Miniature LED device

Abstract

The utility model discloses a miniature LED device, comprising a light-emitting unit array, the light-emitting unit array comprises a first base layer and a plurality of light-emitting units, the plurality of light-emitting units are distributed on the first base layer at intervals, and the surface of the first base layer is set as a first bonding surface; the functional unit array comprises a second base layer and a plurality of functional units, the plurality of functional units are distributed on the second base layer at intervals, and the surface of the second base layer is arranged as a second bonding surface; the bonding adhesive layer is arranged between the first bonding surface and the second bonding surface, the first bonding surface and the second bonding surface are bonded and bonded through the bonding adhesive layer, and at least one light-emitting unit in the multiple light-emitting units corresponds to at least one functional unit in the multiple functional units; and the first limiting structure is arranged on the second bonding surface and is used for limiting the light-emitting unit array during bonding. According to the utility model, the displacement of the functional unit array is reduced during fitting, and the brightness of the Micro LED device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and in particular to a micro LED device. Background Art

[0002] Micro LED display has superior performance, which needs to be further realized by superimposing and bonding other functional units, such as Micro Lens (to enhance light focusing) or quantum dot film (to achieve RGB colorization). Since the pixel size of Micro LED is very small, usually only tens of microns, the current bonding accuracy cannot meet the demand, affecting the brightness of Micro LED devices. Utility Model Content

[0003] The main purpose of the utility model is to provide a micro LED device.

[0004] In order to achieve the above object, the utility model provides a micro LED device, comprising:

[0005] A light emitting unit array, the light emitting unit array comprising a first base layer and a plurality of light emitting units, the plurality of light emitting units are distributed on the first base layer at intervals, and a surface of the first base layer is set as a first bonding surface;

[0006] A functional unit array, the functional unit array comprising a second base layer and a plurality of functional units, the plurality of functional units are distributed on the second base layer at intervals, and a surface of the second base layer is configured as a second bonding surface;

[0007] a bonding adhesive layer, provided between the first bonding surface and the second bonding surface, the first bonding surface and the second bonding surface are bonded and bonded by the bonding adhesive layer, and at least one of the plurality of light-emitting units corresponds to at least one of the plurality of functional units;

[0008] The first limiting structure is provided on the second bonding surface and is located at the periphery of the functional unit, and is used for limiting the functional unit array during bonding.

[0009] Furthermore, the first limiting structure includes a plurality of micro-convex structures arranged on the second bonding surface, and the micro-convex structures are at least partially embedded in the bonding adhesive layer.

[0010] Furthermore, the micro-convex structures are provided in plurality, and the groove between adjacent micro-convex structures has two oppositely distributed straight surfaces, and the two straight surfaces are joined at the apex of the groove.

[0011] Furthermore, the micro-convex structure corresponds to the first base layer and is staggered with the light-emitting unit.

[0012] Furthermore, one end of the micro-convex structure away from the second bonding surface is set as a pointed end, and the pointed end is embedded in the bonding adhesive layer.

[0013] Furthermore, the micro LED device also includes a second limiting structure, which is arranged on the first bonding surface, and the first limiting structure and the second limiting structure are plugged together to limit the functional unit array.

[0014] Further, the first limiting structure is a positioning groove provided on the second bonding surface, and the second limiting structure is a positioning protrusion provided on the first bonding surface; and / or,

[0015] The first limiting structure is a positioning protrusion provided on the second bonding surface, and the second limiting structure is a positioning groove provided on the first bonding surface, and the positioning groove and the positioning protrusion are plug-fitted.

[0016] Furthermore, the positioning protrusion passes through the bonding adhesive layer and is plugged into and matched with the positioning groove.

[0017] Furthermore, the first limiting structure is arranged on both sides of the second bonding surface, and the second limiting structure is arranged on both sides of the first bonding surface.

[0018] Furthermore, the functional unit array includes a quantum dot membrane, the functional units are quantum dots arranged on the quantum dot membrane, and the first limiting structure is located at the periphery of the quantum dots.

[0019] Furthermore, the functional unit array includes a lens sheet, the functional units are light-transmitting points arranged on the lens sheet, and the first limiting structure is located at the periphery of the light-transmitting points.

[0020] In the embodiment of the utility model, a light-emitting unit array is provided, the light-emitting unit array includes a first base layer and a plurality of light-emitting units, the plurality of light-emitting units are spaced apart on the first base layer, and the surface of the first base layer is provided as a first bonding surface; a functional unit array, the functional unit array includes a second base layer and a plurality of functional units, the plurality of functional units are spaced apart on the second base layer, and the surface of the second base layer is provided as a second bonding surface; a bonding layer is provided between the first bonding surface and the second bonding surface, the first bonding surface and the second bonding surface are bonded and bonded by the bonding layer, and at least one of the plurality of light-emitting units corresponds to at least one of the plurality of functional units; a first limiting structure is provided on the second bonding surface and is located at the periphery of the functional unit, and is used to limit the functional unit array during bonding, so that when the functional unit array and the light-emitting unit array are bonded by the bonding layer, the first limiting structure located on the functional unit array can limit the functional unit array, thereby achieving the technical effect of reducing the displacement of the functional unit array during bonding and improving the bonding accuracy, thereby solving the problem that the bonding accuracy of the functional unit array of the micro LED in the related art is low and it is difficult to meet the accuracy requirements.

[0021] Moreover, after improving the fitting accuracy between the functional unit array and the light-emitting unit array, the device yield is improved and the device brightness is significantly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings constituting a part of the present invention are used to provide a further understanding of the present invention, so that other features, purposes and advantages of the present invention become more obvious. The drawings and descriptions of the schematic embodiments of the present invention are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0023] Figure 1 This is a schematic diagram of the structure of a micro LED device in the related technology

[0024] Figure 2 It is a schematic diagram of the functional unit array in the micro LED device in the related art being offset during bonding;

[0025] Figure 3 is a schematic structural diagram of a micro LED device according to an embodiment of the present invention;

[0026] Figure 4 is a schematic structural diagram of a micro LED device according to another embodiment of the present invention;

[0027] Among them, 1 functional unit array, 10 second base layer, 11 functional unit, 12 second bonding surface, 2 light-emitting unit array, 20 first base layer, 21 light-emitting unit, 22 first bonding surface, 3 bonding glue layer, 4 first limiting structure, 40 micro-convex structure, 41 positioning groove, 3 bonding glue layer, 5 bonding conductive material, 6 CMOS, 7 FPCB board, 8 second limiting structure, 80 positioning protrusion, 9 pressure head. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0029] It should be noted that the terms "first", "second", etc. in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so as to describe the embodiments of the utility model described here.

[0030] In the present invention, the directions or positional relationships indicated by the terms "upper", "lower", "inner", etc. are based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific direction, or to be constructed and operated in a specific direction.

[0031] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0032] In addition, the terms "disposed", "provided with", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0033] In addition, the term "plurality" shall mean two or more.

[0034] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] like Figure 1 As shown, in Micro LED, it is necessary to bond other functional unit arrays 1 on the Micro LED (light-emitting unit array 2) that can emit blue light to realize the corresponding functions, such as bonding Micro Lens to enhance the focusing strength, or bonding quantum dot film to realize RGB colorization. In the related art, the bonding process is to first apply bonding glue on the Micro LED, press the functional unit on the bonding glue through a bonding device with a pressing head 9, then release the pressing head, take out the bonded product and put it into related equipment such as UV furnace or oven for baking. Figure 2 As shown, since the bonding adhesive has a certain fluidity, the functional unit array 1 may produce secondary displacement during the process of loosening the pressure head 9 and removing it, which has a great impact on product performance.

[0036] To solve the above technical problems, Figure 3 and Figure 4 As shown, the embodiment of the utility model provides a micro LED device, including:

[0037] The light emitting unit array 2 includes a first base layer 20 and a plurality of light emitting units 21. The plurality of light emitting units 21 are distributed on the first base layer 20 at intervals. The surface of the first base layer 20 is configured as a first bonding surface 22.

[0038] A functional unit array 1, comprising a second base layer 10 and a plurality of functional units 11, wherein the plurality of functional units 11 are distributed on the second base layer 10 at intervals, and a surface of the second base layer 10 is configured as a second adhesive surface 12;

[0039] The bonding adhesive layer 3 is provided between the first bonding surface 22 and the second bonding surface 12, the first bonding surface 22 and the second bonding surface 12 are bonded and bonded by the bonding adhesive layer 3, and at least one of the plurality of light-emitting units 21 corresponds to at least one of the plurality of functional units 11;

[0040] The first limiting structure 4 is provided on the second adhesive surface 12 and is located at the periphery of the functional unit 11, and is used to limit the functional unit array 1 during bonding.

[0041] In this embodiment, the light-emitting unit array 2 is a prefabricated Micro LED, which includes a first substrate 20 and a plurality of light-emitting units 21, wherein the plurality of light-emitting units 21 are spaced apart on the first substrate 20 so that adjacent light-emitting units 21 do not interfere with each other. Correspondingly, the functional unit array 1 is a prefabricated functional component according to the effect to be achieved by the LED device, which includes a second substrate 10 and a plurality of functional units 11, wherein the plurality of functional units 11 are spaced apart on the second substrate 10 and correspond to the light-emitting units 21, and the light emitted by each light-emitting unit 21 is emitted after passing through the corresponding functional unit 11.

[0042] In order to achieve the bonding of the light emitting unit array 2 and the functional unit array 1, the surface of the first base layer 20 is set as the first bonding surface 22, and the surface of the second base layer 10 is set as the second bonding surface 12. The first bonding surface 22 and the second bonding surface 12 can be bonded and bonded by the bonding adhesive layer 3. In order to prevent the functional unit array 1 from being offset relative to the light emitting unit array 2 during the bonding process, a first limiting structure 4 is provided on the second bonding surface 12 in this embodiment. The first limiting structure 4 limits the functional unit array 1 during the bonding process, so that the functional unit array 1 can maintain the stability of the position after bonding, and reduce the displacement caused by the movement of the pressure head 9 and the secondary movement of the product.

[0043] According to different limiting methods, the first limiting structure 4 has different structural forms. In one embodiment, the friction between the second bonding surface 12 and the bonding adhesive layer 3 can be increased by the first limiting structure 4, so that the bonding strength is improved under the cooperation of the first limiting structure 4 and the bonding adhesive layer 3, and the displacement of the functional unit array 1 is reduced. In this embodiment, the first limiting structure 4 can be a protruding structure formed on the second bonding surface 12. On this basis, the protruding structure has a variety of structural forms, which are not limited in this embodiment.

[0044] In another embodiment, the first limiting structure 4 is configured to cooperate with a specific structure on the first bonding surface 22 to achieve the limitation of the functional unit array 1. For example, the first limiting structure 4 is configured to be able to be plugged into and cooperate with a groove on the first bonding surface 22 to achieve the limitation of the functional unit array 1 in the horizontal direction, etc.

[0045] In order to prevent the first limiting structure 4 from affecting the incident light of the functional unit 11, in this embodiment, the first limiting structure 4 is arranged at the periphery of the functional unit 11. There is a spacing material between adjacent functional units 11, and the spacing material is part of the second base layer 10. The first limiting structure 4 is at least located on the surface of the spacing material.

[0046] In one embodiment of the light emitting unit array 2, as Figure 3As shown, the light emitting unit array 2 further includes an FPCB board 7 and a CMOS 6, wherein the CMOS 6 is fixed on the FPCB board 7, and the light emitting unit 21 is bonded to the CMOS 6 via a bonding conductive material 5. The functional unit array 1 may include at least one of a Micro Lens and a quantum dot film.

[0047] This embodiment achieves the purpose that when the functional unit array 1 and the light-emitting unit array 2 are bonded together through the bonding adhesive layer 3, the first limiting structure 4 located on the functional unit array 1 can limit the functional unit array 1, thereby achieving the technical effect of reducing the displacement of the functional unit array 1 during bonding and improving the bonding accuracy, thereby solving the problem that the bonding accuracy of the functional unit 11 of the micro-LED in the related art is low and it is difficult to meet the accuracy requirements.

[0048] Furthermore, after improving the bonding accuracy between the functional unit array 1 and the light-emitting unit array 2, the device yield is improved and the device brightness is significantly improved.

[0049] In one embodiment of the first limiting structure 4, as Figure 3 As shown, the first limiting structure 4 includes a plurality of micro-convex structures 40 provided on the second bonding surface 12, and the micro-convex structures 40 are at least partially embedded in the bonding adhesive layer 3. In this embodiment, by forming a plurality of micro-convex structures 40 on the second bonding surface 12, the friction between the second bonding surface 12 and the bonding adhesive layer 3 can be increased by the micro-convex structures 40, thereby improving the bonding strength and reducing the offset displacement after bonding. In this embodiment, the micro-convex structures 40 can be formed by 3D printing or etching on the second bonding surface 12.

[0050] To further increase friction, Figure 3 As shown, the micro-convex structure 40 in this embodiment is arranged in plurality, and the groove between adjacent micro-convex structures 40 has two relatively distributed straight surfaces, and the two straight surfaces are joined at the vertices of the groove, so that the cross-section of the formed groove is triangular. When the micro-convex structure 40 is embedded in the bonding adhesive layer, the bonding adhesive layer is embedded in the triangular groove, so that the friction force can be further increased.

[0051] Since the pressure head moves horizontally after bonding, in order to further prevent the functional unit from moving, in this embodiment, the micro-convex structure is set as a triangle with a pointed tip on the basis of the above embodiment, and the micro-convex structure is set obliquely. Figure 2 As shown, taking the movement of the pressure head toward the left as an example, the tip of the micro-convex structure is inclined toward the right, thereby further preventing the functional unit from moving toward the right.

[0052] In order to prevent the micro-convex structure 40 from interfering with the light emitted from the light emitting unit 21 to the functional unit 11, the micro-convex structure 40 should avoid the light path from the light emitting unit 21 to the functional unit 11. Figure 3 As shown, in this embodiment, the micro-convex structure 40 should not only be located at the periphery of the functional unit 11, but also correspond to the first base layer 20 and be staggered with the light-emitting unit 21, so that the light emitted from the light-emitting unit 21 to the functional unit 11 will not be interfered by the micro-convex structure 40.

[0053] Since the functional unit array 1 needs to be pressed down onto the bonding adhesive layer 3 during bonding, in order to facilitate the embedding of the micro-convex structure 40 into the bonding adhesive layer 3 to improve the bonding strength, in this embodiment, the end of the micro-convex structure 40 away from the second bonding surface 12 is set as a pointed end, and the pointed end is embedded in the bonding adhesive layer 3.

[0054] In another embodiment of positioning the functional unit 11, Figure 4 As shown, the micro LED device further includes a second limiting structure 8 , which is disposed on the first bonding surface 22 , and the first limiting structure 4 is plugged into and matched with the second limiting structure 8 to limit the positioning functional unit array 1 .

[0055] In this embodiment, the first limiting structure 4 and the second limiting structure 8 can be plugged and matched in the vertical direction, so that the position of the functional unit 11 can be accurately positioned. The first limiting structure 4 can be a positioning groove 41 provided on the second bonding surface 12, and the second limiting structure 8 is a positioning protrusion 80 provided on the first bonding surface 22. When the functional unit array 1 is attached, the positioning protrusion 80 can be partially inserted into the positioning groove 41, so that the functional unit array 1 is accurately positioned, and the functional unit array 1 can be prevented from being displaced in the horizontal direction.

[0056] It is understandable that the first limiting structure 4 may be provided as a positioning protrusion 80 (not shown in the figure) in addition to being provided as the positioning groove 41, and the corresponding second limiting structure 8 may be provided as a positioning groove 41 (not shown in the figure) in addition to being provided as the positioning protrusion 80. The first bonding surface 22 may be provided with both the positioning protrusion 80 and the positioning groove 41, or only with the positioning protrusion 80 or the positioning groove 41. Similarly, the second bonding surface 12 may be provided with both the positioning protrusion 80 and the positioning groove 41, or only with the positioning protrusion 80 or the positioning groove 41.

[0057] In order to facilitate the insertion and matching of the positioning protrusion 80 and the positioning groove 41, the distal end of the positioning protrusion 80 in this embodiment can be set to a cone, and a trumpet-shaped opening can be set at the open end of the positioning groove 41. The positions of the positioning protrusion 80 and the positioning groove 41 should also avoid the light path from the light emitting unit 21 to the functional unit 11.

[0058] In terms of the position distribution of the first limiting structure 4 and the second limiting structure 8 , the first limiting structure 4 is disposed on both sides or around the second bonding surface 12 , and the second limiting structure 8 is disposed on both sides or around the first bonding surface 22 .

[0059] It can be understood that the first limiting structure 4 can be arranged between adjacent functional units 11 , and the corresponding second limiting structure 8 can also be arranged between adjacent light-emitting units 21 .

[0060] To improve the bonding strength between the functional unit 11 and the light emitting unit 21 , the bonding adhesive layer 3 needs to completely cover the first bonding surface 22 and the second bonding surface 12 , so the positioning protrusion 80 needs to pass through the bonding adhesive layer 3 and be plugged into the positioning groove 41 .

[0061] In addition, it should be noted that the second bonding surface 12 of the functional unit array 1 can be provided with a serrated micro-convex structure 40 and a positioning groove 41 or a positioning protrusion 80, so as to improve the bonding strength of the bonding adhesive layer 3 to the functional unit array 1 while accurately positioning the functional unit array 1.

[0062] In one embodiment of the functional unit array 1, the functional unit array 1 includes a quantum dot film, the functional unit 11 is a quantum dot film on which a plurality of quantum dots are arranged at intervals, and the first limiting structure 4 is located at the periphery of the quantum dots. After the quantum dot film is attached to the light-emitting unit 21, each quantum dot corresponds to each light-emitting point on the light-emitting unit 21.

[0063] In another embodiment of the functional unit array 1, the functional unit array 1 comprises a lens sheet, the functional unit 11 is a lens sheet on which a plurality of light-transmitting points distributed at intervals are arranged, and the first limiting structure 4 is located at the periphery of the light-transmitting points.

[0064] According to another aspect of the utility model of the present application, a preparation process of a micro LED structure is provided:

[0065] Step 1: First, design a Micro LED (light-emitting unit array 2) according to product requirements. The size is determined according to the requirements, such as the product size of 6MM×3MM;

[0066] Step 2: Perform LLO (laser lift-off) of the Micro LED product, and adjust the laser energy according to the actual situation (40%-80%);

[0067] Step 3: Make a 6×3×0.2MM quantum dot membrane (functional unit array 1), the quantum dot hole position corresponds to the LED pixel point in Step 2, so that the LED is lit to excite the corresponding quantum dot liquid to emit the corresponding color, and at the same time, the bottom of the quantum dot membrane (the contact surface with the LED) is microstructured to form a serrated first limiting structure 4, which can be obtained by 3D printing or etching;

[0068] Step 4: The equipment applies bonding glue (bonding glue layer 3), and the bonding glue can be epoxy resin, UV glue or silicone, etc.;

[0069] Step 5: The laminating equipment laminates the quantum dot film to make them correspond to the pixel points one by one, and performs relevant treatment on the laminated products, such as UV curing of UV glue, and heating curing of silicone or epoxy resin under corresponding conditions;

[0070] Step 6: Conduct relevant tests on the product, such as whether the corresponding pixels of the appearance are offset, and test the display effect by powering on.

[0071] In this embodiment, Step 3 can be replaced by: making a positioning groove 41 on the second bonding surface 12 of the quantum dot film, and making a positioning protrusion 80 on the first bonding surface of the Micro LED. The positioning groove 41 and the positioning protrusion 80 can be obtained by 3D printing or etching.

[0072] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Within the spirit and principle of the present invention, any modification, equivalent replacement, improvement, etc., shall be included in the protection scope of the present invention.

[0073] The above description is only the preferred embodiment of the utility model and is not intended to limit the utility model. For those skilled in the art, the utility model may have various modifications and changes. Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement, etc. made shall be included in the protection scope of the utility model.

Claims

1. A micro LED device, characterized in that: include: A light emitting unit array, the light emitting unit array comprising a first base layer and a plurality of light emitting units, the plurality of light emitting units are distributed on the first base layer at intervals, and a surface of the first base layer is set as a first bonding surface; A functional unit array, the functional unit array comprising a second base layer and a plurality of functional units, the plurality of functional units are distributed on the second base layer at intervals, and a surface of the second base layer is configured as a second bonding surface; a bonding adhesive layer, provided between the first bonding surface and the second bonding surface, the first bonding surface and the second bonding surface are bonded and bonded by the bonding adhesive layer, and at least one of the plurality of light-emitting units corresponds to at least one of the plurality of functional units; The first limiting structure is arranged on the second bonding surface and is located at the periphery of the functional unit. The first limiting structure is used to limit the functional unit array during bonding.

2. The micro LED device according to claim 1, characterized in that: The first limiting structure includes a plurality of micro-convex structures arranged on the second bonding surface, and the micro-convex structures are at least partially embedded in the bonding adhesive layer.

3. The micro LED device according to claim 2, characterized in that: The micro-convex structures are arranged in plurality, and the groove between adjacent micro-convex structures has two straight surfaces that are oppositely distributed, and the two straight surfaces are joined at the apex of the groove.

4. The micro LED device according to claim 3, characterized in that: The micro-convex structure corresponds to the first base layer and is staggered with the light-emitting unit.

5. The micro LED device according to any one of claims 2 to 4, characterized in that: One end of the micro-convex structure away from the second bonding surface is set as a tip, and the tip is embedded in the bonding adhesive layer.

6. The micro LED device according to claim 1, characterized in that: The micro LED device further includes a second limiting structure, which is disposed on the first bonding surface, and the first limiting structure and the second limiting structure are plugged together to limit the functional unit array.

7. The micro LED device according to claim 6, characterized in that: The first limiting structure is a positioning groove provided on the second bonding surface, and the second limiting structure is a positioning protrusion provided on the first bonding surface; and / or, The first limiting structure is a positioning protrusion provided on the second bonding surface, and the second limiting structure is a positioning groove provided on the first bonding surface, and the positioning groove and the positioning protrusion are plug-fitted.

8. The micro LED device according to claim 6 or 7, characterized in that: The first limiting structure is arranged on both sides of the second bonding surface, and the second limiting structure is arranged on both sides of the first bonding surface.

9. The micro LED device according to claim 1, characterized in that: The functional unit array includes a quantum dot membrane, the functional units are quantum dots arranged on the quantum dot membrane, and the first limiting structure is located at the periphery of the quantum dots.

10. The micro LED device according to claim 1, characterized in that: The functional unit array includes a lens sheet, the functional units are light-transmitting points arranged on the lens sheet, and the first limiting structure is located at the periphery of the light-transmitting points.

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