Constant-temperature self-control temperature control device for memory test

Abstract

The utility model discloses a memory test constant temperature self-control temperature control device which comprises a protection case, a test groove is formed in the upper end face of the protection case, a test mainboard is installed in the test groove and used for testing a memory bank to be tested, and a heating protection assembly is arranged on the upper end face of the protection case and used for heating the memory bank to be tested. The heating protection assembly comprises a sealing part, and a heating groove is formed in the side, adjacent to the protection case, of the sealing part. According to the utility model, the heating assembly is arranged, the heating assembly specifically comprises the radiating fins which are integrally designed from top to bottom, and the memory bank to be tested is placed in the gaps of the radiating fins during testing, so that the memory bank is uniformly heated and the temperature is stable in a working environment, and the consistency and stability of testing results are ensured; and meanwhile, when the tested memory bank reaches an overtemperature, the temperature control device takes away heat at the upper part of the heater assembly, so that the heating temperature of the tested memory bank is uniform and stable, and the stability and the standard of a test result are further guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of memory bar testing, in particular to a memory test constant temperature automatic control device. Background Art

[0002] Memory aging test usually conducts rigorous tests on memory modules in terms of working environment and electrical performance, thereby shortening the test time and shortening the failure of a module within a few months of normal use to a few hours. Therefore, a temperature chamber is usually configured on the memory test equipment to test the working environment, but the memory and its chips are very sensitive to temperature. If the temperature of the memory module and its particles is uneven or unstable, it will cause different test results. Ensuring that the memory module is heated evenly and the temperature is stable in the working environment is a reliable guarantee for achieving consistent and stable test results. Utility Model Content

[0003] The utility model aims to provide a memory test constant temperature automatic temperature control device, comprising a protective chassis, a test slot is provided on the upper end surface of the protective chassis, a test mainboard is installed inside the test slot, the test mainboard is used to test the memory stick under test, a heating protection component is provided on the upper end surface of the protective chassis, the heating protection component comprises a sealing part, a heating slot is provided on the side of the sealing part adjacent to the protective chassis, a heater component is installed inside the heating slot, and the heater component is used to control the temperature of the memory stick under test.

[0004] As a further preference, the heating slot corresponds to the test slot in position.

[0005] As a further preference, a temperature control device is installed inside the heating protection assembly, and the temperature control device is used to adjust the heat inside the heating tank.

[0006] As a further preference, the heater assembly comprises a mounting plate, a plurality of groups of heat dissipating fins disposed at intervals are mounted on the upper and lower portions of the mounting plate, and a thermostat for heating is mounted in the gaps between the plurality of groups of heat dissipating fins above the heater assembly.

[0007] As a further preference, the memory bar under test is in the gaps between the plurality of groups of heat dissipation fins below the heater assembly, and there is a gap between the memory bar under test and the heat dissipation fins on both sides.

[0008] As a further preference, the heater assembly is installed inside the heating tank by means of studs, a thermostat for heating is installed in the gaps between several groups of heat dissipation fins below the heater assembly, and a heat conduction assembly is provided between the thermostat and the heat dissipation fins.

[0009] As a further preference, temperature sensors are arranged outside the several groups of heat dissipation fins arranged at intervals on the upper and lower parts of the mounting plate.

[0010] Through the above technical solution, the beneficial effects of the utility model are:

[0011] The utility model provides a heating component, wherein the heating component is specifically an integrated upper and lower heat dissipation fin. The memory stick under test is placed in the gap between the heat dissipation fins during the test, so as to ensure that the memory stick is heated evenly and the temperature is stable in the working environment, thereby ensuring that the test results are consistent and stable. At the same time, when the memory stick under test reaches an overtemperature, the temperature control device will take away the heat from the upper part of the heater component, so that the heating temperature of the memory stick under test is uniform and stable, further ensuring the stability and standardization of the test results.

[0012] At the same time, through the design of multiple test slots, the device can test several different types of memory sticks at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a structural schematic diagram of a memory test constant temperature automatic control device of the utility model;

[0014] Figure 2 It is a top view of the memory test constant temperature automatic control device of the utility model;

[0015] Figure 3 for Figure 2 AA side section view;

[0016] Figure 4 for Figure 2 BB side section view;

[0017] Figure 5 for Figure 4 A magnified view of the structure at C;

[0018] Figure 6 It is a schematic diagram of the structure of the constant temperature self-controlled heating device of the utility model after the cover is lifted.

[0019] In the figure: 1 protective chassis, 2 cover hinge assembly, 3 heating protection assembly, 4 heater assembly, 5 temperature control device, 6 tested memory stick, 7 test motherboard. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] See also Figure 1-5 As shown, the utility model provides a protective chassis 1, the upper end surface of the protective chassis 1 is provided with a test slot, a test mainboard 7 is installed inside the test slot, the test mainboard 7 is used to test the memory stick 6 under test, the upper end surface of the protective chassis 1 is provided with a heating protection component 3, the heating protection component 3 includes a sealing portion, a heating slot is provided on the side of the sealing portion adjacent to the protective chassis 1, a heater component 4 is installed inside the heating slot, and the heater component 4 is used to control the temperature of the memory stick under test.

[0022] It should be noted that the heating protection component 3 is connected to the upper end surface of the protection chassis through the flip cover shaft component 2.

[0023] Furthermore, the heating protection assembly 3 can be opened from the protection chassis 1 only manually.

[0024] like Figure 6 As shown, after the heating protection assembly 3 is turned on, the memory stick 6 to be tested is installed on the test mainboard 7.

[0025] It is understandable that the heating protection component 3 can also be connected to the protection chassis 1 in other ways, wherein when the heating protection component 3 is connected to the protection chassis 1 in other ways, the heating protection component 3 can cover the top of the protection chassis 1.

[0026] Specifically, the memory stick test is usually performed on a test mainboard. The test mainboard 7 is provided with memory slots as test positions. Several groups of test mainboards 7 can implement simultaneous testing of multiple groups of different memory sticks.

[0027] Specifically, the heater assembly 4 inside the heating device radiates uniform heating, so that the heating temperature of the test product is uniform and stable, thus ensuring the stability and standard of the test results.

[0028] It is understandable that the present invention can also be used to test other semiconductor devices of the same type as the memory stick.

[0029] like Figure 4 and Figure 5 As shown, the heating slot corresponds to the position of the test slot.

[0030] Specifically, there may be more than one group of heating slots and test slots, and there may be intervals between the groups of test slots, thereby enabling partitioned testing of memory sticks.

[0031] Among them, after opening the heating protection component, the memory stick can be installed on the test motherboard. The design of multiple groups of test slots can realize the testing of multiple types or different models of memory sticks.

[0032] Furthermore, a temperature control device 5 is installed inside the heating protection assembly, and the temperature control device 5 is used to adjust the heat inside the heating tank.

[0033] Specifically, when the temperature control device 5 is turned on, the heat on the upper part of the heater assembly 4 can be taken away, thereby ensuring that the temperature is stable and does not exceed the temperature.

[0034] It can be understood that the temperature control device 5 can be a blower or a fan.

[0035] Furthermore, the heater assembly 4 includes a mounting plate, and a plurality of groups of heat dissipating fins arranged at intervals are mounted on the upper and lower parts of the mounting plate. A thermostat for heating is mounted in the gaps between the plurality of heat dissipating fins below the heater assembly 4 .

[0036] The heat dissipation component can dissipate heat from the memory stick 6 under test to ensure stable temperature during the test. The heat dissipation component can be heated by a temperature controller to heat the memory stick 6 under test, and the temperature inside the heating tank and the test tank can be monitored by a temperature sensor.

[0037] Furthermore, the memory bar 6 under test is in the gaps between the groups of heat dissipation fins below the heater assembly 4 , and there are gaps between the memory bar 6 under test and the heat dissipation fins on both sides.

[0038] Specifically, the memory bar under test is arranged in the gaps between the groups of heat sink fins, which can further improve the temperature control (heating or heat dissipation) effect of the memory bar under test.

[0039] Furthermore, the heater assembly 4 is installed inside the heating tank through studs, and a thermostat for heating is installed in the gap between several groups of heat dissipation fins above the heater assembly 4, and a heat conduction assembly is arranged between the thermostat and the heat dissipation fins.

[0040] Temperature sensors are arranged outside the plurality of groups of heat dissipation fins arranged at intervals on the upper and lower parts of the installation plate, and the temperature of the tested memory stick during testing can be monitored by the temperature sensors.

[0041] It should be noted that the thermally conductive component may be a thermally conductive pad, thermally conductive glue, or other thermally conductive materials.

[0042] In addition, the four mounting screws are slightly higher than the heat dissipation fins on the upper part of the heater assembly 4 and are connected to the heating protection assembly 3 .

[0043] The heater assembly 4 is an integrated structure design, and is usually made of aluminum or other metal materials with good thermal conductivity, so that the entire heater assembly can be heated more evenly and conduct heat more quickly, thus better meeting the requirements of uniformity and stability.

[0044] It is understandable that, in addition to the temperature sensor and the temperature controller, there are also some vacant heat dissipation fins on the upper part of the heater assembly 4 .

[0045] Specifically, heat dissipation fins are arranged on the upper and lower sides of the heater assembly 4, and gaps for the memory stick to be tested are left between the upper and lower heat dissipation fins. Such close-range radiation ensures that the devices on the left and right sides of the memory stick can be heated more evenly.

[0046] At the same time, a thermostat is placed in the middle of the heat dissipation fins designed on the heater assembly 4. The thermostat fits tightly against the heat dissipation fins. A thermal conductive rubber pad is set between the heat dissipation fins and the thermostat to improve heat conduction and reduce heat loss. A portion of the heat dissipation teeth are left vacant to ensure temperature stability.

[0047] In the process of testing, the memory stick 6 under test will generate heat, and some of the heat dissipation will be relatively large, which will cause the temperature in the temperature box to continue to rise and overheat. At this time, the temperature on the overheated memory stick 6 under test will also be transmitted to the heat dissipation fins, and the heat dissipation fan 5 will be turned on to take away the heat in the upper heat dissipation fins, thereby ensuring that the temperature is stable and does not overheat.

[0048] It should be noted that the heat dissipation fins on the upper and lower parts of the mounting plate are connected and integrated, so that the heat dissipation and heating of the heat dissipation fins are more uniform, and the wind flow generated by the temperature control device 5 in the upper heat dissipation fins is blocked well, and the temperature uniformity of the lower heat dissipation fins is not affected. In addition, for the memory stick 6 under test with relatively large heat dissipation, the temperature difference between the environment and the target memory stick can be eliminated by controlling the temperature generated by the memory stick, making the test result more reliable.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A memory test constant temperature automatic temperature control device, characterized in that: The invention comprises a protective case (1), wherein the upper end surface of the protective case (1) is provided with a test slot, wherein a test mainboard (7) is installed inside the test slot, and wherein the test mainboard (7) is used to test a memory stick (6) under test; wherein the upper end surface of the protective case (1) is provided with a heating protection component (3), and wherein the heating protection component (3) comprises a sealing portion, wherein a heating slot is provided on a side of the sealing portion adjacent to the protective case (1), and wherein a heater component (4) is installed inside the heating slot, and wherein the heater component (4) is used to control the temperature of the memory stick under test.

2. A memory test constant temperature automatic control device according to claim 1, characterized in that: The heating slot corresponds to the testing slot in position.

3. A memory test constant temperature automatic control device according to claim 1, characterized in that: A temperature control device (5) is installed inside the heating protection component (3), and the temperature control device (5) is used to adjust the heat inside the heating tank.

4. A memory test constant temperature automatic control device according to claim 1, characterized in that: The heater assembly (4) comprises a mounting plate, and a plurality of groups of heat dissipation fins arranged at intervals are mounted on the upper and lower parts of the mounting plate, and a thermostat for heating is mounted in the gaps between the plurality of groups of heat dissipation fins above the heater assembly (4).

5. A memory test constant temperature automatic control device according to claim 4, characterized in that: The memory bar (6) under test is in the gap between a plurality of groups of heat dissipation fins below the heater assembly (4), and there is a gap between the memory bar (6) under test and the heat dissipation fins on both sides.

6. A memory test constant temperature automatic control device according to claim 4, characterized in that: The heater assembly (4) is installed inside the heating tank via studs, a thermostat for heating is installed in the gaps between the groups of heat dissipation fins below the heater assembly (4), and a heat conduction assembly is provided between the thermostat and the heat dissipation fins.

7. A memory test constant temperature automatic control device according to claim 4, characterized in that: Temperature sensors are arranged outside the plurality of groups of heat dissipation fins at the upper part and the lower part of the installation plate.

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