Rapid cooling device for stamping die

Abstract

The utility model discloses a rapid cooling device for a stamping die, which relates to the technical field of stamping dies and comprises a worktable, a lower die holder is mounted on the upper surface of the worktable, an upper die holder is arranged above the lower die holder, and a group of positioning components are mounted between the lower die holder and the upper die holder. Through cooperative arrangement of the workbench, the lower mold base, the upper mold base, the positioning assembly, the cooling water tank, the cooling water injection assembly, the backflow assembly and the refrigeration assembly, the cooling water injection assembly can inject cooling water into the lower mold base and the upper mold base; cooling water exchanges heat with the lower die base and the upper die base and then flows back into the cooling water tank through the backflow assembly, the cooling water in the cooling water tank can be refrigerated and cooled through the refrigeration assembly, the temperature of the cooling water is prevented from rising along with temperature rising of the die, rapid cooling of the stamping die can be achieved, and the service life of the stamping die is prolonged. And the cooling effect on the stamping die can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of stamping dies, in particular to a rapid cooling device for a stamping die. Background Art

[0002] Stamping is a forming method that uses a press and a die to apply external force to plates, strips, pipes, and profiles to cause plastic deformation or separation, thereby obtaining a workpiece (stamping part) of the desired shape and size. Stamping and forging are both plastic processing (or pressure processing), collectively known as forging. When performing stamping, a stamping die is required. A stamping die is a special process equipment used to process materials (metal or non-metal) into parts (or semi-finished products) in stamping. During the hot stamping process, the metal sheet is first heated, and then the heated metal sheet is placed between the upper die seat and the lower die seat. The upper die seat moves down to extrude the metal sheet into shape. The hot stamping die generates a lot of heat during use, and generally a water channel is set inside the die to use coolant to achieve cooling.

[0003] According to the patent with application number 202121983319.2, a cooling device for a stamping die is disclosed, and its technical solution is: it includes a piston tube and a water tank, the water tank is filled with cooling water, a water pump is fixedly arranged inside the water tank, and a water pipe is fixedly connected to the output end of the water pump. One end of the water pipe passes through the inner wall of the water tank and extends to the outside of the water tank. A first valve is fixedly installed on the water pipe, and one end of the water pipe located outside the water tank is fixedly connected to a first branch pipe and a second branch pipe, the first branch pipe is fixedly connected to the upper die base, and the second branch pipe is fixedly connected to the lower die base.

[0004] By adopting the above scheme, a piston tube is set between the mold and the water tank. When the heat dissipation demand is small, the up and down movement of the upper mold base is used to drive the piston to move up and down, and then the cooling water is transported to the first branch pipe and the second branch pipe. This can not only meet the heat dissipation demand, but also save electricity and reduce costs. It is more practical. However, the above scheme still has certain defects when used. The above scheme cannot cool the cooling water when used. After long-term use, the temperature of the cooling water increases with the temperature of the mold, making it difficult to achieve rapid cooling of the stamping mold, affecting the cooling effect of the stamping mold. To this end, we provide a stamping mold rapid cooling device to solve the above technical problems. Utility Model Content

[0005] The utility model aims to make up for the deficiencies of the prior art and provides a rapid cooling device for a stamping die.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a stamping die rapid cooling device, comprising a workbench, a lower die seat is installed on the upper surface of the workbench, an upper die seat is arranged above the lower die seat, a group of positioning components are installed between the lower die seat and the upper die seat, the positioning component comprises a positioning rod fixedly connected to the upper surface of the lower die seat, the top end of the positioning rod is slidably connected to the bottom surface of the upper die seat, the outer surface of the positioning rod is slidably connected to a reset plate, the bottom surface of the reset plate is installed with a reset spring, and the bottom end of the reset spring is connected to the upper surface of the lower die seat, cooling cavities are arranged inside the lower die seat and inside the upper die seat, a cooling water tank is installed on the upper surface of the workbench, and a cooling water injection component, a reflux component and a refrigeration component are installed outside the cooling water tank.

[0007] Preferably, the cooling water injection assembly includes a booster pump fixedly embedded in the outer surface of the cooling water tank, the output end of the booster pump is fixedly connected to a water injection hose 1, the end of the water injection hose 1 away from the booster pump is connected to the interior of the lower mold base, the outer surface of the water injection hose 1 is fixedly connected to a water injection hose 2, and the end of the water injection hose 2 away from the water injection hose 1 is connected to the interior of the upper mold base.

[0008] Preferably, the reflux assembly includes a reflux hose 1 fixedly connected to the outer surface of the cooling water tank, the outer surface of the reflux hose 1 is fixedly connected to a reflux hose 2, one end of the reflux hose 1 away from the cooling water tank and the end of the reflux hose 2 away from the cooling water tank are respectively connected to the interior of the lower mold base and the interior of the upper mold base.

[0009] Preferably, the refrigeration assembly includes a heat conducting plate 1 fixedly embedded in the outer surface of the cooling water tank, a group of semiconductor refrigeration sheets are installed on the outer surface of the heat conducting plate 1, a heat conducting plate 2 is arranged on the right side of the heat conducting plate 1, and the heat conducting plate 2 is connected to the semiconductor refrigeration sheets.

[0010] Preferably, a group of heat dissipation fins are fixedly connected to the outer surface of the second heat conducting plate, a group of heat dissipation fans are arranged on the right side of the second heat conducting plate, and the heat dissipation fans are connected to the heat dissipation fins.

[0011] Preferably, a transparent plate is fixedly inlaid on the front of the cooling water tank, and a water filling cover is installed on the upper surface of the cooling water tank.

[0012] Preferably, the front side of the cooling water tank is fixedly connected to a drain pipe, and a valve is installed on the outer surface of the drain pipe.

[0013] Beneficial effects:

[0014] Compared with the prior art, the stamping die rapid cooling device has the following beneficial effects:

[0015] 1. The utility model coordinates the workbench, the lower die base, the upper die base, the positioning assembly, the cooling water tank, the cooling water injection assembly, the reflux assembly and the refrigeration assembly. The cooling water injection assembly can inject cooling water into the interior of the lower die base and the upper die base, so that the cooling water exchanges heat with the lower die base and the upper die base and then flows back to the interior of the cooling water tank through the reflux assembly. The refrigeration assembly can be used to cool the cooling water in the cooling water tank to prevent the temperature of the cooling water from increasing as the temperature of the mold increases, so that the stamping mold can be quickly cooled and the cooling effect of the stamping mold can be guaranteed.

[0016] 2. The utility model is configured through the coordination of the lower die base, the upper die base, the cooling water tank, the booster pump, the water injection hose 1, the water injection hose 2, the reflux hose 1, the reflux hose 2, the heat transfer plate 1, the semiconductor refrigeration sheet, the heat transfer plate 2, the heat dissipation fins and the heat dissipation fan. The booster pump can pressurize the cooling water in the cooling water tank and inject it into the lower die base and the upper die base. The cooling water exchanges heat with the lower die base and the upper die base. The cooling water after the heat exchange can flow back to the interior of the cooling water tank through the reflux hose 1 and the reflux hose 2. The semiconductor refrigeration sheet can reduce the temperature of the heat transfer plate 1. The heat transfer plate 1 can continuously cool and cool the cooling water in the cooling water tank, so that the cooling water in the cooling water tank can always be kept at a low temperature, thereby achieving rapid cooling of the stamping die. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0018] Figure 2 It is a three-dimensional structural schematic diagram of another viewing angle of the utility model;

[0019] Figure 3 This is a schematic diagram of the internal structure of the lower die base of the utility model;

[0020] Figure 4 It is a three-dimensional structural schematic diagram of the refrigeration component of the utility model.

[0021] In the figure: 1. workbench, 2. lower die base, 3. upper die base, 4. positioning assembly, 401. positioning rod, 402. reset plate, 403. reset spring, 5. cooling water tank, 6. cooling water injection assembly, 601. booster pump, 602. water injection hose 1, 603. water injection hose 2, 7. reflux assembly, 701. reflux hose 1, 702. reflux hose 2, 8. refrigeration assembly, 801. heat conduction plate 1, 802. semiconductor refrigeration plate, 803. heat conduction plate 2, 804. heat dissipation fins, 805. cooling fan, 9. transparent plate, 10. water filling cover, 11. drain pipe, 12. valve, 13. cooling chamber. DETAILED DESCRIPTION

[0022] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0023] See also Figure 1 to Figure 4 A rapid cooling device for a stamping die comprises a workbench 1, a lower die base 2 is installed on the upper surface of the workbench 1, an upper die base 3 is arranged above the lower die base 2, cooling cavities 13 are arranged inside the lower die base 2 and inside the upper die base 3, the lower die base 2 and the upper die base 3 are adapted to each other, and the lower die base 2 and the upper die base 3 are arranged to facilitate stamping processing on the workpiece, and the cooling cavity 13 is arranged to facilitate the circulation of cooling water from the inside of the lower die base 2 and the upper die base 3, so as to facilitate cooling treatment of the lower die base 2 and the upper die base 3.

[0024] A group of positioning components 4 are installed between the lower mold base 2 and the upper mold base 3. The positioning component 4 includes a positioning rod 401 fixedly connected to the upper surface of the lower mold base 2. The top of the positioning rod 401 is slidably connected to the bottom surface of the upper mold base 3. The outer surface of the positioning rod 401 is slidably connected to a reset plate 402. A reset spring 403 is installed on the bottom surface of the reset plate 402, and the bottom end of the reset spring 403 is connected to the upper surface of the lower mold base 2.

[0025] A positioning hole matched with the positioning rod 401 is provided on the bottom surface of the upper die base 3, so that the outer surface of the positioning rod 401 can be slidably connected with the inner wall of the positioning hole. When the upper die base 3 moves downward to punch the workpiece, the top end of the positioning rod 401 can slide on the inner wall of the positioning hole, so as to position the lower die base 2 and the upper die base 3, so that the reset plate 402 can slide downward on the outer surface of the positioning rod 401, and the reset spring 403 can be compressed. Under the elastic force of the reset spring 403, the reset plate 402 and the upper die base 3 can be easily reset.

[0026] A cooling water tank 5 is installed on the upper surface of the workbench 1. The cooling water tank 5 can be used to store cooling water. A transparent plate 9 is fixedly embedded on the front of the cooling water tank 5. The transparent plate 9 can be used to observe the amount of cooling water inside the cooling water tank 5, so that cooling water can be added in time. A water filling cover 10 is installed on the upper surface of the cooling water tank 5. A water filling port matched with the water filling cover 10 is provided on the upper surface of the cooling water tank 5, so that the water filling cover 10 can be threadedly connected to the inner wall of the water filling port. A circle of anti-slip grooves is provided on the outer surface of the water filling cover 10, so that the water filling cover 10 can be opened conveniently to add cooling water to the inside of the cooling water tank 5.

[0027] The front of the cooling water tank 5 is fixedly connected to a drain pipe 11, and a valve 12 is installed on the outer surface of the drain pipe 11. When the valve 12 is opened, the cooling water inside the cooling water tank 5 can be discharged through the drain pipe 11, so that the cooling water inside the cooling water tank 5 can be easily replaced.

[0028] A cooling water injection assembly 6 is installed on the front of the cooling water tank 5, and the cooling water injection assembly 6 includes a booster pump 601 fixedly embedded in the outer surface of the cooling water tank 5, the input end of the booster pump 601 is connected to the interior of the cooling water tank 5, the output end of the booster pump 601 is fixedly connected to a water injection hose 602, the end of the water injection hose 602 away from the booster pump 601 is connected to the interior of the lower mold base 2, the outer surface of the water injection hose 602 is fixedly connected to a water injection hose 2 603, and the end of the water injection hose 2 603 away from the water injection hose 602 is connected to the interior of the upper mold base 3.

[0029] The boost pump 601 can pressurize the cooling water inside the cooling water tank 5 and inject it into the interior of the lower mold base 2 and the interior of the upper mold base 3 through the water injection hose 1 602 and the water injection hose 2 603 respectively. The cooling water inside the lower mold base 2 and the upper mold base 3 can exchange heat with the heat of the lower mold base 2 and the heat of the upper mold base 3.

[0030] A reflux assembly 7 is installed on the back of the cooling water tank 5. The reflux assembly 7 includes a reflux hose 1 701 fixedly connected to the outer surface of the cooling water tank 5. The outer surface of the reflux hose 1 701 is fixedly connected to a reflux hose 2 702. One end of the reflux hose 1 701 away from the cooling water tank 5 and the other end of the reflux hose 2 702 away from the cooling water tank 5 are respectively connected to the interior of the lower mold base 2 and the interior of the upper mold base 3.

[0031] The cooling water after heat exchange with the lower mold base 2 and the upper mold base 3 can flow back to the interior of the cooling water tank 5 through the return hose 1 701 and the return hose 2 702, which can facilitate cooling of the lower mold base 2 and the upper mold base 3 and ensure the use effect of the lower mold base 2 and the upper mold base 3.

[0032] A refrigeration assembly 8 is installed on the right side of the cooling water tank 5. The refrigeration assembly 8 includes a heat conducting plate 1 801 fixedly embedded on the outer surface of the cooling water tank 5. A group of semiconductor cooling sheets 802 are installed on the outer surface of the heat conducting plate 1 801. A heat conducting plate 2 803 is arranged on the right side of the heat conducting plate 1 801, and the heat conducting plate 2 803 is connected to the semiconductor cooling sheet 802. The cold end of the semiconductor cooling sheet 802 is in contact with the heat conducting plate 1 801, and the hot end of the semiconductor cooling sheet 802 is in contact with the heat conducting plate 2 803. The operation of the semiconductor cooling sheet 802 can reduce the temperature of the heat conducting plate 1 801 and transfer the heat to the heat conducting plate 2 803, so that the heat conducting plate 1 801 can continuously cool and cool the cooling water inside the cooling water tank 5, so that the cooling water inside the cooling water tank 5 can always be kept at a low temperature, so that the stamping die can be quickly cooled, and the cooling effect of the stamping die can be improved. A group of equidistantly arranged heat dissipating fins 804 are fixedly connected to the outer surface of the second heat conducting plate 803 . A group of heat dissipating fans 805 are arranged on the right side of the second heat conducting plate 803 , and the heat dissipating fans 805 are connected to the heat dissipating fins 804 .

[0033] The heat dissipation fins 804 can be used to dissipate heat for the second heat conducting plate 803. The operation of the heat dissipation fan 805 can speed up the flow of air on the outer surface of the heat dissipation fins 804, thereby improving the heat dissipation effect of the heat dissipation fins 804 and the second heat conducting plate 803, thereby ensuring the cooling effect of the semiconductor refrigeration sheet 802 on the first heat conducting plate 801.

[0034] Working principle: When the device is used, first install the cooling water tank 5 on the upper surface of the workbench 1 for use, so that the end of the water injection hose 1 602 and the end of the water injection hose 2 603 are connected to the inside of the lower die base 2 and the inside of the upper die base 3 respectively, so that the end of the return hose 1 701 and the end of the return hose 2 702 are connected to the lower die base 2 and the upper die base 3, open the water filling cover 10, add cooling water to the inside of the cooling water tank 5, and when the lower die base 2 and the upper die base 3 are stamping, the cooling water generated during stamping can be The heat will be transferred to the lower die base 2 and the upper die base 3, and the booster pump 601 will be started. The booster pump 601 can pressurize the cooling water inside the cooling water tank 5 and inject it into the lower die base 2 and the upper die base 3 through the water injection hose 1 602 and the water injection hose 2 603 respectively. The cooling water inside the lower die base 2 and the upper die base 3 can exchange heat with the heat of the lower die base 2 and the heat of the upper die base 3. The cooling water after the heat exchange can flow back to the cooling water tank 5 through the return hose 1 701 and the return hose 2 702. The interior of the water tank 5 can conveniently cool the lower mold base 2 and the upper mold base 3, and can ensure the use effect of the lower mold base 2 and the upper mold base 3. When the device is used for a long time and the temperature of the cooling water inside the cooling water tank 5 rises, the power of the semiconductor refrigeration plate 802 and the heat dissipation fan 805 is turned on. The operation of the semiconductor refrigeration plate 802 can reduce the temperature of the heat conducting plate 1 801 and increase the temperature of the heat conducting plate 2 803. The heat dissipation fins 804 are used to conveniently dissipate heat for the heat conducting plate 2 803. The operation of the heat dissipation fan 805 can accelerate the flow rate of air on the outer surface of the heat dissipation fins 804, and can improve the heat dissipation effect of the heat dissipation fins 804 and the heat conducting plate 2 803, thereby ensuring the cooling effect of the semiconductor refrigeration plate 802 on the heat conducting plate 1 801, so that the heat conducting plate 1 801 can continuously cool and cool the cooling water inside the cooling water tank 5, so that the cooling water inside the cooling water tank 5 can always maintain a low temperature state, which can achieve rapid cooling of the stamping mold and improve the cooling effect of the stamping mold.

[0035] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A stamping die rapid cooling device, comprising a workbench (1), characterized in that: A lower die base (2) and a cooling water tank (5) are installed on the upper surface of the workbench (1); an upper die base (3) is arranged above the lower die base (2); a group of positioning components (4) are installed between the lower die base (2) and the upper die base (3); the positioning component (4) comprises a positioning rod (401) fixedly connected to the upper surface of the lower die base (2); the top end of the positioning rod (401) is slidably connected to the bottom surface of the upper die base (3); the outer surface of the positioning rod (401) is slidably connected to a reset plate (402); and a cooling water injection component (6), a reflux component (7), and a refrigeration component (8) are installed on the outside of the cooling water tank (5).

2. A stamping die rapid cooling device according to claim 1, characterized in that: A reset spring (403) is installed on the bottom surface of the reset plate (402), and the bottom end of the reset spring (403) is connected to the upper surface of the lower die base (2). The interior of the lower die base (2) and the interior of the upper die base (3) are both provided with cooling cavities (13).

3. A stamping die rapid cooling device according to claim 2, characterized in that: The cooling water injection assembly (6) comprises a booster pump (601) fixedly embedded in the outer surface of the cooling water tank (5); the output end of the booster pump (601) is fixedly connected to a water injection hose 1 (602); the end of the water injection hose 1 (602) away from the booster pump (601) is connected to the interior of the lower mold base (2); the outer surface of the water injection hose 1 (602) is fixedly connected to a water injection hose 2 (603); and the end of the water injection hose 2 (603) away from the water injection hose 1 (602) is connected to the interior of the upper mold base (3).

4. A stamping die rapid cooling device according to claim 2, characterized in that: The return assembly (7) comprises a return hose 1 (701) fixedly connected to the outer surface of the cooling water tank (5); the outer surface of the return hose 1 (701) is fixedly connected to a return hose 2 (702); one end of the return hose 1 (701) away from the cooling water tank (5) and one end of the return hose 2 (702) away from the cooling water tank (5) are respectively connected to the interior of the lower mold base (2) and the interior of the upper mold base (3).

5. A stamping die rapid cooling device according to claim 2, characterized in that: The refrigeration component (8) includes a heat conducting plate 1 (801) fixedly embedded in the outer surface of the cooling water tank (5), a group of semiconductor refrigeration plates (802) are installed on the outer surface of the heat conducting plate 1 (801), a heat conducting plate 2 (803) is arranged on the right side of the heat conducting plate 1 (801), and the heat conducting plate 2 (803) is connected to the semiconductor refrigeration plate (802).

6. A stamping die rapid cooling device according to claim 5, characterized in that: A group of heat dissipation fins (804) are fixedly connected to the outer surface of the second heat conduction plate (803), and a group of heat dissipation fans (805) are arranged on the right side of the second heat conduction plate (803), and the heat dissipation fans (805) are connected to the heat dissipation fins (804).

7. A stamping die rapid cooling device according to claim 2, characterized in that: A transparent plate (9) is fixedly inlaid on the front of the cooling water tank (5), and a water filling cover (10) is installed on the upper surface of the cooling water tank (5).

8. The stamping die rapid cooling device according to claim 2, characterized in that: The front side of the cooling water tank (5) is fixedly connected to a drainage pipe (11), and a valve (12) is installed on the outer surface of the drainage pipe (11).

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