Zirconium core material substrate coining device for sensor chip

By designing a zirconium core material substrate precision pressing device for sensor chips, the problems of chip substrate removal operation risk and low efficiency in the prior art are solved, and safe and efficient chip substrate replacement and die-casting quality control are achieved.

CN222830675UActive Publication Date: 2025-05-06ZHEJIANG XINCI INTELLIGENT TECH CO LTD
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Patent Information

Application Number
CN202421896336.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-07
Publication Date
2025-05-06
Estimated Expiration
2034-08-07

AI Technical Summary

Technical Problem

The existing chip substrate precision pressing device requires workers to manually remove it after forming, which poses operating risks and the molded chip substrate is tightly clamped with the mold, which is difficult to remove, affecting efficiency.

Method used

A zirconium core material substrate precision pressing device for sensor chips is designed, including a base, a support frame, a cylinder, a press block, a sliding groove, a base plate, a press mold and a split frame. By moving the base plate out of the die-casting area, the chip substrate is easily divided using the split frame, and the residue in the pressure plate mold is cleaned through the airbag.

Benefits of technology

This device avoids manual replacement operations for staff in the die-casting area, ensures personal safety, improves the efficiency of chip substrate replacement, and ensures the die-casting quality by cleaning residues.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a zirconium core material substrate coining device for a sensor chip, and belongs to the technical field of coining devices. According to the zirconium core material substrate coining device for the sensor chip, a supporting frame is fixed to a base, an air cylinder is arranged on the supporting frame, and a pressing block is fixedly connected to the lower portion of the air cylinder; a sliding groove is formed in the base, and a bottom plate slides on the sliding groove; a pressing plate mold is fixed to the bottom plate through bolts, a segmentation frame is embedded in the pressing plate mold, a clamping block is fixed to the bottom plate, a sliding block is fixed to the lower end of the bottom plate, a servo motor is fixed in the base, a threaded rod is fixed to the output end of the servo motor, and the threaded rod is connected with the sliding block through threads. According to the die-casting die, potential safety hazards caused by the fact that workers replace the chip substrate in the die-casting area can be avoided, the personal safety of the workers is guaranteed, meanwhile, the chip substrate can be rapidly replaced, the die-casting efficiency is improved, and the interior of the pressing plate die can be automatically cleaned when the chip substrate is replaced.
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Description

Technical Field

[0001] The utility model relates to the technical field of precision pressing devices, in particular to a precision pressing device for a zirconium core material substrate for a sensor chip. Background Art

[0002] A sensor chip is a miniature electronic device that converts non-electrical quantities (such as temperature, pressure, light intensity, sound, etc.) into electrical quantities (such as voltage, current, resistance, etc.). It is widely used in various electronic devices to realize information detection, transmission, processing and control. In the composition of the sensor chip, the chip substrate is an important component of the sensor chip. It carries various components of the sensor chip and ensures that the chip can work stably and reliably.

[0003] At present, zirconium core material substrates are very popular in applications requiring these properties, such as aerospace, electronics, medical and energy fields, because of their high strength, high hardness, high temperature tolerance, corrosion resistance and good insulation performance. However, most of the existing chip substrates are die-casted by precision pressing devices, and after molding, workers are often required to manually remove the die-cast chip substrates from the mold. Performing this operation in the die-casting position has certain operational risks, and the molded chip substrate is often tightly fastened to the mold and is not easy to remove. Based on this, the utility model is proposed. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a precision pressing device for a zirconium core material substrate for a sensor chip which can overcome the above problems or at least partially solve the above problems.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A precision pressing device for a zirconium core material substrate for a sensor chip comprises a base, and also includes: a support frame fixed on the base, a cylinder provided on the support frame, a pressure block fixedly connected below the cylinder; a sliding groove is provided on the base, a bottom plate slides on the sliding groove; a pressure plate mold is fixed on the bottom plate by bolts, and a split frame is embedded in the pressure plate mold.

[0007] Preferably, a clamping block is fixed on the bottom plate, and a sliding block is fixed at the lower end of the bottom plate.

[0008] Furthermore, a servo motor is fixed in the base, a threaded rod is fixed to the output end of the servo motor, and the threaded rod is connected to the slider through threads.

[0009] Preferably, the base is fixedly connected to a fixing plate via a connecting rod, and an airbag is fixed on the fixing plate.

[0010] Furthermore, the airbag is respectively connected with an air intake pipe and a hose.

[0011] Furthermore, the pressing plate mold is connected with a connecting pipe, and the connecting pipe is connected to the other end of the hose.

[0012] Furthermore, the pressing plate mold is provided with a plurality of air holes, and the air holes are connected with the connecting pipe.

[0013] Furthermore, the pressing plate mold and the bottom plate are both provided with dust cleaning grooves.

[0014] Compared with the prior art, the utility model provides a precision pressing device for a zirconium core material substrate for a sensor chip, which has the following beneficial effects:

[0015] 1. The precision pressing device for the zirconium core material substrate for the sensor chip moves the bottom plate out of the die-casting area, thereby avoiding the occurrence of safety accidents caused by machine erroneous operation when the staff replaces the chip substrate in the die-casting area, thereby ensuring the personal safety of the staff.

[0016] 2. The precision pressing device for the zirconium core material substrate for the sensor chip can easily remove the split frame and the die-cast chip substrate from the die-casting mold by holding the handles extending from both sides of the split frame, and then quickly replace the chip substrate to improve the die-casting efficiency.

[0017] 3. The precision pressing device for the zirconium core material substrate for the sensor chip squeezes the compressed airbag when moving the bottom plate, so that the air inside the compressed airbag is discharged through the air holes, thereby cleaning the residue in the pressing plate mold to avoid affecting the quality of the next die-casting.

[0018] The parts not involved in the device are the same as the existing technology or can be implemented by using the existing technology. The utility model can avoid the staff from replacing the chip substrate in the die-casting area, thereby ensuring the personal safety of the staff, and can quickly replace the chip substrate to improve the die-casting efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the overall structure of a precision pressing device for a zirconium core material substrate for a sensor chip proposed by the utility model;

[0020] Figure 2 This is a structural schematic diagram of a bottom plate and a pressing plate mold in a precision pressing device for a zirconium core material substrate for a sensor chip proposed by the utility model;

[0021] Figure 3 This is an exploded view of a bottom plate and a pressing plate mold in a precision pressing device for a zirconium core material substrate for a sensor chip proposed by the utility model;

[0022] Figure 4 This is an exploded view of the bottom plate portion of a precision pressing device for a zirconium core material substrate for a sensor chip proposed in the utility model;

[0023] Figure 5 The utility model discloses a cross-sectional view of a pressing plate mold in a precision pressing device for a zirconium core material substrate for a sensor chip.

[0024] In the figure: 1. base; 11. control module; 12. support frame; 13. cylinder; 14. pressure block; 15. sliding groove; 2. bottom plate; 21. clamping block; 22. slider; 23. servo motor; 24. threaded rod; 3. pressure plate mold; 31. dividing frame; 32. air hole; 33. connecting pipe; 4. cleaning groove; 5. air bag; 51. hose; 52. air intake pipe; 53. fixing plate. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0026] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0027] Embodiment 1:

[0028] Reference Figure 1-Figure 5 A precision pressing device for a zirconium core material substrate for a sensor chip includes a base 1, and also includes: a support frame 12 is fixed on the base 1, a cylinder 13 is provided on the support frame 12, and a pressing block 14 is fixedly connected to the lower part of the cylinder 13; a sliding groove 15 is opened on the base 1, and a bottom plate 2 slides on the sliding groove 15; a pressing plate mold 3 is fixed to the bottom plate 2 by bolts, and a dividing frame 31 is embedded in the pressing plate mold 3, and a control module 11 is fixedly connected next to the support frame 12.

[0029] In the utility model, the bottom plate 2 and the pressing plate mold 3 are fixedly connected by bolts, so that the pressing plate mold 3 is convenient to replace. After the pressing block 14 is die-casted on the chip substrate, the bottom plate 2 is moved to the bottom plate 2. Figure 1The left side of the middle part can be moved, so that the pressing plate mold 3 can be separated from the die-casting area, which can avoid the occurrence of safety accidents caused by machine error operation when the staff replaces the chip substrate in the die-casting area, thereby ensuring the personal safety of the staff;

[0030] The staff can take the split frame 31 out of the pressure plate mold 3 by holding the handles extending from both sides of the split frame 31. The supporting part extending from the bottom of the split frame 31 will support the chip substrate and take it out together, so that the chip substrate can be quickly replaced and the die-casting efficiency is improved.

[0031] Embodiment 2:

[0032] Reference Figure 1-Figure 5 , which is basically the same as Example 1, and furthermore: a clamping block 21 is fixed on the clamping bottom plate 2, a slider 22 is fixed at the lower end of the bottom plate 2, a servo motor 23 is fixed in the base 1, a threaded rod 24 is fixed at the output end of the servo motor 23, the threaded rod 24 is connected to the slider 22 by threads, the base 1 is fixedly connected to a fixing plate 53 by a connecting rod, an airbag 5 is fixed on the fixing plate 53, an air inlet pipe 52 and a hose 51 are respectively connected to the airbag 5, a connecting pipe 33 is connected to the pressing plate mold 3, the connecting pipe 33 is connected to the other end of the hose 51, a plurality of air holes 32 are provided on the pressing plate mold 3, the air holes 32 are connected to the connecting pipe 33, and a dust cleaning groove 4 is provided on the pressing plate mold 3 and the bottom plate 2.

[0033] In the present invention, the servo motor 23 drives the threaded rod 24 to rotate, thereby causing the slider 22 and the bottom plate 2 to move along the direction of the sliding groove 15;

[0034] A rubber layer is provided on one side of the split frame 31 that is connected to the air hole 32, so that when the split frame 31 is placed in the pressure plate mold 3, the split frame 31 can block the air hole 32 through the rubber layer. A one-way air inlet valve is provided in the air inlet pipe 52, so that air can only enter the airbag 5 through the air inlet pipe 52. A one-way air outlet valve is provided in the hose 51, so that the air in the airbag 5 can only be discharged through the hose 51 when compressed. When the bottom plate 2 is moved to one side of the airbag 5, The protruding push block on the base plate 2 will press the airbag 5. At this time, since the air hole 32 is blocked by the dividing frame 31, the airbag 5 will expand. When the dividing frame 31 is lifted up, the air inside the airbag 5 will be discharged from the air hole 32 through the hose 51, thereby cleaning the residue inside the pressure plate mold 3. The residue will be blown to one side of the cleaning trough 4 and discharged through the cleaning trough 4. A return spring is provided inside the airbag 5. When the base plate 2 is away from the airbag 5, the return spring supports the airbag 5 to return to its original position.

[0035] When in use, the user first starts the device, the servo motor 23 will move the base plate 2 to the side of the airbag 5, the staff will put the plate to be die-cast into the pressure plate mold 3, and then send a die-casting command through the control module 11, the servo motor 23 drives the base plate 2 to return for the die-casting operation, when the die-casting operation is completed, the servo motor 23 drives the base plate 2 to move to the side of the airbag 5 again, the staff only needs to take out the split frame 31 to take out the chip substrate, and put the next chip substrate into the split frame 31, and then place the split frame 31 and the chip substrate in the pressure plate mold 3 and repeat the above operation.

[0036] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A coining device for a zirconium core material substrate for a sensor chip, comprising a base (1), characterized in that: Also includes: A support frame (12) is fixed on the base (1), a cylinder (13) is provided on the support frame (12), and a pressure block (14) is fixedly connected below the cylinder (13); The base (1) is provided with a sliding groove (15), and a bottom plate (2) slides on the sliding groove (15); A pressing plate mold (3) is fixed on the bottom plate (2) by means of bolts, and a splitting frame (31) is embedded in the pressing plate mold (3).

2. The coining device for a zirconium core material substrate for a sensor chip according to claim 1, characterized in that: A clamping block (21) is fixed on the bottom plate (2), and a sliding block (22) is fixed at the lower end of the bottom plate (2).

3. The coining device for a zirconium core material substrate for a sensor chip according to claim 2, characterized in that: A servo motor (23) is fixed inside the base (1), a threaded rod (24) is fixed to the output end of the servo motor (23), and the threaded rod (24) is connected to the slider (22) via threads.

4. The coining device for a zirconium core material substrate for a sensor chip according to claim 1, characterized in that: The base (1) is fixedly connected to a fixing plate (53) via a connecting rod, and an air bag (5) is fixed on the fixing plate (53).

5. The coining device for a zirconium core material substrate for a sensor chip according to claim 4, characterized in that: The air bag (5) is connected to an air intake pipe (52) and a hose (51) respectively.

6. The coining device for a zirconium core material substrate for a sensor chip according to claim 5, characterized in that: The pressing plate mold (3) is connected to a connecting pipe (33), and the connecting pipe (33) is connected to the other end of the hose (51).

7. A coining device for a zirconium core material substrate for a sensor chip according to claim 6, characterized in that: The pressing plate mold (3) is provided with a plurality of air holes (32), and the air holes (32) are connected to the connecting pipe (33).

8. The coining device for a zirconium core material substrate for a sensor chip according to claim 1, characterized in that: The pressing plate mold (3) and the bottom plate (2) are both provided with dust cleaning grooves (4).