Chip material belt pressing device
By designing a chip tape compression device, the chip tape is tightened by a compaction block made of flexible materials, the problem of inconvenience of manually tearing off the heat dissipation patch is solved, and more efficient operation process and better chip protection is achieved.
Patent Information
- Application Number
- CN202420565530.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-22
- Publication Date
- 2025-05-02
- Estimated Expiration
- 2034-03-22
AI Technical Summary
In the prior art, it is inconvenient to manually tear off the heat dissipation patch of the chip, especially during automated packaging or testing, the chip tape is soft and difficult to fix, resulting in difficulty in manual operation.
A chip tape compression device is designed, including a substrate, a rotatably connected compression structure and a compression block. The pressing block is a flexible material, which extends into the storage tank through the flip plate to tighten the chip material tape, making it easier to manually tear off the heat dissipation patch.
By pressing the chip tape through the pressing block, the process of manually tearing off the heat dissipation patch is significantly simplified, the convenience and efficiency of operation are improved, and the damage to the chip is avoided.
Smart Images
Figure CN222826361U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip packaging and testing, in particular to a chip material strip pressing device. Background Art
[0002] To meet the growing demand for use, the chip integration is getting higher and higher, the power consumption is getting higher and higher, and the heat generated by a single chip is also getting higher and higher. The heat dissipation function of the chip has an extremely important impact on the function and stability of the entire system. Nowadays, chip packaging and testing factories generally use heat dissipation stickers to dissipate heat from chips.
[0003] During automated packaging or testing, several chips are usually placed on a material strip and connected to each other through the material strip. When an abnormality occurs in the heat sink operation, the abnormal heat sink needs to be manually torn off from the chip. Since the chip material strip is soft and difficult to fix, the manual tearing operation is inconvenient. Utility Model Content
[0004] One of the purposes of the utility model is to provide a chip material strip pressing device to solve the technical problem of the inconvenience of manually tearing off the heat dissipation sticker in the prior art.
[0005] To achieve one of the purposes of the utility model mentioned above, one embodiment of the utility model provides a chip strip pressing device, including: a substrate, a pressing structure rotatably connected to the substrate, the substrate including a receiving groove arranged on its surface, the receiving groove is used to place the chip strip, the pressing structure includes a flip plate that can be flipped relative to the substrate, and a pressing block arranged on the flip plate, when the flip plate rotates toward the substrate and abuts against the substrate, the pressing block extends into the receiving groove.
[0006] As a further improvement of an embodiment of the utility model, the pressing block includes a pressing protrusion arranged on a surface of one side close to the substrate, and the pressing protrusion is made of a flexible material.
[0007] As a further improvement of an embodiment of the utility model, the clamping blocks are arranged in pairs along a first direction and spaced apart, each of the clamping blocks is movably adjustable along the first direction, the clamping blocks extend along a second direction, the first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the flip plate.
[0008] As a further improvement of one embodiment of the utility model, the flip plate includes a receiving space located in the middle area, and two mounting shafts installed in the receiving space and arranged at intervals along the second direction; the two ends of the clamping block are respectively installed on the mounting shafts, and the ends of the clamping block are slidably matched with the mounting shafts.
[0009] As a further improvement of an implementation manner of the utility model, the installation shaft and the clamping block are arranged to form a rectangular structure.
[0010] As a further improvement of an embodiment of the utility model, the receiving groove includes an escape groove formed by being recessed from the bottom surface thereof, and the escape groove is used to escape the chip.
[0011] As a further improvement of an embodiment of the utility model, the receiving groove includes a positioning structure arranged on the bottom surface thereof, and the positioning structure is used to position the chip strip.
[0012] As a further improvement of one embodiment of the utility model, it includes a connecting shaft, the first side of the substrate and the first side of the clamping structure are rotatably connected through the connecting shaft, and a handle is provided on the second side of the clamping structure to drive the clamping structure to rotate around the connecting shaft; the first side and the second side of the clamping structure are arranged opposite to each other.
[0013] As a further improvement of an embodiment of the utility model, it includes a locking structure arranged between the second side of the substrate and the second side of the clamping structure, and the first side and the second side of the substrate are arranged opposite to each other.
[0014] As a further improvement of an embodiment of the utility model, the locking structure includes a positioning block and a positioning groove that cooperate with each other, the positioning block is provided with a locking groove, and the locking structure also includes a fastener that cooperates with the locking groove.
[0015] Compared with the prior art, the utility model provides a chip material strip pressing device, including a pressing block for cooperating with the chip material strip. When the heat sink works abnormally, the pressing block can press the chip material strip to facilitate manual removal of the heat sink on the chip. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of placing a chip strip on a chip strip clamping device in one embodiment of the utility model.
[0017] Figure 2 It is a schematic diagram of a chip strip being compressed in one embodiment of the utility model.
[0018] Figure 3 It is a schematic diagram of a chip strip pressing device in one embodiment of the utility model.
[0019] Figure 4 It is a schematic diagram of another angle of the chip strip pressing device in one embodiment of the utility model.
[0020] Figure 5 It is a schematic diagram of a chip strip pressing device in one embodiment of the utility model from another angle. DETAILED DESCRIPTION
[0021] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.
[0022] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In addition, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.
[0023] The terms "connected", "connected to" or any other variants are intended to cover various relative positions in a connection relationship, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by a gas pipeline, the indirect connection can be a connection relationship established by a device such as a valve body, a sensor, etc., can be a connection relationship established by a gas circuit component such as a brake control unit, or can be a connection relationship established by any other medium such as air.
[0024] See also Figure 1 , is a schematic structural diagram of a chip strip 200 and a chip strip pressing device 100 provided in one embodiment of the utility model.
[0025] The chip strip pressing device 100 (hereinafter referred to as the pressing device 100 ) includes a base plate 10 , a connecting shaft 20 , and a pressing structure 30 rotatably connected to the base plate 10 . The base plate 10 and the pressing structure 30 are rotatably connected via the connecting shaft 20 .
[0026] Specifically, combined Figure 2-3 As shown, the connecting shaft 20 passes through the first side of the substrate 10 and the first side of the clamping structure 30, and a handle 31 is provided on the second side of the clamping structure 30, and the second side of the clamping structure 30 is arranged opposite to the first side. By operating the handle 31, the clamping structure 30 can be driven to rotate around the connecting shaft 20, so that the second side of the clamping structure 30 is relatively close to or away from the second side of the substrate 10, and correspondingly, the second side of the substrate 10 is arranged opposite to the first side.
[0027] The first side of the base plate 10 includes a boss 11 protruding toward the clamping structure 30, and the first side of the clamping structure 30 includes a connecting portion 32 that cooperates with the boss 11, and the connecting shaft 20 passes through the boss 11 and the connecting portion 32. The connecting shaft 20 is sleeved with a torsion spring 21, and the two ends of the torsion spring 21 abut against the base plate 10 and the clamping structure 30 respectively.
[0028] The substrate 10 includes a receiving groove 101 disposed on the surface thereof. The substrate 10 is a rectangular supporting plate. The upper surface of the substrate 10 is recessed to form the receiving groove 101 . The receiving groove 101 is used to place the chip strip 200 .
[0029] The chip strip 200 includes a plurality of chips and a heat sink 210 attached to the chips. The heat sink 210 is located in the middle area of the chip strip 200 and exposed on the upper surface of the chip strip 200. A plurality of chip strips 200 are connected to each other and can be arranged in the receiving slot 101 at the same time.
[0030] The receiving groove 101 includes an avoidance groove 102 formed by a depression from its bottom surface, and the avoidance groove 102 is used to avoid the chip. The heat sink 210 is exposed upward to the receiving groove 101. In actual applications, the chip located under the heat sink 210 may contact the bottom surface of the receiving groove 101, causing the chip to be pressed, which may cause problems such as chip damage. Therefore, the bottom surface of the receiving groove 101 is provided with an avoidance groove 102 to accommodate the chip that may bulge downward to protect the chip from damage. The avoidance groove 102 located in the middle working position is smaller and can only avoid the chip. The bottom surfaces of the receiving groove 101 on both sides of the avoidance groove 102 corresponding to the receiving groove 101 can also carry the chip strip 200, providing a force-bearing surface when manually tearing off the heat sink 210. The avoidance grooves 102 arranged on both sides can be directly designed to avoid the entire chip strip 200.
[0031] The receiving groove 101 includes a positioning structure 103 disposed on the bottom surface thereof, and the positioning structure 103 is used to position the chip strip 200. The positioning structure 103 is a positioning column, and a positioning groove that cooperates with the positioning column is disposed on the edge of the chip strip 200. In actual use, the chip strip 200 can be positioned in the receiving groove 101 first by the cooperation of the positioning column and the positioning groove, and then the pressing structure 30 is turned over.
[0032] The clamping structure 30 includes a flip plate 40 that can flip relative to the base plate 10, and a clamping block 50 disposed on the flip plate 40. The first side of the clamping structure 30 is also the first side of the flip plate 40, and the second side of the clamping structure 30 is also the second side of the flip plate 40, that is, the second side of the flip plate 40 is provided with a handle 31, and the first side of the flip plate 40 is provided with a connecting portion 32.
[0033] When the flip plate 40 rotates toward the substrate 10 and abuts against the substrate 10, the pressing block 50 extends into the receiving groove 101. In this way, the pressing block 50 abuts against the chip strip 200 in the receiving groove 101, making it convenient to manually tear off the heat dissipation sticker 210 on the surface of the chip strip 200.
[0034] Combination Figure 2 As shown, on a normal production line, several chip strips 200 are connected to each other. When one of the heat sinks 210 operates abnormally and needs to be manually torn off, the several chip strips 200 are placed in the receiving groove 101 as a whole, and the chip can be located in the avoidance groove 102; the abnormal heat sink 210 should correspond to the middle working position of the receiving groove 101, and the middle working position is used to cooperate with the clamping structure 30. The normal heat sink 210 is located on both sides of the receiving groove 101, and no additional operation is required.
[0035] After the clamping structure 30 is flipped as a whole toward the substrate 10, the clamping block 50 enters the receiving groove 101 and presses the chip strip 200 at the corresponding position, which should be the chip strip 200 with the abnormal heat dissipation post 210. In this way, the chip strip 200 is clamped and fixed, making it convenient for the operator to tear off the abnormal heat dissipation post 210 without damaging the corresponding chip or affecting other normal chip strips 200.
[0036] The pressing block 50 includes a pressing protrusion 51 disposed on a surface of one side close to the substrate 10 . The pressing protrusion 51 is made of a flexible material and has an elastic margin for crimping, so that the pressing can be done tightly and avoid damage to the chip strip 200 .
[0037] The pressing blocks 50 are arranged in pairs along the first direction with intervals, and each of the pressing blocks 50 is movable and adjustable along the first direction. The pressing blocks 50 extend along the second direction, the first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the flip plate 40 .
[0038] In this way, the two pressing blocks 50 are arranged in parallel and spaced apart along the first direction, and respectively press the two sides of the chip strip 200, and the heat sink 210 is located between the two pressing blocks 50, and the two pressing blocks 50 are parallel to the two sides of the heat sink 210, which is more convenient to tear off. The distance between the two pressing blocks 50 can be adjusted along the first direction to adapt to chip strips 200 of different sizes.
[0039] The flip plate 40 includes a receiving space 401 located in the middle area, and two mounting shafts 41 installed in the receiving space 401 and arranged at intervals along the second direction; the two ends of the clamping block 50 are respectively installed on the mounting shafts 41, and the ends of the clamping block 50 are slidably matched with the mounting shafts 41 to facilitate the operation of moving the clamping block 50.
[0040] Continue to combine Figure 4-5 As shown, the flip plate 40 is a rectangular frame structure, which is surrounded to form a receiving space 401 in the middle. The receiving space 401 is also a corresponding rectangular structure. The axial direction of the installation shaft 41 is the first direction. The two installation shafts 41 are arranged in parallel and spaced in the receiving space 401 along the second direction. Both ends of the installation shaft 41 are fixed to the flip plate 40. Two pressing blocks 50 are arranged perpendicular to the two installation shafts 40 to form a rectangular structure together.
[0041] Circular holes are set at both ends of each of the clamping blocks 50, and the clamping blocks 50 are sleeved on the mounting shaft 41 through the circular holes. A fastening structure or a snap-fit structure is further set to fix the end of the clamping block 50 to the mounting shaft 41. When the chip strip 200 is of different sizes, the fastening structure or the snap-fit structure is unlocked, and the clamping block 50 is slid to adjust the distance between the two clamping blocks 50. After adjustment, the fastening structure or the snap-fit structure is used to lock it.
[0042] The clamping device 100 also includes a locking structure 60 arranged between the second side of the substrate 10 and the second side of the clamping structure 30. When the clamping structure 30 is rotated to adhere to the substrate 10, the locking structure 60 can lock the clamping structure 30 and the substrate 10 to prevent relative movement between the two during operation.
[0043] The locking structure 60 includes a positioning block 61 and a positioning groove 62 that cooperate with each other. The positioning block 61 is provided with a locking groove 610 . The locking structure 60 also includes a fastener 63 that cooperates with the locking groove 610 .
[0044] The flip plate 40 is provided with a positioning block 61 between the receiving space 401 and the handle 31. When the flip plate 40 is rotated to be parallel to the substrate 10, the positioning block 61 enters the positioning groove 62. The fastener 63 is then screwed into the positioning groove 32 and further clamped in the locking groove 610 to prevent the flip plate 40 from rotating around the connecting shaft 20.
[0045] The beneficial effects of the utility model are: the clamping block 50 presses the chip strip 200 to assist in manually tearing off the heat dissipation sticker 210; the two clamping blocks 50 are slidably arranged along the first direction, and the distance between them can be adjusted to adapt to chip strips 200 of different sizes; the clamping protrusion 51 is made of flexible material, which can be pressed tightly and protect the chip strip 200.
[0046] It can be formed by referring to any of the technical solutions provided above, and will not be described in detail here.
[0047] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.
[0048] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.
Claims
1. A chip strip pressing device, characterized in that: include: A substrate and a clamping structure rotatably connected to the substrate, the substrate including a receiving groove arranged on its surface, the receiving groove is used to place the chip strip, the clamping structure includes a flip plate that can be flipped relative to the substrate, and a clamping block arranged on the flip plate, when the flip plate rotates toward the substrate and abuts against the substrate, the clamping block extends into the receiving groove.
2. The chip strip pressing device according to claim 1, characterized in that: The pressing block comprises a pressing protrusion arranged on a surface of one side close to the substrate, and the pressing protrusion is made of a flexible material.
3. The chip strip pressing device according to claim 1, characterized in that: The pressing blocks are arranged in pairs along a first direction and spaced apart from each other. Each of the pressing blocks is movable and adjustable along the first direction. The pressing blocks extend along a second direction. The first direction is perpendicular to the second direction, and the first direction and the second direction are parallel to the flip plate.
4. The chip strip pressing device according to claim 3, characterized in that: The flip plate includes a receiving space located in the middle area, and two installation shafts installed in the receiving space and arranged at intervals along the second direction; both ends of the clamping block are respectively installed on the installation shafts, and the ends of the clamping block are slidably matched with the installation shafts.
5. The chip strip pressing device according to claim 4, characterized in that: The installation shaft and the pressing block are arranged to form a rectangular structure.
6. The chip strip pressing device according to claim 1, characterized in that: The receiving groove comprises an escape groove formed by being recessed from the bottom surface thereof, and the escape groove is used for escaping the chip.
7. The chip strip pressing device according to claim 1, characterized in that: The receiving groove includes a positioning structure arranged on the bottom surface thereof, and the positioning structure is used for positioning the chip strip.
8. The chip strip pressing device according to claim 1, characterized in that: It includes a connecting shaft, the first side of the base plate and the first side of the clamping structure are rotatably connected through the connecting shaft, and a handle is provided on the second side of the clamping structure to drive the clamping structure to rotate around the connecting shaft; the first side and the second side of the clamping structure are arranged opposite to each other.
9. The chip strip pressing device according to claim 8, characterized in that: It comprises a locking structure arranged between the second side of the substrate and the second side of the pressing structure, and the first side and the second side of the substrate are arranged opposite to each other.
10. The chip strip pressing device according to claim 9, characterized in that: The locking structure includes a positioning block and a positioning groove that cooperate with each other, the positioning block is provided with a locking groove, and the locking structure also includes a fastener that cooperates with the locking groove.