Multilayer PCB (Printed Circuit Board) superposition connection structure

Abstract

The utility model discloses a multilayer PCB superposition connection structure, which comprises a first PCB, a second PCB, a switching circuit board and an external mainboard, a first connector is arranged on the back surface of the first PCB, a second connector is arranged on the front surface of the second PCB, the first connector is connected with the second connector, and a main connector is arranged on one side surface, far away from the first connector, of the first PCB; the switching circuit board is respectively connected with the main connector and the external mainboard; the second PCB is provided with a copper leakage area, and the copper leakage area is provided with a metal ring. Therefore, the first PCB and the second PCB are in a stacked connection state. Therefore, two sets of PCB connecting structures are not needed to be connected with an external mainboard, so that the length and width space of the corresponding camera module is reduced, and the camera module is suitable for the camera module of which the length and width size of the whole machine design space is limited but the height is not limited; and meanwhile, an antistatic effect is achieved through the metal ring.

Description

Technical Field

[0001] The utility model relates to the technical field of camera modules, in particular to a multi-layer PCB stacking connection structure. Background Art

[0002] In the field of camera module manufacturing, some camera modules require multiple PCB boards, so the space they occupy is relatively large. For camera modules with limited design space, such as endoscope cameras used in medical applications, detection cameras used in narrow spaces, and vehicle-mounted cameras, setting up multiple PCB boards will obviously increase the length and width of the camera module. Therefore, it is necessary to propose a multi-layer PCB stacking connection structure to reduce the length and width of the design space of the camera module. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies in the prior art and provide a multi-layer PCB stacking connection structure, thereby reducing the length and width of the camera module.

[0004] The purpose of this utility model is achieved through the following technical solutions:

[0005] A multi-layer PCB stacking connection structure includes: a first PCB, a second PCB, a transfer circuit board and an external main board, wherein a first connector is arranged on a side surface of the first PCB facing the second PCB, a second connector is arranged on a side surface of the second PCB facing the first PCB, the first connector is connected to the second connector so that the first PCB and the second PCB are in a stacked connection structure, a main connector is installed on a side surface of the first PCB away from the first connector; the transfer circuit board is respectively connected to the main connector and the external main board; a copper leakage area is arranged on the second PCB, and a metal ring is installed on the copper leakage area.

[0006] In one of the embodiments, four copper leakage areas are provided, and four metal rings are provided, and the four metal rings are respectively provided on the copper leakage areas.

[0007] In one embodiment, the four metal rings are respectively disposed on four corner ends of the second PCB.

[0008] In one embodiment, a first mounting hole is formed on the metal ring, and a second mounting hole is formed on the second PCB, and the first mounting hole and the second mounting hole are connected via a screw connection.

[0009] In one embodiment, the metal ring is made of copper.

[0010] In one embodiment, the thickness of the metal ring between the second PCB and the first PCB is equal to the height of the first connector and the second connector after being connected and matched.

[0011] In one of the embodiments, the transfer circuit board is a transfer FPC.

[0012] In one embodiment, the first connector is a male socket.

[0013] In one embodiment, the second connector is a female socket.

[0014] In one of the embodiments, a motherboard connector is installed on the external motherboard.

[0015] Compared with the prior art, the utility model has at least the following advantages:

[0016] The multi-layer PCB stacking connection structure of the utility model is provided with a first PCB, a second PCB, a transfer circuit board and an external main board, and the first PCB and the second PCB are stacked and connected through a first connector on the first PCB and a second connector on the second PCB, and the main connector on the first PCB and the external main board are connected through the transfer circuit board, so as to achieve connectivity. In this way, there is no need for two sets of PCB connection structures to connect with the external main board, so that the corresponding camera module is reduced in length and width, so that it is suitable for camera modules with limited length and width of the overall design space, but not limited in height; at the same time, the ground signal is connected through a metal ring, so as to effectively improve the anti-static ability of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0018] Figure 1 It is a structural schematic diagram of a multi-layer PCB stacking connection structure in one embodiment of the utility model. DETAILED DESCRIPTION

[0019] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0020] See also Figure 1As shown, a multi-layer PCB stacking connection structure 10 includes: a first PCB 100, a second PCB 200, a transfer circuit board 300 and an external main board 400, a first connector 110 is arranged on a side surface of the first PCB 100 facing the second PCB 200, a second connector 210 is arranged on a side surface of the second PCB 200 facing the first PCB 100, the first connector 110 is connected with the second connector 210, so that the first PCB 100 and the second PCB 200 are in a stacked connection structure, a main connector 120 is installed on a side surface of the first PCB 100 away from the first connector 110; the transfer circuit board 300 is respectively connected to the main connector 120 and the external main board 400; a copper leakage area is arranged on the second PCB 200, and a metal ring 500 is installed on the copper leakage area.

[0021] It should be noted that for endoscope cameras used in medical applications, detection cameras used in narrow spaces, and vehicle-mounted cameras, such camera modules are subject to space limitations in the use scenarios, resulting in the length and width of the overall design space being limited, but the height being unrestricted. Therefore, when the camera module needs to use multiple PCB boards, the multiple PCB boards laid flat will increase the length and width of the camera module, and each PCB board needs to be matched with a corresponding adapter circuit board, which will further increase the length and width of the camera module. In the present invention, taking two PCBs as an example, a first connector 110 is arranged on a side of the first PCB 100 facing the second PCB 200, that is, on the back of the first PCB 100, and a second connector 210 is arranged on a side of the second PCB 200 facing the first PCB 100, that is, on the front of the second PCB 200. In this way, the first PCB 100 and the second PCB 200 are connected through the first connector 110 and the second connector 210, and the first PCB 100 and the second PCB 200 are in a stacked connection state. In this way, there is no need for two sets of PCB connection structures to connect with the external main board 400, so that the corresponding camera module is reduced in length and width, so that it is suitable for the camera module with limited length and width of the overall design space but unlimited height; at the same time, the ground signal is connected through the metal ring 500, so as to effectively improve the anti-static ability of the camera module. When there are more than two PCBs, the superimposed connection structure is analogous to the two-layer superimposed connection structure in this embodiment. Furthermore, the first connector 110 is a male socket, and the second connector 210 is a female socket, so that the first connector 110 and the second connector 210 can be pressed down and plugged together.

[0022] Furthermore, there are four copper leakage areas, and four metal rings 500 are provided, and the four metal rings 500 are respectively provided on the copper leakage areas. In this way, the antistatic ability of the camera module can be further improved.

[0023] Preferably, four metal rings 500 are respectively disposed on four corner ends of the second PCB 200 .

[0024] In one embodiment, a first mounting hole is provided on the metal ring 500, and a second mounting hole is provided on the second PCB 200, and the first mounting hole and the second mounting hole are connected by a screw connection. The screw connection is used to lock the second PCB 200 and the metal ring 500 to ensure the structural stability between the PCB and the metal ring 500. A threaded structure is provided on the first mounting hole, for example, the screw connection is a screw, and the second PCB 200 and the metal ring 500 are locked by the screw.

[0025] Preferably, the metal ring 500 is made of copper, which will not rust and has good thermal and electrical conductivity, thus improving the thermal conductivity of the overall structure.

[0026] In one embodiment, the thickness of the metal ring 500 between the second PCB 200 and the first PCB 100 is equal to the height of the first connector 110 and the second connector 210 after being connected and matched. In this way, the first PCB 100 can be supported by the metal ring 500 to prevent certain parts of the first PCB 100 from collapsing, and the connection between the first connector 110 and the second connector 210 will not be affected, ensuring that the first PCB 100 and the second PCB 200 can be properly matched and plugged, and will not be damaged due to excessive squeezing due to external force.

[0027] In one embodiment, the transfer circuit board 300 is a transfer FPC. The transfer FPC is a flexible circuit board, which has the advantages of being bendable, windable and foldable. Therefore, when the main connector 120 and the external main board 400 are connected by the transfer FPC, the FPC can be bent and folded, so that the space occupied by the overall structure in length and width can be further reduced. The external main board 400 is equipped with a main board connector 410, that is, the transfer FPC is respectively connected to the main connector 120 and the main board connector 410 on the first PCB 100 to achieve communication, thereby controlling the operation of the camera module. In this way, there is no need for two PCBs to be connected to the external main board 400 through their respective connectors and their respective transfer circuit boards; thereby avoiding the need for the external main board 400 to have two sets of communication systems and software systems for the control module PCB, which simplifies the communication and software design, especially for the case of more layers of PCB.

[0028] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A multi-layer PCB stacking connection structure, characterized in that: include: A first PCB, a second PCB, a transfer circuit board and an external main board, a first connector is arranged on a side of the first PCB facing the second PCB, a second connector is arranged on a side of the second PCB facing the first PCB, the first connector is connected to the second connector so that the first PCB and the second PCB are in a stacked connection structure, a main connector is installed on a side of the first PCB away from the first connector; the transfer circuit board is respectively connected to the main connector and the external main board; a copper leakage area is arranged on the second PCB, and a metal ring is installed on the copper leakage area.

2. The multi-layer PCB stacking connection structure according to claim 1, characterized in that: There are four copper leakage areas, and there are four metal rings. The four metal rings are respectively and correspondingly arranged on the copper leakage areas.

3. The multi-layer PCB stacking connection structure according to claim 2, characterized in that: The four metal rings are respectively arranged on the four corner ends of the second PCB.

4. The multi-layer PCB stacking connection structure according to claim 3, characterized in that: The metal ring is provided with a first mounting hole, the second PCB is provided with a second mounting hole, and the first mounting hole and the second mounting hole are connected via a screw connection.

5. The multi-layer PCB stacking connection structure according to claim 4, characterized in that: The metal ring is made of copper.

6. The multi-layer PCB stacking connection structure according to any one of claims 1 to 5, characterized in that: The thickness of the metal ring between the second PCB and the first PCB is equal to the height of the first connector and the second connector after they are connected and matched.

7. The multi-layer PCB stacking connection structure according to any one of claims 1 to 5, characterized in that: The transfer circuit board is a transfer FPC.

8. The multi-layer PCB stacking connection structure according to any one of claims 1 to 5, characterized in that: The first connector is a male socket.

9. The multi-layer PCB stacking connection structure according to claim 8, characterized in that: The second connector is a female socket.

10. The multi-layer PCB stacking connection structure according to claim 1, characterized in that: A mainboard connector is installed on the external mainboard.

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