Audio development board device

Abstract

The utility model discloses an audio development board device, which comprises a master control MCU (Microprogrammed Control Unit), a plurality of audio amplification modules, a conversion module and a plurality of loudspeakers, the output end of the main control MCU is connected with the input end of each audio amplification module, the output end of each audio amplification module is connected with the input end of the conversion module, and the output end of the conversion module is connected with a plurality of loudspeakers in parallel. According to the audio development board device provided by the utility model, when a new electronic product to be tested is replaced every time, only the audio amplification module of the corresponding product needs to be selected on the main control MCU, the corresponding sound signal is amplified and then is emitted through different loudspeakers, and the audio development board device does not need to be redesigned, so that the operation steps are simplified, and the production efficiency is improved. The test efficiency is improved and the test cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of electrical communication, in particular to an audio development board device. Background Art

[0002] At present, in the early stage of electronic product development, it is often necessary to test the electronic products through the audio amplifier and speakers in the audio development board, that is, the sound signals of the electronic products are amplified, multiple filtered, frequency modulated and amplitude stabilized to achieve the desired sound frequency in their own design, so as to ensure the sound effect of the electronic products and improve the user experience.

[0003] However, in the face of the sound effects of different electronic products, and the audio amplifier devices used in different electronic products are also different, it is necessary to redesign the audio development board every time a new electronic product to be tested is replaced, resulting in cumbersome operations, low test efficiency, and increased test costs. Utility Model Content

[0004] In view of this, the utility model provides an audio development board device, which is used to solve the problems in the prior art that the audio development board has cumbersome operation, low testing efficiency and increased testing cost.

[0005] The technical solution of the utility model is an audio development board device, including a main control MCU, multiple audio amplification modules, a conversion module and multiple speakers;

[0006] The output end of the main control MCU is connected to the input end of each of the audio amplification modules, the output end of each of the audio amplification modules is connected to the input end of the conversion module, and the output end of the conversion module is connected in parallel with a plurality of speakers.

[0007] Further, the audio amplification module includes at least one first audio amplification module, each of which includes a first amplification chip U1, a capacitor C1, a capacitor C2, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a resistor R1, a resistor R2, a resistor R4 and a resistor R5;

[0008] Pin 1 of the first amplifier chip U1 is used to connect to the output end of the first switch module, and a capacitor C7 is connected between pins 3 and 19 of the first amplifier chip U1; pins 4 and 8 of the first amplifier chip U1, a first end of the capacitor C4, and a first end of the capacitor C5 are all connected to pin 1 of the main control MCU;

[0009] Pins 12, 17 and 18 of the first amplifier chip U1 are all connected to the first end of the capacitor C6;

[0010] A capacitor C3 is connected between pin 6 and pin 7 of the first amplifier chip U1, and pin 6 of the first amplifier chip U1 is connected in series with the resistor R1 and the capacitor C1 and then connected to pin 2 of the main control MCU, and pin 7 of the first amplifier chip U1 is connected in series with the resistor R2 and the capacitor C2 and then connected to pin 3 of the main control MCU; pin 13 of the first amplifier chip U1 is connected to the second input end of the conversion module, and pin 15 of the first amplifier chip U1 is connected to the first input end of the conversion module;

[0011] Pin 14, pin 20, pin 21 of the first amplifier chip U1, a second end of the capacitor C4, a second end of the capacitor C5 and a second end of the capacitor C6 are all grounded.

[0012] Further, the audio amplification module includes at least one second audio amplification module, each of which includes a second amplification chip U2, a capacitor C20, a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C27, a resistor R20 and a resistor R21;

[0013] A capacitor C22 is connected between pin 1 and pin 2 of the second amplifier chip U2, and pin 1 of the second amplifier chip U2 is connected in series with the resistor R20 and the capacitor C20 and then connected to pin 2 of the main control MCU, and pin 2 of the second amplifier chip U2 is connected in series with the resistor R21 and the capacitor C21 and then connected to pin 3 of the main control MCU;

[0014] Pin 3, pin 7, the first end of capacitor C23 and the first end of capacitor C24 of the second amplifier chip U2 are all connected to pin 1 of the main control MCU, and pin 4 of the second amplifier chip U2 is used to connect the output end of the second switch module; capacitor C25 is connected between pin 9 and pin 14 of the second amplifier chip U2; pin 5 and pin 6 of the second amplifier chip U2 are connected to the first end of the capacitor C26, and pin 13 of the second amplifier chip U2 is connected to the second end of the capacitor C26;

[0015] Pin 8 of the second amplifier chip U2 is connected to the first input end of the conversion module, and pin 16 of the first amplifier chip U1 is connected to the second input end of the conversion module; pin 15 of the second amplifier chip U2 is connected to the first end of the capacitor C27;

[0016] Pin 10, pin 11, pin 12 of the second amplifier chip U2, a second end of the capacitor C23, a second end of the capacitor C24 and a second end of the capacitor C27 are all grounded.

[0017] Further, the audio amplification module includes at least one third audio amplification module, and each of the third audio amplification modules includes a third amplification chip U3, a capacitor C40, a capacitor C41, a capacitor C42, a capacitor C43, a capacitor C44, a capacitor C45 and a capacitor C46;

[0018] Pin 1 of the third amplifier chip U3 is connected to the first input end of the conversion module, and pin 9 of the third amplifier chip U3 is connected to the second input end of the conversion module; pins 2 and 6 of the third amplifier chip U3 are connected to the first end of the capacitor C45 and the first end of the capacitor C46; pins 3 and 7 of the third amplifier chip U3 are connected to the first end of the capacitor C44, and pin 4 of the third amplifier chip U3 is connected to the second end of the capacitor C44;

[0019] Pin 14 of the third amplifier chip U3, the first end of the capacitor C42, and the first end of the capacitor C43 are all connected to pin 1 of the main control MCU; pin 15 of the third amplifier chip U3 is connected in series with the resistor R41 and then connected to pin 3 of the main control MCU, and pin 16 of the third amplifier chip U3 is connected in series with the resistor R40 and then connected to pin 2 of the main control MCU; pin 17 of the third amplifier chip U3 is connected to pin 4 of the main control MCU, and pin 18 of the third amplifier chip U3 is connected to pin 5 of the main control MCU;

[0020] Pins 5, 8, 10, 11, 12, and 13 of the third amplifier chip U3, a second end of capacitor C42, a second end of capacitor C43, a second end of capacitor C45, and a second end of capacitor C46 are all grounded.

[0021] Further, the audio amplification module includes at least one fourth audio amplification module, each of which includes a fourth amplification chip U4, a capacitor C60, a capacitor C61, a capacitor C62, a capacitor C63, a capacitor C64, a capacitor C65, a capacitor C66, a capacitor C67 and an inductor L60;

[0022] Pin 2 of the fourth amplifier chip U4 is connected to the second input end of the conversion module, and pin 9 of the third amplifier chip U3 is connected to the first input end of the conversion module; pin 4 of the fourth amplifier chip U4 is connected to pin 6 of the main control MCU, pin 9 of the fourth amplifier chip U4 is connected to pin 5 of the main control MCU, and pin 10 of the fourth amplifier chip U4 is connected to pin 4 of the main control MCU; pin 7 of the fourth amplifier chip U4 is connected in series with the capacitor C60 and then connected to pin 3 of the main control MCU, and pin 8 of the fourth amplifier chip U4 is connected in series with the capacitor C61 and then connected to pin 2 of the main control MCU;

[0023] Pin 3 of the fourth amplifier chip U4, the first end of the capacitor C62, the first end of the capacitor C63, the first end of the capacitor C64 and the first end of the inductor L60 are all connected to pin 1 of the main control MCU; pin 18 of the fourth amplifier chip U4 is connected to the second end of the inductor L60;

[0024] Pin 17 of the fourth amplifier chip U4 is connected to the first end of the capacitor C65, and pin 19 of the fourth amplifier chip U4 is connected to the second end of the capacitor C65, the first end of the capacitor C66, and the first end of the capacitor C67;

[0025] Pin 1, pin 5, pin 6, pin 11, pin 12, pin 13, pin 14, pin 15, pin 16, the second end of capacitor C62, the second end of capacitor C63, the second end of capacitor C64, the second end of capacitor C66 and the second end of capacitor C67 of the fourth amplifier chip U4 are all grounded.

[0026] Further, the audio amplification module includes at least one fifth audio amplification module, each of which includes a fifth amplification chip U5, a resistor R84, a resistor R85, a resistor R86, a capacitor C82, a capacitor C83, a capacitor C84, a capacitor C85, a capacitor C86 and an inductor L80;

[0027] Pin 1 and Pin 2 of the fifth amplifier chip U5 are connected to Pin 4 of the main control MCU, Pin 3 of the fifth amplifier chip U5 is connected to Pin 5 of the main control MCU, Pin 6 of the fifth amplifier chip U5 is connected to Pin 7 of the main control MCU, Pin 7 and Pin 8 of the fifth amplifier chip U5 are connected to Pin 8 of the main control MCU, Pin 9 of the fifth amplifier chip U5 is connected to Pin 9 of the main control MCU, Pin 10 of the fifth amplifier chip U5 is connected to Pin 10 of the main control MCU, Pin 11 of the fifth amplifier chip U5 is connected to Pin 6 of the main control MCU, and Pin 12 of the fifth amplifier chip U5 is connected to Pin 11 of the main control MCU; Pins 27 and 28 of the fifth amplifier chip U5 are both connected to the second input terminal of the conversion module, and Pins 29 and 30 of the fifth amplifier chip U5 are both connected to the first input terminal of the conversion module;

[0028] Pins 31, 32, 33, 34 and 25 of the fifth amplifier chip U5 are connected to the first end of the capacitor C84, the first end of the capacitor C85 and the first end of the capacitor C86, and pin 36 of the fifth amplifier chip U5 is connected to the second end of the capacitor C84;

[0029] Pins 37, 38 and 39 of the fifth amplifier chip U5 are all connected to the first end of the inductor L80, and pin 40 of the fifth amplifier chip U5, the second end of the inductor L80, the first end of the capacitor C82 and the first end of the capacitor C83 are all connected to pin 1 of the main control MCU; pins 41 and 42 of the fifth amplifier chip U5 are both used to connect to the output end of the voltage stabilizing unit;

[0030] Pin 13 of the fifth amplifier chip U5 is connected to the first end of the resistor R84, pin 14 of the fifth amplifier chip U5 is connected to the first end of the resistor R85, and pin 15 of the fifth amplifier chip U5 is connected to the first end of the resistor R86;

[0031] Pin 4, pin 5, pin 13, pin 14, pin 15, pin 16, pin 17, pin 18, pin 19, pin 20, pin 21, pin 22, pin 23, pin 24, pin 25, pin 26, the second end of capacitor C82, the second end of capacitor C83, the second end of capacitor C85, the second end of capacitor C86, the second end of resistor R84, the second end of resistor R85 and the second end of resistor R86 of the fifth amplifier chip U5 are all grounded.

[0032] Further, the conversion module includes a toggle switch K, a capacitor C10, a capacitor C11, a capacitor C12, a transient suppression diode TVS1 and a transient suppression diode TVS2;

[0033] Pins 1 and 2 of the toggle switch K are connected to the output end of each of the audio amplifier modules, and pin 3 of the toggle switch K, the first end of the capacitor C10, the first end of the capacitor C12, and the first end of the transient suppression diode TVS2 are all connected to the positive electrodes of multiple speakers; pin 4 of the toggle switch K, the second end of the capacitor C10, the first end of the capacitor C11, and the first end of the transient suppression diode TVS1 are all connected to the negative electrodes of the multiple speakers;

[0034] Pin 5 of the toggle switch K is connected to pin 12 of the main control MCU, and pin 6 of the toggle switch K is connected to pin 13 of the main control MCU;

[0035] Pin 9, pin 10 of the toggle switch K, the second end of the capacitor C11, the second end of the capacitor C12, the second end of the transient suppression diode TVS1 and the second end of the transient suppression diode TVS2 are all grounded.

[0036] Furthermore, the toggle switch K is any one of a 2P3T toggle switch, a 2P4T toggle switch and a 2P8T toggle switch.

[0037] Compared with the prior art, the utility model has at least the following beneficial effects:

[0038] The audio development board device proposed by the utility model only needs to select the audio amplification module of the corresponding product on the main control MCU each time a new electronic product to be tested is replaced, amplify the corresponding sound signal, and then release it through different speakers respectively, without redesigning the audio development board device, thereby simplifying the operation steps, improving the test efficiency and reducing the test cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of the present invention; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" and any variations thereof in the specification and claims of the present invention and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of the present invention or the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order.

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0041] Figure 1 It is a structural block diagram of the utility model;

[0042] Figure 2 This is the first circuit diagram proposed by the utility model;

[0043] Figure 3 This is the second circuit diagram proposed by the utility model;

[0044] Figure 4 This is the third circuit diagram proposed by the utility model;

[0045] Figure 5 This is the fourth circuit diagram proposed by the utility model;

[0046] Figure 6 This is the fifth circuit diagram proposed by the utility model.

[0047] Reference numerals:

[0048] 100. Main control MCU;

[0049] 200, audio amplifier module;

[0050] 201, first audio amplification module; 202, second audio amplification module; 203, third audio amplification module; 204, fourth audio amplification module; 205, fifth audio amplification module; 206, first switch module; 207, first filter module; 208, second switch module; 209, second filter module; 210, third filter module; 211, fourth filter module; 212, fifth filter module; 213, voltage stabilization module;

[0051] 300, conversion module;

[0052] 400. Speaker. DETAILED DESCRIPTION

[0053] In order to make the technical problems, technical solutions and beneficial effects to be solved by the utility model clearer, the utility model is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the utility model and are not used to limit the utility model. Thus, a feature indicated in this specification will be used to illustrate one of the features of an embodiment of the utility model, rather than implying that each embodiment of the utility model must have the described features. In addition, it should be noted that this specification describes many features. Although certain features can be combined together to illustrate possible system designs, these features can also be used in other combinations that are not explicitly described. Thus, unless otherwise stated, the described combinations are not intended to be limiting.

[0054] The principle and structure of the present utility model are described in detail below with reference to the accompanying drawings and embodiments.

[0055] In one embodiment, in order to solve the problem of not needing to redesign the audio development board each time a new electronic product to be tested is replaced, the operation steps are simplified, the test efficiency is improved, and the test cost is reduced. Figure 1 The utility model proposes an audio development board device, including a main control MCU 100, a plurality of audio amplification modules 200, a conversion module 300 and a plurality of speakers 400;

[0056] The output end of the main control MCU 100 is connected to the input end of each audio amplification module 200 , and the output end of each audio amplification module 200 is connected to the input end of the conversion module 300 . The output end of the conversion module 300 is connected in parallel with a plurality of speakers 400 .

[0057] It should be noted that the multiple audio amplifier modules 200 include class D audio amplifier circuits, class K audio amplifier circuits, high-voltage audio amplifier circuits and intelligent audio amplifier circuits. Of course, the audio amplifier module 200 can also include class A audio amplifier circuits, class B audio amplifier circuits or other types of audio amplifier circuits, which are not limited here.

[0058] And this article takes three speakers 400 as an example, and the main control MCU 100 of this article is preferably a STMS2F427 chip, the same as the whole article.

[0059] In this way, when the audio development board device starts to detect the electronic product to be tested to obtain the desired sound frequency and sound effect, the main control MCU 100 can pass the sound signal of the electronic product to be tested through each audio amplifier module 200 in turn to amplify the signal, and then release it through different speakers 400 respectively. The developer can then make a choice based on the sound released by the speaker 400 to obtain the desired sound effect.

[0060] Therefore, when the audio development board device proposed by the utility model faces different electronic products and different audio amplifier modules 200, each time a new electronic product to be tested is replaced, it is only necessary to select the audio amplifier module 200 of the corresponding product on the main control MCU 100, amplify the corresponding sound signal, and then release it through different speakers 400 respectively, without redesigning the audio development board device, thereby simplifying the operation steps, improving test efficiency, and reducing test costs.

[0061] In this embodiment, refer to the attached Figure 2 The audio amplification module 200 includes at least one first audio amplification module 201. The present invention takes one first audio amplification module 201 as an example and also proposes a circuit structure of the first audio amplification module 201.

[0062] Specifically, the first audio amplification module 201 includes a first amplification chip U1, a capacitor C1, a capacitor C2, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a resistor R1, a resistor R2, a resistor R4 and a resistor R5; it also includes a switch S1 and a resistor R3 constituting a first switch module 206, a toggle switch K, a capacitor C10, a capacitor C11, a capacitor C12, a transient suppression diode TVS1 and a transient suppression diode TVS2 constituting a conversion module 300; and a resistor R4, a resistor R5, a capacitor C8 and a capacitor C9 constituting a first filtering module 207.

[0063] Pin 1 of the first amplifier chip U1 is connected to pin 2 of the switch S1, pin 3 of the switch S1 and the first end of the resistor R3 are connected to pin 14 of the main control MCU100, and pins 1, 4, 5, 6, 7 of the switch S1 and the second end of the resistor R3 are grounded.

[0064] A capacitor C7 is connected between pin 3 and pin 19 of the first amplifier chip U1; pin 4, pin 8, the first end of capacitor C4 and the first end of capacitor C5 of the first amplifier chip U1 are all connected to pin 1 of the main control MCU100; pin 12, pin 17 and pin 18 of the first amplifier chip U1 are all connected to the first end of capacitor C6; a capacitor C3 is connected between pin 6 and pin 7 of the first amplifier chip U1, and pin 6 of the first amplifier chip U1 is connected in series with resistor R1 and capacitor C1 and then connected to pin 2 of the main control MCU100, and pin 7 of the first amplifier chip U1 is connected in series with resistor R2 and capacitor C2 and then connected to pin 3 of the main control MCU100.

[0065] Pin 13 of the first amplifier chip U1 is connected to the first end of the resistor R5, and the second end of the resistor R5 and the first end of the capacitor C9 are both connected to pin 2 of the toggle switch K; pin 15 of the first amplifier chip U1 is connected to the first end of the resistor R4, and the second end of the resistor R4 and the first end of the capacitor C8 are both connected to pin 1 of the toggle switch K, pin 5 of the toggle switch K is connected in series with resistor R6 and then connected to pin 12 of the main control MCU100, and pin 6 of the toggle switch K is connected in series with resistor R7 and then connected to pin 13 of the main control MCU100; pin 3 of the toggle switch K, the first end of the capacitor C10, the first end of the capacitor C12 and the first end of the transient suppression diode TVS2 are respectively connected to the positive electrodes of the three speakers 400; pin 4 of the toggle switch K, the second end of the capacitor C10, the first end of the capacitor C11 and the first end of the transient suppression diode TVS1 are respectively connected to the negative electrodes of the three speakers 400.

[0066] Pins 14, 20, and 21 of the first amplifier chip U1, the second end of capacitor C4, the second end of capacitor C5, the second end of capacitor C6, the second end of capacitor C8, the second end of capacitor C9, pins 9 and 10 of the toggle switch K, the second end of capacitor C11, the second end of capacitor C12, the second end of transient suppression diode TVS1, and the second end of transient suppression diode TVS2 are all grounded.

[0067] It should be noted that the first amplifier chip U1 proposed in this embodiment is illustrated by a 20-pin AW8733 chip, the switch S1 is illustrated by a 9-pin switch, and the toggle switch K is illustrated by a 2P3T toggle switch. In addition, pin 1 of the main control MCU 100 is a VBAT pin, pin 2 of the main control MCU 100 is an EXT_IN_N pin, pin 3 of the main control MCU 100 is an EXT_IN_P pin, pin 12 of the main control MCU 100 is an INT_IN_P pin, pin 13 of the main control MCU 100 is an INT_IN_N pin, and pin 14 of the main control MCU 100 is an EN pin.

[0068] In this way, when the main control MCU 100 amplifies the sound signal through the first audio amplifier module 201, the amplified sound signal will be broadcast through three different speakers 400. When the developer determines the sound effect he wants, he will record the first audio amplifier module 201 and the corresponding speaker 400 for subsequent electronic product processing.

[0069] In this embodiment, refer to the attached Figure 3 The audio amplification module 200 includes at least one second audio amplification module 202. The present invention takes one second audio amplification module 202 as an example and also proposes a circuit structure of the second audio amplification module 202.

[0070] Specifically, the second audio amplification module 202 includes a second amplification chip U2, a capacitor C20, a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C27, a resistor R20 and a resistor R21; it also includes a switch S2, a resistor R22 and a resistor R27 constituting the second switch module 208, a toggle switch K, a capacitor C10, a capacitor C11, a capacitor C12, a transient suppression diode TVS1 and a transient suppression diode TVS2 constituting the conversion module 300, and a resistor R23, a resistor R24, a capacitor C28 and a capacitor C29 constituting the second filtering module 209.

[0071] A capacitor C22 is connected between pin 1 and pin 2 of the second amplifier chip U2, and pin 1 of the second amplifier chip U2 is connected in series with a resistor R20 and a capacitor C20, and then connected to pin 2 of the main control MCU100, and pin 2 of the second amplifier chip U2 is connected in series with a resistor R21 and a capacitor C21, and then connected to pin 3 of the main control MCU100; pins 3 and 7 of the second amplifier chip U2, a first end of a capacitor C23, and a first end of a capacitor C24 are all connected to pin 1 of the main control MCU100; a capacitor C25 is connected between pins 9 and 14 of the second amplifier chip U2; pins 5 and 6 of the second amplifier chip U2 are connected to the first end of a capacitor C26, pin 13 of the second amplifier chip U2 is connected to the second end of the capacitor C26, and pin 15 of the second amplifier chip U2 is connected to the first end of a capacitor C27.

[0072] Pin 4 of the second amplifier chip U2 is connected to pin 2 of switch S2 and the first end of resistor R22; pin 3 of switch S2 and the first end of resistor R27 are both connected to pin 14 of the main control MCU100; pins 1, 4, 5, 6 and 7 of switch S2 are all grounded.

[0073] Pin 8 of the second amplifier chip U2 is connected to the first end of the resistor R23, and the second end of the resistor R23 and the first end of the capacitor C28 are both connected to pin 1 of the toggle switch K; pin 16 of the first amplifier chip U1 is connected to the first end of the resistor R24, and the second end of the resistor R24 ​​and the first end of the capacitor C29 are both connected to pin 2 of the toggle switch K; pin 5 of the toggle switch K is connected in series with resistor R6 and then connected to pin 12 of the main control MCU100, and pin 6 of the toggle switch K is connected in series with resistor R7 and then connected to pin 13 of the main control MCU100; pin 3 of the toggle switch K, the first end of the capacitor C10, the first end of the capacitor C12 and the first end of the transient suppression diode TVS2 are respectively connected to the positive electrodes of the three speakers 400; pin 4 of the toggle switch K, the second end of the capacitor C10, the first end of the capacitor C11 and the first end of the transient suppression diode TVS1 are respectively connected to the negative electrodes of the three speakers 400.

[0074] Pins 10, 11, and 12 of the second amplifier chip U2, the second end of capacitor C23, the second end of capacitor C24, the second end of capacitor C27, the second end of capacitor C28, the second end of capacitor C29, the second end of resistor R22, the second end of resistor R27, pins 9 and 10 of the toggle switch K, the second end of capacitor C11, the second end of capacitor C12, the second end of transient suppression diode TVS1, and the second end of transient suppression diode TVS2 are all grounded.

[0075] It should be noted that the second amplifier chip U2 proposed in this embodiment is illustrated by a 16-pin AW8737 chip, and the switch S2 is illustrated by a 9-pin switch.

[0076] In this way, when the main control MCU 100 amplifies the sound signal through the second audio amplifier module 202, the amplified sound signal will be broadcast through three different speakers 400. When the developer determines the sound effect he wants, he will record the second audio amplifier module 202 and the corresponding speaker 400 for subsequent electronic product processing.

[0077] In this embodiment, refer to the attached Figure 4 The audio amplification module 200 includes at least one third audio amplification module 203. The present invention takes one third audio amplification module 203 as an example and also proposes a circuit structure of the third audio amplification module 203.

[0078] Specifically, the third audio amplification module 203 includes a third amplification chip U3, capacitor C40, capacitor C41, capacitor C42, capacitor C43, capacitor C44, capacitor C45 and capacitor C46; it also includes a toggle switch K, capacitor C10, capacitor C11, capacitor C12, transient suppression diode TVS1 and transient suppression diode TVS2 that constitute the conversion module 300, and a resistor R4, resistor R5, capacitor C8 and capacitor C9 that constitute the third filtering module 210.

[0079] Pin 2 and pin 6 of the third amplifier chip U3 are connected to the first end of the capacitor C45 and the first end of the capacitor C46; pin 3 and pin 7 of the third amplifier chip U3 are connected to the first end of the capacitor C44, and pin 4 of the third amplifier chip U3 is connected to the second end of the capacitor C44;

[0080] Pin 14 of the third amplifier chip U3, the first end of capacitor C42 and the first end of capacitor C43 are all connected to pin 1 of the main control MCU100; pin 15 of the third amplifier chip U3 is connected in series with resistor R41 and then connected to pin 3 of the main control MCU100, and pin 16 of the third amplifier chip U3 is connected in series with resistor R40 and then connected to pin 2 of the main control MCU100; pin 17 of the third amplifier chip U3 is connected to pin 4 of the main control MCU100, and pin 18 of the third amplifier chip U3 is connected to pin 5 of the main control MCU100.

[0081] Pin 1 of the third amplifier chip U3 is connected to the first end of the resistor R9, and the second end of the resistor R9 and the first end of the capacitor C47 are both connected to pin 1 of the toggle switch K; pin 9 of the third amplifier chip U3 is connected to the first end of the resistor R8, and the second end of the resistor R8 and the first end of the capacitor C48 are both connected to pin 2 of the toggle switch K; pin 5 of the toggle switch K is connected in series with resistor R6 and then connected to pin 12 of the main control MCU100, and pin 6 of the toggle switch K is connected in series with resistor R7 and then connected to pin 13 of the main control MCU100; pin 3 of the toggle switch K, the first end of the capacitor C10, the first end of the capacitor C12 and the first end of the transient suppression diode TVS2 are respectively connected to the positive electrodes of the three speakers 400; pin 4 of the toggle switch K, the second end of the capacitor C10, the first end of the capacitor C11 and the first end of the transient suppression diode TVS1 are respectively connected to the negative electrodes of the three speakers 400.

[0082] Pins 5, 8, 10, 11, 12, and 13 of the third amplifier chip U3, the second end of capacitor C42, the second end of capacitor C43, the second end of capacitor C45, the second end of capacitor C46, ​​the second end of capacitor C47, pins 9 and 10 of the toggle switch K, the second end of capacitor C11, the second end of capacitor C12, the second end of transient suppression diode TVS1, and the second end of transient suppression diode TVS2 are all grounded.

[0083] It should be noted that the third amplifier chip U3 proposed in this embodiment is illustrated by taking the 18-pin AW87391 chip as an example, and the 5th pin of the main control MCU 100 is the SDA pin, and the 4th pin of the main control MCU 100 is the SCL pin.

[0084] In this way, when the main control MCU 100 amplifies the sound signal through the third audio amplifier module 203, the amplified sound signal will be broadcast through three different speakers 400. When the developer determines the sound effect he wants, he will record the third audio amplifier module 203 and the corresponding speaker 400 for subsequent electronic product processing.

[0085] In this embodiment, refer to the attached Figure 5 The audio amplification module 200 includes at least one fourth audio amplification module 204 . The present invention takes one fourth audio amplification module 204 as an example and also proposes a circuit structure of the fourth audio amplification module 204 .

[0086] Specifically, the fourth audio amplification module 204 includes a fourth amplification chip U4, a capacitor C60, a capacitor C61, a capacitor C62, a capacitor C63, a capacitor C64, a capacitor C65, a capacitor C66, a capacitor C67 and an inductor L60; it also includes a toggle switch K, a capacitor C10, a capacitor C11, a capacitor C12, a transient suppression diode TVS1 and a transient suppression diode TVS2 that constitute the conversion module 300; and a resistor R60, a resistor R61, a capacitor C68 and a capacitor C69 that constitute the fourth filtering module 211.

[0087] Pin 4 of the fourth amplifier chip U4 is connected to pin 6 of the main control MCU100, pin 9 of the fourth amplifier chip U4 is connected to pin 5 of the main control MCU100, and pin 10 of the fourth amplifier chip U4 is connected to pin 4 of the main control MCU100; pin 7 of the fourth amplifier chip U4 is connected in series with capacitor C60 and then connected to pin 3 of the main control MCU100, and pin 8 of the fourth amplifier chip U4 is connected in series with capacitor C61 and then connected to pin 2 of the main control MCU100; pin 3 of the fourth amplifier chip U4, the first end of capacitor C62, the first end of capacitor C63, the first end of capacitor C64, and the first end of inductor L60 are all connected to pin 1 of the main control MCU100; pin 18 of the fourth amplifier chip U4 is connected to the second end of inductor L60; pin 17 of the fourth amplifier chip U4 is connected to the first end of capacitor C65, and pin 19 of the fourth amplifier chip U4 is connected to the second end of capacitor C65, the first end of capacitor C66, and the first end of capacitor C67;

[0088] Pin 2 of the fourth amplifier chip U4 is connected to the first end of the resistor R61, and the second end of the resistor R61 and the first end of the capacitor C68 are both connected to pin 2 of the toggle switch K; pin 15 of the first amplifier chip U1 is connected to the first end of the resistor R60, and the second end of the resistor R60 and the first end of the capacitor C69 are both connected to pin 1 of the toggle switch K; pin 5 of the toggle switch K is connected in series with resistor R6 and then connected to pin 12 of the main control MCU100, and pin 6 of the toggle switch K is connected in series with resistor R7 and then connected to pin 13 of the main control MCU100; pin 3 of the toggle switch K, the first end of the capacitor C10, the first end of the capacitor C12 and the first end of the transient suppression diode TVS2 are respectively connected to the positive electrodes of the three speakers 400; pin 4 of the toggle switch K, the second end of the capacitor C10, the first end of the capacitor C11 and the first end of the transient suppression diode TVS1 are respectively connected to the negative electrodes of the three speakers 400.

[0089] Pin 1, pin 5, pin 6, pin 11, pin 12, pin 13, pin 14, pin 15, pin 16 of the fourth amplifier chip U4, the second end of capacitor C62, the second end of capacitor C63, the second end of capacitor C64, the second end of capacitor C66, the second end of capacitor C67, the second end of capacitor C68, the second end of capacitor C69, pin 9 and pin 10 of the toggle switch K, the second end of capacitor C11, the second end of capacitor C12, the second end of transient suppression diode TVS1 and the second end of transient suppression diode TVS2 are all grounded.

[0090] It should be noted that the fourth amplifier chip U4 proposed in this embodiment is illustrated by taking the 20-pin AW87565 chip as an example, and the 6th pin of the main control MCU 100 is the RST pin.

[0091] In this way, when the main control MCU 100 amplifies the sound signal through the fourth audio amplifier module 204, the amplified sound signal will be broadcast through three different speakers 400. When the developer determines the sound effect he wants, the fourth audio amplifier module 204 and the corresponding speaker 400 will be recorded for subsequent electronic product processing.

[0092] In this embodiment, refer to the attached Figure 6 The audio amplification module 200 includes at least one fifth audio amplification module 205. The present invention takes one fifth audio amplification module 205 as an example and also proposes a circuit structure of the fifth audio amplification module 205.

[0093] Specifically, the fifth audio amplification module 205 includes a fifth amplification chip U5, a resistor R84, a resistor R85, a resistor R86, a capacitor C82, a capacitor C83, a capacitor C84, a capacitor C85, a capacitor C86 and an inductor L80; it also includes a toggle switch K, a capacitor C10, a capacitor C11, a capacitor C12, a transient suppression diode TVS1 and a transient suppression diode TVS2 that constitute the conversion module 300; a resistor R80, a resistor R81, a resistor R82, a resistor R83, a capacitor C87 and a capacitor C88 that constitute the fifth filtering module 212; and a voltage stabilization chip U6, a capacitor C80 and a capacitor C81 that constitute the voltage stabilization module 213.

[0094] Pin 1 and Pin 2 of the fifth amplifier chip U5 are connected to Pin 4 of the main control MCU100, Pin 3 of the fifth amplifier chip U5 is connected to Pin 5 of the main control MCU100, Pin 6 of the fifth amplifier chip U5 is connected to Pin 7 of the main control MCU100, Pin 7 and Pin 8 of the fifth amplifier chip U5 are connected to Pin 8 of the main control MCU100, Pin 9 of the fifth amplifier chip U5 is connected to Pin 9 of the main control MCU100, Pin 10 of the fifth amplifier chip U5 is connected to Pin 10 of the main control MCU100, Pin 11 of the fifth amplifier chip U5 is connected to Pin 6 of the main control MCU100, and Pin 12 of the fifth amplifier chip U5 is connected to Pin 11 of the main control MCU100; Pin 31, Pin 32, Pin 33, Pin 34, and Pin 25 of the fifth amplifier chip U5 are all connected to the first end of capacitor C84, the first end of capacitor C85, and the first end of capacitor C86, and Pin 36 of the fifth amplifier chip U5 is connected to the second end of capacitor C84.

[0095] Pins 37, 38 and 39 of the fifth amplifier chip U5 are all connected to the first end of the inductor L80, and pin 40 of the fifth amplifier chip U5, the second end of the inductor L80, the first end of the capacitor C82 and the first end of the capacitor C83 are all connected to pin 1 of the main control MCU100; pins 41 and 42 of the fifth amplifier chip U5 are all connected to the first end of the capacitor C81 and pin 1 of the voltage stabilizing chip U6, pins 3, 4 and the first end of the capacitor C80 of the voltage stabilizing chip U6 are all connected to pin 1 of the main control chip 100, and pins 2 and 5 of the voltage stabilizing chip U6 are both grounded.

[0096] Pin 13 of the fifth amplifier chip U5 is connected to the first end of the resistor R84 , pin 14 of the fifth amplifier chip U5 is connected to the first end of the resistor R85 , and pin 15 of the fifth amplifier chip U5 is connected to the first end of the resistor R86 .

[0097] Pin 27 of the fifth amplifier chip U5 is connected to the first end of the resistor R83, pin 28 of the fifth amplifier chip U5 is connected to the first end of the resistor R82, and the second end of the resistor R82, the second end of the resistor R83 and the first end of the capacitor C88 are all connected to pin 2 of the toggle switch K;

[0098] Pin 29 of the fifth amplifier chip U5 is connected to the first end of the resistor R81, pin 30 of the fifth amplifier chip U5 is connected to the first end of the resistor R80, the second end of the resistor R80, the second end of the resistor R81 and the first end of the capacitor C87 are all connected to pin 1 of the toggle switch K; pin 5 of the toggle switch K is connected in series with resistor R6 and then connected to pin 12 of the main control MCU100, and pin 6 of the toggle switch K is connected in series with resistor R7 and then connected to pin 13 of the main control MCU100; pin 3 of the toggle switch K, the first end of the capacitor C10, the first end of the capacitor C12 and the first end of the transient suppression diode TVS2 are respectively connected to the positive electrodes of the three speakers 400; pin 4 of the toggle switch K, the second end of the capacitor C10, the first end of the capacitor C11 and the first end of the transient suppression diode TVS1 are respectively connected to the negative electrodes of the three speakers 400.

[0099] Pin 4, pin 5, pin 13, pin 14, pin 15, pin 16, pin 17, pin 18, pin 19, pin 20, pin 21, pin 22, pin 23, pin 24, pin 25, pin 26 of the fifth amplifier chip U5, the second end of capacitor C80, the second end of capacitor C81, the second end of capacitor C82, the second end of capacitor C83, the second end of capacitor C85, the second end of capacitor C86, the second end of capacitor C87, the second end of capacitor C88, the second end of resistor R84, the second end of resistor R85, the second end of resistor R86, pin 9 and pin 10 of the toggle switch K, the second end of capacitor C11, the second end of capacitor C12, the second end of transient suppression diode TVS1 and the second end of transient suppression diode TVS2 are all grounded.

[0100] It should be noted that the fifth amplifier chip U5 proposed in this embodiment is illustrated by the 42-pin AW88394 chip, and the voltage regulator chip U6 is illustrated by the 5-pin ET53333Y chip. In addition, the 7th pin of the main control MCU100 is the I2S_BCK pin, the 8th pin of the main control MCU100 is the I2S_WCK pin, the 9th pin of the main control MCU100 is the I2S_DATAI pin, the 10th pin of the main control MCU100 is the I2S_DATAO pin, and the 11th pin of the main control MCU100 is the I2S_INT pin.

[0101] In this way, when the main control MCU 100 amplifies the sound signal through the fifth audio amplifier module 205, the amplified sound signal will be broadcast through three different speakers 400. When the developer determines the sound effect he wants, the fifth audio amplifier module 205 and the corresponding speaker 400 will be recorded for subsequent electronic product processing.

[0102] The toggle switch K is any one of a 2P3T toggle switch, a 2P4T toggle switch and a 2P8T toggle switch, and the toggle switch K in this article is preferably a 2P3T toggle switch.

[0103] It should be noted that, in this embodiment, each of the first audio amplification module 201 , the second audio amplification module 202 , the third audio amplification module 203 , the fourth audio amplification module 204 and the fifth audio amplification module 205 shares a conversion module 300 .

[0104] However, in other embodiments, each of the first audio amplification module 201 , the second audio amplification module 202 , the third audio amplification module 203 , the fourth audio amplification module 204 and the fifth audio amplification module 205 can use one conversion module 300 , respectively.

[0105] It should be noted that the first audio amplification module 201 compares the effects of two input signal sources (one on and one off) through the first switch module 206, the second audio amplification module 202 compares the effects of two input signal sources (one on and one off) through the second switch module 208, and the third audio amplification module 203, the fourth audio amplification module 204 and the fifth audio amplification module 205 compare the effects of at least two input signal sources through built-in switch programs and switch devices, so that the same audio amplification module 200 can generate different sound frequencies through different input signal sources to obtain different sound effects.

[0106] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. An audio development board device, characterized in that: It includes a main control MCU, multiple audio amplification modules, a conversion module and multiple speakers; The output end of the main control MCU is connected to the input end of each of the audio amplification modules, the output end of each of the audio amplification modules is connected to the input end of the conversion module, and the output end of the conversion module is connected in parallel with a plurality of speakers.

2. The audio development board device according to claim 1, characterized in that: The audio amplification module includes at least one first audio amplification module, each of which includes a first amplification chip U1, a capacitor C1, a capacitor C2, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a resistor R1, a resistor R2, a resistor R4 and a resistor R5; Pin 1 of the first amplifier chip U1 is used to connect to the output end of the first switch module, and a capacitor C7 is connected between pins 3 and 19 of the first amplifier chip U1; pins 4 and 8 of the first amplifier chip U1, a first end of the capacitor C4, and a first end of the capacitor C5 are all connected to pin 1 of the main control MCU; Pins 12, 17 and 18 of the first amplifier chip U1 are all connected to the first end of the capacitor C6; A capacitor C3 is connected between pin 6 and pin 7 of the first amplifier chip U1, and pin 6 of the first amplifier chip U1 is connected in series with the resistor R1 and the capacitor C1 and then connected to pin 2 of the main control MCU, and pin 7 of the first amplifier chip U1 is connected in series with the resistor R2 and the capacitor C2 and then connected to pin 3 of the main control MCU; pin 13 of the first amplifier chip U1 is connected to the second input end of the conversion module, and pin 15 of the first amplifier chip U1 is connected to the first input end of the conversion module; Pin 14, pin 20, pin 21 of the first amplifier chip U1, a second end of the capacitor C4, a second end of the capacitor C5 and a second end of the capacitor C6 are all grounded.

3. The audio development board device according to claim 2, characterized in that: The audio amplification module includes at least one second audio amplification module, each of which includes a second amplification chip U2, a capacitor C20, a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a capacitor C25, a capacitor C26, a capacitor C27, a resistor R20 and a resistor R21; A capacitor C22 is connected between pin 1 and pin 2 of the second amplifier chip U2, and pin 1 of the second amplifier chip U2 is connected in series with the resistor R20 and the capacitor C20 and then connected to pin 2 of the main control MCU, and pin 2 of the second amplifier chip U2 is connected in series with the resistor R21 and the capacitor C21 and then connected to pin 3 of the main control MCU; Pin 3, pin 7, the first end of capacitor C23 and the first end of capacitor C24 of the second amplifier chip U2 are all connected to pin 1 of the main control MCU, and pin 4 of the second amplifier chip U2 is used to connect the output end of the second switch module; capacitor C25 is connected between pin 9 and pin 14 of the second amplifier chip U2; pin 5 and pin 6 of the second amplifier chip U2 are connected to the first end of the capacitor C26, and pin 13 of the second amplifier chip U2 is connected to the second end of the capacitor C26; Pin 8 of the second amplifier chip U2 is connected to the first input end of the conversion module, and pin 16 of the first amplifier chip U1 is connected to the second input end of the conversion module; pin 15 of the second amplifier chip U2 is connected to the first end of the capacitor C27; Pin 10, pin 11, pin 12 of the second amplifier chip U2, a second end of the capacitor C23, a second end of the capacitor C24 and a second end of the capacitor C27 are all grounded.

4. The audio development board device according to claim 1, characterized in that: The audio amplification modules each include at least one third audio amplification module, and each of the third audio amplification modules includes a third amplification chip U3, a capacitor C40, a capacitor C41, a capacitor C42, a capacitor C43, a capacitor C44, a capacitor C45, and a capacitor C46; Pin 1 of the third amplifier chip U3 is connected to the first input end of the conversion module, and pin 9 of the third amplifier chip U3 is connected to the second input end of the conversion module; pins 2 and 6 of the third amplifier chip U3 are connected to the first end of the capacitor C45 and the first end of the capacitor C46; pins 3 and 7 of the third amplifier chip U3 are connected to the first end of the capacitor C44, and pin 4 of the third amplifier chip U3 is connected to the second end of the capacitor C44; Pin 14 of the third amplifier chip U3, the first end of the capacitor C42, and the first end of the capacitor C43 are all connected to pin 1 of the main control MCU; pin 15 of the third amplifier chip U3 is connected in series with resistor R41 and then connected to pin 3 of the main control MCU, and pin 16 of the third amplifier chip U3 is connected in series with resistor R40 and then connected to pin 2 of the main control MCU; pin 17 of the third amplifier chip U3 is connected to pin 4 of the main control MCU, and pin 18 of the third amplifier chip U3 is connected to pin 5 of the main control MCU; Pins 5, 8, 10, 11, 12, and 13 of the third amplifier chip U3, a second end of capacitor C42, a second end of capacitor C43, a second end of capacitor C45, and a second end of capacitor C46 are all grounded.

5. The audio development board device according to claim 4, characterized in that: The audio amplification modules each include at least one fourth audio amplification module, and each of the fourth audio amplification modules includes a fourth amplification chip U4, a capacitor C60, a capacitor C61, a capacitor C62, a capacitor C63, a capacitor C64, a capacitor C65, a capacitor C66, a capacitor C67 and an inductor L60; Pin 2 of the fourth amplifier chip U4 is connected to the second input terminal of the conversion module, and pin 9 of the third amplifier chip U3 is connected to the first input terminal of the conversion module; Pin 4 of the fourth amplifier chip U4 is connected to pin 6 of the main control MCU, pin 9 of the fourth amplifier chip U4 is connected to pin 5 of the main control MCU, and pin 10 of the fourth amplifier chip U4 is connected to pin 4 of the main control MCU; pin 7 of the fourth amplifier chip U4 is connected in series with the capacitor C60 and then connected to pin 3 of the main control MCU, and pin 8 of the fourth amplifier chip U4 is connected in series with the capacitor C61 and then connected to pin 2 of the main control MCU; Pin 3 of the fourth amplifier chip U4, the first end of the capacitor C62, the first end of the capacitor C63, the first end of the capacitor C64 and the first end of the inductor L60 are all connected to pin 1 of the main control MCU; pin 18 of the fourth amplifier chip U4 is connected to the second end of the inductor L60; Pin 17 of the fourth amplifier chip U4 is connected to the first end of the capacitor C65, and pin 19 of the fourth amplifier chip U4 is connected to the second end of the capacitor C65, the first end of the capacitor C66, and the first end of the capacitor C67; Pin 1, pin 5, pin 6, pin 11, pin 12, pin 13, pin 14, pin 15, pin 16, the second end of capacitor C62, the second end of capacitor C63, the second end of capacitor C64, the second end of capacitor C66 and the second end of capacitor C67 of the fourth amplifier chip U4 are all grounded.

6. The audio development board device according to claim 1, characterized in that: The audio amplification module includes at least one fifth audio amplification module, each of which includes a fifth amplification chip U5, a resistor R84, a resistor R85, a resistor R86, a capacitor C82, a capacitor C83, a capacitor C84, a capacitor C85, a capacitor C86 and an inductor L80; Pin 1 and Pin 2 of the fifth amplifier chip U5 are connected to Pin 4 of the main control MCU, Pin 3 of the fifth amplifier chip U5 is connected to Pin 5 of the main control MCU, Pin 6 of the fifth amplifier chip U5 is connected to Pin 7 of the main control MCU, Pin 7 and Pin 8 of the fifth amplifier chip U5 are connected to Pin 8 of the main control MCU, Pin 9 of the fifth amplifier chip U5 is connected to Pin 9 of the main control MCU, Pin 10 of the fifth amplifier chip U5 is connected to Pin 10 of the main control MCU, Pin 11 of the fifth amplifier chip U5 is connected to Pin 6 of the main control MCU, and Pin 12 of the fifth amplifier chip U5 is connected to Pin 11 of the main control MCU; Pins 27 and 28 of the fifth amplifier chip U5 are both connected to the second input terminal of the conversion module, and pins 29 and 30 of the fifth amplifier chip U5 are both connected to the first input terminal of the conversion module; Pins 31, 32, 33, 34 and 25 of the fifth amplifier chip U5 are connected to the first end of the capacitor C84, the first end of the capacitor C85 and the first end of the capacitor C86, and pin 36 of the fifth amplifier chip U5 is connected to the second end of the capacitor C84; Pins 37, 38 and 39 of the fifth amplifier chip U5 are all connected to the first end of the inductor L80, and pin 40 of the fifth amplifier chip U5, the second end of the inductor L80, the first end of the capacitor C82 and the first end of the capacitor C83 are all connected to pin 1 of the main control MCU; pins 41 and 42 of the fifth amplifier chip U5 are both used to connect to the output end of the voltage stabilizing unit; Pin 13 of the fifth amplifier chip U5 is connected to the first end of the resistor R84, pin 14 of the fifth amplifier chip U5 is connected to the first end of the resistor R85, and pin 15 of the fifth amplifier chip U5 is connected to the first end of the resistor R86; Pin 4, pin 5, pin 13, pin 14, pin 15, pin 16, pin 17, pin 18, pin 19, pin 20, pin 21, pin 22, pin 23, pin 24, pin 25, pin 26, the second end of capacitor C82, the second end of capacitor C83, the second end of capacitor C85, the second end of capacitor C86, the second end of resistor R84, the second end of resistor R85 and the second end of resistor R86 of the fifth amplifier chip U5 are all grounded.

7. The audio development board device according to claim 1, characterized in that: The conversion module includes a toggle switch K, a capacitor C10, a capacitor C11, a capacitor C12, a transient suppression diode TVS1 and a transient suppression diode TVS2; Pins 1 and 2 of the toggle switch K are connected to the output end of each of the audio amplifier modules, and pin 3 of the toggle switch K, the first end of the capacitor C10, the first end of the capacitor C12, and the first end of the transient suppression diode TVS2 are all connected to the positive electrodes of multiple speakers; pin 4 of the toggle switch K, the second end of the capacitor C10, the first end of the capacitor C11, and the first end of the transient suppression diode TVS1 are all connected to the negative electrodes of the multiple speakers; Pin 5 of the toggle switch K is connected to pin 12 of the main control MCU, and pin 6 of the toggle switch K is connected to pin 13 of the main control MCU; Pin 9, pin 10 of the toggle switch K, the second end of the capacitor C11, the second end of the capacitor C12, the second end of the transient suppression diode TVS1 and the second end of the transient suppression diode TVS2 are all grounded.

8. The audio development board device according to claim 7, characterized in that: The toggle switch K is any one of a 2P3T toggle switch, a 2P4T toggle switch and a 2P8T toggle switch.

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