Ceramic sputtering furnace

Abstract

The utility model discloses a ceramic sputtering furnace, which relates to the technical field of coating equipment and comprises a device main body, a fixing mechanism, a target material, a mounting seat, a cooling cavity and an isolation block, a backflow cavity is arranged in the isolation block, a first cooling pipe is arranged in the cooling cavity, and the bottom of the first cooling pipe is connected with a first backflow pipe. A circulating pipe is connected to the interior of the first cooling pipe, a second cooling pipe is connected to the other side of the circulating pipe, a second backflow pipe is connected to the bottom of the second cooling pipe, and the second backflow pipe penetrates through the connecting opening. According to the cooling device, the first cooling pipe and the second cooling pipe with the height difference are matched with each other, cooling liquid interaction is conducted through the circulating pipe, the second cooling pipe assists in cooling when the first cooling pipe is used for cooling, and meanwhile the cooling liquid in the first cooling pipe is mixed with the second cooling pipe when being about to be heated; the cooling effect of the first cooling pipe is improved, and the cooling effect is prevented from becoming poor when the first cooling pipe reaches the bottom.

Description

Technical Field

[0001] The utility model relates to the technical field of coating equipment, in particular to a ceramic sputtering furnace. Background Art

[0002] The principle of magnetron sputtering thin film deposition is to add a certain voltage between the anode and the cathode sputtering target to form an electrostatic field of sufficient strength, and then introduce an inert gas that is more easily ionized into the vacuum chamber. Under the action of the electrostatic field, a gas ionization glow discharge is generated, and the inert gas is ionized to produce high-energy inert gas cations and secondary electrons. The high-energy inert gas cations will be accelerated to the surface of the cathode sputtering target due to the action of the electric field, and bombard the target surface with high energy, causing the target surface to sputter, and the sputtered target atoms are deposited on the substrate to form a thin film.

[0003] The existing patent (Announcement No.: CN220413507U) discloses a ceramic sputtering furnace, in which a cooling medium source is connected to a liquid inlet and a liquid outlet respectively, and the cooling medium source is used to transport the cooling medium from the liquid inlet to the cooling pipe. The utility model can significantly improve the heat dissipation and cooling effect of the magnetron sputtering target. In the process of implementing this solution, it is found that the following problems exist in the prior art and have not been well solved:

[0004] During use, the device achieves a cooling effect through a spiral cooling pipe. However, as the coolant flows downward during use, the coolant easily becomes hot after absorbing heat, affecting the cooling effect at the bottom. Moreover, when in use, the cooling pipe surrounds the liquid outlet, and the heat at the liquid outlet is easily absorbed by the cooling pipe, further reducing the cooling effect of the cooling pipe. Utility Model Content

[0005] In order to improve the above-mentioned problem that the cooling effect at the bottom of the cooling pipe is easily deteriorated and the heat of the liquid outlet pipe is easily absorbed by the cooling pipe, causing the cooling effect to further deteriorate, the utility model provides a ceramic sputtering furnace.

[0006] The utility model provides a ceramic sputtering furnace, which adopts the following technical scheme:

[0007] A ceramic sputtering furnace comprises a device body, a fixing mechanism is arranged above the device body, a target is arranged at the center of the fixing mechanism, a mounting seat is arranged below the target, a cooling cavity is arranged inside the target, an isolation block is arranged inside the cooling cavity, and a reflux cavity is arranged inside the isolation block;

[0008] A first cooling pipe is arranged inside the cooling chamber, a first return pipe is connected to the bottom of the first cooling pipe, a circulation pipe is connected to the inside of the first cooling pipe, a second cooling pipe is connected to the other side of the circulation pipe, a second return pipe is connected to the bottom of the second cooling pipe, and the second return pipe passes through the connecting port.

[0009] Through the above technical solution, it is convenient to isolate the cooling chamber from the reflux chamber through the isolation block to prevent the heat of the reflux pipe from being absorbed by the cooling pipe and affecting the cooling effect. By providing a first cooling pipe and a second cooling pipe, the second cooling pipe can assist in cooling and mix the coolant inside it with the first cooling pipe to improve the cooling effect.

[0010] Optionally, in the above-mentioned ceramic sputtering furnace, the target material is integrated with the device body through a mounting seat, the target material is symmetrically distributed inside the device body, and the length of the target material is consistent with the length of the cooling chamber.

[0011] Through the above technical solution, it is convenient to utilize the cooling cavity for auxiliary cooling to ensure the cooling effect.

[0012] Optionally, in the above-mentioned ceramic sputtering furnace, the first cooling pipe is distributed in a spiral shape inside the cooling chamber, the first cooling pipe and the first reflux pipe are installed in an integrated manner, and the first reflux pipe has a linear structure.

[0013] Through the above technical solution, it is convenient to initially cool the target material through the first cooling tube to ensure its continuous use.

[0014] Optionally, in the above-mentioned ceramic sputtering furnace, the shape of the second cooling tube is consistent with that of the first cooling tube, the height of the second cooling tube is higher than that of the first cooling tube, and the second cooling tube and the second reflux tube are installed in an integrated manner.

[0015] The above technical solution facilitates auxiliary cooling through the second cooling pipe, thereby preventing the cooling effect of the first cooling pipe from deteriorating when the first cooling pipe reaches the bottom.

[0016] Optionally, in the above-mentioned ceramic sputtering furnace, the isolation block and the target material are connected by hot-melt connection, the length of the isolation block is consistent with the length of the reflux chamber, and connection ports are symmetrically distributed on the inner side of the isolation block.

[0017] Through the above technical solution, it is convenient to use the isolation block to isolate the cooling chamber from the reflux chamber, so as to prevent the cooling pipe from absorbing the heat in the reflux pipe and thus affecting the cooling effect.

[0018] Optionally, in the above-mentioned ceramic sputtering furnace, the circulation pipe runs through the first cooling pipe and the second cooling pipe, and the circulation pipe is in an eight-shaped structure, with the inside of the circulation pipe being higher and the outside being lower.

[0019] Through the above technical solution, it is convenient to use the circulation pipe to mix the coolant in the second cooling pipe with the coolant in the first cooling pipe, thereby ensuring that the second cooling pipe can assist in adsorption cooling of the first cooling pipe to avoid overheating of the first cooling pipe.

[0020] In summary, the present invention has at least one of the following beneficial effects:

[0021] The first cooling pipe and the second cooling pipe with a height difference cooperate with each other, and the circulation pipe is used to exchange the cooling liquid, so that the second cooling pipe assists in cooling when the first cooling pipe is cooling. At the same time, the cooling liquid inside the first cooling pipe is mixed with the second cooling pipe when it is about to become hot, thereby improving the cooling effect of the first cooling pipe and preventing the cooling effect from being deteriorated when it reaches the bottom;

[0022] By arranging an isolation block inside the cooling chamber, the cooling chamber and the reflux chamber cannot communicate with each other, so that the reflux pipe will not affect the cooling pipe when in use, thereby ensuring that the cooling effect of the cooling pipe is further improved, and the reflux of the coolant is guaranteed through the connecting port for normal operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall front view structure of the utility model;

[0024] Figure 2 This is a schematic diagram of the top view structure of the target material of the utility model;

[0025] Figure 3 This is a schematic diagram of the front view structure of the isolation block of the utility model;

[0026] Figure 4 This utility model Figure 1 Enlarged structural diagram at A in the middle.

[0027] In the figure: 1. Device body; 2. Target material; 3. Mounting seat; 4. Cooling chamber; 5. First cooling pipe; 6. First reflux pipe; 7. Second cooling pipe; 8. Isolation block; 9. Second reflux pipe; 10. Circulation pipe; 11. Connecting port; 12. Reflux chamber; 13. Fixing mechanism. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-4 The utility model is described in further detail.

[0029] Please refer to the attached figure in the instruction manual Figure 1-4The utility model provides an embodiment: a ceramic sputtering furnace, including a device body 1, a fixing mechanism 13 is arranged above the device body 1, a target material 2 is arranged at the center of the fixing mechanism 13, and an auxiliary limit fixation is performed by the fixing mechanism 13 to ensure the subsequent work, a mounting seat 3 is arranged below the target material 2, a cooling chamber 4 is arranged inside the target material 2, a first cooling tube 5 and a second cooling tube 7 are accommodated by the cooling chamber 4, and cooling is convenient, an isolation block 8 is arranged inside the cooling chamber 4, and a reflux chamber 12 is arranged inside the isolation block 8, and the reflux chamber 12 cooperates with the isolation block 8 to avoid affecting the cooling work;

[0030] A first cooling pipe 5 is provided inside the cooling chamber 4, and a first return pipe 6 is connected to the bottom of the first cooling pipe 5. Preliminary cooling is performed through the first cooling pipe 5. A circulation pipe 10 is connected inside the first cooling pipe 5, and a second cooling pipe 7 is connected to the other side of the circulation pipe 10. The circulation pipe 10 cooperates with the second cooling pipe 7 to improve the cooling effect. A second return pipe 9 is connected to the bottom of the second cooling pipe 7, and the second return pipe 9 passes through a connecting port 11.

[0031] See the attached drawings in the specification Figure 1-4 The target material 2 is integrated with the device body 1 through the mounting seat 3. The target material 2 is symmetrically distributed inside the device body 1. The length of the target material 2 is consistent with the length of the cooling cavity 4. The cooling cavity 4 is used for auxiliary cooling to ensure the cooling effect.

[0032] See the attached drawings in the specification Figure 1-4 The first cooling pipe 5 is spirally distributed inside the cooling chamber 4. The first cooling pipe 5 and the first reflux pipe 6 are installed in an integrated manner. The first reflux pipe 6 is a linear structure. The target material 2 is preliminarily cooled by the first cooling pipe 5 to ensure its continuous use.

[0033] See the attached drawings in the specification Figure 1-4 The shape of the second cooling pipe 7 is consistent with that of the first cooling pipe 5. The height of the second cooling pipe 7 is higher than that of the first cooling pipe 5. The second cooling pipe 7 and the second reflux pipe 9 are installed in an integrated manner. Auxiliary cooling is performed through the second cooling pipe 7 to prevent the cooling effect of the first cooling pipe 5 from deteriorating when it reaches the bottom.

[0034] See the attached drawings in the specification Figure 1-4 The isolation block 8 is connected to the target material 2 by hot-melt connection. The length of the isolation block 8 is consistent with the length of the reflux chamber 12. The inner side of the isolation block 8 is symmetrically provided with connection ports 11. The isolation block 8 is used to isolate the cooling chamber 4 from the reflux chamber 12 to prevent the cooling pipe from absorbing the heat in the reflux pipe and thus affecting the cooling effect.

[0035] See the attached drawings in the specification Figure 1-4The circulation pipe 10 runs through the first cooling pipe 5 and the second cooling pipe 7. The circulation pipe 10 is in an eight-shaped structure. The circulation pipe 10 is high inside and low outside. The circulation pipe 10 is used to mix the coolant in the second cooling pipe 7 with the coolant in the first cooling pipe 5, thereby ensuring that the second cooling pipe 7 can assist in adsorption cooling of the first cooling pipe 5 to avoid overheating of the first cooling pipe 5.

[0036] Working principle: When in use, first, when the target material 2 is working and needs to be cooled, the coolant is injected from the liquid inlet above the first cooling tube 5 and the second cooling tube 7, so that the coolant begins to spiral downward around the first cooling tube 5. In the process of spiraling downward, the target material 2 will be initially filtered, and the second cooling tube 7 will perform auxiliary cooling to ensure cooling efficiency. The circulation tube 10 connects the second cooling tube 7 and the first cooling tube 5, and the second cooling tube 7 is on the inside. The heat adsorbed by the coolant inside is lower than that of the first cooling tube 5. Therefore, when the coolant circulates, the second cooling tube 7 will simultaneously assist in allocating the heat to the first cooling tube 5 to ensure the cooling effect.

[0037] As mentioned above, after the coolant completes the cooling work, the coolant inside the first cooling tube 5 and the second cooling tube 7 respectively enters the first return tube 6 and the second return tube 9 through the connecting port 11. Due to the influence of the isolation block 8, the coolant will not affect the cooling work inside the outer cooling cavity 4 at this time, and is finally discharged from the upper liquid outlet.

[0038] The above are all preferred embodiments of the present utility model, and are not intended to limit the protection scope of the present utility model. Therefore, any equivalent changes made based on the structure, shape, and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. A ceramic sputtering furnace, comprising a device body (1), characterized in that: A fixing mechanism (13) is arranged above the device body (1), a target material (2) is arranged at the center of the fixing mechanism (13), a mounting seat (3) is arranged below the target material (2), a cooling cavity (4) is arranged inside the target material (2), an isolation block (8) is arranged inside the cooling cavity (4), and a reflux cavity (12) is arranged inside the isolation block (8); A first cooling pipe (5) is arranged inside the cooling chamber (4); a first return pipe (6) is connected to the bottom of the first cooling pipe (5); a circulation pipe (10) is connected to the inside of the first cooling pipe (5); a second cooling pipe (7) is connected to the other side of the circulation pipe (10); a second return pipe (9) is connected to the bottom of the second cooling pipe (7); and the second return pipe (9) passes through the connection port (11).

2. A ceramic sputtering furnace according to claim 1, characterized in that: The target material (2) is integrally mounted with the device body (1) via a mounting seat (3); the target material (2) is symmetrically distributed inside the device body (1); and the length of the target material (2) is consistent with the length of the cooling chamber (4).

3. A ceramic sputtering furnace according to claim 1, characterized in that: The first cooling pipe (5) is distributed in a spiral shape inside the cooling cavity (4); the first cooling pipe (5) and the first return pipe (6) are installed in an integrated manner; and the first return pipe (6) is a linear structure.

4. A ceramic sputtering furnace according to claim 1, characterized in that: The shape of the second cooling pipe (7) is consistent with that of the first cooling pipe (5); the height of the second cooling pipe (7) is higher than that of the first cooling pipe (5); and the second cooling pipe (7) and the second return pipe (9) are installed in an integrated manner.

5. A ceramic sputtering furnace according to claim 1, characterized in that: The isolation block (8) and the target material (2) are connected by hot-melt connection. The length of the isolation block (8) is consistent with the length of the reflow chamber (12). The inner side of the isolation block (8) is symmetrically provided with connection ports (11).

6. A ceramic sputtering furnace according to claim 1, characterized in that: The circulation pipe (10) passes through the first cooling pipe (5) and the second cooling pipe (7); the circulation pipe (10) is in an eight-shaped structure; the circulation pipe (10) is higher inside and lower outside.

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