Modularized heat dissipation device

Through the modularly designed liquid-cooled cooling device, the problems of poor use of heat exchange cold plates and low overall integration in existing liquid-cooled cooling systems are solved, achieving higher general flexibility and overall integration, and reducing maintenance costs.

CN222837388UActive Publication Date: 2025-05-06LCFC HEFEI ELECTRONICS TECH
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Patent Information

Application Number
CN202420493881.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-14
Publication Date
2025-05-06
Estimated Expiration
2034-03-14

AI Technical Summary

Technical Problem

In existing liquid-cooled cooling systems, the use of heat exchange cold plates is poor, the overall integration is low, and the maintenance cost is high.

Method used

A modular heat dissipation device is designed, adopting an integrated design of a detachable module heat exchange plate and a heat exchange shell, and the circulating liquid path is connected to the heat dissipation module to achieve modularization and integration of the heat exchange module.

Benefits of technology

It improves the general flexibility and overall integration of the heat exchange module, reduces maintenance costs, and can replace module heat exchange boards of different specifications according to different usage scenarios.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of heat dissipation equipment, and provides a modular heat dissipation device which comprises a heat exchange module and a heat dissipation module. The heat exchange module is connected with the heat dissipation module through a circulating liquid path; the heat exchange module comprises a heat exchange shell and a module heat exchange plate; a concave containing part is arranged in the heat exchange shell; the module heat exchange plate is detachably embedded in the accommodating part; a liquid inlet path and a liquid outlet path which are correspondingly connected are formed in the module heat exchange plate; and the heat exchange shell is provided with a liquid inlet port and a liquid outlet port which are correspondingly communicated and connected with the liquid inlet path and the liquid outlet path. The modularized heat dissipation device has the advantages of being flexible in use, good in adaptability, high in overall integration degree and low in later maintenance cost.
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Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation equipment, and in particular to a modular heat dissipation device. Background Art

[0002] Liquid cooling is a common and efficient heat dissipation solution in the prior art. Liquid cooling in the prior art generally includes several major components: a heat exchange plate, a heat dissipation radiator, a heat dissipation fan, and a circulating liquid pump. The heat exchange plate, the heat dissipation radiator, and the circulating liquid pump are connected in sequence through pipelines to form a closed-loop circulating liquid circuit. The heat exchange plate is used to absorb heat from the heat source, and the heat dissipation fan is used to blow heat from the heat dissipation radiator.

[0003] However, the liquid cooling system in the prior art has certain disadvantages. For example, the heat exchange plates therein are mostly formed by welding "aluminum die-cast cavity + cover plate" to form a sealed liquid cavity, which has a bulky structure and poor flexibility in use. In addition, once the cooling liquid leaks, the heat exchange plate needs to be scrapped as a whole, which also leads to high maintenance costs. In addition, the integration of the three major components of the heat sink, cooling fan, and circulating liquid pump in the prior art is also relatively low, and the overall design is less compact.

[0004] Therefore, there is an urgent need for a new structure of liquid cooling and heat dissipation system on the market to solve the problems of poor flexibility of use and low overall integration of heat exchange cold plates in the existing liquid cooling and heat dissipation systems. Utility Model Content

[0005] The disclosed embodiment provides a modular heat dissipation device to solve the problems of poor flexibility of use, low overall integration and high subsequent maintenance cost of heat exchange cold plates in liquid cooling systems in the prior art.

[0006] The modular heat dissipation device provided in the embodiment of the present disclosure includes a heat exchange module and a heat dissipation module;

[0007] The heat exchange module is connected to the heat dissipation module through a circulating fluid circuit;

[0008] The heat exchange module comprises a heat exchange shell and a module heat exchange plate;

[0009] Wherein, the heat exchange shell has a recessed receiving portion;

[0010] The module heat exchange plate can be detachably embedded in the housing portion;

[0011] The module heat exchange plate is provided with a correspondingly connected liquid inlet and liquid outlet.

[0012] The heat exchange shell has a liquid inlet port and a liquid outlet port which are connected to the liquid inlet path and the liquid outlet path respectively.

[0013] In one possible implementation manner, the liquid inlet path and the liquid outlet path are extended along the length direction of the module heat exchange plate;

[0014] The liquid inlet and the liquid outlet are parallel and spaced apart along the width direction of the module heat exchange plate;

[0015] One end of the liquid inlet path is conductively connected to the liquid inlet port, and the other end is connected to one end of the liquid outlet path through a flow path reversing member;

[0016] The other end of the liquid outlet path is connected to the liquid outlet port.

[0017] In one possible implementation, the liquid inlet path includes a plurality of liquid inlet sub-paths spaced parallel to each other along the width direction of the module heat exchange plate;

[0018] The liquid outlet path includes a plurality of liquid outlet sub-paths spaced parallel to each other along the width direction of the module heat exchange plate;

[0019] The flow path reversing member has a reversing flow guide, and the reversing flow guide is used to conduct and connect the plurality of liquid inlet sub-paths with the plurality of liquid outlet sub-paths.

[0020] In one possible implementation, on the end side of the module heat exchange plate close to the flow path reversing member, reversing guide plates inclined toward each other are respectively provided between two adjacent liquid inlet sub-paths and between two adjacent liquid outlet sub-paths.

[0021] In one possible implementation manner, the flow path reversing member has an inclined flow guide wall facing the liquid inlet sub-path and the liquid outlet sub-path respectively;

[0022] The two inclined flow guide walls intersect at the center of the flow path reversing member to form a maximum recessed portion.

[0023] In one possible implementation manner, the liquid inlet sub-path and the liquid outlet sub-path are both configured as prismatic pipelines with a right-angled triangle cross-section shape;

[0024] The inclined surfaces of two adjacent prismatic pipelines are arranged to face each other.

[0025] In one possible implementation manner, the heat exchange housing further comprises a coolant inlet and outlet cover disposed opposite to the flow path reversing member;

[0026] The coolant inlet and outlet cover is provided with the liquid inlet port and the liquid outlet port.

[0027] In one possible implementation manner, the liquid inlet ends of two adjacent liquid inlet sub-paths are provided with liquid inlet diverter plates extending toward the liquid inlet port.

[0028] In one possible implementation manner, the heat dissipation module includes a heat dissipation fan, a heat dissipation radiator, a circulating liquid pump, a mounting frame, and connecting pipes;

[0029] The cooling fan, the cooling radiator and the circulating liquid pump can be detachably mounted on the mounting frame;

[0030] The circulating liquid pump is connected to the heat dissipation radiator through the connecting pipeline, and the circulating liquid pump also has an interface connected to the heat exchange module.

[0031] In one possible implementation, the mounting frame is configured as a sheet metal frame that is overall U-shaped;

[0032] The tops of the two side frame walls of the sheet metal frame are respectively provided with mounting holes for mounting and fixing the cooling fan and the cooling radiator;

[0033] The middle parts of the frame walls on both sides of the sheet metal frame are correspondingly provided with accommodating holes for accommodating the circulating liquid pump.

[0034] Compared with the prior art, the technical solution provided by the embodiments of the present disclosure has the following advantages:

[0035] The modular heat dissipation device provided by the disclosed embodiment adopts the method of removably embedding the modular heat exchange plate in the housing of the heat exchange shell, thereby realizing the integrated and modular design of the heat exchange module. In this way, the modular heat exchange plates of different sizes and shapes can be replaced according to different actual usage scenarios, so that they can adapt to different equipment to be cooled, and the general flexibility of the heat exchange module is fully improved. Moreover, when the modular heat exchange plate has the problem of aging and leakage after long-term use, the old modular heat exchange plate can also be removed from the housing of the heat exchange shell and replaced with a new modular heat exchange plate. The heat exchange shell can still continue to be used together, thereby reducing the later maintenance cost of the modular heat dissipation device.

[0036] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present disclosure are shown in an exemplary and non-limiting manner, in which:

[0038] In the drawings, the same or corresponding reference numerals represent the same or corresponding parts.

[0039] Figure 1An overall schematic diagram of a modular heat dissipation device provided by an embodiment of the present disclosure is shown;

[0040] Figure 2 An exploded view of a heat exchange module in a modular heat dissipation device provided in an embodiment of the present disclosure is shown;

[0041] Figure 3 A cross-sectional view of a module heat exchange plate in a modular heat dissipation device provided by an embodiment of the present disclosure is shown;

[0042] Figure 4 A three-dimensional diagram of a module heat exchange plate in a modular heat dissipation device provided by an embodiment of the present disclosure is shown;

[0043] Figure 5 A schematic diagram of the overall assembly of a heat dissipation module in a modular heat dissipation device provided in an embodiment of the present disclosure is shown;

[0044] Figure 6 A schematic diagram of a mounting frame in a modular heat dissipation device provided in an embodiment of the present disclosure is shown.

[0045] Explanation of the numbers in the figure: 1. heat exchange module; 11. heat exchange shell; 111. liquid inlet port; 112. liquid outlet port; 113. container; 114. coolant inlet and outlet cover; 12. module heat exchange plate; 121. liquid inlet path; 121a. liquid inlet sub-path; 122. liquid outlet path; 122a. liquid outlet sub-path; 123. flow path reversing member; 123a. oblique guide wall; 124. reversing guide plate; 125. liquid inlet diverter plate; 2. heat dissipation module; 21. cooling fan; 22. heat dissipation radiator; 23. circulating liquid pump; 24. mounting bracket; 241. mounting hole position; 242. container hole position. DETAILED DESCRIPTION

[0046] In order to make the purpose, features, and advantages of the present disclosure more obvious and easy to understand, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present disclosure.

[0047] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings.

[0048] Combination Figure 1 and Figure 2As shown, the embodiment of the present disclosure provides a modular heat dissipation device, which includes a heat exchange module 1 and a heat dissipation module 2; the heat exchange module 1 is connected to the heat dissipation module 2 through a circulating liquid circuit; the heat exchange module 1 includes a heat exchange shell 11 and a module heat exchange plate 12; wherein the heat exchange shell 11 has a recessed receiving portion 113; the module heat exchange plate 12 is detachably embedded in the receiving portion 113; and the module heat exchange plate 12 is provided with a correspondingly connected liquid inlet path 121 and a liquid outlet path 122 inside; the heat exchange shell 11 has a liquid inlet port 111 and a liquid outlet port 112 which are correspondingly conductively connected to the liquid inlet path 121 and the liquid outlet path 122.

[0049] The modular heat dissipation device adopts a method of detachably embedding the modular heat exchange plate 12 in the receiving portion 113 of the heat exchange shell 11, thereby realizing the integrated and modular design of the heat exchange module 1. In this way, the modular heat exchange plates 12 of different sizes and shapes can be replaced according to different actual usage scenarios, so that it can adapt to different equipment to be cooled, thereby fully improving the general flexibility of the heat exchange module 1.

[0050] Moreover, when the module heat exchange plate 12 has aging and leakage problems after long-term use, the old module heat exchange plate 12 can be removed from the housing 113 of the heat exchange shell 11 and replaced with a new module heat exchange plate 12, and the heat exchange shell 11 can still continue to be used, thereby reducing the subsequent maintenance cost of the modular heat dissipation device.

[0051] In summary, the modular heat dissipation device provided by the embodiments of the present disclosure has the beneficial effects of flexible use, good adaptability, high overall integration, and low subsequent maintenance costs.

[0052] In one embodiment, the liquid inlet path 121 and the liquid outlet path 122 are extended along the length direction of the module heat exchange plate 12; and the liquid inlet path 121 and the liquid outlet path 122 are parallel and spaced along the width direction of the module heat exchange plate 12; one end of the liquid inlet path 121 is conductively connected to the liquid inlet port 111, and the other end is connected to one end of the liquid outlet path 122 through a flow path reversing member 123; the other end of the liquid outlet path 122 is connected to the liquid outlet port 112.

[0053] Specific, combined Figure 3To further explain in detail, the liquid inlet path 121 and the liquid outlet path 122 are respectively extended along the length direction of the module heat exchange plate 12, and the two are parallel and spaced along the width direction of the module heat exchange plate 12, so that the internal space of the module heat exchange plate 12 can be fully utilized, and the tail end of the liquid inlet path 121 is connected to the head end of the liquid outlet path 122 through the flow path reversing member 123, so that the flow direction of the coolant inside the liquid inlet path 121 and the liquid outlet path 122 is opposite, and the heat exchange and cooling effect of the coolant itself will continue to decrease as it continues to flow downstream. However, by providing the flow path reversing member 123, the flow directions of the liquid inlet path 121 and the liquid outlet path 122 are opposite, so that the heat exchange and cooling capabilities of the coolant inside the two will compensate each other, so that the module heat exchange plate 12 forms a relatively balanced heat conduction and heat exchange capacity along its own length direction.

[0054] The specific arrangement of the liquid inlet 121, the liquid outlet 122 and the flow path reversing member 123 can fully utilize the internal space of the module heat exchange plate 12 and achieve the beneficial effect of balanced heat conduction and heat exchange capacity of the module heat exchange plate 12 along the length direction.

[0055] In one embodiment, the liquid inlet path 121 includes multiple liquid inlet sub-paths 121a spaced in parallel along the width direction of the module heat exchange plate 12; the liquid outlet path 122 includes multiple liquid outlet sub-paths 122a spaced in parallel along the width direction of the module heat exchange plate 12; the flow path reversing member 123 has a reversing flow channel, and the reversing flow channel is used to conduct and connect the multiple liquid inlet sub-paths 121a with the multiple liquid outlet sub-paths 122a.

[0056] Specific, combined Figure 3 To further explain in detail, the liquid inlet path 121 is specifically arranged as a plurality of parallel and spaced liquid inlet sub-paths 121a, and the liquid outlet path 122 is specifically arranged as a plurality of parallel and spaced liquid outlet sub-paths 122a. In this way, the flow rate of each liquid inlet sub-path 121a and liquid outlet sub-path 122a can be adjusted accordingly according to the heat source distribution of the heat dissipation component to be cooled, thereby achieving accurate and precise heat dissipation of the heat dissipation component. The reversing guide channel in the flow path reversing member 123 connects the plurality of liquid inlet sub-paths 121a with the plurality of liquid outlet sub-paths 122a, so that the coolant will be mixed at a certain uniform temperature in the flow path reversing member 123, so that when it is diverted into the plurality of liquid outlet sub-paths 122a, the overall temperature will be more uniform.

[0057] The specific arrangement of the liquid inlet sub-path 121a and the liquid outlet sub-path 122a has the beneficial effects of simple structure, flexible control of flow rate, and precise heat dissipation of the heat dissipation element.

[0058] In one embodiment, on the end side of the module heat exchange plate 12 close to the flow path reversing member 123, reversing guide plates 124 inclined toward each other are respectively provided between two adjacent liquid inlet sub-paths 121a and between two adjacent liquid outlet sub-paths 122a.

[0059] Specific, combined Figure 3 To further explain in detail, the above-mentioned reversing guide plate 124 can be specifically but not limited to being set as a rectangular thin plate, or an arc-shaped thin plate with a certain curvature.

[0060] On the end side of the module heat exchange plate 12 close to the flow path reversing member 123, reversing guide plates 124 are provided, which are respectively located between two adjacent liquid inlet sub-paths 121a and between two adjacent liquid outlet sub-paths 122a, and the reversing guide plates 124 are inclined toward each other, so that when the coolant flowing out of the liquid inlet sub-path 121a enters the flow path reversing member 123, it will be diverted once by the reversing guide plates 124, and when the coolant flowing out of the flow path reversing member 123 enters the liquid outlet sub-path 122a, it will also be diverted again by the reversing guide plates 124. The two reversing guides of the reversing guide plates 124 finally realize a 180° turn of the coolant.

[0061] The specific arrangement of the above-mentioned reversing guide plate 124 has the beneficial effects of simple structure, being able to perform reversing and guiding of the coolant separately, and greatly reducing the flow velocity loss of the coolant in the flow path reversing member 123 .

[0062] In one embodiment, the flow path reversing member 123 has oblique guide walls 123a facing the liquid inlet sub-path 121a and the liquid outlet sub-path 122a respectively; and the two oblique guide walls 123a intersect at the center of the flow path reversing member 123 to form a maximum recessed portion.

[0063] Specific, combined Figure 3 To further explain in detail, the inner walls of the flow path reversing member 123 facing the liquid inlet sub-path 121a and the liquid outlet sub-path 122a are respectively arranged to be inclined guide walls 123a with a certain inclined depression angle, and the two inclined guide walls 123a intersect at the center of the flow path reversing member 123 to form a maximum depression. In this way, when the coolant flows out from the liquid inlet sub-path 121a to the flow path reversing member 123, the "expanded" depression formed by the two inclined guide walls 123a will assist in the drainage and buffering of the reversing torrent of the coolant, so that the coolant can more smoothly realize turning and reversing in the flow path reversing member 123.

[0064] The specific manner of the above-mentioned inclined guide wall 123a has the beneficial effects of simple structure, being able to assist the coolant in reversing in the flow path reversing member 123, and further reducing the coolant flow velocity loss.

[0065] In one embodiment, the liquid inlet sub-path 121a and the liquid outlet sub-path 122a are both configured as prismatic pipelines with a right-angled triangle cross-section; and the inclined surfaces of two adjacent prismatic pipelines are configured to face each other.

[0066] Specific, combined Figure 4 To further explain in detail, the cross-sectional shapes of the liquid inlet sub-path 121a and the liquid outlet sub-path 122a are both set to be right-angled triangular prism-shaped pipelines, and the inclined sides of two adjacent prism-shaped pipelines are arranged toward each other, so that the two inclined sides of the liquid inlet sub-paths 121a facing each other, or the two inclined sides of the liquid outlet sub-paths 122a facing each other can form a strip tube group, so that the maximum number of liquid inlet sub-paths 121a and liquid outlet sub-paths 122a can be set inside the module heat exchange plate 12, thereby fully improving the utilization efficiency of the internal space of the module heat exchange plate 12.

[0067] Of course, chamfer structures can be provided at the inner corners of the right-angled triangle prismatic pipeline to facilitate the processing and preparation of the prismatic pipeline.

[0068] In one embodiment, the heat exchange housing 11 further includes a coolant inlet and outlet cover 114 disposed opposite to the flow path reversing member 123 ; the coolant inlet and outlet cover 114 is provided with a liquid inlet port 111 and a liquid outlet port 112 .

[0069] Specific, combined Figure 3 To further explain in detail, the above-mentioned coolant inlet and outlet cover 114 and the flow path reversing member 123 are respectively arranged in two opposite side walls of the module heat exchange plate 12 at relative intervals, and the coolant inlet and outlet cover 114 is provided with a liquid inlet port 111 and a liquid outlet port 112 separated from each other, and the liquid inlet port 111 is correspondingly connected to the liquid inlet path 121 in the module heat exchange plate 12 through the liquid inlet port 111, and is correspondingly connected to the liquid outlet path 122 in the module heat exchange plate 12 through the liquid outlet port 112.

[0070] By setting the above-mentioned coolant inlet and outlet cover 114, it is separated from the module heat exchange plate 12, which can indirectly simplify the structure of the module heat exchange plate 12, and the liquid inlet port 111 and the liquid outlet port 112 are set in the coolant inlet and outlet cover 114. In this way, even if the interface has aging and leakage problems during long-term use, it is only necessary to replace the coolant inlet and outlet cover 114 accordingly, which further reduces the later maintenance cost of the modular heat dissipation device.

[0071] In one embodiment, the liquid inlet ends of two adjacent liquid inlet sub-paths 121 a are provided with liquid inlet diverter plates 125 extending toward the liquid inlet port 111 .

[0072] Specific, combined Figure 3 To further explain in detail, at the liquid inlet end of two adjacent liquid inlet sub-paths 121a, a liquid inlet diverter plate 125 extending toward the liquid inlet port 111 is provided. The liquid inlet diverter plate 125 can be specifically but not limited to being provided as a rectangular plate. In this way, through the diversion effect of the liquid inlet diverter plate 125, the coolant flowing out of the liquid inlet port 111 in the coolant inlet and outlet cover 114 can be evenly dispersed and enter each liquid inlet sub-path 121a.

[0073] The specific configuration of the liquid inlet diverter plate 125 has the beneficial effects of being simple in structure and being able to evenly disperse the coolant flowing out of the liquid inlet port 111 .

[0074] In one embodiment, the heat dissipation module 2 includes a cooling fan 21, a cooling radiator 22, a circulating liquid pump 23, a mounting frame 24 and connecting pipes; the cooling fan 21, the cooling radiator 22 and the circulating liquid pump 23 can be detachably mounted on the mounting frame 24; the circulating liquid pump 23 is connected to the cooling radiator 22 through the connecting pipes, and the circulating liquid pump 23 also has an interface for connecting to the heat exchange module 1.

[0075] Specific, combined Figure 5 To further explain in detail, the cooling fan 21, the cooling radiator 22 and the circulating liquid pump 23 in the cooling module 2 can be detachably mounted on the mounting frame 24, which can further improve the spatial compactness and structural integration of the cooling module 2, and the function of adjusting the installation positions of the cooling fan 21, the cooling radiator 22 and the circulating liquid pump 23 can be uniformly achieved only by adjusting the installation position of the mounting frame 24.

[0076] In one possible implementation, the mounting frame 24 is configured as a sheet metal frame that is U-shaped as a whole; and mounting holes 241 for mounting and fixing the cooling fan 21 and the cooling radiator 22 are respectively provided on the top of the frame walls on both sides of the sheet metal frame; and corresponding mounting holes 242 for accommodating the circulating liquid pump 23 are opened in the middle of the frame walls on both sides of the sheet metal frame.

[0077] Specific, combined Figure 6 To further explain in detail, the mounting holes 241 in the mounting frame 24 can be specifically but not limited to being set as threaded mounting holes, and a plurality of them can be spaced apart along the top of the frame walls on both sides of the sheet metal frame, so that the cooling fan 21 and the cooling radiator 22 can be fixedly installed in the sheet metal frame by screwing; the accommodating holes 242 in the mounting frame 24 can be simultaneously processed and manufactured when the sheet metal frame is stamped and formed, and the U-shaped recessed groove inside the overall U-shaped sheet metal frame can be used to accommodate the wiring harness, thereby saving space and further improving the overall integration of the modular heat dissipation device.

[0078] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present disclosure, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0079] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A modular heat dissipation device, characterized in that: It comprises a heat exchange module (1) and a heat dissipation module (2); The heat exchange module (1) is connected to the heat dissipation module (2) via a circulating fluid circuit; The heat exchange module (1) comprises a heat exchange shell (11) and a module heat exchange plate (12); Wherein, the heat exchange shell (11) has a recessed receiving portion (113); The module heat exchange plate (12) is detachably embedded in the housing portion (113); The module heat exchange plate (12) is provided with a correspondingly connected liquid inlet path (121) and a liquid outlet path (122) inside; The heat exchange shell (11) has a liquid inlet port (111) and a liquid outlet port (112) which are connected to the liquid inlet path (121) and the liquid outlet path (122) in a corresponding manner.

2. The modular heat dissipation device according to claim 1, characterized in that: The liquid inlet path (121) and the liquid outlet path (122) are arranged to extend along the length direction of the module heat exchange plate (12); The liquid inlet path (121) and the liquid outlet path (122) are parallel and spaced apart along the width direction of the module heat exchange plate (12); One end of the liquid inlet path (121) is conductively connected to the liquid inlet port (111), and the other end is connected to one end of the liquid outlet path (122) via a flow path reversing member (123); The other end of the liquid outlet path (122) is connected to the liquid outlet port (112).

3. The modular heat dissipation device according to claim 2, characterized in that: The liquid inlet path (121) comprises a plurality of liquid inlet sub-paths (121a) spaced in parallel along the width direction of the module heat exchange plate (12); The liquid outlet path (122) comprises a plurality of liquid outlet sub-paths (122a) spaced in parallel along the width direction of the module heat exchange plate (12); The flow path reversing member (123) has a reversing flow guide, and the reversing flow guide is used to conduct and connect the plurality of liquid inlet sub-paths (121a) with the plurality of liquid outlet sub-paths (122a).

4. The modular heat dissipation device according to claim 3, characterized in that: On the end side of the module heat exchange plate (12) close to the flow path reversing member (123), reversing guide plates (124) inclined toward each other are respectively provided between two adjacent liquid inlet sub-paths (121a) and between two adjacent liquid outlet sub-paths (122a).

5. The modular heat dissipation device according to claim 3, characterized in that: The flow path reversing member (123) has oblique flow guide walls (123a) facing the liquid inlet sub-path (121a) and the liquid outlet sub-path (122a). Furthermore, the two inclined flow guide walls (123a) intersect at the center of the flow path reversing member (123) to form a maximum recessed portion.

6. The modular heat dissipation device according to claim 5, characterized in that: The liquid inlet sub-path (121a) and the liquid outlet sub-path (122a) are both configured as prismatic pipelines with a right-angled triangle cross-section; The inclined surfaces of two adjacent prismatic pipelines are arranged to face each other.

7. The modular heat dissipation device according to claim 3, characterized in that: The heat exchange housing (11) further comprises a coolant inlet and outlet cover (114) arranged opposite to the flow path reversing member (123); The cooling liquid inlet and outlet cover (114) is provided with the liquid inlet port (111) and the liquid outlet port (112).

8. The modular heat dissipation device according to claim 7, characterized in that: The liquid inlet ends of two adjacent liquid inlet sub-paths (121a) are provided with liquid inlet flow dividers (125) extending towards the liquid inlet port (111).

9. The modular heat dissipation device according to claim 1, characterized in that: The heat dissipation module (2) comprises a heat dissipation fan (21), a heat dissipation radiator (22), a circulating liquid pump (23), a mounting frame (24) and connecting pipelines; The heat dissipation fan (21), the heat dissipation radiator (22) and the circulating liquid pump (23) are detachably mounted on the mounting frame (24); The circulating liquid pump (23) is connected to the heat dissipation radiator (22) via the connecting pipeline, and the circulating liquid pump (23) also has an interface connected to the heat exchange module (1).

10. The modular heat dissipation device according to claim 9, characterized in that: The mounting frame (24) is configured as a sheet metal frame that is overall U-shaped; The tops of the frame walls on both sides of the sheet metal frame are respectively provided with mounting holes (241) for mounting and fixing the cooling fan (21) and the cooling radiator (22); The middle parts of the frame walls on both sides of the sheet metal frame are provided with corresponding accommodation holes (242) for accommodating the circulating liquid pump (23).