Germanium infrared wafer detection device

Abstract

The utility model relates to the technical field of germanium infrared wafer detection, in particular to a germanium infrared wafer detection device which comprises a base, a conveying belt is arranged in the base, a plurality of bearing plates are fixedly connected to the surface of the conveying belt, a plurality of grooves are formed in the upper ends of the bearing plates, a notch is formed in the upper end of the base, and the bearing plates are fixedly connected with the grooves. A collecting frame is slidably connected to the side wall of the base. A detector is fixedly connected to the top in the support, a movable plate is slidably connected between the inner walls of the two sides of the support, and a suction cup is slidably connected to the interior of the movable plate. An operator places a plurality of germanium infrared wafers in the grooves, the conveying belt drives the bearing plate to move, the germanium infrared wafers are moved to the position below the detector, the detector scans the germanium infrared wafers, edge breakage, cracks and other defects of the germanium infrared wafers are accurately judged and detected, and therefore batch detection of the germanium infrared wafers is facilitated, and the detection efficiency is improved. And the production efficiency of the germanium infrared wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of germanium infrared wafer detection, in particular to a germanium infrared wafer detection device. Background Art

[0002] Germanium infrared wafer, also known as infrared grade germanium single crystal, is a high-purity germanium material with excellent infrared transmittance and thermal conductivity. Its crystal structure is compact and orderly, the lattice constant is small, and the atomic arrangement is regular, so it has high optical transmittance and thermal conductivity. At the same time, the refractive index of germanium single crystal is high, and it has good absorption and conduction ability for infrared radiation. Germanium infrared wafer detection device is a professional equipment used to evaluate the performance and quality of germanium infrared wafers. These devices usually combine multiple technologies and methods to ensure that the germanium infrared wafer is scanned and defects such as edge collapse and cracks are accurately identified and detected.

[0003] After searching, the utility model patent with Chinese patent publication number CN216773183U discloses a wafer detection device, including a base, a first support frame is fixedly connected to the middle position of the upper rear side of the base, a first stepper motor is fixedly connected to the upper front side of the first support frame, the output end of the first stepper motor passes through the first support frame and is fixedly connected to a rotating shaft, and the lower end of the rotating shaft is fixedly connected to a mounting plate. In the utility model, the wafer is loaded and unloaded by a manipulator, and when the wafer is detected, it is placed in the clamping mechanism on the front side of the mounting plate through the manipulator. The first stepper motor can drive the wafer to rotate, move the wafer to the lower end of the detection component to detect the upper surface of the wafer, and the second stepper motor can drive the clamping component to rotate and flip the wafer, so that the detection component can detect the lower surface of the wafer, thereby improving the detection efficiency of the wafer.

[0004] After searching the above patents, it was found that the wafer detection was processed. However, when the device detects the wafer, the detection component can only detect one wafer at a time and cannot detect multiple wafers at the same time, which leads to low wafer production efficiency. Utility Model Content

[0005] The utility model aims to provide a germanium infrared wafer detection device, which can facilitate batch detection of germanium infrared wafers, so as to solve the problem that it is inconvenient to perform batch detection of germanium infrared wafers in the prior art.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A germanium infrared wafer detection device comprises a base, a conveyor belt is arranged inside the base, a plurality of bearing plates are fixedly connected to the surface of the conveyor belt, a plurality of grooves are arranged on the upper end of the bearing plates, a notch is arranged on the upper end of the base, a collection frame is slidably connected to the side wall of the base, and the collection frame is located below the notch; a bracket, the bracket is arranged on the upper end of the base, a detector is fixedly connected to the top of the bracket, a movable plate is slidably connected between the inner walls on both sides of the bracket, a suction cup is slidably connected inside the movable plate, a vacuum pump is fixedly connected to the upper end of the movable plate, a connecting pipe is fixedly connected between the input end of the vacuum pump and the upper end of the suction cup, and the connecting pipe is slidably connected to the upper end of the movable plate.

[0008] Preferably, a driving motor is fixedly connected to the side wall of the base, a main roller is rotatably connected inside the base, and an output end of the driving motor is fixedly connected to an end of the main roller.

[0009] Preferably, a roller body is rotatably connected inside the base, and the conveyor belt is sleeved on the main roller and the outside of the roller body.

[0010] Preferably, a motor is fixedly connected to the side wall of the bracket, a screw is rotatably connected between the inner walls on both sides of the bracket, the end of the screw is fixedly connected to the output end of the motor, and the screw is rotatably connected to the movable plate through a thread.

[0011] Preferably, an auxiliary rod is fixedly connected between the inner walls on both sides of the bracket, and the auxiliary rod is slidably connected to the movable plate.

[0012] Preferably, the upper end of the movable plate is fixedly connected to an electric push rod, a plate is slidably connected inside the movable plate, the upper end of the plate is fixedly connected to the output end of the electric push rod, the lower end of the plate is fixedly connected to the upper end of the suction cup, and the connecting pipe is fixedly connected to the plate through.

[0013] Compared with the prior art, the advantages of the utility model are:

[0014] 1. The operator places multiple germanium infrared wafers in the groove, drives the main roller to rotate through the driving motor, and through the cooperation of the roller body, the conveyor belt drives the carrier plate to move, and moves the germanium infrared wafer to the bottom of the detector. The detector scans the germanium infrared wafer, and accurately identifies and detects defects such as edge collapse and cracks of the germanium infrared wafer, so as to facilitate batch detection of germanium infrared wafers and improve the production efficiency of germanium infrared wafers.

[0015] 2. When one of the germanium infrared wafers has a defect, the movable plate slides to move the suction cup to the top of the corresponding germanium infrared wafer, and then the suction cup moves downward to the inside of the corresponding groove, while the lower end of the suction cup fits with the upper end of the germanium infrared wafer, and then the vacuum pump sucks the suction cup through the connecting pipe, so that the suction cup adsorbs and grabs the germanium infrared wafer, and then the suction cup moves upward to separate the defective germanium infrared wafer from the corresponding groove, the movable plate slides to move the defective germanium infrared wafer to the top of the notch, the suction cup releases the defective germanium infrared wafer, and the defective germanium infrared wafer falls into the collection frame through the notch, so that the defective germanium infrared wafer is centrally collected and processed through the collection frame, so as to facilitate the reprocessing of the defective germanium infrared wafer at a later time. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model discloses a front view external structure diagram of a germanium infrared wafer detection device.

[0017] Figure 2 The utility model discloses a rear-view external structure schematic diagram of a germanium infrared wafer detection device.

[0018] Figure 3 The utility model discloses a front cross-sectional structural schematic diagram of a germanium infrared wafer detection device.

[0019] Figure 4 The utility model discloses a rear cross-sectional structural schematic diagram of a germanium infrared wafer detection device.

[0020] Figure 5 for Figure 4 Schematic diagram of the structure of part A.

[0021] Figure 6 The utility model discloses a side view cross-sectional structure schematic diagram of a germanium infrared wafer detection device.

[0022] In the figure: 1 base, 2 drive motor, 3 main roller, 4 roller body, 5 conveyor belt, 6 bearing plate, 7 groove, 8 bracket, 9 detector, 10 motor, 11 screw, 12 auxiliary rod, 13 movable plate, 14 electric push rod, 15 plate, 16 suction cup, 17 vacuum pump, 18 connecting pipe, 19 notch, 20 collection frame. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0024] Reference Figure 1-6A germanium infrared wafer detection device comprises a base 1, a conveyor belt 5 is arranged inside the base 1, a plurality of carrying plates 6 are fixedly connected to the surface of the conveyor belt 5, a plurality of grooves 7 are arranged on the upper end of the carrying plate 6, a notch 19 is arranged on the upper end of the base 1, a collecting frame 20 is slidably connected to the side wall of the base 1, and the collecting frame 20 is located below the notch 19; a bracket 8, the bracket 8 is arranged at the upper end of the base 1, a detector 9 is fixedly connected to the top of the bracket 8, a movable plate 13 is slidably connected between the inner walls on both sides of the bracket 8, a suction cup 16 is slidably connected inside the movable plate 13, a vacuum pump 17 is fixedly connected to the upper end of the movable plate 13, a connecting pipe 18 is fixedly connected between the input end of the vacuum pump 17 and the upper end of the suction cup 16, the connecting pipe 18 is slidably connected to the upper end of the movable plate 13, the middle part of the lower end of the carrying plate 6 is fixedly connected to the surface of the conveyor belt 5, the operator places a plurality of germanium infrared wafers inside the groove 7, drives the carrying plate 6 to move by the conveyor belt 5, and moves the germanium infrared wafers The movable plate 13 slides to move the suction cup 16 to the top of the corresponding germanium infrared wafer, and then the suction cup 16 moves downward to the inside of the corresponding groove 7. At the same time, the lower end of the suction cup 16 is in contact with the upper end of the germanium infrared wafer, and then the vacuum pump 17 sucks the suction cup 16 through the connecting pipe 18, so that the suction cup 16 adsorbs and grabs the germanium infrared wafer, and then the suction cup 16 moves upward to separate the defective germanium infrared wafer from the corresponding groove 7, and the movable plate 13 slides to move the defective germanium infrared wafer to the top of the notch 19, and the suction cup 16 loosens the defective germanium infrared wafer, so that the defective germanium infrared wafer falls into the collection frame 20 through the notch 19, so that the defective germanium infrared wafer is collected and processed centrally through the collection frame 20.

[0025] The side wall of the base 1 is fixedly connected with a driving motor 2, and the base 1 is rotatably connected with a main roller 3. The output end of the driving motor 2 is fixedly connected to the end of the main roller 3, and the main roller 3 is driven to rotate by the driving motor 2.

[0026] A roller body 4 is rotatably connected inside the base 1, and a conveyor belt 5 is sleeved on the main roller 3 and the outside of the roller body 4. When the main roller 3 rotates, the conveyor belt 5 drives the carrying plate 6 to move through the cooperation of the roller body 4.

[0027] A motor 10 is fixedly connected to the side wall of the bracket 8, and a screw 11 is rotatably connected between the inner walls on both sides of the bracket 8. The end of the screw 11 is fixedly connected to the output end of the motor 10, and the screw 11 is threadedly rotatably connected to the movable plate 13. The screw 11 is driven to rotate by the motor 10, so that the movable plate 13 slides laterally.

[0028] An auxiliary rod 12 is fixedly connected between the inner walls on both sides of the bracket 8. The auxiliary rod 12 is slidably connected with the movable plate 13. When the movable plate 13 slides, the auxiliary rod 12 assists the movable plate 13 in moving to prevent the movable plate 13 from tilting when sliding horizontally.

[0029] An electric push rod 14 is fixedly connected to the upper end of the movable plate 13, and a plate 15 is slidably connected inside the movable plate 13. The upper end of the plate 15 is fixedly connected to the output end of the electric push rod 14, and the lower end of the plate 15 is fixedly connected to the upper end of the suction cup 16. The connecting pipe 18 is fixedly connected to the plate 15 through and through. The plate 15 is pushed or pulled by the electric push rod 14 to slide up and down, and at the same time, the plate 15 drives the suction cup 16 to slide up and down.

[0030] In the utility model, an operator places a plurality of germanium infrared wafers inside a groove 7, drives a main roller 3 to rotate through a driving motor 2, and cooperates with a roller body 4 to enable a conveyor belt 5 to drive a carrier plate 6 to move, and moves the germanium infrared wafers to below a detector 9. The detector 9 scans the germanium infrared wafers, and accurately identifies and detects defects such as edge collapse and cracks of the germanium infrared wafers, thereby facilitating batch detection of germanium infrared wafers.

[0031] When one of the germanium infrared wafers has a defect, the movable plate 13 slides to move the suction cup 16 to the top of the corresponding germanium infrared wafer, and then the suction cup 16 moves downward to the inside of the corresponding groove 7, and at the same time, the lower end of the suction cup 16 fits with the upper end of the germanium infrared wafer, and then the vacuum pump 17 sucks the suction cup 16 through the connecting pipe 18, so that the suction cup 16 adsorbs and grabs the germanium infrared wafer, and then the suction cup 16 moves upward to separate the defective germanium infrared wafer from the corresponding groove 7, the movable plate 13 slides to move the defective germanium infrared wafer to the top of the notch 19, the suction cup 16 releases the defective germanium infrared wafer, so that the defective germanium infrared wafer falls into the collection frame 20 through the notch 19, so that the defective germanium infrared wafer is collected and processed centrally by the collection frame 20, and when the conveyor belt 5 is turned over, the defect-free germanium infrared wafer in the groove 7 falls into the subsequent processing device.

[0032] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A germanium infrared wafer detection device, characterized in that: include A base (1), wherein a conveyor belt (5) is arranged inside the base (1), a plurality of bearing plates (6) are fixedly connected to the surface of the conveyor belt (5), a plurality of grooves (7) are arranged at the upper end of the bearing plates (6), a notch (19) is arranged at the upper end of the base (1), a collection frame (20) is slidably connected to the side wall of the base (1), and the collection frame (20) is located below the notch (19); A bracket (8), wherein the bracket (8) is arranged at the upper end of the base (1), a detector (9) is fixedly connected to the top of the bracket (8), a movable plate (13) is slidably connected between the inner walls on both sides of the bracket (8), a suction cup (16) is slidably connected inside the movable plate (13), a vacuum pump (17) is fixedly connected to the upper end of the movable plate (13), a connecting pipe (18) is fixedly connected between the input end of the vacuum pump (17) and the upper end of the suction cup (16), and the connecting pipe (18) is slidably connected to the upper end of the movable plate (13).

2. A germanium infrared wafer detection device according to claim 1, characterized in that: The side wall of the base (1) is fixedly connected to a driving motor (2), the interior of the base (1) is rotatably connected to a main roller (3), and the output end of the driving motor (2) is fixedly connected to the end of the main roller (3).

3. A germanium infrared wafer detection device according to claim 2, characterized in that: The base (1) is rotatably connected to a roller body (4), and the conveyor belt (5) is sleeved on the main roller (3) and the outside of the roller body (4).

4. A germanium infrared wafer detection device according to claim 1, characterized in that: A motor (10) is fixedly connected to the side wall of the bracket (8), a screw rod (11) is rotatably connected between the inner walls on both sides of the bracket (8), an end of the screw rod (11) is fixedly connected to the output end of the motor (10), and the screw rod (11) is rotatably connected to the movable plate (13) via a thread.

5. A germanium infrared wafer detection device according to claim 1, characterized in that: An auxiliary rod (12) is fixedly connected between the inner walls on both sides of the bracket (8), and the auxiliary rod (12) is slidably connected to the movable plate (13).

6. A germanium infrared wafer detection device according to claim 1, characterized in that: The upper end of the movable plate (13) is fixedly connected to an electric push rod (14), and a plate (15) is slidably connected inside the movable plate (13). The upper end of the plate (15) is fixedly connected to the output end of the electric push rod (14), and the lower end of the plate (15) is fixedly connected to the upper end of the suction cup (16). The connecting pipe (18) penetrates and is fixedly connected to the plate (15).

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