Semiconductor product for electroplating after transverse cutting

Abstract

The semiconductor product comprises a frame body, and positioning circular holes are formed in the edges of the two sides of the frame body respectively. A plurality of unit bodies are uniformly distributed on the frame body, each unit body comprises a plurality of base island groups which are arranged in rows, each base island group comprises a plurality of base island units, each base island unit comprises a pair of base island combination parts which are arranged at intervals, and the pair of base island combination parts are respectively connected with the frame body through conductive wires. According to the utility model, the base island combination part in the frame is transversely connected and conducted with one side of the frame by using the conductive wire during wire welding, so that the electroplating reliability is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of packaging, and in particular relates to a semiconductor product for electroplating after cross-cutting. Background Art

[0002] DFN package is a double-sided pinless semiconductor package type. During the production process, this type of product can be plated by pre-cutting before plating, so that the pin sides are fully tinned to enhance the bonding between the product and the printed circuit board, and allow the use of 2D optical detection of the side to determine whether tinning is applied. However, when using conventional frames to manufacture full-flank wettable semiconductor products, most of the frames are not conductive to the internal unit and the overall frame after being cut horizontally, so electroplating operations cannot be performed. For some products with complex structures, only conducting electricity through frame connection will reduce the chip mounting area, resulting in a significant decrease in product performance, and even the internal unit cannot be connected to the overall frame after cutting, which greatly limits the use of the method for manufacturing full-flank wettable semiconductor products. Utility Model Content

[0003] In view of the above problems, the utility model provides a semiconductor product for electroplating after cross-cutting, which has a simple structure, is convenient for processing and has improved reliability.

[0004] The technical solution of the utility model is: a semiconductor product for electroplating after cross-cutting, comprising a frame body, and positioning circular holes are respectively provided on the two side edges of the frame body;

[0005] A plurality of unit bodies are evenly distributed on the frame body, and the unit bodies include a plurality of base island groups arranged in rows.

[0006] The base island group includes a plurality of base island units, and the base island unit includes a pair of base island combination parts that are spaced apart, and the pair of base island combination parts are respectively connected to the frame body through conductive wires.

[0007] The base island combination part includes a drain base island, a source base island and a gate base island,

[0008] The source base island and the gate base island are respectively located on the same side of the drain base island;

[0009] The outer sides of the drain base island, the source base island and the gate base island are connected to the frame body through pins respectively.

[0010] The drain base island and the source base island are respectively connected to the frame body through reinforcing ribs.

[0011] The grid base island is connected to the frame body through conductive connecting ribs.

[0012] The base island combination part is arranged in an L shape, and the source base island and the gate base island are located at the horizontal end of the base island combination part.

[0013] The horizontal ends of a pair of base island assembly parts are located on both sides of the base island unit.

[0014] The gate base island in the base island combination part is connected to the frame body through a conductive line, and the conductive line is located above the pin of the drain base island in another base island combination part.

[0015] The frame body is provided with stress release grooves between adjacent unit bodies.

[0016] The unit body further includes a reinforcing rib located in the middle, and the reinforcing rib is used to separate the base island groups.

[0017] Both sides of the unit body include at least one column of base island units to form a reserved unit.

[0018] An identification hole is arranged on the drain base island of the reserved unit.

[0019] The edges of the unit body are surrounded by stress release holes.

[0020] The frame body is provided with positioning square holes on the four sides of the unit body.

[0021] During operation, the utility model can realize left-right interconnection by arranging conductive wires and conductive connecting ribs, because the base island unit includes a pair of base island assembly parts arranged at intervals, thereby avoiding excessive reduction in product performance caused by a reduction in the base island area for chip installation in complex products to achieve connection, or even failure to realize the overall connection between the inside of the unit and the frame after cutting off, thereby ensuring the tinning ability of the side electroplating. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall framework of the utility model;

[0023] Figure 2 It is a partial schematic diagram of the framework of the utility model;

[0024] Figure 3 This is a schematic diagram of the utility model after horizontal cutting;

[0025] Figure 4 This is a schematic diagram of the conductive wire connection structure in the framework of the utility model;

[0026] Figure 5 This is a partial schematic diagram of the utility model after horizontal cutting;

[0027] In the figure, 1, frame body; 101, positioning circular hole; 102, stress release groove; 103, reinforcing rib; 104, positioning square hole; 105, stress release hollow hole; 106, identification hole; 107, drain base island; 108, source base island; 109, gate base island; 110, reinforcement rib; 111, conductive rib; 112, pin; 2 conductive wires. DETAILED DESCRIPTION

[0028] like Figure 1-5 As shown, a semiconductor product for electroplating after cross-cutting comprises a frame body 1, and positioning circular holes 101 are respectively provided on the two side edges of the frame body 1;

[0029] The positioning circular holes 101 are located at the edges of both sides of the frame body 1 and are used for die bonding, wire bonding, front and back identification and positioning of plastic packaging.

[0030] The frame body 1 is evenly provided with a plurality of unit bodies, each of which includes a plurality of base island groups arranged in a row.

[0031] The base island group includes a plurality of base island units, and the base island unit includes a pair of base island combination parts that are spaced apart, and the pair of base island combination parts are connected to the frame body through conductive wires 2 respectively.

[0032] During operation, the utility model has a base island unit including a pair of base island assembly parts spaced apart, and the left and right interconnections are realized by arranging conductive wires. Thus, the frame can still conduct electricity after being cut transversely, thereby improving the reliability of electroplating.

[0033] The base island assembly portion includes a drain base island 107, a source base island 108 and a gate base island 109.

[0034] The source base island 108 and the gate base island 109 are respectively located on the same side of the drain base island 107;

[0035] The outer sides of the drain base island 107, the source base island 108 and the gate base island 109 are connected to the frame body 1 through pins 112 respectively.

[0036] The drain base island 107 and the source base island 108 are connected to the frame body 1 through reinforcing ribs 110.

[0037] The gate base island 109 is connected to the frame body 1 via a conductive connecting rib 111 .

[0038] The drain island 107 is used to mount the chip and connect the chip drain, the source island 108 is used as a wire platform to connect the chip surface source, and the gate island 109 is used as a wire platform to connect the chip gate.

[0039] The base island is connected to the frame body through the reinforcement rib 110 to prevent shaking during die bonding and wire bonding. In application, the pins 112 and the reinforcement rib 110 are formed by opening holes in the frame body.

[0040] The conductive connecting ribs 111 are used to connect the interior of the unit with the frame body in a transverse direction, so that the frame can still be connected to the edge for conductivity and electroplating after being cut in a transverse direction.

[0041] The base island combination part is arranged in an L shape, and the source base island 108 and the gate base island 109 are located at the horizontal end of the base island combination part.

[0042] The horizontal ends of a pair of base island assembly parts are located on both sides of the base island unit.

[0043] The base island combination is arranged in an L shape, with a reasonable layout and space saving.

[0044] The gate base island 109 in the base island combination part is connected to the frame body through a conductive line 2, and the conductive line 2 is located above the pin 112 of the drain base island 107 in another base island combination part.

[0045] In this way, the conductive line connection is carried out through the gate base island in the base island combination part, which is convenient for operation.

[0046] The frame body 1 is provided with stress release grooves 102 between adjacent unit bodies. The edges of the unit bodies are provided with stress release holes 105.

[0047] The stress release groove 102 is located between each unit body of the frame body 1, and the stress release hole 105 is located at the edge of each unit body for releasing stress.

[0048] The unit body further includes a reinforcing rib 103 located in the middle, and the reinforcing rib 103 is used to separate the base island groups.

[0049] The reinforcing rib 103 is located in the middle of the unit body, and this part is not cut when the transverse groove is cut, so as to enhance the overall strength of the frame.

[0050] Both sides of the unit body include at least one column of base island units to form a reserved unit.

[0051] An identification hole 106 is provided on the drain base island 107 of the reserved unit.

[0052] Compared with conventional frames, the overall strength of the frame is reduced after the horizontal grooves are cut, and it is easy to deform during electroplating. Therefore, two columns of units are left on the left and right sides of each unit body. The positions of these two columns of units are not cut when the horizontal grooves are cut to strengthen the overall strength of the frame. Since these two columns are not used as products, there is no need to perform die bonding and wire bonding. In order to facilitate machine image recognition to distinguish normal units, an identification hole 106 is drilled on the drain base island.

[0053] The frame body 1 is provided with positioning square holes 104 around the unit body for positioning during disassembly.

[0054] Regarding the contents disclosed in this case, there are a few points that need to be explained:

[0055] (1) The drawings of the embodiments disclosed in this case only involve the structures involved in the embodiments disclosed in this case. Other structures can refer to the general design;

[0056] (2) In the absence of conflict, the embodiments and features of the embodiments disclosed in this case may be combined with each other to obtain new embodiments;

[0057] The above are only specific implementation methods disclosed in this case, but the protection scope of the present disclosure is not limited thereto. The protection scope disclosed in this case should be based on the protection scope of the claims.

Claims

1. A semiconductor product for electroplating after cross-cutting, comprising a frame body (1), wherein two side edges of the frame body (1) are respectively provided with positioning circular holes (101); the characteristics are as follows: A plurality of unit bodies are evenly distributed on the frame body (1), and the unit bodies include a plurality of base island groups arranged in rows. The base island group includes a plurality of base island units, and the base island unit includes a pair of base island assembly parts arranged at intervals, and the pair of base island assembly parts are respectively connected to the frame body through conductive wires (2).

2. A semiconductor product for electroplating after cross-cutting according to claim 1, characterized in that: The base island combination portion comprises a drain base island (107), a source base island (108) and a gate base island (109), The source base island (108) and the gate base island (109) are respectively located on the same side of the drain base island (107); The outer sides of the drain base island (107), the source base island (108) and the gate base island (109) are connected to the frame body (1) via pins (112). The drain electrode base island (107) and the source electrode base island (108) are respectively connected to the frame body (1) via reinforcing ribs (110). The grid base island (109) is connected to the frame body (1) via a conductive connecting rib (111).

3. A semiconductor product for electroplating after cross-cutting according to claim 2, characterized in that: The base island combination part is arranged in an L shape, and the source base island (108) and the gate base island (109) are located at the horizontal end of the base island combination part. The horizontal ends of a pair of base island assembly parts are located on both sides of the base island unit.

4. A semiconductor product for electroplating after cross-cutting according to claim 2, characterized in that: The gate base island (109) in the base island combination part is connected to the frame body via a conductive wire (2), and the conductive wire (2) is located above the pin (112) of the drain base island (107) in another base island combination part.

5. A semiconductor product for electroplating after cross-cutting according to claim 2, characterized in that: The frame body (1) is provided with stress release grooves (102) between adjacent unit bodies.

6. A semiconductor product for electroplating after cross-cutting according to claim 1, characterized in that: The unit body further comprises a reinforcing rib (103) located in the middle, and the reinforcing rib (103) is used to separate the base island groups.

7. A semiconductor product for electroplating after cross-cutting according to claim 1, characterized in that: Both sides of the unit body include at least one column of base island units to form a reserved unit.

8. A semiconductor product for electroplating after cross-cutting according to claim 7, characterized in that: An identification hole (106) is provided on the drain base island (107) of the reserved unit.

9. A semiconductor product for electroplating after cross-cutting according to claim 1, characterized in that: Stress release holes (105) are provided on the four edges of the unit body.

10. A semiconductor product for electroplating after cross-cutting according to claim 1, characterized in that: The frame body (1) is provided with positioning square holes (104) on the four sides of the unit body.

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