Monocrystalline silicon wafer polishing machine
By designing a single crystal silicon wafer polishing machine that includes support pillars, rotating sleeves, placing plates, teeth and electric push rods, the continuous loading and unloading of the silicon wafer and the multi-directional movement of the polishing discs is achieved, solving the problems of inefficiency of traditional equipment and dust pollution, and improving production efficiency and environmental protection.
Patent Information
- Application Number
- CN202421652103.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2034-07-12
AI Technical Summary
Traditional single crystal silicon wafer polishing equipment cannot carry out loading and unloading operations at the same time, resulting in low production efficiency and difficult to control the dust generated during the polishing process, polluting the environment and affecting the accuracy and stability of the equipment.
A single crystal silicon wafer polishing machine is designed, using supporting pillars, rotating sleeves, placing plates, teeth and electric push rods to realize multi-directional movement of the polishing disc and continuous loading and unloading of the silicon wafer, and combined with a dustproof cover to reduce dust dissipation.
It improves the production efficiency of single crystal silicon wafer polishing, reduces the idle time of the equipment, effectively controls dust pollution, protects the processing environment, and improves the accuracy and stability of the equipment.
Smart Images
Figure CN222831511U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of single crystal silicon wafer polishing, in particular to a single crystal silicon wafer polishing machine. Background Art
[0002] In the field of semiconductor manufacturing, the surface quality of single-crystal silicon wafers is crucial to the subsequent chip manufacturing process, and polishing of single-crystal silicon wafers is one of the key steps to improve their surface quality.
[0003] Traditional single crystal silicon wafer polishing equipment usually has only one silicon wafer slot. When polishing single crystal silicon wafers, it is impossible to load and unload materials at the same time, which leads to low production efficiency. Operators need to wait for the current silicon wafer to be polished, take out and reload new silicon wafers. During this period, the equipment is idle, wasting a lot of time. In addition, a lot of dust will be generated during the polishing process. If this dust cannot be effectively controlled, it will not only pollute the working environment and affect the health of operators, but also may have an adverse effect on the accuracy and stability of the equipment. For this reason, we propose a single crystal silicon wafer polishing machine. Utility Model Content
[0004] The utility model aims to provide a single crystal silicon wafer polishing machine to solve the problems raised by the above background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a single crystal silicon wafer polishing machine, comprising a pillar, a rotating sleeve is rotatably installed on the outer side of the pillar, a placement plate is fixedly installed on the outer side of the rotating sleeve, a plurality of teeth are fixedly installed on the outer side of the placement plate, and a driving component for driving the teeth to move is installed on one side of the pillar;
[0006] A first electric push rod is installed on the top surface of the pillar, a moving plate is installed on one end of the inner rod of the first electric push rod, a linear motor is installed on the top surface of the moving plate, a vertical plate is fixedly installed on the moving end of the linear motor, a second electric push rod is installed on one side of the vertical plate, a moving plate is fixedly installed on one end of the inner rod of the second electric push rod, a polishing device is installed on the surface of the moving plate, and a dust cover is installed on the bottom surface of the moving plate.
[0007] Preferably, a plurality of teeth are distributed in a circular shape at equal intervals on the outer side of the rotating sleeve.
[0008] Preferably, two silicon wafer grooves are symmetrically opened on the top surface of the placement plate.
[0009] Preferably, the driving assembly includes a mounting plate, a first motor is mounted on the top surface of the mounting plate, an output end of the first motor movably passes through the mounting plate, a gear is fixedly mounted on the output end of the first motor, and the gear is meshed with teeth.
[0010] Preferably, the polishing device includes a second motor, which is mounted on the top surface of the moving plate, an output end of the second motor movably passes through the moving plate, and a polishing disc is fixedly mounted on the output end of the second motor.
[0011] Preferably, the dust cover is located at the output end of the second motor and the outside of the polishing disk.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. The single crystal silicon wafer polishing machine controls the polishing disc to contact with the top surface of the silicon wafer, turns on the switch of the second motor, drives the polishing disc to rotate for polishing, turns on the switch of the linear motor, drives the vertical plate and the second electric push rod to move horizontally, and finally makes the polishing disc move longitudinally. The second electric push rod can drive the polishing disc to move horizontally, thereby driving the polishing disc to move and perform comprehensive polishing on the surface of the single crystal silicon wafer. During this process, the dust cover is covered on the outside of the single crystal silicon wafer, thereby reducing the dust generated by polishing and protecting the processing environment.
[0014] 2. During the polishing process of one silicon wafer, the single crystal silicon wafer is placed in another silicon wafer slot. After polishing is completed, the polishing disc is separated from the silicon wafer and the first motor is turned on to drive the gears to rotate, thereby driving the teeth to rotate and thus driving the placement plate to rotate 180 degrees, so that the loaded single crystal silicon wafer is transported to the bottom of the polishing disc for polishing, and the polished single crystal silicon wafer is transported to the other side for unloading and reloading, thereby ensuring continuous polishing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0016] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model.
[0017] In the figure: 1. support; 2. rotating sleeve; 3. teeth; 4. mounting plate; 5. first motor; 6. gear; 7. placement plate; 8. silicon wafer slot; 9. first electric push rod; 10. moving plate; 11. vertical plate; 12. second electric push rod; 13. second motor; 14. polishing disc; 15. dust cover; 16. linear motor; 17. moving plate. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] Embodiment 1
[0020] Please refer to Figure 1-2 As shown, the utility model provides a single crystal silicon wafer polishing machine, comprising a pillar 1, a rotating sleeve 2 is rotatably mounted on the outer side of the pillar 1, a placement plate 7 is fixedly mounted on the outer side of the rotating sleeve 2, a plurality of teeth 3 are fixedly mounted on the outer side of the placement plate 7, and the plurality of teeth 3 are distributed in a ring-shaped manner with equal spacing on the outer side of the rotating sleeve 2, and a driving component for driving the teeth 3 to move is installed on one side of the pillar 1;
[0021] A first electric push rod 9 is installed on the top surface of the pillar 1, a moving plate 10 is installed on one end of the inner rod of the first electric push rod 9, a linear motor 16 is installed on the top surface of the moving plate 10, a vertical plate 11 is fixedly installed on the moving end of the linear motor 16, a second electric push rod 12 is installed on one side of the vertical plate 11, a moving plate 17 is fixedly installed on one end of the inner rod of the second electric push rod 12, a polishing device is installed on the surface of the moving plate 17, and a dust cover 15 is installed on the bottom surface of the moving plate 17.
[0022] Specifically, the polishing device is covered by a dust cover 15, thereby effectively preventing dust from being scattered, and the placement plate 7 is conveniently controlled to rotate through a driving component, thereby changing the position of the single crystal silicon wafer.
[0023] Wherein: two silicon wafer grooves 8 are symmetrically provided on the top surface of the placement plate 7 , and the single crystal silicon wafers can be placed in the silicon wafer grooves 8 .
[0024] Wherein: the driving assembly includes a mounting plate 4, a first motor 5 is mounted on the top surface of the mounting plate 4, an output end of the first motor 5 movably penetrates the mounting plate 4, a gear 6 is fixedly mounted on the output end of the first motor 5, the gear 6 is meshed with the teeth 3, the first motor 5 is controlled to open, and the gear 6 is driven to rotate, and the placement plate 7 can be driven to rotate 180 degrees through the teeth 3.
[0025] Wherein: the polishing equipment includes a second motor 13, the second motor 13 is installed on the top surface of the moving plate 17, the output end of the second motor 13 moves through the moving plate 17, the output end of the second motor 13 is fixedly installed with a polishing disc 14, the dust cover 15 is located at the output end of the second motor 13 and the outside of the polishing disc 14, turn on the switch of the second motor 13, drive the polishing disc 14 to rotate for polishing, and the dust cover 15 covers the outside of the single crystal silicon wafer, so as to reduce the dust generated by polishing.
[0026] Working principle: The utility model is a single crystal silicon wafer polishing machine. A silicon wafer is placed in a silicon wafer groove 8. The thickness of the silicon wafer groove 8 is less than that of the single crystal silicon wafer, so that the single crystal silicon wafer can protrude from the silicon wafer groove 8. The first electric push rod 9 is controlled to contract, driving the moving plate 10, the linear motor 16, the vertical plate 11, the second electric push rod 12, the moving plate 17, and the polishing disc 14 to move downward. The polishing disc 14 contacts the top surface of the silicon wafer. The switch of the second motor 13 is turned on to drive the polishing disc 14 to rotate for polishing. The switch of the linear motor 16 is turned on to drive the vertical plate 11 and the second electric push rod 12 to move horizontally, and finally the polishing disc 14 moves longitudinally. The second electric push rod 12 can drive the polishing disc 14 to move horizontally, thereby driving the polishing disc 14 to move and perform comprehensive polishing on the surface of the single crystal silicon wafer. In this process, the dust cover 15 covers the outer side of the single crystal silicon wafer, thereby reducing the dust generated by polishing and protecting the processing environment.
[0027] During the polishing process of a silicon wafer, another single crystal silicon wafer is placed in another silicon wafer slot 8. After the polishing is completed, the polishing disk 14 is controlled to separate from the silicon wafer, and the first motor 5 is controlled to turn on, driving the gear 6 to rotate, driving the teeth 3 to rotate, and thus driving the placement plate 7 to rotate one hundred and eighty degrees, so that the loaded single crystal silicon wafer is transported to the bottom of the polishing disk 14 for polishing, and the polished single crystal silicon wafer is transported to the other side for unloading and reloading.
[0028] The contents not described in detail in this specification belong to the prior art known to professionals in this field.
[0029] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A single crystal silicon wafer polishing machine, comprising a support (1), characterized in that: A rotating sleeve (2) is rotatably mounted on the outer side of the pillar (1), a placement plate (7) is fixedly mounted on the outer side of the rotating sleeve (2), a plurality of teeth (3) are fixedly mounted on the outer side of the placement plate (7), and a driving component for driving the teeth (3) to move is mounted on one side of the pillar (1); A first electric push rod (9) is installed on the top surface of the pillar (1), a moving plate (10) is installed at one end of the inner rod of the first electric push rod (9), a linear motor (16) is installed on the top surface of the moving plate (10), a vertical plate (11) is fixedly installed on the moving end of the linear motor (16), a second electric push rod (12) is installed on one side of the vertical plate (11), a moving plate (17) is fixedly installed at one end of the inner rod of the second electric push rod (12), a polishing device is installed on the surface of the moving plate (17), and a dust cover (15) is installed on the bottom surface of the moving plate (17).
2. A single crystal silicon wafer polishing machine according to claim 1, characterized in that: The plurality of teeth (3) are distributed in an annular manner at equal intervals on the outside of the rotating sleeve (2).
3. A single crystal silicon wafer polishing machine according to claim 1, characterized in that: Two silicon wafer grooves (8) are symmetrically provided on the top surface of the placement plate (7).
4. A single crystal silicon wafer polishing machine according to claim 1, characterized in that: The driving assembly comprises a mounting plate (4), a first motor (5) is mounted on the top surface of the mounting plate (4), an output end of the first motor (5) movably passes through the mounting plate (4), a gear (6) is fixedly mounted on the output end of the first motor (5), and the gear (6) is meshed with the teeth (3).
5. A single crystal silicon wafer polishing machine according to claim 1, characterized in that: The polishing device comprises a second motor (13), the second motor (13) is mounted on the top surface of a moving plate (17), an output end of the second motor (13) movably penetrates the moving plate (17), and a polishing disc (14) is fixedly mounted on the output end of the second motor (13).
6. A single crystal silicon wafer polishing machine according to claim 5, characterized in that: The dust cover (15) is located at the output end of the second motor (13) and outside the polishing disc (14).