the linear direction substantially parallel to the tear-proof edge 2311. After being dispersed by a plurality of strip patterns, the stress propagating along the tearing direction is finally dispersed, and the film peeling caused by the tearing is prevented from extending to the corresponding position of the binding terminal and the circuit pattern 232, which affects the signal transmission.

[0061] The conductive adhesive 3 is disposed between the thin film transistor panel 1 and the flexible circuit board 2, and is used to electrically connect the thin film transistor panel 1 and the flexible circuit board 2. When tearing occurs, film peeling may occur between the flexible circuit board 2 and the conductive adhesive 3, or between the conductive adhesive 3 and the thin film transistor panel 1, and eventually the thin film transistor panel 1 and the flexible circuit board 2 are partially separated, so that the peeling barrier pattern 231 and part of the circuit pattern 232 are separated from the corresponding marking pattern 111 and other conductive patterns such as the binding terminal, causing a failure in display signal transmission.

[0062] The shape of the flexible circuit board 2 can be rectangular. In this case, there are multiple peeling barrier patterns 231, which are respectively arranged near the top corners of the flexible circuit board 2. For example, multiple peeling barrier patterns 231 can be respectively arranged near the four top corners of the rectangular flexible circuit board 2, so as to accurately align the flexible circuit board 2 with other panels to ensure product quality.

[0063] Fig.16 FIG. 1 is a schematic diagram showing a transparent conductive pattern located on a thin film transistor panel according to an embodiment of the present application. Fig.16 As shown, the thin film transistor panel 1 has a stacked glass substrate, a device layer formed on the glass substrate, and a transparent conductive pattern layer 11. The transparent conductive pattern layer 11 is in contact with the conductive adhesive 3 and is connected to the flexible circuit board 2 through the conductive adhesive 3. The transparent conductive pattern layer 11 includes a marking pattern 111, and the marking pattern 111 is set to a shape that can cover the corresponding peeling barrier pattern 231, so as to realize the alignment of the peeling barrier pattern 231 and the marking pattern 111, which is convenient for accurate positioning. The binding terminal is set in the transparent conductive pattern layer 11, which is used to cooperate with the circuit pattern 232 to realize the electrical connection between the two.

[0064] Since the marking pattern 111 is firmly combined with the thin film transistor panel 1 and is hardly affected by the peeling of the conductive adhesive 3, it is not necessary to set multiple spaced stripe patterns in the marking pattern 111. That is, in some embodiments, the area of ​​the marking pattern 111 is greater than or equal to the peeling barrier pattern 231, so as to avoid repeatedly setting stripe patterns and making the production process too complicated.

[0065] The peeling barrier pattern 231 is described in detail below by taking the peeling barrier pattern 231 disposed at the lower left corner of the flexible circuit board 2 as an example. The tearing direction at this time is a direction extending to the upper right.

[0066] Fig.12 FIG. 1 is a schematic diagram showing a metal pattern located on a flexible circuit board according to an embodiment of the present application. Fig.12As shown, in the metal pattern, the outer contour of the peeling barrier pattern 231 can be a pentagon. When the outer contour of the peeling barrier pattern 231 is a pentagon, its side located at the lower left, namely the anti-tear side 2311, is substantially perpendicular to the tearing direction. In other words, the anti-tear side 2311 of the peeling barrier pattern 231 can disperse the stress propagating along the tearing direction to a linear direction substantially perpendicular thereto, namely, in the length direction of the side, thereby achieving stress dispersion and preventing the film layer peeling caused by tearing from extending to the corresponding position of the binding terminal and the circuit pattern 232, thereby affecting signal transmission.

[0067] At the same time, when the outer contour of the peeling barrier pattern 231 is a pentagon, the length direction of the multiple strip patterns constituting the peeling barrier pattern 231 is substantially parallel to the anti-tearing edge 2311 and substantially perpendicular to the tearing direction. When the tearing stress is generated, the first strip pattern located at the lower left can disperse the stress propagating along the tearing direction to the linear direction along the length direction of the strip pattern. The stress that is not completely dispersed and still diffuses and propagates along the tearing direction encounters the next strip pattern adjacent to it, and is dispersed again by it to the linear direction substantially parallel to the length direction of the strip pattern. After being dispersed by multiple strip patterns, the stress propagating along the tearing direction is finally dispersed, preventing the film layer peeling caused by the tearing from extending to the corresponding position of the binding terminal and the circuit pattern 232, which affects the signal transmission.

[0068] Fig.13 A schematic diagram of another metal pattern located on a flexible circuit board according to an embodiment of the present application is shown.

[0069] In one embodiment, the outer contour of the stripping barrier pattern 231 may be a triangle. Fig.13 As shown, in the metal pattern, when the outer contour of the stripping barrier pattern 231 is a triangle, its long side, i.e., the anti-tear edge 2311, is substantially perpendicular to the tearing direction. At the same time, when the outer contour of the stripping barrier pattern 231 is a triangle, the length direction of the multiple bar patterns constituting the stripping barrier pattern 231 is substantially parallel to the anti-tear edge 2311, and substantially perpendicular to the tearing direction. When the tearing stress is generated, the first bar pattern located at the lower left can disperse the stress propagating along the tearing direction to the linear direction along the length direction of the bar pattern. The stress that is not completely dispersed and still diffuses and propagates along the tearing direction encounters the next bar pattern adjacent to it, and is dispersed by it again to the linear direction substantially parallel to the length direction of the bar pattern. After the dispersion of multiple bar patterns, the stress propagating along the tearing direction is finally dispersed, so as to avoid the film layer peeling caused by the tearing extending to the corresponding position of the binding terminal and the circuit pattern 232, which affects the signal transmission.

[0070] Fig.14A schematic diagram of another metal pattern located on a flexible circuit board according to an embodiment of the present application is shown.

[0071] In one embodiment, the outer contour of the stripping barrier pattern 231 may be a rectangle. Fig.14 As shown, in the metal pattern, when the outer contour of the stripping barrier pattern 231 is a rectangle, the side of the lower left, namely the anti-tear side 2311, is substantially perpendicular to the tearing direction, and the two sides adjacent to the side are substantially parallel to the tearing direction. At the same time, when the outer contour of the stripping barrier pattern 231 is a rectangle, the length direction of the multiple bar patterns constituting the stripping barrier pattern 231 is substantially parallel to the anti-tear and substantially perpendicular to the tearing direction. When the tearing stress is generated, the first bar pattern located at the lower left can disperse the stress propagating along the tearing direction to the linear direction along the length direction of the bar pattern. The stress that is not completely dispersed and still diffuses and propagates along the tearing direction encounters the next bar pattern adjacent to it, and is dispersed by it again to the linear direction substantially parallel to the length direction of the bar pattern. After the dispersion of multiple bar patterns, the stress propagating along the tearing direction is finally dispersed, avoiding the film layer peeling caused by the tearing from extending to the corresponding position of the binding terminal and the circuit pattern 232, which affects the signal transmission.

[0072] Fig.15 A schematic diagram of another metal pattern located on a flexible circuit board according to an embodiment of the present application is shown.

[0073] In one embodiment, the outer contour of the stripping barrier pattern 231 may be a triangle. Fig.15 As shown, in the metal pattern, when the stripping barrier pattern 231 is a triangle, its long side, namely the tear-proof side 2311, is substantially perpendicular to the tearing direction. In other words, the tear-proof side 2311 of the stripping barrier pattern 231 can disperse the stress propagating along the tearing direction to a linear direction substantially perpendicular thereto, namely, in the length direction of the side, thereby dispersing the stress and preventing the film layer from being peeled off due to tearing from extending to the corresponding position of the binding terminal and the circuit pattern 232, thereby affecting the signal transmission. At the same time, in the case where a plurality of strip patterns are not provided, the provision of the side substantially perpendicular to the tearing direction as the long side can improve the strength of the stripping barrier pattern 231 itself to resist the stress.

[0074] Other structures of the stripping barrier pattern in the above embodiment may be adopted by various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.

[0075] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0076] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0077] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0078] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0079] It should be noted that although the various steps of the method in the present application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in this specific order, or that all the steps shown must be performed to achieve the desired results. Additionally or alternatively, some steps can be omitted, multiple steps can be combined into one step for execution, and / or one step can be decomposed into multiple steps for execution, etc. The above-mentioned drawings are only schematic illustrations of the processing included in the method according to the exemplary embodiments of the present application, and are not intended to be limiting. It is easy to understand that the processing shown in the above-mentioned drawings does not indicate or limit the time sequence of these processing. In addition, it is also easy to understand that these processing can be, for example, performed synchronously or asynchronously in multiple modules.

[0080] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0081] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A liquid crystal display module, characterized in that: include: A thin film transistor panel (1), comprising a binding area (12) and a display area, the thin film transistor panel (1) having a first edge (13) and a second edge (14) opposite to each other on both sides of the binding area (12), and the thin film transistor panel (1) having a third edge (15) close to one side of the binding area (12); A flexible circuit board (2) comprising a flexible base layer (22) and a metal pattern layer (23) arranged on the flexible base layer (22); the flexible circuit board (2) is connected to the thin-film transistor panel (1) in the binding area (12); and an orthographic projection of the metal pattern layer (23) on the thin-film transistor panel (1) is located in the binding area (12); Conductive adhesive (3), arranged between the thin film transistor panel (1) and the flexible circuit board (2), and used for connecting the thin film transistor panel (1) and the flexible circuit board (2); The metal pattern layer (23) comprises a peeling barrier pattern (231) and a circuit pattern (232), the peeling barrier pattern (231) is located on a side of the binding area (12) close to the first edge (13) and / or the second edge (14), the peeling barrier pattern (231) comprises an anti-tear edge (2311), and the anti-tear edge (2311) has an angle with the third edge (15), and the angle is greater than 0° and less than 90°.

2. The liquid crystal display module according to claim 1, characterized in that: The angle is greater than or equal to 15° and less than or equal to 75°.

3. The liquid crystal display module according to claim 1, characterized in that: The stripping blocking pattern (231) is an alignment mark pattern.

4. The liquid crystal display module according to claim 1, characterized in that: The flexible circuit board (2) is rectangular, and the stripping blocking patterns (231) are multiple and are respectively arranged at positions close to the top corners of the flexible circuit board (2).

5. The liquid crystal display module according to claim 1, characterized in that: The stripping barrier pattern (231) is rectangular, triangular or pentagonal.

6. The liquid crystal display module according to claim 1, characterized in that: The peeling blocking pattern (231) comprises a plurality of strip patterns arranged at intervals, and the length directions of the plurality of strip patterns are substantially parallel to the anti-tearing edge (2311).

7. The liquid crystal display module according to claim 1, characterized in that: The thin film transistor panel (1) comprises a stacked glass substrate, a device layer formed on the glass substrate, and a transparent conductive pattern layer (11), wherein the transparent conductive pattern layer (11) comprises a marking pattern (111), and the marking pattern (111) is arranged in a shape capable of covering the corresponding peeling blocking pattern (231).

8. The liquid crystal display module according to claim 7, characterized in that: The area of ​​the marking pattern (111) is greater than or equal to the stripping blocking pattern (231).

9. The liquid crystal display module according to claim 7, characterized in that: The marking pattern (111) is a rectangle, a triangle or a pentagon.

10. The liquid crystal display module according to claim 1, characterized in that: The flexible circuit board (2) further comprises a covering layer (21) which is arranged on one side of the flexible base layer (22).

11. The liquid crystal display module according to claim 1, characterized in that: An integrated circuit electrically connected to the circuit pattern (232) is arranged on the flexible circuit board (2).

12. A flexible circuit board, characterized in that: include: Flexible base layer (22); A metal pattern layer (23) is disposed on the flexible base layer (22), wherein the metal pattern layer (23) comprises a peeling barrier pattern (231) and a circuit pattern (232); The flexible circuit board (2) has a connection area for connecting to a thin film transistor panel or a printed circuit board, and has at least one vertex in the connection area; the metal pattern layer (23) includes a peeling barrier pattern (231) and a circuit pattern (232); and the peeling barrier pattern (231) includes an anti-tearing edge (2311).

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