Shell and electronic equipment

Abstract

The embodiment of the utility model provides a shell and electronic equipment, and belongs to the technical field of electronic equipment, the shell comprises a side frame and a rear cover, the side frame and the rear cover define a containing cavity, the inner surface of the frame body wall of the side frame is provided with an edge folding structure protruding towards the interior of the containing cavity, and the edge folding structure is arranged in the circumferential direction of the frame body wall. When the shell is formed, the part of the base material used for forming the folded edge structure can play a role in reinforcing and positioning the part of the base material used for forming the frame body wall, namely, the part of the base material plays a role of a mold skirt edge structure in the related technology. When the shell is formed, a skirt edge structure can be formed on the inner side of the frame body wall base material, the skirt edge structure plays a role in reinforcing and positioning the frame body wall base material in the injection molding process, and the folded edge structure is reserved on the inner side of the finally formed frame body wall. According to the shell forming method, the skirt structure in the shell forming process is not completely removed or not removed, less waste is removed, skirt waste is reduced, the utilization rate of shell forming base materials is increased, CNC working hours and time are shortened, and the manufacturing cost of the shell is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to a housing and an electronic equipment. Background Art

[0002] With the continuous development of science and technology, electronic devices have also developed rapidly. Many electronic devices, such as tablets and smart phones, have become necessities in people's daily lives.

[0003] The electronic device includes a housing and a display screen. The housing can be used as the main load-bearing structural member of the electronic device. The housing can have a housing cavity inside for accommodating various structural components of the electronic device. The display screen is usually mounted on one side of the housing, and the display screen and the housing can enclose the above-mentioned housing cavity. The display screen is used to display images, text, videos, etc., and the display screen can also provide an interactive interface for users. With the widespread application of universal mobile communication technology (long term evolution, referred to as LTE), in order to realize the LTE communication function of electronic devices, the housing is usually made of metal or metal alloy, and a gap is opened on the side frame of the housing. The side frame is divided into multiple antenna radiators through the gap to realize the LTE communication antenna function. The housing structure and the side frame gap are usually processed by CNC machine tools (also known as CNC milling machines) (computer numerical control, referred to as CNC), and then plastic is injected into the gap by nano injection molding.

[0004] However, the above-mentioned shell has the problems of low utilization rate of the molding base material and high cost. Utility Model Content

[0005] The embodiments of the present application provide a housing and an electronic device, which improve the material utilization rate of the housing molding substrate and reduce the manufacturing and processing cost of the housing.

[0006] A first aspect of an embodiment of the present application provides a shell, including a back cover and a side frame, wherein the side frame is arranged on one side of the back cover, and the side frame and the back cover form a receiving cavity.

[0007] The inner surface of the frame wall of the side frame has a folding structure, one end of the folding structure is fixed on the frame wall, and the other end of the folding structure protrudes toward the accommodating cavity. That is, the folding structure is protrudingly arranged on the inner surface of the frame wall, and the folding structure is located on the inner side of the frame wall and is arranged around the circumference of the frame wall. During the molding process of the shell, the part of the base material used to form the folding structure can play a role in strengthening the positioning of the part of the base material used to form the frame wall, that is, it plays the role of the mold skirt structure in the related art. For example, when the shell is formed, a skirt structure can be formed on the inner side of the frame wall substrate, and the skirt structure surrounds the circumferential arrangement of the frame wall substrate, and then a gap and other structural features are formed on the frame wall substrate, and the frame wall substrate is separated by the gap and formed into a plurality of parts, and the skirt structure can be connected, and the skirt structure can play a role in strengthening the positioning of the frame wall substrate during the injection molding process, improve the strength of the frame wall substrate, reduce or avoid the problem of deformation of the frame wall substrate, and then the frame wall substrate and the skirt structure are processed with the shape structural features, so that the frame wall substrate forms the frame wall, and the skirt structure forms the folding structure. That is, the skirt structure in the shell forming process is not completely removed or not removed, so that the inner surface of the frame wall of the side frame formed finally has a folding structure, and compared with the related art, it is not necessary to remove the mold skirt structure by CNC, and the waste material is less removed, and the generation of skirt waste is reduced, which effectively improves the utilization rate of the shell forming substrate and reduces the manufacturing and processing cost of the shell. And it can also reduce the number of times and working hours of CNC processing, which is also conducive to reducing the manufacturing and processing cost of the shell.

[0008] In addition, the folding structure on the inner surface of the frame wall can ensure the strength of the frame wall base material during the molding process to reduce or avoid deformation of the frame wall during the molding process and improve the yield rate of the finished product, and it is also beneficial to improve the overall strength of the shell after molding.

[0009] The frame wall, the folding edge structure and the back cover are an integrated structural part. That is, the frame wall, the folding edge structure and the back cover can be an integral component, such as a whole shell substrate, which can be formed into an integrated frame wall, folding edge structure and back cover by stamping, bending, roughening and CNC processing, etc., which is conducive to improving the strength of the frame wall, folding edge structure and back cover during the processing and forming process, further reducing or avoiding deformation and other problems during the forming process, and improving the finished product yield of the shell.

[0010] Furthermore, the frame wall, the folded edge structure and the back cover are an integrated structural member, that is, the side frame and the back cover form an integrated structure, which is beneficial to improving the connection strength between the side frame and the back cover and further improving the strength of the entire shell.

[0011] In one possible implementation, a first gap is provided on the frame wall, a second gap is provided on the folded edge structure, and a third gap is provided between part of the frame wall and the back cover. The third gap, the first gap, and the second gap are connected in sequence. The first gap and the second gap separate part of the frame wall into multiple antenna radiators. The antenna radiators can be used to realize communication functions to meet the communication needs of electronic equipment.

[0012] The shell also includes an injection molding structure, and part of the injection molding structure is located between at least part of the folding structure and part of the back cover. The part of the injection molding structure can support and strengthen the folding structure, which is beneficial to improving the strength of the shell.

[0013] The injection molding structure fills the first gap, the second gap and the third gap, and plays a role in isolating each antenna radiator and the antenna radiator and the back cover.

[0014] In a possible implementation, the second gap divides the hem structure into a plurality of sub-hem bodies, and the plurality of sub-hem bodies are sequentially arranged around the inner side of the frame wall, with a second gap between ends of two adjacent sub-hem bodies.

[0015] At least part of the ends of the sub-folding bodies have a reinforcing portion protruding toward the accommodating cavity. The reinforcing portion can improve the strength of the ends of the sub-folding bodies, so that the ends of the sub-folding bodies on at least one side of the second gap have the reinforcing portion, which can improve the strength of the folding structure at the second gap position, and thus better improve the strength of the side frame, which is more conducive to reducing or avoiding the problem of deformation of the frame wall caused by the impact generated by injection molding in the second gap during the injection molding process.

[0016] In a possible implementation, the inner surface of the frame wall does not have a convex reinforcing rib connected to the back cover. For example, the molded substrate of the shell can be formed into a side frame substrate and a back cover substrate by stamping, and the bent part of the side frame substrate forms a skirt structure by roughening and bending, and the unbent part of the side frame substrate forms a frame wall substrate. Compared with the related art in which the frame wall substrate and the back cover substrate are formed by CNC processing, the inner surface of the side frame substrate formed by stamping can be a flat surface, which means that the inner surface of the frame wall substrate is a flat surface, and there will be no convex reinforcing ribs connected to the back cover substrate on the inner surface of the frame wall substrate. In the finally formed shell, there is no convex reinforcing rib connected to the back cover on the inner surface of the frame wall, which simplifies the structural design, the molding method is simple, and has a low manufacturing and processing cost.

[0017] In a possible implementation, the frame wall includes a main body and an extension, the main body is connected to the back cover, the extension is located inside the main body, and the inner surface of the extension forms the inner surface of the frame wall. For example, in the process of shell molding, the side frame substrate and the back cover substrate can be formed by stamping, and then the side frame substrate is processed by roughening, so that the side frame substrate can include a main body substrate and an extension substrate, and the extension substrate is located inside the main body substrate. That is, part of the side frame substrate is formed into the main body substrate by roughening, and part of the side frame substrate is extended to the inside of the main body substrate under the roughening effect to form the extension substrate, thereby increasing the overall thickness of the side frame substrate, so that the thickness of the side frame substrate can be greater than the thickness of the back cover substrate. Then, part of the side frame substrate is formed into a frame wall substrate, that is, the frame wall substrate includes part of the main body substrate and the extension part substrate. The frame wall substrate is used to form the frame wall. The main body substrate and the extension part substrate respectively form the main body and the extension part of the frame wall, so that in the finally formed shell, the frame wall can include the main body and the extension part, the extension part is located on the inner side of the main body, and the folding structure is located on the extension part.

[0018] There is a slit structure between the extension part and the side of the back cover facing the accommodating cavity. Since the extension part substrate is formed by extending the main body substrate by means of roughening, there may be no direct contact connection relationship between the extension part substrate and the back cover substrate, so that there is a slit structure between the extension part substrate and the back cover substrate, and in the final formed shell, there is a slit structure between the extension part of the frame wall and the side of the back cover facing the accommodating cavity. A high-strength frame wall structure can be obtained by a simpler molding method, which significantly reduces the manufacturing cost while meeting the strength requirements.

[0019] In a possible implementation, the maximum thickness of the frame wall is greater than the maximum thickness of the back cover. That is, the frame wall has a larger wall thickness and a stronger strength. On the one hand, it ensures that the strength is strong during the shell molding process to avoid deformation and improve the yield of the finished product. On the other hand, it can effectively improve the overall strength of the shell after molding and improve the reliability of the shell.

[0020] In a possible implementation, the frame wall and the folding structure are formed by stamping, bending, roughing and CNC processing. For example, after roughing to increase the wall thickness of the side frame substrate, the part of the side frame substrate that is away from the rear cover substrate can be bent, and the bent side frame substrate is further roughened, such as making the bending angle between the part of the bent side frame substrate and the part of the side frame substrate that is not bent to be about 90°, the bent part of the side frame substrate can form a skirt structure, and the unbent part of the side frame substrate can form a frame wall substrate, so that a skirt structure protruding toward the accommodating cavity is formed on the inner surface of the frame wall substrate. After that, the first gap, the second gap and the third gap can be formed on the frame wall substrate, the skirt structure and the rear cover substrate by CNC. After the above gaps are injection molded, the rear cover substrate, the frame wall substrate and the skirt structure can be processed by CNC to obtain the appearance structure features, etc., to obtain the rear cover, the frame wall and the folding structure.

[0021] Compared with the related art that mainly uses CNC processing to form the frame wall substrate or mold skirt structure of the side frame, the number of times and working hours of CNC processing are greatly reduced, and the overall strength of the shell is effectively improved. While ensuring the high strength performance of the shell during and after molding, the manufacturing and processing costs are significantly reduced.

[0022] In a possible implementation, a portion of the injection molding structure is located on the side of at least a portion of the folding structure facing the accommodating cavity, and the frame wall, the portion of the injection molding structure, and the folding structure can together form a step structure, and the step structure is used to support and limit the display screen of the electronic device. The side of the partial injection molding structure facing away from the back cover is flush with the side of the folding structure facing away from the back cover to form a support surface of the step structure, and the display screen can be adhered and fixed on the support surface to achieve assembly of the display screen and the shell. The portion of the frame wall that is higher than the folding structure in the thickness direction can be used to surround the periphery of the display screen, limit and position the display screen, improve the assembly firmness of the display screen, and facilitate the precise assembly of the display screen.

[0023] In a possible implementation, the molding material of the folded edge structure, the back cover and the frame wall includes a metal material or an alloy material.

[0024] A second aspect of an embodiment of the present application provides an electronic device, comprising a display screen and any of the above-mentioned shells, wherein the display screen and the back cover of the shell are respectively arranged on opposite sides of a side frame of the shell.

[0025] In a possible implementation, the display screen is attached to a supporting surface of the step structure of the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0027] Figure 2 for Figure 1 A schematic diagram of a partial disassembled structure of an electronic device;

[0028] Figure 3 A schematic diagram of a shell substrate and a mold skirt structure in a shell molding process in the related art;

[0029] Figure 4 A schematic diagram of the structure of a housing provided in an embodiment of the present application;

[0030] Figure 5a for Figure 4 A schematic diagram of the structure of the side frame and the back cover of the shell;

[0031] Figure 5b for Figure 4 A front view schematic diagram of the assembly of the side frame and the rear cover of the housing;

[0032] Figure 6a for Figure 5a A partial enlarged schematic diagram of part A;

[0033] Figure 6b for Figure 5b A partial enlarged schematic diagram of part B in the middle;

[0034] Figure 7 for Figure 4 A partial enlarged schematic diagram of part C in the middle;

[0035] Figure 8 for Figure 4 A schematic cross-sectional view of the middle shell;

[0036] Fig. 9 for Figure 5b The partial enlarged schematic diagram of part D in the middle;

[0037] Fig.10 for Figure 8 A schematic front view of the cross-sectional structure of the middle side frame;

[0038] Fig.11 for Figure 4 A schematic diagram of a process flow of a molding method for a middle shell;

[0039] Fig.11a It is a front view of the formed substrate after stamping;

[0040] Fig.11b for Fig.11a A schematic diagram of the partial structure of the molded substrate;

[0041] Fig.11c It is a schematic diagram of the structure of the formed substrate after roughening treatment;

[0042] Fig.11d for Fig.11c A schematic diagram of the partial structure of the molded substrate;

[0043] Fig.11e A schematic diagram of the structure of the formed substrate after the skirt structure is formed;

[0044] Fig.11f for Fig.11e A schematic diagram of the partial structure of the molded substrate;

[0045] Figure 11g It is a schematic diagram of the structure of the formed substrate after the gap is formed;

[0046] Fig.11h A schematic diagram of the positioning of a preform in a mold during the injection molding process;

[0047] Fig.11i This is a schematic diagram of the structure of the preform after injection molding;

[0048] Fig.11j for Figure 4 Another enlarged schematic diagram of the local structure of the middle shell.

[0049] Description of reference numerals:

[0050] 100- electronic equipment;

[0051] 101- housing;

[0052] 10- side frame;

[0053] 11-frame wall; 11a-inner surface; 11b-outer surface;

[0054] 111-first slit; 112-main body; 113-extension portion; 114-slit structure; 115-first opening; 116-second opening; 117-third opening;

[0055] 12-Folding structure;

[0056] 121 - second gap; 123 - reinforcement portion;

[0057] 13- step structure; 131- support surface;

[0058] 20-rear cover; 21-third gap; 22-installation slot;

[0059] 30-injection molding structure;

[0060] 102-display screen; 103-accommodation cavity. DETAILED DESCRIPTION

[0061] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0062] An embodiment of the present application provides an electronic device, which may include but is not limited to a mobile phone, a tablet personal computer, a laptop computer (PC), a camera, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device, a virtual reality (VR) device (such as VR glasses, VR helmets, etc.), an augmented reality (AR) device (such as AR glasses, AR helmets, etc.), a vehicle-mounted device, etc.

[0063] The electronic device may be a foldable electronic device, or the electronic device may be a non-foldable electronic device. In the embodiment of the present application, an electronic device that is a non-foldable tablet computer is taken as an example for description.

[0064] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application.

[0065] See also Figure 1 As shown, the electronic device 100 includes a housing 101 and a display screen 102. The housing 101 can support and assemble the display screen 102, and the display screen 102 can be arranged on one side of the housing 101. The display screen 102 is used to display images, texts, videos, etc., and can also provide an interactive interface for users. The side of the display screen 102 facing away from the housing 101 can be used as the display surface of the electronic device 100.

[0066] The display screen 102 may include, but is not limited to, an organic light-emitting diode (OLED) display screen, a micro organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a light-emitting diode (LED) display screen, a mini organic light-emitting diode (Mini LED) display screen, a micro organic light-emitting diode (Micro LED) display screen, a quantum dot light emitting diode (QLED) display screen, a liquid crystal display (LCD), etc.

[0067] Figure 2 for Figure 1 Schematic diagram of the partial structure disassembly of the electronic device.

[0068] See also Figure 2 As shown, the housing 101 may include a back cover 20 and a side frame 10. For example, the back cover 20 may be a rectangular plate-shaped structure, and the back cover 20 may have an inner surface and an outer surface facing each other. The side frame 10 may be a frame structure, and the side frame 10 may be located on the inner surface side of the back cover 20. The side frame 10 and the back cover 20 may together form a receiving cavity 103, and the receiving cavity 103 may be used to assemble and receive various structural components of the electronic device 100.

[0069] In the embodiments of the present application, for the convenience of description, Figure 1 and Figure 2 As shown in , the width direction of the rear cover 20 is the x direction, the length direction of the rear cover 20 is the y direction, and the thickness direction of the rear cover 20 is the z direction. The inner surface and the outer surface of the rear cover 20 can be respectively located on two opposite sides of the rear cover 20 along the thickness direction. It can be understood that the length, width, and thickness in the embodiment of the present application are only for the convenience of description and do not mean any limitation on the size. For example, the length can be greater than, equal to, or less than the width.

[0070] Of course, in some other examples, the outer contour of the back cover 20 may also be a regular or irregular shape such as a square, a circle, an oval, a rounded rectangle, etc. The outer contour of the side frame 10 may match the outer contour of the back cover 20 .

[0071] The display screen 102 can be set on the side frame 10, and the display screen 102 and the back cover 20 can be respectively located on opposite sides of the side frame 10 along the thickness direction (z direction), and the display screen 102 can close the accommodating cavity 103 of the shell 101, that is, the shell 101, the side frame 10 and the display screen 102 together form a closed accommodating cavity 103, so as to protect the various structural components located in the accommodating cavity 103 and enhance the aesthetics of the electronic device 100.

[0072] The back cover 20 may serve as an appearance cover of the back side of the electronic device 100 , and the outer surface (the side facing away from the display screen) of the back cover 20 may form an appearance surface of the electronic device 100 .

[0073] The electronic device 100 may also include a main circuit board, a battery, a charging management module, a power management module, etc. (not shown in the figure), and the main circuit board, the battery, the charging management module, the power management module, etc. may be fixed in the above-mentioned accommodating cavity 103.

[0074] The main circuit board can be used to realize the electrical connection or electrical insulation between various electronic devices in the electronic device 100. Exemplarily, the main circuit board may include a processor, and the processor may include an application processor (application processor, referred to as AP), a modem processor, a graphics processor (graphics processing unit, referred to as GPU), an image signal processor (image signal processor, referred to as ISP), a controller, a video codec, a digital signal processor (digital signal processor, referred to as DSP), a baseband processor, a display processing unit (display process unit, referred to as DPU), and / or a neural network processor (neural-network processing unit, referred to as NPU), etc. Among them, the controller can be the nerve center and command center of the electronic device 100. The controller can generate an operation control signal according to the instruction operation code and the timing signal to complete the control of fetching and executing instructions. A memory can also be set in the processor for storing instructions and data.

[0075] The processor may include one or more interfaces. The interface may be used to connect a charger to charge the electronic device 100 . The interface may also be used to implement data transmission between the electronic device 100 and an external device. For example, the interface may be used to connect headphones, a projection device, and the like.

[0076] The charging management module is used to receive charging input from a charger. The charger can be a wireless charger or a wired charger. In some wired charging examples, the charging management module can receive charging input from the wired charger through an interface. In some wireless charging embodiments, the charging management module can receive wireless charging input through a wireless charging coil of the electronic device 100. The charging management module can charge the battery and can also power the electronic device 100 through the power management module.

[0077] The power management module is used to connect the battery, the charging management module and the processor. The power management module receives input from the battery and / or the charging management module to power the processor, the memory, the display screen 102, the camera module, etc. The power management module can also be used to monitor parameters such as battery capacity, battery cycle number, battery health status (leakage, impedance), etc.

[0078] In some examples, the power management module can be disposed in a processor of the main circuit board. In other examples, the power management module and the charging management module can also be disposed in the same device.

[0079] To realize the LTE function of the electronic device 100, the electronic device 100 may further include an antenna radiator (not shown in the figure). For example, the molding material of the side frame 10 may include a metal material or an alloy material, so that the side frame 10 can be used to form the antenna radiator. The electronic device 100 may further include a radio frequency chip (not shown in the figure). For example, the radio frequency chip may be arranged on the main circuit board, the radio frequency chip may be electrically connected to the main circuit board, and the main circuit board may be electrically connected to the antenna radiator, so as to realize the electrical connection between the radio frequency chip and the antenna radiator.

[0080] For example, the RF chip can send a RF signal and transmit the RF signal to the antenna radiator through the main circuit board, and the antenna radiator can send the RF signal out. The antenna radiator can also receive an external electromagnetic wave signal and transmit the electromagnetic wave signal to the RF chip.

[0081] The structure illustrated in the embodiment of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 may include more or fewer components than shown in the figure, or combine certain components, or separate certain components, or arrange the components differently. For example, the electronic device 100 may also include a camera module (such as a front camera and a rear camera), a microphone, a speaker, a flash, and other devices.

[0082] Figure 3 It is a schematic diagram of a shell substrate and a mold skirt structure during a shell molding process in the related art.

[0083] Usually, in order to form an antenna radiator to meet the communication requirements of LTE functions, the shell is usually formed by CNC processing combined with nano injection molding. For example, aluminum plate profiles can be obtained by aluminum extrusion CNC, and the aluminum plate profiles are used as the base material for shell molding. The aluminum plate profiles are processed by CNC processing to form the shell base material and the mold skirt structure. Figure 3 As shown, the formed housing substrate 200 may include a back cover substrate 201 and a frame wall substrate 202. A plurality of slot structures 201a may be formed on the inner surface of the back cover substrate 201 for fixing and assembling structural components. The frame wall substrate 202 is arranged around one side of the back cover substrate 201, and an antenna gap 203 is formed between the frame wall substrate 202 and the back cover substrate 201. The antenna gap 203 extends to the frame wall substrate 202. The antenna gap 203 makes the connection strength between the frame wall substrate 202 and the back cover substrate 201 relatively weak. Figure 3 There is an antenna gap 203 between the part of the frame wall substrate 202 and the back cover substrate 201 shown in the figure, so that part of the frame wall substrate 202 is suspended on one side of the back cover substrate 201. The formed mold skirt structure 300 can be arranged around the entire shell substrate 200, that is, around the circumferential outer side of the frame wall substrate 202. The mold skirt structure 300 can be connected to the frame wall substrate 202, and play a role in strengthening the positioning of the suspended frame wall substrate 202, which can reduce or avoid the impact deformation of the frame wall substrate 202 caused by the injection molding process in the subsequent injection molding process. In addition, due to the CNC processing technology, when milling the aluminum plate shape to form the back cover substrate 201 and the frame wall substrate 202, a number of raised reinforcing ribs (not shown in the figure) will be formed on the inner surface of the frame wall substrate 202, and the reinforcing ribs connect the frame wall substrate 202 and the back cover substrate 201.

[0084] Afterwards, the shell substrate 200 and the mold skirt structure 300 are subjected to nano injection molding, so that the antenna gap 203 and other parts are filled with the nano injection molding structure (not shown in the figure), and the nano injection molding structure can form a step structure for supporting the display screen on the inner side of the frame wall substrate 202. After injection molding, the mold skirt structure 300 is removed by CNC processing, and the inner and outer surface features of the frame wall substrate 202 and the inner and outer surface features of the back cover substrate 201 are modified, so that the frame wall substrate 202 forms a frame wall, the frame wall surrounds the side frame, and the back cover substrate 201 forms a back cover. The inner surface of the frame wall of the side frame has a raised reinforcing rib, which is connected to the back cover. The frame wall of the side frame is divided into multiple antenna radiators by the antenna gap, and there is an injection molding structure between the antenna gaps to isolate and fix adjacent antenna radiators, so as to obtain a shell capable of realizing LTE function.

[0085] However, in order to ensure the enhanced positioning of the shell substrate (or frame wall substrate), the mold skirt structure 300 is usually wider, as shown by the width L′1 in the figure, which is usually greater than or equal to 20 mm. Removing the mold skirt structure 300 generates a lot of waste, and the material utilization rate of the aluminum plate material used as the substrate is low, and the problem of raw material waste is serious. In addition, during the entire molding and manufacturing process of the shell, CNC processing needs to be used many times, such as realizing the mold skirt structure, forming the structural features of the shell substrate, and removing the mold skirt structure by blanking. The number of times and duration of CNC use are long, and the cost of CNC is high, which will lead to the problem of high manufacturing and processing costs of the shell.

[0086] Based on this, the embodiment of the present application provides a shell, the inner surface of the frame wall of the side frame has a folding structure, one end of the folding structure is fixed on the frame wall, and the other end extends toward the accommodating cavity, that is, the folding structure is convexly arranged on the inner side of the frame wall, and is arranged around the circumference of the frame wall. In the molding process of the shell, the part of the substrate used to form the folding structure can play a role in strengthening the positioning of the part of the substrate used to form the frame wall, that is, it plays the role of the mold skirt structure in the related art. For example, when the shell is molded, a skirt structure can be formed on the inner side of the frame wall substrate, and then a gap and other structural features are formed on the frame wall substrate, etc., and the parts of the frame wall substrate separated by the gap can be connected by the skirt structure. During the injection molding process, the skirt structure plays a role in strengthening the positioning of the frame wall substrate, improving the strength of the frame wall substrate, reducing or avoiding the problem of deformation of the frame wall substrate, and then the frame wall substrate and the skirt structure are processed with the appearance structure features, so that the frame wall substrate forms the frame wall, and the skirt structure forms the folding structure. That is, the skirt structure in the process of shell molding is not completely removed or not removed, so that the inner surface of the frame wall of the final formed side frame is retained with a folding structure. Compared with the related art, it is not necessary to remove the mold skirt structure by CNC, and less waste is removed, which reduces the generation of skirt waste, effectively improves the utilization rate of the shell molding substrate, and reduces the manufacturing and processing cost of the shell. It can also reduce the number of times and working hours of CNC processing, which is also conducive to reducing the manufacturing and processing cost of the shell. In addition, the folding structure on the inner surface of the frame wall can ensure the strength of the frame wall substrate during the molding process, so as to reduce or avoid the deformation of the frame wall during the molding process and improve the finished product yield. It is also conducive to improving the overall strength of the shell after molding, and is conducive to improving the support and fixing strength of the display screen, and improving the reliability of the electronic device.

[0087] Figure 4 A schematic diagram of the structure of a shell provided in an embodiment of the present application.

[0088] For example, see Figure 4As shown, the housing 101 includes a rear cover 20 and a side frame 10, and the rear cover 20 and the side frame 10 enclose a receiving cavity 103. The side of the rear cover 20 facing the receiving cavity 103 is the inner surface of the rear cover 20, and a mounting slot 22 may be provided on the inner surface of the rear cover 20 for assembling structural components such as batteries and main circuit boards.

[0089] The side frame 10 may include a frame wall 11, and the frame wall 11 may be an annular structure (combined with Figure 5b As shown), for example, the frame wall 11 may be a discontinuous annular structure, see Figure 4 As shown, the frame wall 11 is located on one side of the back cover 20 and is disposed around the circumference of the back cover 20 . The frame wall 11 and the back cover 20 may enclose the aforementioned accommodation cavity 103 .

[0090] Figure 5a for Figure 4 A schematic diagram of the structure of the side frame and the back cover of the shell, Figure 5b for Figure 4 A front view schematic diagram of the assembly of the side frame and the back cover of the shell.

[0091] See also Figure 5a As shown, the side of the frame wall 11 facing the accommodating cavity 103 may be the inner surface 11a of the frame wall 11, and the inner surface 11a of the frame wall 11 and the inner surface of the back cover 20 enclose the above-mentioned accommodating cavity. The side of the frame wall 11 facing away from the accommodating cavity 103 is the outer surface of the frame wall 11, and the outer surface of the frame wall 11 may be the outer surface of the side frame. For example, Figure 5a As shown, the outer surface 11b of the frame wall 11 may be an arc-shaped surface.

[0092] Alternatively, in some examples, the outer surface 11 b of the frame wall 11 may also be a plane, or the outer surface 11 b of the frame wall 11 may be partially an arc-shaped surface and partially a plane.

[0093] Exemplarily, a first opening 115 may be provided on the frame wall 11 , and the first opening 115 may be the above-mentioned interface of the electronic device, which is used to charge the electronic device or realize data transmission.

[0094] The frame wall 11 may further be provided with a second opening 116 , which may be a sound outlet of the electronic device. The sound outlet may be connected to a speaker located in the accommodating cavity 103 of the electronic device for playing sound.

[0095] The frame wall 11 may further be provided with a third opening 117 , which may be a sound pickup opening of the electronic device. The sound pickup opening may be connected to a microphone located in the accommodating cavity 103 of the electronic device for sound pickup.

[0096] Alternatively, in some examples, the second opening 116 and the third opening 117 may both be sound outlets of the electronic device to improve the sound quality of the electronic device.

[0097] The side frame 10 may further include a folding structure 12, which is disposed on the inner surface 11a of the frame wall 11. The folding structure 12 may be disposed on the inner surface 11a of the entire frame wall 11. Figure 5b As shown, the folding structure 12 can also be an annular structure, such as the folding structure 12 can also be a discontinuous annular structure. The folding structure 12 is located on the inner side of the frame wall 11 and is arranged around the circumference of the frame wall 11.

[0098] Of course, in some examples, the folded edge structure 12 may be formed only on a portion of the inner surface 11 a of the frame wall 11 .

[0099] Figure 6a for Figure 5a A partial enlarged schematic diagram of part A in FIG.

[0100] Combination Figure 6a As shown, the folding structure 12 is convexly arranged on the inner surface 11a of the frame wall 11, that is, one end of the folding structure 12 is fixed on the frame wall 11, and the other end of the folding structure 12 convexly extends toward the accommodating cavity 103. During the molding process of the shell, the part of the base material used to form the folding structure 12 can play a role in strengthening the positioning of the part of the base material used to form the frame wall 11, that is, it can play the role of the above-mentioned mold skirt structure.

[0101] For example, when the shell is formed, a skirt structure can be formed on the inner side of the frame wall substrate, and the skirt structure surrounds the circumferential arrangement of the frame wall substrate, and then a structural feature such as a gap is formed on the frame wall substrate, and the frame wall substrate is separated by the gap and formed. The multiple parts can be connected by the skirt structure. In the injection molding process, the skirt structure can play a role in strengthening the positioning of the frame wall substrate, improve the strength of the frame wall substrate, reduce or avoid the problem of deformation of the frame wall substrate, and then the frame wall substrate and the skirt structure are processed with the shape structural features, so that the frame wall substrate forms the frame wall 11, and the skirt structure forms the folding structure 12. That is, the skirt structure in the shell molding process is not completely removed or not removed, so that the inner surface 11a of the frame wall 11 of the side frame 10 formed finally has the folding structure 12, and compared with the related art, it is not necessary to remove the mold skirt structure by the CNC method, and the waste material is less removed, and the generation of the skirt waste material is reduced, which effectively improves the utilization rate of the shell molding substrate and reduces the manufacturing and processing cost of the shell. It can also reduce the number of times and working hours of CNC processing, which is also beneficial to reducing the manufacturing and processing costs of the shell.

[0102] In addition, the folding structure 12 on the inner surface 11a of the frame wall 11 can ensure the strength of the frame wall substrate during the molding process to reduce or avoid deformation of the frame wall 11 during the molding process and improve the yield of the finished product, and is also beneficial to improving the overall strength of the shell after molding.

[0103] Among them, the frame wall 11, the folding structure 12 and the back cover 20 are an integrated structural part, that is, the frame wall 11, the folding structure 12 and the back cover 20 can be an integral component, such as a whole shell substrate, through stamping, bending, roughening and CNC processing to form an integrated frame wall 11, folding structure 12 and back cover 20, which is beneficial to improve the strength of the frame wall 11, the folding structure 12 and the back cover 20 during the processing and forming process, reduce or avoid deformation during the forming process, and improve the finished product yield of the shell.

[0104] In addition, the frame wall 11, the folded edge structure 12 and the back cover 20 are an integrated structural component, that is, the side frame 10 and the back cover 20 form an integrated structure, which is beneficial to improving the connection strength between the side frame 10 and the back cover 20 and further improving the strength of the entire shell.

[0105] In order to meet the LTE function of the electronic device, the molding substrate of the side frame 10 and the back cover 20 may include metal materials or alloy materials, that is, a structural plate material of metal material or alloy material can be used as a substrate to form the frame wall 11 and the folded edge structure 12 of the back cover 20 and the side frame 10, so that the frame wall 11 and the folded edge structure 12 can be used to form an antenna radiator to meet the requirements of communication transmission function.

[0106] For example, see Figure 6a As shown, the frame wall 11 is provided with a first slit 111, and the first slit 111 can penetrate the inner surface 11a and the outer surface 11b of the frame wall 11. The hem structure 12 can be provided with a second slit 121, and the second slit 121 can extend from one end of the hem structure 12 connected to the frame wall 11 to the end of the hem structure 12 facing away from the frame wall 11, and the second slit 121 can penetrate the hem structure 12 in the thickness direction.

[0107] Figure 6b for Figure 5b A partial enlarged schematic diagram of part B in the middle.

[0108] Combination Figure 6b As shown, a third gap 21 may be provided between a portion of the frame wall 11 and the back cover 20, so that the portion of the frame wall 11 is separated from the back cover 20 by the third gap 21. The third gap 21, the first gap 111 and the second gap 121 are connected in sequence.

[0109] It can be understood that the other part of the frame wall is directly fixed to the back cover 20 without a gap between them, the part of the frame wall having the third gap 21 with the back cover 20 can be separated from the other part of the frame wall by a first gap, and the folding structure on the part of the frame wall can be separated from the folding structure 12 on the other part of the frame wall by a second gap. Figure 6a As shown, the frame wall 11 may include a frame wall 11e and a frame wall 11f, a third gap 21 is provided between the frame wall 11e and the back cover 20, the frame wall 11f and the back cover are directly connected without a third gap therebetween, a first gap 111 is provided between the frame wall 11e and the frame wall 11f, and a second gap 121 is provided between the folding structure on the inner side of the frame wall 11e and the folding structure on the inner side of the frame wall 11f.

[0110] Exemplarily, the distribution positions of the first slit 111 and the second slit 121 can correspond to each other, so that the first slit 111 and the second slit 121 can be connected to each other in a manner of being connected at the ends. The first slit 111 and the second slit 121 separate the portion of the frame wall 11 (such as the frame wall 11e) into multiple antenna radiators, each of which includes a portion of the frame wall 11 and a portion of the folded edge structure 12.

[0111] It should be noted that the number of the first slits 111 on the frame wall 11 may be one, or may be multiple. The number of the second slits 121 may correspond to the number of the first slits 111. The number of the third slits 21 may be one, or may be multiple, which may be selected and set according to the actual design requirements of the antenna radiator.

[0112] The first slit 111 may be a linear slit, and the slit width of the first slit 111 may be approximately consistent in the extension direction of the first slit 111. The slit width of the third slit 21 may also be approximately consistent in the extension direction of the third slit 21.

[0113] The second slit 121 may have a gradually increasing slit width from one end connected to the first slit 111 to the other end away from the first slit 111 , so that the second slit 121 may have a trumpet-shaped outline.

[0114] Figure 7 for Figure 4 A partial enlarged schematic diagram of part C in the middle.

[0115] See also Figure 7 As shown, the housing 101 further includes an injection molding structure 30, and part of the injection molding structure 30 can be located between at least part of the folding structure 12 and part of the back cover 20 (refer to Figure 8As shown in FIG. 1 , the injection molding structure 30 can support and strengthen the folding structure 12, thereby improving the strength of the entire housing. In some examples, the display screen can be attached to the folding structure 12, and the folding structure 12 with high support strength can improve the support and fixing strength of the display screen.

[0116] The injection molding structure 30 partially fills the first gap 111 and the second gap 121, and the injection molding structure 30 also fills the third gap 21 (refer to Figure 8 As shown), it serves to isolate each antenna radiator and the antenna radiator from the back cover 20.

[0117] It should be noted that the distribution position of the injection molding structure 30 can be selected and set according to the design requirements of the housing, and the injection molding structure 30 can be ensured to fill the first gap 111, the second gap 121 and the third gap 21. For example, the injection molding structure may not be provided at the position where the first opening 115, the second opening 116, etc. are formed on the side frame 10.

[0118] Figure 8 for Figure 4 Schematic diagram of the cross section of the middle shell.

[0119] See also Figure 8 As shown, the folding structure 12 is located on the inner surface 11a of the frame wall 11, and there may be a certain distance between the side 12a of the folding structure 12 facing away from the back cover 20 and the end face 11c of the frame wall 11 facing away from the back cover 20, that is, in the thickness direction, the height of the end face 11c of the frame wall 11 facing away from the back cover 20 is higher than the height of the side 12a of the folding structure 12 facing away from the back cover 20, and part of the frame wall 11 is higher than the folding structure 12 in the thickness direction.

[0120] Part of the injection molding structure 30 can be located on the side of at least part of the folding structure 12 facing the accommodating cavity 103, that is, part of the injection molding structure 30 is located on the inner side of at least part of the folding structure 12, so that the frame wall 11, part of the injection molding structure 30 and the folding structure 12 can jointly form a step structure 13, and the step structure 13 can be used to support and limit the display screen of the electronic device.

[0121] Exemplarily, the folding structure 12 and the partial injection molding structure 30 located inside the folding structure 12 are used together to support the display screen. For example, the side 12a of the folding structure 12 facing away from the back cover 20 and the side 30a of the partial injection molding structure 30 facing away from the back cover 20 are flush and can form a support surface 131 of the step structure 13. The display screen can be glued and fixed on the support surface 131 to achieve the assembly of the display screen and the shell. The part of the frame wall 11 that is higher than the folding structure 12 in the thickness direction can be used to surround the periphery of the display screen, limit and position the display screen, improve the assembly firmness of the display screen, and facilitate the precise assembly of the display screen.

[0122] Fig. 9 for Figure 5b A partial enlarged schematic diagram of part D in the middle.

[0123] See also Fig. 9 As shown, the hem structure 12 has a second gap 121, and the second gap 121 can separate the hem structure 12 into a plurality of sub-hem bodies 122, for example, see Fig. 9 As shown, the hem structure 12 can be divided into sub-hem bodies 122a, 122b and 122c by two second gaps 121. A plurality of hem bodies can be arranged in sequence to form an annular hem structure 12, and a plurality of sub-hem bodies 122 are arranged around the inner side of the frame wall 11 in the circumferential direction.

[0124] A second gap 121 may be provided between the ends of two adjacent sub-folding bodies 122, such as a second gap 121 between the sub-folding body 122a and the sub-folding body 122b, and a second gap 121 between the sub-folding body 122a and the sub-folding body 122c.

[0125] At least part of the ends of the sub-folding body 122 have a reinforcing portion 123. For example, taking the sub-folding body 122a as an example, the two ends of the sub-folding body 122a have reinforcing portions 123a and 123b respectively. One end of the reinforcing portion 123 is fixed to the end of the sub-folding body 122, and the other end of the reinforcing portion 123 protrudes toward the accommodating cavity 103, that is, compared with the end of the sub-folding body 122, the reinforcing portion 123 is more protruding from the frame wall 11.

[0126] The reinforcing portion 123 can improve the strength of the end of the sub-folding body 122. The end of the sub-folding body 122 on at least one side of the second gap 121 has a reinforcing portion 123, which can improve the strength of the folding structure 12 at the position of the second gap 121, thereby better improving the strength of the side frame 10, and is more conducive to reducing or avoiding the problem of deformation of the frame wall 11 caused by the impact generated by injection molding in the second gap 121 during the injection molding process.

[0127] In some examples, both ends of all sub-hemming bodies 122 may have reinforcing parts 123. Alternatively, only one or both ends of some sub-hemming bodies 122 may have reinforcing parts 123.

[0128] For example, in the folding structure 12, at least some of the adjacent sub-folding bodies 122 can have reinforcing parts 123 on both end portions, that is, at least some of the sub-folding bodies 122 on both sides of the second gap 121 can have reinforcing parts 123 on their ends, which is more conducive to improving the strength of the side frame 10.

[0129] For example, see Fig. 9 As shown, taking the sub-folding body 122a and the sub-folding body 122b as examples, the sub-folding body 122a and the sub-folding body 122b are arranged adjacent to each other, and the two ends of the sub-folding body 122a respectively have a reinforcing portion 123, such as a reinforcing portion 123a and a reinforcing portion 123b. The two ends of the sub-folding body 122b also respectively have a reinforcing portion 123, such as a reinforcing portion 123c at one end, and the reinforcing portion 123 at the other end is not shown in the figure.

[0130] A second gap 121 may be provided between the reinforcement portion 123a of the sub-folding body 122a and the reinforcement portion 123c of the sub-folding body 122b. A second gap 121 may also be provided between the reinforcement portion 123b of the sub-folding body 122a and the reinforcement portion 123d of another sub-folding body 122c adjacent to the sub-folding body 122a. Correspondingly, a second gap may be provided between the reinforcement portion at the other end of the sub-folding body 122b and the reinforcement portion of another sub-folding body adjacent to the sub-folding body 122b.

[0131] Fig.10 for Figure 8 Schematic diagram of the cross-sectional structure of the middle side frame.

[0132] For example, see Fig.10 As shown, the protruding extension length of the folding structure 12 is less than the maximum thickness of the frame wall 11, wherein the thickness of the frame wall 11 refers to the wall thickness of the frame wall 11 from the inner surface 11a to the outer surface 11b. For example, the maximum thickness of the frame wall 11 can be Fig.10 As shown in h1.

[0133] The extension length of the folding structure 12 refers to the length of the folding structure 12 extending from the inner surface 11a of the frame wall 11 to the accommodating cavity 103. Fig.10 The extension length of the folding structure 12 is made smaller, that is, the formed folding structure 12 is smaller, while ensuring the strength of the frame wall 11 during the molding process, the amount of base material occupied by the folding structure 12 is reduced, which is conducive to further reducing the manufacturing and processing cost of the shell.

[0134] Exemplarily, the maximum thickness of the frame wall 11 is greater than the maximum thickness of the back cover 20, wherein the thickness of the back cover 20 refers to the wall thickness from the inner surface of the back cover 20 to the outer surface of the back cover 20. For example, the maximum thickness of the back cover 20 can be Fig.10 As shown by h2 in FIG. 1 , the maximum thickness h1 of the frame wall 11 is greater than the maximum thickness h2 of the back cover 20. That is, the frame wall 11 has a larger wall thickness and a stronger strength. On the one hand, it ensures that the strength is strong during the shell molding process to avoid deformation and improve the yield of the finished product. On the other hand, it can effectively improve the overall strength of the shell after molding and improve the reliability of the shell.

[0135] For example, the ratio of the maximum thickness h1 of the frame wall 11 to the maximum thickness h2 of the back cover 20 may be in the range of 1

[0136] Alternatively, in some examples, the ratio of the maximum thickness h1 of the frame wall 11 to the maximum thickness h2 of the back cover 20 may be in the range of 1

[0137] Continue to see Fig.10 As shown, the frame wall 11 may include a main body 112 and an extension 113, the main body 112 is connected to the back cover 20, the extension 113 may be located on the inner side of the main body 112, the side of the main body 112 facing away from the extension 113 may form the outer surface 11b of the frame wall 11, and the inner surface 11a of the extension 113 may form the inner surface 11a of the frame wall 11, and the wall thickness of the frame wall 11 may be increased by adding the extension 113. The folding structure 12 may be located on the inner surface 11a of the extension 113.

[0138] For example, in the actual molding process of the shell, taking the rectangular plate structure with the contour shape of the side frame 10 and the back cover 20 as an example, a rectangular plate material can be used as a molding substrate, and the molding substrate is processed by stamping so that the molding substrate can include a back cover substrate and a side frame substrate. The back cover substrate is arranged around the side frame substrate, and the back cover substrate is located on one side of the side frame substrate. The wall thickness of the side frame substrate and the back cover substrate can be the same.

[0139] Of course, in some examples, the wall thicknesses of the obtained back cover substrate and the side frame substrate may also be different.

[0140] The side frame substrate is then processed by roughening, wherein roughening refers to a process of reducing the height of the side frame substrate and increasing the cross-sectional area. For example, the side frame substrate can be placed in a mold, and pressure is applied to the side frame substrate by a hammer, a slider, a punch, etc. to achieve plastic deformation. ​​

[0141] After the roughening treatment, the side frame substrate may include a main body substrate and an extension portion substrate, and the extension portion substrate is located inside the main body substrate, that is, through the roughening treatment, part of the side frame substrate forms the main body substrate, and part of the side frame substrate extends to the inside of the main body substrate under the roughening stamping action to form the extension portion substrate. The overall thickness of the side frame substrate is increased, so that the thickness of the side frame substrate can be greater than the thickness of the back cover substrate. Part of the side frame substrate can form a frame wall substrate, and the frame wall substrate is used to form a frame wall. The main body substrate and the extension portion substrate respectively form the main body and the extension portion of the frame wall, so that the maximum thickness of the frame wall 11 is greater than the maximum thickness of the back cover 20.

[0142] Since the extension part substrate is formed by extending the main part substrate by means of upsetting, there may be no direct contact connection relationship between the extension part substrate and the back cover substrate, and there is a slit structure between the extension part substrate and the back cover substrate, see Fig.10 As shown, in the final molded housing, there is a slit structure 114 between the extended portion 113 of the frame wall 11 and the side of the rear cover 20 facing the accommodating cavity. A high-strength frame wall 11 structure can be obtained by a simpler molding method, which significantly reduces the manufacturing cost while meeting the strength requirements.

[0143] Exemplarily, after the above-mentioned roughening to increase the wall thickness of the side frame substrate, the portion of the side frame substrate that is away from the rear cover substrate can be bent by a bending process, and the bent side frame substrate can continue to be roughened, such as making the bending angle of the bent portion of the side frame substrate and the unbent portion of the side frame substrate approximately 90°, the bent portion of the side frame substrate can form a skirt structure, and the unbent portion of the side frame substrate can form a frame wall substrate, so that a skirt structure protruding toward the accommodating cavity can be formed on the inner surface of the frame wall substrate.

[0144] After that, the first gap, the second gap and the third gap can be formed on the frame wall substrate, the skirt structure and the back cover substrate by CNC. After the above gaps are injection molded, the back cover substrate, the frame wall substrate and the skirt structure can be processed by CNC to obtain the back cover 20, the frame wall 11 and the folding edge structure 12. That is, the back cover substrate, the frame wall substrate and the skirt structure can be formed by stamping, roughening and bending, and then the gaps and the shape and structure features are processed by CNC. Compared with the related art that mainly uses CNC processing to form the back cover substrate, the frame wall substrate or the mold skirt structure, the number of times and working hours of CNC processing are greatly reduced, and the overall strength of the shell is effectively improved. Under the condition of ensuring the high strength performance of the shell during and after the molding process, the manufacturing and processing costs are significantly reduced.

[0145] In addition, the side frame substrate and the back cover substrate are formed by stamping, and part of the side frame substrate forms a skirt structure by roughening and bending, and part of the side frame substrate forms a frame wall substrate. Compared with the related art in which the frame wall substrate and the back cover substrate are formed by CNC processing, the inner surface of the side frame substrate formed by stamping can be a flat surface, which means that the inner surface of the frame wall substrate can be a flat surface, and there will be no protruding reinforcement ribs on the inner surface of the frame wall substrate connected to the back cover substrate. That is, in the finally formed shell, there are no protruding reinforcement ribs on the inner surface of the frame wall 11 and connected to the back cover 20, which simplifies the structural design, the molding method is simple, and has a lower manufacturing and processing cost.

[0146] The shell provided in the embodiment of the present application may have a molding process that may include stamping, roughening, bending, injection molding, and CNC machining, etc. The molding method of the above-mentioned shell is illustrated below.

[0147] Fig.11 for Figure 4 Schematic diagram of the process flow of the molding method of the middle shell.

[0148] The above-mentioned method for forming a shell may include step S101: providing a forming substrate.

[0149] Exemplarily, the molding substrate may be a metal or alloy plate, for example, the molding substrate may be an aluminum alloy plate, such as 5052 aluminum alloy in the Al-Mg alloy series. Of course, in some other examples, the molding substrate may also be other types of alloys or metal plates.

[0150] Step S102: stamping the molded substrate to obtain a side frame substrate and a rear cover substrate.

[0151] Fig.11a This is the front view of the formed substrate after stamping. Fig.11b for Fig.11a Schematic diagram of the enlarged local structure of the molded substrate.

[0152] See also Fig.11a As shown, the side frame substrate 407 can be arranged around the circumference of the rear cover substrate 401, combined with Fig.11b As shown, the side frame substrate 407 is located on one side of the back cover substrate 401 , and the side frame substrate 407 and the back cover substrate 401 can enclose a receiving cavity 403 .

[0153] See also Fig.11b As shown, the wall thickness of the side frame substrate 407 can be the same as the wall thickness of the rear cover substrate 401. Fig.11bAs shown in , L1 is the wall thickness of the side frame substrate 407, L2 is the wall thickness of the back cover substrate 401, L1=L2, for example, the wall thickness of the side frame substrate 407 and the wall thickness of the back cover substrate 401 can both be about 1.5 mm.

[0154] It is understandable that the wall thickness of the side frame substrate 407, the wall thickness of the back cover substrate 401, and the height of the side frame substrate 407 protruding from the back cover substrate 401 can be selected and set according to the actual design requirements of the shell 101.

[0155] Step S103: roughening the side frame substrate.

[0156] Fig.11c This is a schematic diagram of the structure of the formed substrate after roughening treatment. Fig.11d for Fig.11c Schematic diagram of the enlarged local structure of the molded substrate.

[0157] Combination Fig.11c and Fig.11d As shown, taking the side frame substrate 407 being located on one side of the back cover substrate 401 along the thickness direction (such as the inner surface side of the back cover substrate 401), and the side frame substrate 407 extending along the thickness direction as an example, the roughening direction can be consistent with the extending direction of the side frame substrate 407, that is, the roughening direction can also be the thickness direction, such as Fig.11d The z direction is shown in FIG.

[0158] Exemplarily, the side frame substrate 407 can be placed in a mold and pushed against the outer surface of the side frame substrate 407 by a side slider. Pressure is applied to the side frame substrate 407 along the upsetting direction by a hammer head, a punch, etc., so that the side frame substrate 407 undergoes plastic deformation.

[0159] After the side frame substrate 407 is subjected to the roughening treatment, part of the side frame substrate 407 can be formed into a main body substrate (not shown in the figure), and part of the side frame substrate 407 is extended to the inside of the main body substrate (facing the side of the accommodating cavity) under the roughening pressure to form an extended part substrate (not shown in the figure), so that the side frame substrate 407 includes a main body substrate and an extended part substrate. The main body substrate is connected to the back cover substrate 401, and a slit structure is provided between the extended part substrate and the back cover substrate 401.

[0160] After the roughening treatment, the overall thickness of the side frame substrate 407 is increased, so that the thickness L1 of the side frame substrate 407 is greater than the thickness L2 of the back cover substrate 401. For example, the thickness L1 of the side frame substrate 407 can be about 1.8 mm. Thus, the maximum thickness of the frame wall of the finally formed shell can be greater than the maximum thickness of the back cover.

[0161] It is understandable that the thickness of the roughened rear side frame substrate 407 can be selected and set according to actual design requirements. For example, in some examples, the thickness of the roughened rear side frame substrate 407 can be approximately greater than or equal to 1.9 mm.

[0162] Step S104: partially bending the side frame substrate, and further roughening the bent side frame substrate to form a frame wall substrate and a skirt structure.

[0163] Exemplarily, the portion of the side frame substrate located on the side facing away from the rear cover substrate is bent toward the accommodating cavity, so that this portion of the side frame substrate can be bent at a certain angle relative to the remaining portion of the side frame substrate (the portion of the side frame substrate that is not bent), such as the bending angle (i.e. the angle between the bent portion of the side frame substrate and the unbent portion of the side frame substrate) can be less than 90°.

[0164] Fig.11e The schematic diagram of the structure of the formed substrate after the skirt structure is formed. Fig.11f for Fig.11e Schematic diagram of the enlarged local structure of the molded substrate.

[0165] Then continue to roughen the bent side frame substrate, combined with Fig.11e and Fig.11f As shown, after the roughening treatment, the bending angle of this part of the side frame substrate can be about 90°, and the part of the side frame substrate that is not bent can form a frame wall substrate 402, and the frame wall substrate 402 and the back cover substrate 201 form a accommodating cavity 403.

[0166] The bent portion of the side frame substrate can form a skirt structure 404, that is, a skirt structure 404 protruding toward the accommodating cavity is formed on the inner surface (the side facing the accommodating cavity 403) of the frame wall substrate 402. Fig.11e As shown, the skirt structure 404 protrudes on the inner surface of the frame wall substrate 402 , and the skirt structure 404 can be arranged around the circumference of the frame wall substrate 402 .

[0167] One or more protruding reinforcement substrates 405 may also be formed on the inner side of the skirt structure 404 to enhance the strength of the skirt structure 404 and the entire frame wall substrate 402 .

[0168] It can be understood that the unbent part of the side frame substrate forms the frame wall substrate 402, and the frame wall substrate 402 includes part of the main body substrate and the extension substrate. The thickness of the frame wall substrate 402 can be as follows: Fig.11f As shown in L4 in FIG. 4 , the thickness of the frame wall substrate 402 may be greater than or equal to the thickness of the side frame substrate.

[0169] The extension length of the skirt structure 404 may be the length of the skirt structure 404 protruding from the frame wall substrate 402 toward the accommodating cavity 403. Fig.11f As shown in L3 in the figure, the extension length L3 of the skirt structure 404 can be smaller than the thickness L4 of the frame wall substrate 402, so that the extension length of the folding structure in the finally formed shell can be smaller than the maximum thickness of the frame wall.

[0170] Step S105: forming a first slit on the frame wall substrate, forming a second slit on the skirt structure, and forming a third slit between a portion of the frame wall and the back cover to obtain a preform.

[0171] Figure 11g Schematic diagram of the structure of the formed substrate after the gap is formed.

[0172] See also Figure 11g As shown, illustratively, a third gap 21 can be formed between a portion of the frame wall substrate 402 and the back cover substrate 401 by CNC, and the third gap 21 separates the portion of the frame wall substrate 402 from the back cover substrate 401, so that the portion of the frame wall substrate 402 is suspended outside the back cover substrate 401.

[0173] By CNC, a first slit 111 can be formed on the frame wall substrate 402, and a second slit 121 can be formed on the skirt structure 404. The third slit 21, the first slit 111 and the second slit 121 are connected in sequence, and the second slit 121 can be opened on the reinforcement substrate 405.

[0174] It should be noted that see Figure 11g As shown, in the extension direction of the reinforcing portion substrate 405 (the direction in which one end of the reinforcing portion substrate 405 adjacent to the skirt structure 404 extends toward the accommodating cavity 403), the second gap 121 may not penetrate the reinforcing portion substrate 405, and the first gap 111 and the second gap 121 separate the frame wall substrate 402 and the skirt structure 404 into multiple parts. The multiple parts can be connected together in sequence through part of the reinforcing portion substrate 405, thereby improving the strength of the skirt structure 404 and the frame wall substrate 402, and reducing or avoiding the impact deformation problem in subsequent injection molding.

[0175] The above step S105 may further include step S1051: forming a connecting structure, wherein the connecting structure connects the frame wall substrate and the back cover substrate.

[0176] For example, when the third gap 21 is formed between the frame wall substrate 402 and the back cover substrate 401 by CNC, a portion of the frame wall substrate 402 and the back cover substrate 401 are retained to form a connecting structure.

[0177] The above step S105 may further include step S1052: shaping the back cover substrate 201. The shaping may include shaping the shape features of the inner surface of the back cover substrate 201, shaping the structural features such as the mounting grooves on the inner surface of the back cover substrate 201, and the like.

[0178] Exemplarily, the rear cover substrate may be shaped by CNC, for example, the mounting slot 22 may be formed on the inner surface of the rear cover substrate 401 by CNC.

[0179] It should be noted that all the structural and shape features required for the back cover design can be formed through the above step S1052, so that the back cover substrate is formed into the back cover, such as completing the shaping of the inner surface of the back cover substrate and forming all the required installation slots on the outer surface of the back cover substrate.

[0180] Alternatively, through the above-mentioned step S1052, only part of the structure and shape features required for the back cover design can be formed on the back cover substrate, such as only part of the installation slot, etc. In the subsequent shaping process (such as step S107 below), the remaining required structures and shape features are formed on the back cover substrate.

[0181] See also Figure 11g As shown, the material connection structure 406 is located at the third gap 21, and there may be multiple material connection structures 406. The material connection structure 406 connects the frame wall substrate 402 and the back cover substrate 401, which can improve the bonding strength between the frame wall substrate 402 and the back cover substrate 401, and further improve the strength of the frame wall substrate 402. In the subsequent injection molding process, the material connection structure 406 can pull the suspended frame wall substrate 402 to resist the impact of injection molding on the frame wall substrate 402, effectively prevent the deformation of the frame wall substrate 402, and improve the finished product yield of the housing 101.

[0182] Of course, in some examples, the above-mentioned connecting material structure may not be formed.

[0183] Step S106: injection molding the preform.

[0184] For example, the preform may be injection molded by nano injection molding. Of course, in some other examples, other methods that can realize metal or alloy injection molding may also be used.

[0185] Fig.11h Schematic diagram of the positioning of a preform in the mold during the injection molding process.

[0186] Exemplarily, the preform may be placed in a mold, see Fig.11hAs shown, for example, the mold may include four movable slider structures 501, and the moving directions of the four slider structures 501 can be seen from the arrows in the figure. By moving, the four slider structures 501 can be respectively abutted against the four sides of the preform 400. The mold may also include positioning columns 502, and the positioning columns 502 can be used to define and fix the preform 400 for injection molding.

[0187] After the injection molding is completed, the four positioning structures 501 can be moved to separate from the preform 400, and the preform after injection molding can be ejected by an ejector pin (not shown in the figure).

[0188] Fig.11i Schematic diagram of the structure of the preform after injection molding.

[0189] Preforms after injection molding, see Fig.11i As shown, the injection molding structure 30 is filled in the first gap (not shown in the figure), the second gap 121 and the third gap (not shown in the figure). Part of the injection molding structure 30 can be located between at least part of the skirt structure 404 and part of the back cover substrate 401 (refer to Fig.11j As shown in FIG. 4 , the skirt structure 404 is supported and strengthened. The partial injection structure 30 may also be located on the side of at least part of the skirt structure facing the accommodating cavity 403.

[0190] Step S107: shaping the preformed part after injection molding to obtain a shell.

[0191] Exemplarily, the shaping process may include material connection processing, shape feature molding, other feature molding of the housing, etc. For example, the material connection between the frame wall substrate and the back cover substrate may be removed by CNC processing. Part of the reinforcement substrate may be removed by CNC processing, so that the reinforcement substrate forms a reinforcement portion, and the second gap may penetrate the reinforcement portion in the extension direction. The skirt structure, the frame wall substrate and the injection molding structure may be processed by CNC processing to form a step structure, etc.

[0192] For example, the outer surface and inner surface of the frame wall substrate can be shaped by CNC processing, such as forming an arc-shaped surface on the outer surface. The first opening, the second opening, the third opening, etc. can be formed on the frame wall substrate by CNC processing. The frame wall substrate, the skirt structure and the injection molding structure can be shaped by CNC processing to form a step structure, and a mounting slot can be formed on the inner surface of the back cover substrate by CNC.

[0193] Fig.11j for Figure 4 Another enlarged schematic diagram of the local structure of the middle shell.

[0194] See also Fig.11jAs shown, for example, the frame wall substrate after the shaping process forms the frame wall 11, the outer surface 11b of the frame wall 11 can be an arc surface, and the frame wall 11 is provided with a second opening 116. The skirt structure forms the folding structure 12, and the frame wall 11, the folding structure 12 and the injection molding structure 30 form a step structure 13. The back cover substrate forms the back cover 20, and the inner surface of the back cover 20 has a mounting groove 22, etc., to obtain the above-mentioned housing (refer to Figure 4 shown).

[0195] That is, the above-mentioned shell can be obtained by combining stamping, roughing, bending, injection molding and CNC. Compared with the shell obtained by mainly using CNC processing and injection molding in the related art, the number of times and working hours of CNC processing are greatly reduced, and the overall strength of the shell is effectively improved. Under the condition of ensuring the high strength performance of the shell during and after molding, the manufacturing and processing cost is significantly reduced. Using lower manufacturing costs can obtain a shell with equivalent or higher strength, with a good finished product yield.

[0196] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two components or the interaction relationship between two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances. The terms "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0197] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A housing, characterized in that: It comprises a back cover and a side frame, wherein the side frame is arranged on one side of the back cover, and the side frame and the back cover enclose a receiving cavity; The inner surface of the frame wall of the side frame has a folded edge structure, one end of the folded edge structure is fixed to the frame wall, and the other end of the folded edge structure extends toward the convexity in the accommodating cavity. The folded edge structure is arranged circumferentially around the frame wall, and the frame wall, the folded edge structure and the back cover are an integrated structural component.

2. The housing according to claim 1, characterized in that The frame wall has a first gap, the folded edge structure has a second gap, and a third gap is formed between part of the frame wall and the back cover; The third slit, the first slit and the second slit are connected in sequence, and the first slit and the second slit divide a portion of the frame wall into a plurality of antenna radiators; The shell further includes an injection molding structure, part of which is located between at least part of the folding structure and part of the back cover, and the injection molding structure fills the first gap, the second gap and the third gap.

3. The housing according to claim 2, characterized in that: The second slit divides the hem structure into a plurality of sub-hem bodies, and the plurality of sub-hem bodies are sequentially arranged around the inner side of the frame wall, and the second slit is provided between the ends of two adjacent sub-hem bodies; At least part of the ends of the sub-folding edge bodies have a reinforcing portion protruding toward the accommodating cavity.

4. The housing according to any one of claims 1 to 3, characterized in that: The inner surface of the frame wall is a flat surface.

5. The housing according to claim 4, characterized in that: The frame wall includes a main body and an extension part, the main body is connected to the back cover, the extension part is located inside the main body, the inner surface of the extension part forms the inner surface of the frame wall, and the folding structure is located on the extension part; A slit structure is provided between the extension portion and a surface of the rear cover facing the accommodating cavity.

6. The housing according to claim 5, characterized in that The maximum thickness of the frame wall is greater than the maximum thickness of the back cover.

7. The housing according to claim 6, characterized in that The frame wall and the folding structure are formed by stamping, bending, roughening and CNC processing.

8. The housing according to claim 2, characterized in that: Part of the injection molding structure is located on a side of at least part of the folding structure facing the accommodating cavity; The frame wall, part of the injection molding structure and the folding structure form a step structure, and a side of part of the injection molding structure facing away from the back cover is flush with a side of the folding structure facing away from the back cover to form a support surface of the step structure.

9. The housing according to any one of claims 1 to 3, characterized in that: The molding material of the folding structure, the back cover and the frame wall includes metal material or alloy material.

10. An electronic device, characterized in that: It comprises a display screen and a shell as claimed in any one of claims 1 to 9, wherein the display screen and the back cover of the shell are respectively arranged on two opposite sides of a side frame of the shell.

11. The electronic device according to claim 10, characterized in that: The display screen is attached to the supporting surface of the step structure of the shell.

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