Large display panel, display panel and display device

Abstract

The utility model discloses a large display panel, a display panel and a display device.The large display panel comprises a substrate layer, a touch layer, an organic protection layer and a peeling prevention structure, the substrate layer comprises an edge area arranged along the outer boundary of the substrate layer and a middle area located on the inner side of the edge area, and the middle area is provided with at least one display panel area; the touch layer is located on one side of the substrate layer and comprises a first conducting layer, an organic insulating layer and a second conducting layer which are arranged in a laminated mode, and the orthographic projection of the organic insulating layer on the substrate layer is located in the substrate layer; the organic protection layer is located on the side, away from the substrate layer, of the touch layer and at least located in the middle area; the peeling-off prevention structure is at least located in the edge area and used for preventing the protective layer from peeling off in the edge area. According to the display panel provided by the invention, the problem of poor contact between the organic protection layer and the organic insulation layer at the position close to the edge of the display panel can be effectively improved, so that the yield of the display panel is improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display board, a display panel and a display device. Background Art

[0002] During the manufacturing process, the display panel is usually cut from a large display panel, which includes multiple display panel areas for forming the display panel. The edge of the large display panel has poor contact performance between film layers, which easily affects the yield of the large display panel. Utility Model Content

[0003] The purpose of this application is to at least solve the problem of poor yield of large display panels. This purpose is achieved through the following technical solutions:

[0004] The first aspect of the present application provides a large display panel, comprising:

[0005] A substrate layer, comprising an edge region arranged along an outer boundary of the substrate layer and a middle region located inside the edge region, wherein at least one display panel region is arranged in the middle region;

[0006] A touch layer, located on one side of the substrate layer, the touch layer comprising a first conductive layer, an organic insulating layer, and a second conductive layer which are stacked, the first conductive layer and the second conductive layer being located in the display panel region, and an orthographic projection of the organic insulating layer on the substrate layer being located within the substrate layer;

[0007] an organic protective layer, located on a side of the touch layer away from the substrate layer, the organic protective layer being at least located in the middle region;

[0008] The peeling prevention structure is at least located in the edge area and is used to prevent the protective layer from peeling off in the edge area.

[0009] The display panel provided in the present application includes a substrate layer, a touch layer, an organic protective layer and a peeling prevention structure. The substrate layer includes an edge region arranged along the outer boundary of the substrate layer and a middle region located inside the edge region. The middle region is provided with at least one display panel region. The display panel can retain the display panel region by cutting to form at least one display panel. The touch layer is located on one side of the substrate layer. The touch layer includes a first conductive layer, an organic insulating layer and a second conductive layer arranged in a stacked manner. The first conductive layer and the second conductive layer are located in the display panel region. One of the first conductive layer and the second conductive layer can be used to form a touch electrode and a first touch wiring, and the other can be used to form a second touch wiring, thereby realizing a touch function. The organic insulating layer is used to realize insulation between the first conductive layer and the second conductive layer. The orthographic projection of the organic insulating layer on the substrate layer is located inside the substrate layer, that is, the orthographic projection of the organic insulating layer on the substrate layer can be located inside the outer boundary of the substrate layer, or the outer boundary of the orthographic projection of the organic insulating layer on the substrate layer can coincide with the outer boundary of the substrate layer. The organic protective layer is located on the side of the touch layer away from the substrate layer, and the organic protective layer is at least located in the middle area. The organic protective layer is used to protect the touch layer. The peeling prevention structure is at least located in the edge area, and is used to prevent the organic protective layer from peeling off in the edge area, thereby helping to improve the yield of the edge area in the display panel and improve the poor separation between the organic protective layer and the organic insulating layer. In the display panel of the present application, by providing a peeling prevention structure, the poor edge area can be improved, which helps to improve the yield of the display panel, and further helps to improve the yield of the product prepared by the display panel.

[0010] In some embodiments of the present application, the orthographic projection of the organic protective layer on the substrate layer is located within the orthographic projection of the organic insulating layer on the substrate layer, and there is a first preset distance between the outer boundary of the orthographic projection of the organic protective layer on the substrate layer and the outer boundary of the substrate layer, and the peeling prevention structure is located in the area defined by the first preset distance, and the peeling prevention structure includes a first hollow portion formed in the organic protective layer, and the orthographic projection of the first hollow portion on the substrate covers the area defined by the first preset distance.

[0011] In some embodiments of the present application, the organic insulating layer has a second preset distance between the outer boundary of the orthographic projection on the substrate layer and the outer boundary of the substrate layer, the second preset distance is equal to or greater than the width of the corresponding edge area, and the first preset distance is greater than the corresponding second preset distance.

[0012] In some embodiments of the present application, the substrate layer also includes a first test area, which is located between the outer boundary of the orthographic projection of the organic insulation layer on the substrate layer and the outer boundary of the orthographic projection of the organic protective layer on the substrate layer, and the substrate layer also includes a test terminal arranged in the first test area.

[0013] In some embodiments of the present application, the middle area also includes a second test area located outside the at least one display panel area, the outer boundary of the second test area close to the edge area coincides with the inner boundary of the first test area, the outer boundary of the orthographic projection of the organic protective layer on the substrate layer coincides with the boundary of the middle area, the outer boundary of the orthographic projection of the organic protective layer on the substrate layer is located on the inner side of the outer boundary of the orthographic projection of the organic insulating layer on the substrate layer, the peeling prevention structure is located in the edge area and the first test area, and the peeling prevention structure includes a second hollow portion formed in the organic protective layer, and the orthographic projection of the second hollow portion on the substrate covers the edge area and the first test area.

[0014] In some embodiments of the present application, the large display panel also includes an isolation layer located between the substrate layer and the touch layer, the isolation layer includes a thickness maintaining area and a thickness reducing area, the thickness reducing area is arranged circumferentially along the outer boundary of the large display panel, the thickness maintaining area is located on the inner side of the thickness reducing area, the thickness of the thickness reducing area gradually decreases from the boundary of the thickness maintaining area toward the outer boundary of the large display panel, and the orthographic projection of the organic insulating layer on the substrate layer is located within the orthographic projection of the thickness maintaining area on the substrate layer.

[0015] In some embodiments of the present application, a reinforcement layer is further included, wherein the reinforcement layer is located between the organic protection layer and the touch layer, the reinforcement layer is at least located in the edge area, and the peeling prevention structure includes a portion of the reinforcement layer located in the edge area.

[0016] In some embodiments of the present application, the display panel area includes a display area and a binding area; the organic protective layer is provided with a first via hole for exposing at least part of the binding area, the reinforcement layer is also located in the middle area, the reinforcement layer is provided with a second via hole in the middle area, and the orthographic projection of the second via hole on the substrate layer is located within the orthographic projection of the first via hole on the substrate layer.

[0017] In some embodiments of the present application, the material of the enhancement layer includes an inorganic material; and / or the thickness of the enhancement layer is in the range of 100 angstroms to 200 angstroms.

[0018] A second aspect of the present application further provides a display panel, comprising:

[0019] A display substrate, comprising a display area and a binding area;

[0020] A touch structure layer, located on one side of the display substrate, the touch structure layer comprising a first conductive layer, an organic insulating layer and a second conductive layer which are stacked, and the touch structure layer is located in the display area;

[0021] A reinforcing layer, located on a side of the touch structure layer away from the display substrate, and at least located in the display area;

[0022] The organic protection layer is located on a side of the enhancement layer away from the display substrate.

[0023] In some embodiments of the present application, the organic protection layer is provided with a first via hole, and an orthographic projection of the first via hole on the display substrate at least partially overlaps with the binding area to expose at least a portion of the binding area;

[0024] The reinforcing layer is provided with a second via hole, wherein an orthographic projection of the second via hole on the display substrate at least partially overlaps with the binding area to expose at least a portion of the binding area;

[0025] The orthographic projection of the second via hole on the display substrate overlaps at least partially with the first via hole on the display substrate.

[0026] In some embodiments of the present application, a planar layer is further included. The planar layer is at least located in the display area and on a side of the organic protective layer away from the display substrate. The planar layer includes a third via hole connected to the second via hole.

[0027] In some embodiments of the present application, the material of the planar layer includes organic material and / or conductive material.

[0028] The third aspect of the present application also provides a display device, comprising any display panel provided in the second aspect of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0030] Figure 1 It is a top view of a display large board in the prior art;

[0031] Figure 2 It is a side view of a prior art showing the preparation process of a large board;

[0032] Figure 3 It is a top view of a large display panel provided in an embodiment of the present application;

[0033] Figure 4 yes Figure 1 Sectional view along P-P';

[0034] Figure 5 yes Figure 1 A cross-sectional view along the middle line Q-Q';

[0035] Figure 6 It is a top view of a display panel area in a display panel provided by an embodiment of the present application;

[0036] Figure 7 yes Figure 3 Another cross-sectional view along the P-P' line;

[0037] Figure 8 yes Figure 3 Another cross-sectional view along the P-P' line;

[0038] Fig. 9 yes Figure 3 Another cross-sectional view along the P-P' line;

[0039] Fig.10 yes Figure 3 Another cross-sectional view along the P-P' line;

[0040] Fig.11 yes Figure 3 Another cross-sectional view along the P-P' line;

[0041] Fig.12 yes Figure 3 Another cross-sectional view along the P-P' line;

[0042] Fig.13 It is a top view of a display panel area in a display panel provided by an embodiment of the present application;

[0043] Fig.14 is a top view of a protective layer in a display panel area of ​​a display panel provided by an embodiment of the present application;

[0044] Fig.15 yes Fig.13 Sectional view along the middle line M-M';

[0045] Fig.16 is a cross-sectional view of a display area in a display panel region of a display panel provided in an embodiment of the present application;

[0046] Fig.17 is a top view of another large display panel provided in an embodiment of the present application;

[0047] Fig.18 is a top view of a display panel provided in an embodiment of the present application;

[0048] Fig.19 yes Fig.18 A cross-sectional view taken along the N-N' line;

[0049] Fig. 20 yes Fig.18 A cross-sectional view along the Y-Y' line;

[0050] Fig.21 is a top view of a protective layer inside a display panel provided in an embodiment of the present application;

[0051] Fig. 22 is a top view of an enhancement layer in a display panel provided by an embodiment of the present application;

[0052] Fig.23 yes Fig.18 Another cross-sectional view along the Y-Y' line;

[0053] Fig.24 is a top view of a flat layer in a display panel provided by an embodiment of the present application;

[0054] Fig.25 is a flow chart of a method for preparing a display panel provided in an embodiment of the present application;

[0055] Figures 26 to 34 It is a schematic diagram of film layer changes during the preparation process of a display panel provided in the present application;

[0056] Fig.35 It is a structural schematic diagram of a display device provided by the present application.

[0057] The reference numerals are as follows:

[0058] 1. Display panel; 11. Substrate layer; 12. Touch layer; 121. Organic insulation layer; 10. Organic protection layer; 101. First via hole; 122. First conductive layer; 123. Second conductive layer; A1. Edge area; A2. Middle area; A21. Display panel area; A211. Display area; A212. Binding area; A22. Second test area; A3. First test area; 13. Isolation layer; 14. Reinforcement layer; 141. Second via hole; 15. Peeling prevention structure; 16. Flat layer; 2. Display panel; 21. Display substrate; 22. Touch structure layer; 3. Display device. DETAILED DESCRIPTION

[0059] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0060] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0061] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0062] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both upper and lower orientations. The device can be oriented otherwise (rotated 90 degrees or in other directions) and the spatial relative descriptors used in the text are interpreted accordingly.

[0063] like Figure 1 and Figure 2 As shown, the inventor has found through research that in the related technology, the reason why the contact performance between the film layers at the edge position of the display panel 01 is poor is that: with the continuous improvement of users' pursuit of the sensory experience of display devices, four-sided curved, folding, scroll and other products have gradually entered the panel market. At the same time, the demand for product flexibility has been further improved, making the product have a better bending shape and becoming an indispensable technical reserve. In the preparation process of the display panel, due to the high hardness of the inorganic layer itself, during the multi-form bending process of conventional products, the display panel has the problem of poor fitting due to extrusion when entering the four corner arc surfaces. Compared with inorganic materials, organic materials have better tensile and ductility, and can better adapt to a variety of bending shapes. Therefore, part of the inorganic material layer in the display panel is replaced with an organic material layer, which can solve the problem of poor arc angle of the display panel. Therefore, part of the inorganic material layer is replaced by the organic material layer in the display panel 01 used for preparing the display panel. However, after part of the inorganic material layer is replaced by the organic material layer in the display panel 01, since the display panel 01 includes a substrate layer, a touch layer and an organic protective layer located on the side of the touch layer away from the substrate layer, and the touch layer includes a first conductive layer, an organic insulating layer and a second conductive layer, during the patterning process of the organic protective layer, the contact part of the organic protective layer and the organic insulating layer will be separated due to the poor adhesion between the two. This problem is easy to occur in the edge area A01 of the display panel 01 used for preparing the display panel. When multiple display panels 01 are assembled into a larger display panel, the edge area A01 of each display panel 01 has the above-mentioned defect, wherein Figure 1The B0 region is the region where the above-mentioned defect occurs. At the same time, since the organic protective layer adopts a negative adhesive material, if the portion of the organic protective layer located in the edge region A01 is to be removed, it is necessary to use a mask plate 02 to block the portion of the organic protective layer located in the edge region A01. However, there is a lateral light leakage phenomenon in the edge region A01. Although the edge region A01 can be blocked by a light shielding plate 04, only the edge region A01 is blocked in the related technology, and there is still a light leakage problem at the position A03 between the edge region A01 and the middle region A02. During the exposure of the organic protective layer by the exposure device 04, a certain amount of light will pass through the region A03 between the edge region A01 and the middle region A02, thereby causing the region A03 between the edge region A01 and the middle region A02 to be exposed by the transmitted light, resulting in the portion of the organic protective layer located in region 03 not being easily developed in the subsequent development process, thereby remaining to form a certain residue, which is also likely to cause the edge region A01 to be defective. The area A03 between the edge area A01 and the middle area A02 can be used to form a test terminal, etc. The middle area A02 includes a display panel area for forming a display panel.

[0064] like Figures 3 to 6 As shown, according to the embodiment of the present application, a large display panel 1 is proposed, including a substrate layer 11, a touch layer 12, an organic protective layer 10 and a peeling prevention structure 15. The substrate layer 11 includes an edge region A1 arranged along the outer boundary of the substrate layer 11 and a middle region A2 located inside the edge region A1, and at least one display panel region A21 is arranged in the middle region A2. The touch layer 12 is located on one side of the substrate layer 11, and the touch layer 12 includes a first conductive layer 122, an organic insulating layer 121 and a second conductive layer 123 arranged in a stacked manner. The first conductive layer 122 and the second conductive layer 123 are located in the display panel region A21, and the orthographic projection of the organic insulating layer 121 on the substrate layer 11 is located in the substrate layer 11. The organic protective layer 10 is located on the side of the touch layer 12 away from the substrate layer 11, and the organic protective layer 10 is at least located in the middle region A2. The peeling prevention structure 15 is at least located in the edge region A1, and is used to prevent the protective layer from peeling off in the edge region A1.

[0065] The display panel 1 provided in the present application includes a substrate layer 11, a touch layer 12, an organic protective layer 10 and a peeling prevention structure 15. The substrate layer 11 includes an edge region A1 arranged along the outer boundary of the substrate layer 11 and an intermediate region A2 located inside the edge region A1. The intermediate region A2 is provided with at least one display panel region A21. The display panel 1 can retain the display panel region A21 by cutting to form at least one display panel 2. The touch layer 12 is located on one side of the substrate layer 11. The touch layer 12 includes a first conductive layer 122, an organic insulating layer 121 and a second conductive layer 123 arranged in a stacked manner. The first conductive layer 122 and the second conductive layer 123 are located in the display panel region A21. One of the first conductive layer 122 and the second conductive layer 123 can be used to form a touch electrode and a first touch wiring, and the other can be used to form a second touch wiring, thereby realizing a touch function. The organic insulating layer 121 is used to achieve insulation between the first conductive layer 122 and the second conductive layer 123. The orthographic projection of the organic insulating layer 121 on the substrate layer 11 is located inside the substrate layer 11, that is, the orthographic projection of the organic insulating layer 121 on the substrate layer 11 can be located inside the outer boundary of the substrate layer 11, or the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 can coincide with the outer boundary of the substrate layer 11. The organic protective layer 10 is located on the side of the touch layer 12 that is away from the substrate layer 11. The organic protective layer 10 is at least located in the middle area A2. The organic protective layer 10 is used to protect the touch layer 12. The peeling prevention structure 15 is at least located in the edge area A1, and is used to prevent the organic protective layer 10 from peeling off in the edge area A1, thereby helping to improve the yield of the edge area A1 in the display panel 1 and improve the poor separation between the organic protective layer 10 and the organic insulating layer 121. In the display panel 1 of the present application, the peeling prevention structure 15 is provided to improve the defect of the edge area A1, which helps to improve the yield of the display panel 1 and further helps to improve the yield of the product prepared by the display panel 1.

[0066] Specifically, the first conductive layer 122 may be located on a side of the second conductive layer 123 close to the substrate layer 11, or the first conductive layer 122 may be located on a side of the second conductive layer 123 away from the substrate layer 11. The touch electrode includes a first touch electrode and a second touch electrode.

[0067] Specifically, the material of the first conductive layer 122 and the second conductive layer 123 includes metal.

[0068] The touch electrodes may include first touch electrodes and second touch electrodes. The first touch electrodes are arranged in an array, and adjacent first touch electrodes along the row direction are connected by first touch wirings. The second touch electrodes are arranged in an array, and adjacent second touch electrodes along the column direction are connected by second touch wirings.

[0069] In a possible implementation, Figure 4and Figure 6 As shown, the orthographic projection of the organic protective layer 10 on the substrate layer 11 is located within the orthographic projection of the organic insulating layer 121 on the substrate layer 11, and there is a first preset distance L1 between the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 and the outer boundary of the substrate layer 11, and the peeling prevention structure 15 is located in the area defined by the first preset distance L1, and the peeling prevention structure 15 includes a first hollow portion 151 formed in the organic protective layer 10, and the orthographic projection of the first hollow portion 151 on the substrate covers the area defined by the first preset distance L1.

[0070] In the above implementation, if Figure 4 As shown, the orthographic projection of the organic protective layer 10 on the substrate layer 11 is located within the orthographic projection of the organic insulating layer 121 on the substrate layer 11, specifically including that the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 is located inside the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11, or, as Figure 7 As shown, the outer boundary of the orthographic projection of the organic protection layer 10 on the substrate layer 11 coincides with the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 .

[0071] In the above embodiment, there is a first preset distance L1 between the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 and the outer boundary of the substrate layer 11, wherein the orthographic projection of the organic protective layer 10 in the thickness direction of the substrate layer 11 and the orthographic projection of the substrate layer 11 in its own thickness direction have overlapping areas and non-overlapping areas, and the non-overlapping areas are areas of the orthographic projection of the substrate layer 11 in its own thickness direction that are not covered by the orthographic projection of the organic protective layer 10 in the thickness direction of the substrate layer 11, and the peeling prevention structure 15 is located in the area defined by the first preset distance L1, that is, located in the above-mentioned non-overlapping area.

[0072] In the above implementation, if Figure 6 As shown, the peeling prevention structure 15 includes a first hollow portion 151 formed on the organic protective layer 10, and the orthographic projection of the first hollow portion 151 on the substrate covers the area defined by the first preset distance L1. The peeling prevention structure 15 can reduce the area of ​​the organic protective layer 10 in the edge area A1, thereby improving the defect of the organic protective layer 10 in the edge area A1, improving the separation and peeling of the organic layer and the organic insulating layer 121 in the edge area A1, and improving the yield of the display panel 1.

[0073] In a possible implementation, Figure 8 As shown, there is a second preset distance L2 between the outer boundary of the positive projection of the organic insulating layer 121 on the substrate layer 11 and the outer boundary of the substrate layer 11, and the second preset distance L2 is equal to or greater than the width of the corresponding edge area A1, and the first preset distance L1 is greater than the corresponding second preset distance L2.

[0074] In the above embodiment, there is a second preset distance L2 between the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 and the outer boundary of the substrate layer 11, and the second preset distance L2 is equal to or greater than the width of the corresponding edge area A1, so the organic insulating layer 121 is not located in the edge area A1; and the first preset distance L1 is greater than the corresponding second preset distance L2, so that the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate is located within the orthographic projection of the organic insulating layer 121 on the substrate layer 11, and the organic protective layer 10 is not located in the insulating area, so that there is no organic insulating layer 121 and organic protective layer 10 in the insulating area, and thus there is no problem of poor fixation of the organic insulating layer 121 and the organic protective layer 10 in the edge area A1.

[0075] In a possible implementation, Figure 3 As shown, the substrate layer 11 also includes a first test area A3, which is located between the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 and the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11, and the substrate layer 11 also includes a test terminal arranged in the first test area A3.

[0076] In the above embodiment, the substrate layer 11 further includes a first test area A3 having a test terminal therein. There is no organic protective layer 10 in the first test area A3. The test terminal is used to detect the display panel area A21.

[0077] In a possible implementation, Figure 3 and Fig. 9 As shown, the middle area A2 also includes a second test area A22 located outside the at least one display panel area A21, the outer boundary of the second test area A22 close to the edge area A1 coincides with the inner boundary of the first test area A3, the outer boundary of the orthographic projection of the organic protection layer 10 on the substrate layer 11 coincides with the boundary of the middle area A2, the outer boundary of the orthographic projection of the organic protection layer 10 on the substrate layer 11 is located on the inner side of the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11, the peeling prevention structure 15 is located in the edge area A1 and the first test area A3, the peeling prevention structure 15 includes a second hollow portion 152 formed in the organic protection layer 10, and the orthographic projection of the second hollow portion 152 on the substrate covers the edge area A1 and the first test area A3.

[0078] In the above implementation, the second test area A22 may correspond to the display panel area A21 one-to-one, and is used to test the display panel area A21. The second test area A22 also includes a test terminal.

[0079] In the above embodiment, the peeling prevention structure 15 includes a second hollow portion 152 formed on the organic protective layer 10, and the orthographic projection of the second hollow portion 152 on the substrate covers the edge area A1 and the first test area A3. Due to design requirements, a protective layer needs to be set in the second test area A22. In order to achieve a balance between the yield of the second test area A22 and the yield of the edge area A1, the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 can be set to coincide with the boundary of the middle area A2, thereby maximizing the yield of the edge area A1 and the first test area A3 and ensuring the yield of the second test area A22. The peeling prevention structure 15 can prevent the organic protective layer 10 from being located in the edge area A1 and the first test area A3, thereby improving the defects of the organic protective layer 10 in the edge area A1 and the first test area A3, and improving the separation and peeling problems of the organic layer and the organic insulating layer 121 in the edge area A1, so as to improve the yield of the display panel 1.

[0080] In a possible implementation, Fig. 9 As shown, the display panel 1 also includes an isolation layer 13 located between the substrate layer 11 and the touch layer 12, the isolation layer 13 includes a thickness maintaining area 131 and a thickness reducing area 132, the thickness reducing area 132 is arranged along the outer boundary of the display panel 1, the thickness maintaining area 131 is located on the inner side of the thickness reducing area 132, the thickness of the thickness reducing area 132 gradually decreases from the boundary of the thickness maintaining area 131 toward the outer boundary of the display panel 1, and the orthographic projection of the organic insulating layer 121 on the substrate layer 11 is located within the orthographic projection of the thickness maintaining area 131 on the substrate layer 11.

[0081] In the above embodiment, the isolation layer 13 is located between the substrate layer 11 and the touch layer 12 to achieve isolation between the isolation layer 13 and the touch layer 12 . The isolation layer 13 can serve as a substrate for the touch layer 12 and achieve insulation between the touch layer 12 and the substrate layer 11 .

[0082] In the above embodiment, the organic insulating layer 121 can be made to contact only with the thickness maintaining area 131 of the isolation layer 13, so that the orthographic projection of the insulating layer on the substrate layer 11 and the orthographic projection of the thickness reducing area 132 on the substrate layer 11 do not overlap, that is, the organic insulating layer 121 does not contact with the thickness reducing area 132, thereby improving the poor contact problem with the organic insulating layer 121 caused by the change of the film thickness of the isolation layer 13, thereby further improving the yield of the display panel 1.

[0083] In a possible implementation, Fig.10 and Fig.11As shown, the display panel 1 further includes a reinforcement layer 14 , which is located between the organic protection layer 10 and the touch layer 12 . The reinforcement layer 14 is at least located in the edge region A1 , and the peeling prevention structure 15 includes a portion of the reinforcement layer 14 located in the edge region A1 .

[0084] In the above embodiment, the display panel 1 further includes a reinforcement layer 14 . The reinforcement layer 14 is located between the organic protection layer 10 and the touch layer 12 . The reinforcement layer 14 can be used to improve the fixing yield between the organic protection layer 10 and the touch layer 12 .

[0085] Specifically, the reinforcement layer 14 is at least located in the edge area A1, and the peeling prevention structure 15 includes a portion of the reinforcement layer 14 located in the edge area A1. One side of the portion of the reinforcement layer 14 located in the edge area A1 can be in contact with the organic protective layer 10, and the other side can be in contact with the organic insulating layer 121. Therefore, the peeling prevention structure 15 can improve the fixing yield between the organic protective layer 10 and the organic insulating layer 121, and improve the problem of poor fixing of the organic protective layer 10 and the organic insulating layer 121 in the edge area A1, thereby helping to improve the yield of the edge area A1 of the display panel 1.

[0086] Specifically, Fig.11 As shown, when the peeling prevention structure 15 includes the portion of the reinforcement layer 14 located in the edge area A1, the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 may coincide with the outer boundary of the substrate layer 11, and the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 may coincide with the outer boundary of the substrate layer 11. Alternatively, as Fig.12 As shown, the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 is located inside the outer boundary of the substrate layer 11; the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 coincides with the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11, or is located inside the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11. At this time, the portions of the orthographic projections of the organic protective layer 10 and the organic insulating layer 121 on the substrate layer 11 that are located in the edge area may form an overlapping area, and the orthographic projection of the reinforcement layer 14 on the substrate layer 11 may at least cover the above-mentioned overlapping area, thereby ensuring that the organic protective layer 10 and the organic insulating layer 121 are not in direct contact but are indirectly fixed through the reinforcement layer 14, thereby improving the fixing yield.

[0087] Specifically, the material of the reinforcement layer 14 includes inorganic materials.

[0088] In the above embodiment, the inorganic material can improve the fixing yield of the organic protective layer 10 and the organic insulating layer 121. At the same time, by providing the reinforcing layer 14, the thickness of the inorganic material layer in the display panel 1 is increased, that is, the overall toughness of the display panel 1 is greatly improved, and the flatness of the display panel 1 is greatly improved. At the same time, the dielectric layer in the touch layer 12 is increased, and the parasitic capacitance is reduced, so that the touch performance of the touch layer 12 is also improved.

[0089] Specifically, the material of the enhancement layer 14 may include silicon nitride.

[0090] In a possible implementation, Figures 13 to 15 As shown, the display panel area A21 includes a display area A211 and a binding area A212; the organic protective layer 10 is provided with a first via hole 101 for exposing at least part of the binding area A212, and the reinforcement layer 14 is also located in the middle area A2. The reinforcement layer 14 is provided with a second via hole 141 in the middle area A2, and the orthographic projection of the second via hole on the substrate layer 11 is located within the orthographic projection of the first via hole 101 on the substrate layer 11.

[0091] In the above embodiment, the display panel area A21 includes a display area A211 and a binding area A212, and the binding area A212 is provided with a binding terminal for binding and connecting with an external circuit. The protective layer includes a first via hole 101, and the first via hole 101 is used to expose the binding terminal of the binding area A212 so that the binding terminal is electrically connected with the external circuit.

[0092] Specifically, the first via hole 101 may be a large hole that exposes the entire binding area A212 , or the first via hole 101 may be a small hole that corresponds to the binding terminal and exposes the binding terminal.

[0093] In the above implementation mode, if Fig.12 As shown, the reinforcement layer 14 is also located in the middle area A2, as shown in FIG. Figure 5 As shown, the reinforcing layer 14 is located in the display area A211, one side of the reinforcing layer 14 contacts the second conductive layer 123, and the other side of the reinforcing layer 14 contacts the organic protective layer 10. The reinforcing layer 14 includes a second via hole for exposing at least part of the binding area A212, and the second via hole is connected to the first via hole 101, and together exposes the binding terminal in the binding area A212, so that the binding terminal is electrically connected to the external circuit. Figures 10 to 12 As shown, the enhancement layer 14 is located in the edge region A1 , with one side contacting the organic insulating layer 121 and the other side contacting the organic protective layer 10 , thereby enhancing the fixing yield of the organic insulating layer 121 and the organic protective layer 10 , thereby improving the yield of the display panel 1 .

[0094] Specifically, the thickness of the reinforcement layer 14 is in the range of 100 angstroms to 200 angstroms.

[0095] In the above embodiment, the thickness of the reinforcing layer 14 is in the range of 100 angstroms to 200 angstroms. On the one hand, it can prevent the reinforcing layer 14 from being too thin and affecting the fixing effect with the organic insulating layer 121 and the organic protective layer 10. On the other hand, it can prevent the reinforcing layer 14 from being too thick and causing a large step difference at the second via position, and prevent affecting the thinness of the display panel 1.

[0096] Specifically, the thickness of the enhancement layer 14 may be 100 angstroms, 105 angstroms, 110 angstroms, 125 angstroms, 138 angstroms, 146 angstroms, 173 angstroms, 180 angstroms, 199 angstroms, 200 angstroms, etc., and the present application does not impose any particular limitation on this.

[0097] Specifically, Fig.16 As shown, a flat layer 16 is formed on the surface of the organic protective layer 10 facing away from the substrate layer 11 . The flat layer 16 includes an organic material. The organic material has a good leveling effect and can reduce the roughness of the surface of the display panel 1 away from the substrate layer 11 .

[0098] In a possible implementation, Figure 3 and Fig.17 As shown, a plurality of large display panels 1 can be spliced ​​together to form a large display panel 1 with a larger area, and the substrate layers 11 in adjacent large display panels 1 can be continuously prepared in the same layer.

[0099] The present application also provides a display panel 2, such as Fig.18 and Fig.19 As shown, it includes a display substrate 21, a touch structure layer 22, a reinforcement layer 14 and an organic protection layer 10. The display substrate 21 includes a display area A211 and a binding area A212. The touch structure layer 22 is located on one side of the display substrate 21. The touch structure layer 22 includes a first conductive layer 122, an organic insulating layer 121 and a second conductive layer 123 arranged in a stacked manner. The touch structure layer 22 is located in the display area A211. The reinforcement layer 14 is located on the side of the touch structure layer 22 away from the display substrate 21, at least in the display area A211. The organic protection layer 10 is located on the side of the reinforcement layer 14 away from the display substrate 21.

[0100] The display panel 2 provided in the present application includes a display substrate 21, a touch structure layer 22, an enhancement layer 14 and an organic protective layer 10. The display substrate 21 includes a display area A211 and a binding area A212. The touch structure layer 22 is located on one side of the display substrate 21, and is used to realize the touch function of the display panel 2. The touch structure layer 22 includes a first conductive layer 122, an organic insulating layer 121 and a second conductive layer 123 arranged in a stacked manner. One of the first conductive layer 122 and the second conductive layer 123 can be used to form a touch electrode and a first touch wiring, and the other can be used to form a second touch wiring, thereby realizing the touch function. The organic insulating layer 121 is used to realize the insulation between the first conductive layer 122 and the second conductive layer 123. The reinforcing layer 14 is located on the side of the touch structure layer 22 away from the display substrate 21, at least in the display area A211, and may also be partially located in the binding area A212. One side surface of the reinforcing layer 14 is in contact with the organic protective layer 10, and the other side is in contact with the second conductive layer 123. The organic protective layer 10 is located on the side of the reinforcing layer 14 away from the display substrate 21, and is used to protect the touch structure layer 22 and the entire display panel 2. In the display panel 2 provided in the present application, by setting the reinforcing layer 14, the overall strength of the display panel 2 can be improved, and the flatness inside the display panel 2 can be improved. At the same time, the parasitic capacitance between the touch structure layer 22 and the subsequent film layer can be reduced, thereby improving the touch performance of the touch layer 12.

[0101] Specifically, the material of the reinforcement layer 14 includes inorganic materials.

[0102] In the above embodiment, the use of inorganic materials can increase the thickness of the overall inorganic material layer in the display panel 2, that is, the overall toughness of the display panel 2 is greatly improved, and the flatness of the display panel 2 is greatly improved. At the same time, it can be used as a dielectric layer between subsequent film layers, thereby reducing the parasitic capacitance between the touch structure layer 22 and the thickness film layer, thereby also having the effect of improving the touch performance of the touch layer 12.

[0103] Specifically, the material of the enhancement layer 14 may include silicon nitride.

[0104] In a possible implementation, Fig. 20 , Fig.21 and Fig. 22 As shown, the organic protective layer 10 is provided with a first via hole 101, and the orthographic projection of the first via hole 101 on the display substrate 21 at least partially overlaps with the binding area A212 to expose at least part of the binding area A212. The reinforcing layer 14 is provided with a second via hole 141, and the orthographic projection of the second via hole 141 on the display substrate 21 at least partially overlaps with the binding area A212 to expose at least part of the binding area A212. The orthographic projection of the second via hole 141 on the display substrate 21 overlaps with at least part of the first via hole 101 on the display substrate 21.

[0105] In the above embodiment, the reinforcing layer 14 is provided with a second via hole 141, and the orthographic projection of the second via hole 141 on the display substrate 21 at least partially overlaps with the binding area A212 to expose at least part of the binding area A212. A binding terminal may be provided in the binding area A212, and the second via hole 141 at least exposes the binding terminal to facilitate electrical connection between the binding terminal and other structures. The organic protective layer 10 is provided with a first via hole 101, and the orthographic projection of the second via hole 141 on the display substrate 21 at least partially overlaps with the first via hole 101 on the display substrate 21 to jointly expose the binding terminal to facilitate subsequent electrical connection of the binding terminal with other components.

[0106] Specifically, the orthographic projection of the second via 141 on the display substrate 21 may be located within the orthographic projection of the first via 101 on the display substrate 21, and the first via 101 and the second via 141 are connected to jointly expose the binding terminal, so as to facilitate the subsequent electrical connection of the binding terminal with other components.

[0107] like Fig.23 and Fig.24 As shown, the display panel 2 provided in the present application further includes a planar layer 16 , which is located at least in the display area A211 and on the side of the organic protective layer 10 away from the display substrate 21 , and includes a third via hole 161 connected to the second via hole 141 .

[0108] In the above embodiment, a flat layer 16 is provided in the display area A211 to reduce the adverse effect on the light output effect caused by the poor flatness of the film layer, thereby improving the light output yield. The flat layer 16 may also be partially located in the binding area A212, and this application does not specifically limit this. The flat layer 16 includes a third via 161 located in the binding area A212 to expose the binding terminal.

[0109] In the above embodiment, the organic material and / or the conductive material of the planar layer 16. The organic material has strong fluidity and can achieve a good planarization effect, and can specifically be made of polyimide or acrylic. The planar layer 16 can also be made of a conductive material with conductive properties, such as conductive ink. In this case, the reinforcing layer 14 can reduce the effect of the parasitic capacitance between the planar layer 16 and the touch structure layer 22.

[0110] The present application also provides a method for preparing a display panel, such as Fig.25 As shown, it includes preparing a large display panel 1, and the process of preparing the large display panel 1 includes:

[0111] S200 , providing a substrate layer 11 , the substrate layer 11 comprising an edge region A1 arranged along an outer boundary of the substrate layer 11 and a middle region A2 located inside the edge region A1 , and at least one display panel region A21 is arranged in the middle region A2 .

[0112] S400, a touch layer 12 is formed on one side of the substrate layer 11, the touch layer 12 includes a first conductive layer 122, an organic insulating layer 121 and a second conductive layer 123 which are stacked, the first conductive layer 122 and the second conductive layer 123 are located in the display panel area A21, and the orthographic projection of the organic insulating layer 121 on the substrate layer 11 is located within the substrate layer 11.

[0113] S600 , forming an organic protection layer 10 on a side of the touch layer 12 away from the substrate layer 11 , wherein the organic protection layer 10 is at least located in the middle area A2 .

[0114] In the process of preparing the display panel 2 , a peeling prevention structure 15 is also formed. The peeling prevention structure 15 is at least located in the edge region A1 and is used to prevent the organic protective layer 10 from peeling off in the edge region A1 .

[0115] S800 , the method for preparing the display panel 2 further includes: cutting the display panel 1 to obtain the display panel 2 , where the display panel 2 is a portion of the display panel 1 corresponding to the display panel area A21 .

[0116] In the preparation method provided in the present application, a display panel 1 is first prepared, and then the display panel area A21 is retained by cutting the display panel 1 to form a display panel 2. During the preparation of the display panel 1, a peeling prevention structure 15 is formed. The peeling prevention structure 15 is at least located in the edge area A1, which is used to prevent the organic protective layer 10 from peeling off in the edge area A1, thereby helping to improve the yield of the edge area A1 in the display panel 1 and improve the poor separation between the organic protective layer 10 and the organic insulating layer 121. In the display panel 1 in the present application, by providing the peeling prevention structure 15, the poor edge area A1 can be improved, which helps to improve the yield of the display panel 1, and further helps to improve the yield of the display panel 2 formed by the display panel 1.

[0117] In a feasible embodiment, the orthographic projection of the organic protective layer 10 on the substrate layer 11 is located within the orthographic projection of the organic insulating layer 121 on the substrate layer 11, and there is a first preset distance L1 between the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 and the outer boundary of the substrate layer 11. The portion of the organic protective layer 10 located in the area defined by the first preset area is removed to form a first hollow portion 151 to form a peeling prevention structure 15. The peeling prevention structure 15 is located in the area defined by the first preset distance L1 and the orthographic projection of the first hollow portion 151 on the substrate covers the area defined by the first preset distance L1.

[0118] In the above embodiment, the orthographic projection of the organic protective layer 10 on the substrate layer 11 is located within the orthographic projection of the organic insulating layer 121 on the substrate layer 11, specifically including that the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 is located on the inner side of the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11, or the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 coincides with the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11.

[0119] In the above embodiment, there is a first preset distance L1 between the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 and the outer boundary of the substrate layer 11, wherein the orthographic projection of the organic protective layer 10 in the thickness direction of the substrate layer 11 and the orthographic projection of the substrate layer 11 in its own thickness direction have overlapping areas and non-overlapping areas, and the non-overlapping areas are areas of the orthographic projection of the substrate layer 11 in its own thickness direction that are not covered by the orthographic projection of the organic protective layer 10 in the thickness direction of the substrate layer 11, and the peeling prevention structure 15 is located in the area defined by the first preset distance L1, that is, located in the above-mentioned non-overlapping area.

[0120] In the above embodiment, forming the peeling prevention structure 15 includes: removing a portion of the organic protective layer 10 located in the area defined by the first preset area to form a first hollow portion 151, and the orthographic projection of the first hollow portion 151 on the substrate covers the area defined by the first preset distance L1. The peeling prevention structure 15 can reduce the area of ​​the organic protective layer 10 in the edge area A1, thereby improving the defect of the organic protective layer 10 in the edge area A1, improving the separation and peeling of the organic layer and the organic insulating layer 121 in the edge area A1, and improving the yield of the display panel 1.

[0121] In a feasible embodiment, the substrate layer 11 also includes a first test area A3, which is located between the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 and the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11. The middle area A2 also includes a second test area A22 located outside the at least one display panel area A21. The outer boundary of the second test area A22 close to the edge area A1 coincides with the inner boundary of the first test area A3. The outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 coincides with the boundary of the middle area A2. The outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 is located on the inner side of the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11. The portion of the organic protective layer 10 located in the edge area A1 and the portion located in the first test area A3 are removed to form a second hollow portion 152 to form a peeling prevention structure 15. The orthographic projection of the second hollow portion 152 on the substrate covers the edge area A1 and the first test area A3.

[0122] In the above embodiment, the substrate layer 11 further includes a first test area A3 having a test terminal therein. There is no organic protective layer 10 in the first test area A3. The test terminal is used to detect the display panel area A21.

[0123] In the above implementation, the second test area A22 may correspond to the display panel area A21 one-to-one, and is used to test the display panel area A21. The second test area A22 also includes a test terminal.

[0124] In the above embodiment, forming the peeling prevention structure 15 includes: removing the portion of the organic protective layer 10 located in the edge area A1 and the portion located in the first test area A3 to form a second hollow portion 152, and the orthographic projection of the second hollow portion 152 on the substrate covers the edge area A1 and the first test area A3. Due to design requirements, a protective layer needs to be set in the second test area A22. In order to achieve a balance between the yield of the second test area A22 and the yield of the edge area A1, the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 can be set to coincide with the boundary of the middle area A2, thereby maximally improving the yield of the edge area A1 and the first test area A3, and ensuring the yield of the second test area A22. The peeling prevention structure 15 can prevent the organic protective layer 10 from being located in the edge area A1 and the first test area A3, thereby improving the defect of the organic protective layer 10 in the edge area A1 and the first test area A3, and improving the separation and peeling of the organic layer and the organic insulating layer 121 in the edge area A1, so as to improve the yield of the display panel 1.

[0125] In a feasible implementation manner, an organic protective layer 10 is formed on a side of the touch layer 12 facing away from the substrate layer 11, including:

[0126] A reinforcement layer 14 is formed on a side of the touch layer 12 facing away from the substrate layer 11 , the reinforcement layer 14 is at least located in the edge region A1 , and the peeling prevention structure 15 includes the reinforcement layer 14 located in the edge region A1 ;

[0127] The organic protective layer 10 is formed on the side of the reinforcement layer 14 facing away from the substrate layer 11 .

[0128] In the above embodiment, a reinforcement layer 14 is further included, and the reinforcement layer 14 is located on the side of the touch layer 12 away from the substrate layer 11 and in contact with the touch layer 12, and then an organic protection layer 10 is formed on the side of the reinforcement layer 14 away from the substrate layer 11, so that one side of the reinforcement layer 14 is in contact with the touch layer 12 and the other side is in contact with the organic protection layer 10, so as to improve the fixing yield between the organic protection layer 10 and the touch layer 12.

[0129] Specifically, the reinforcement layer 14 is at least located in the edge area A1, and the peeling prevention structure 15 includes a portion of the reinforcement layer 14 located in the edge area A1. One side of the portion of the reinforcement layer 14 located in the edge area A1 can be in contact with the organic protective layer 10, and the other side can be in contact with the organic insulating layer 121. Therefore, the peeling prevention structure 15 can improve the fixing yield between the organic protective layer 10 and the organic insulating layer 121, and improve the problem of poor fixing of the organic protective layer 10 and the organic insulating layer 121 in the edge area A1, thereby helping to improve the yield of the edge area A1 of the display panel 1.

[0130] Specifically, when the peeling prevention structure 15 includes the portion of the reinforcement layer 14 located in the edge area A1, the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 may coincide with the outer boundary of the substrate layer 11, and the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 may coincide with the outer boundary of the substrate layer 11. Alternatively, the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11 is located inside the outer boundary of the substrate layer 11; the outer boundary of the orthographic projection of the organic protective layer 10 on the substrate layer 11 coincides with the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11, or is located inside the outer boundary of the orthographic projection of the organic insulating layer 121 on the substrate layer 11. At this time, the portions of the edge areas of the orthographic projections of the organic protective layer 10 and the organic insulating layer 121 on the substrate layer 11 may form an overlapping area, and the orthographic projection of the reinforcing layer 14 on the substrate layer 11 may at least cover the above-mentioned overlapping area, thereby ensuring that the organic protective layer 10 and the organic insulating layer 121 are not in direct contact with each other but are indirectly fixed through the reinforcing layer 14, thereby improving the fixing yield.

[0131] Specifically, the process of preparing the touch layer 12 includes:

[0132] like Fig.26 and Fig. 27 As shown, a first conductive layer 122 is first formed on the isolation layer 13, and the first conductive layer 122 is patterned. Specifically, the first conductive layer 122 can be patterned to form a second touch control wiring. Specifically, the display area A211 is as shown in FIG. Fig.26 As shown, the binding area A212 is as Fig. 27 As shown, the portion of the first conductive layer 122 located in the binding area A212 is removed during the patterning process.

[0133] like Fig.28 and Fig.29 As shown, an insulating material layer is then formed, and the insulating material layer is patterned to form an organic insulating layer 121, and a via hole 1211 is formed in the insulating material layer. Fig.28 As shown, the via 1211 can be used to achieve the connection between the first conductive layer 122 and the second conductive layer 123; the binding area A212 is as shown in FIG. Fig.29As shown, during the patterning process, an opening communicating with the via 1211 may be opened in the isolation layer 13 to facilitate connection with the inner film layer of the substrate layer 11 .

[0134] like Fig.30 and Fig.31 As shown, a second conductive layer 123 is then formed and patterned. Specifically, the second conductive layer 123 can be patterned to form a first touch electrode, a second touch electrode and a first touch line. The first touch electrode and the first touch line are continuously arranged in the same layer, so as to realize electrical connection between adjacent first touch electrodes in the row direction. The second touch electrode is electrically connected to the second touch line through a via hole, so as to realize electrical connection between adjacent second touch electrodes in the column direction. Specifically, the display area A211 is as shown in FIG. Fig.30 As shown, the via 1211 can be used to achieve the connection between the first conductive layer 122 and the second conductive layer 123; the binding area A212 is as shown in FIG. Fig.31 As shown, the second conductive layer 123 is connected to the inner film layer of the substrate layer 11 .

[0135] The preparation method also includes: Fig.32 and Fig.33 As shown, a reinforcement layer 14 is then formed and patterned, a second via hole 141 is formed in a portion opposite to the binding area A212 in the display panel area A21, and a portion in the edge area A1 is removed or completely retained. Specifically, the display area A211 is as shown in FIG. Fig.32 As shown; binding area A212 is as Fig.33 shown.

[0136] like Figure 5 and Fig.33 As shown, a protective material layer is then formed and patterned, a first via hole 101 is formed in a portion opposite to the binding area A212 in the display panel area A21, and at least a portion located in the edge area is removed. When the preparation method of step S600 is adopted, the portion of the organic protective layer 10 located in the edge area A1 can be completely removed. Fig.33 The portion of the enhancement layer 14 located in the binding area A212 is removed. Figure 5 As shown; binding area A212 is as Fig.34As shown. Since the enhancement layer 14 is deposited on the entire surface, the binding area A212 will be covered, and signal input will not be possible. Therefore, the portion of the enhancement layer 14 located in the binding area A212 needs to be removed after the protective material layer is patterned. During the removal process, a plasma process can be used to perform plasma bombardment on the entire surface of the protective layer and the enhancement layer 14 exposed through the first via 101 until the portion of the enhancement layer 14 located in the binding area A212 is completely etched away. Specifically, in order to ensure the yield of the organic protective layer 10, the actual thickness of the protective material layer can be set to be greater than the final thickness of the organic protective layer 10, so that in the process of patterning the enhancement layer 14, that is, in the process of plasma bombarding the protective material layer, the protective material layer is thinned to obtain an organic protective layer 10 of a preset thickness.

[0137] Specifically, during the process of patterning the protective material layer, a light shielding plate and a mask plate 02 may be provided on the side of the protective material layer away from the isolation layer 13. The mask plate 02 exposes the middle area and only shields the edge area A1 and at least part of the first test area A3, so as to shield the light vertically directed toward the protective material layer from the side of the mask plate 02 away from the protective material layer. The light shielding plate may be used to shield light leakage at the edge position. The light shielding plate is located between the mask plate 02 and the organic material layer. The inner edge of the positive projection of the light shielding plate on the organic material layer may coincide with the edge of the middle area, so as to improve the problem of exposure residue of the organic material layer in the first test area A3 and improve the adverse effect of the residue on the edge area A1.

[0138] Specifically, a flat layer 16 is formed on the surface of the organic protective layer 10 on the side away from the substrate layer 11. The flat layer 16 includes an organic material. The organic material has a good leveling effect and can prevent the problem of poor surface roughness on the side of the protective layer away from the substrate layer 11. The flat layer 16 can also be made of conductive material, which is not particularly limited in this application.

[0139] At the same time, by setting the reinforcement layer 14, the overall inorganic layer thickness in the display panel 1 is increased, that is, the overall toughness of the display panel 1 is greatly improved, and the flatness of the display panel 1 is greatly improved. At the same time, when the flat layer 16 is made of conductive material, due to the provision of the reinforcement layer 14, the thickness of the dielectric layer between the touch layer 12 and the flat layer 16 is increased, and the parasitic capacitance is reduced, thereby also improving the touch performance of the touch layer 12.

[0140] Specifically, the plasma process may use conventional inorganic etching gases such as CF / O.

[0141] The present application also provides a display panel 2, such as Fig.18As shown, it is prepared by any one of the preparation methods provided in the above embodiments. In the preparation method provided in the above embodiments, the poor contact problem between the organic protective layer 10 and the organic insulating layer 121 is improved, so that the yield of the display panel 1 is higher, thereby improving the yield of the display panel 2, and further improving the user experience.

[0142] The present application also provides a display device 3, such as Fig.35 As shown, it includes any one of the display panels 2 provided in the above embodiments.

[0143] The yield of the display panel 2 in the display device is improved, thereby improving the yield of the display device and thus improving the user experience.

[0144] The above are only preferred specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A large display panel, characterized in that: include: A substrate layer, comprising an edge region arranged along an outer boundary of the substrate layer and a middle region located inside the edge region, wherein at least one display panel region is arranged in the middle region; A touch layer, located on one side of the substrate layer, the touch layer comprising a first conductive layer, an organic insulating layer, and a second conductive layer which are stacked, the first conductive layer and the second conductive layer being located in the display panel region, and an orthographic projection of the organic insulating layer on the substrate layer being located within the substrate layer; an organic protective layer, located on a side of the touch layer away from the substrate layer, the organic protective layer being at least located in the middle region; The peeling prevention structure is at least located in the edge area and is used to prevent the protective layer from peeling off in the edge area.

2. The display panel according to claim 1, characterized in that: The orthographic projection of the organic protective layer on the substrate layer is located within the orthographic projection of the organic insulating layer on the substrate layer, and there is a first preset distance between the outer boundary of the orthographic projection of the organic protective layer on the substrate layer and the outer boundary of the substrate layer. The peeling prevention structure is located in the area defined by the first preset distance, and the peeling prevention structure includes a first hollow portion formed in the organic protective layer, and the orthographic projection of the first hollow portion on the substrate covers the area defined by the first preset distance.

3. The display panel according to claim 2, characterized in that: The organic insulating layer has a second preset distance between the outer boundary of the orthographic projection on the substrate layer and the outer boundary of the substrate layer, the second preset distance is equal to or greater than the width of the corresponding edge area, and the first preset distance is greater than the corresponding second preset distance.

4. The display panel according to claim 1, characterized in that: The substrate layer further includes a first test area, which is located between the orthographic outer boundary of the organic insulating layer on the substrate layer and the orthographic outer boundary of the organic protection layer on the substrate layer, and the substrate layer further includes a test terminal arranged in the first test area.

5. The display panel according to claim 4, characterized in that: The middle area also includes a second test area located outside the at least one display panel area, the outer boundary of the second test area close to the edge area coincides with the inner boundary of the first test area, the outer boundary of the orthographic projection of the organic protective layer on the substrate layer coincides with the boundary of the middle area, the outer boundary of the orthographic projection of the organic protective layer on the substrate layer is located on the inner side of the outer boundary of the orthographic projection of the organic insulating layer on the substrate layer, the peeling prevention structure is located in the edge area and the first test area, the peeling prevention structure includes a second hollow portion formed in the organic protective layer, and the orthographic projection of the second hollow portion on the substrate covers the edge area and the first test area.

6. The display panel according to claim 1, characterized in that: The large display panel also includes an isolation layer located between the substrate layer and the touch layer, the isolation layer includes a thickness maintaining area and a thickness reducing area, the thickness reducing area is arranged circumferentially along the outer boundary of the large display panel, the thickness maintaining area is located on the inner side of the thickness reducing area, the thickness of the thickness reducing area gradually decreases from the boundary of the thickness maintaining area toward the outer boundary of the large display panel, and the orthographic projection of the organic insulating layer on the substrate layer is located within the orthographic projection of the thickness maintaining area on the substrate layer.

7. The display panel according to claim 1, characterized in that: It also includes a reinforcement layer, which is located between the organic protection layer and the touch layer. The reinforcement layer is at least located in the edge area, and the peeling prevention structure includes a portion of the reinforcement layer located in the edge area.

8. The display panel according to claim 7, characterized in that: The display panel area includes a display area and a binding area; the organic protective layer is provided with a first via hole for exposing at least part of the binding area, the reinforcement layer is also located in the middle area, the reinforcement layer is provided with a second via hole in the middle area, and the orthographic projection of the second via hole on the substrate layer is located within the orthographic projection of the first via hole on the substrate layer.

9. The display panel according to claim 7, characterized in that: The material of the enhancement layer includes inorganic material; and / or the thickness of the enhancement layer is in the range of 100 angstroms to 200 angstroms.

10. A display panel, characterized in that: include: A display substrate, comprising a display area and a binding area; A touch structure layer, located on one side of the display substrate, the touch structure layer comprising a first conductive layer, an organic insulating layer and a second conductive layer which are stacked, and the touch structure layer is located in the display area; A reinforcement layer, located on a side of the touch structure layer away from the display substrate, at least located in the display area; The organic protection layer is located on a side of the enhancement layer away from the display substrate.

11. The display panel according to claim 10, characterized in that: The organic protection layer is provided with a first via hole, wherein an orthographic projection of the first via hole on the display substrate at least partially overlaps with the binding area to expose at least a portion of the binding area; The reinforcing layer is provided with a second via hole, wherein an orthographic projection of the second via hole on the display substrate at least partially overlaps with the binding area to expose at least a portion of the binding area; The orthographic projection of the second via hole on the display substrate overlaps at least partially with the first via hole on the display substrate.

12. The display panel according to claim 11, characterized in that: The device further comprises a planar layer, wherein the planar layer is at least located in the display area and located on a side of the organic protective layer away from the display substrate, and the planar layer comprises a third via hole connected to the second via hole.

13. The display panel according to claim 12, characterized in that: The material of the planar layer includes organic material and / or conductive material.

14. A display device, characterized in that: A display panel comprising any one of claims 10-13.

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