LED substrate and reflow oven using same

Abstract

The utility model provides an LED substrate and a reflow oven using the same, the LED substrate comprises a substrate body, the top of the substrate body is provided with a plurality of pedestals used for attaching LED lamp beads and glue containing grooves arranged around the pedestals, the pedestals are provided with power supply terminals used for electrically connecting the LED lamp beads and notches used for prying the LED lamp beads, and the power supply terminals are connected with the power supply terminals. A power terminal is arranged on the substrate body, notches are formed in the two sides of the power terminal, one end of the substrate body is provided with a socket structure which is electrically connected with the power terminal and used for being connected with a power source, a cover plate is movably arranged at the top of the substrate body, a plurality of first grooves corresponding to the bases are formed in the cover plate, and bottom frames matched with the glue containing grooves are arranged at the bottoms of the first grooves. The hollowed-out part of the bottom frame is matched with the base, prying structures used for prying the LED lamp beads are hinged to the two sides, close to the notch, of the first groove, and the prying structures are movably arranged in the notch.

Description

Technical Field

[0001] The utility model relates to the field of LED packaging, in particular to an LED substrate and a reflow furnace using the substrate. Background Art

[0002] With the development of technology, although the existing LED lamp bead packaging process has been relatively complete, there are still some problems in some process nodes and equipment design. Although these problems are not fatal, they will affect the overall LED packaging efficiency. At the same time, certain defects in the equipment will also cause deformation of the product during the production process.

[0003] After the LED lamp beads are packaged, they need to be tested for air tightness, lighting, and light decay.

[0004] In the prior art, the existing lighting test of LED lamp beads usually involves applying solder on the top of a substrate, attaching the LED lamp beads to the solder paste, and finally soldering the LED lamp beads to the substrate through a reflow oven. However, the amount of solder paste cannot be accurately controlled when applying it, and a large amount of time is required to clean the excess solder paste applied on the substrate after the lighting test, which greatly affects production efficiency. In addition, the substrate cannot be fixed on the conveyor belt of the reflow oven, which often leads to production accidents caused by collisions between the front and rear substrates. In addition, when the LED lamp beads are subsequently removed from the substrate for transfer using clamps such as tweezers, the LED lamp beads are often accidentally damaged. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide an LED substrate and a reflow furnace using the substrate, which can effectively solve the deficiencies in the above-mentioned prior art.

[0006] An LED substrate, comprising:

[0007] substrate body;

[0008] A plurality of bases for attaching LED lamp beads and a glue holding groove arranged around the base are arranged on the top of the substrate body, a power terminal for electrically connecting the LED lamp beads and a notch for prying the LED lamp beads are arranged on the base, the notch is arranged on both sides of the power terminal, and a socket structure electrically connected to the power terminal for connecting to the power supply is arranged at one end of the substrate body;

[0009] Cover plate;

[0010] The cover plate is movably arranged on the top of the substrate body, and a plurality of first grooves corresponding to the base are arranged on the cover plate, a bottom frame adapted to the glue containing groove is arranged at the bottom of the first groove, and the hollow part of the bottom frame is adapted to the base, and a prying structure for prying the LED lamp bead is hinged on both sides of the first groove close to the notch, and the prying structure is movably arranged in the notch.

[0011] Furthermore, the width of the notch is greater than or equal to the width of the prying structure, the length of the prying structure is x, the length of the notch is y, the width of the first groove is z, and y+z>x>z.

[0012] Furthermore, the depth of the glue containing groove is equal to the sum of the depth of the first groove and the thickness of the bottom frame.

[0013] Furthermore, a plurality of first card slots for fixing are arranged at equal intervals at the bottom of the substrate body, and the length of the first card slots is equal to the width of the substrate body.

[0014] Furthermore, a second card slot is provided at one end of the substrate body away from the socket structure, a holding block is connected to the second card slot, and a second groove for lifting the cover and a label slot for attaching a label are provided on the top of the holding block.

[0015] Furthermore, a handle for holding the cover plate is connected to one end of the cover plate facing the second groove, and the handle is arranged above the second groove.

[0016] On the other hand, the utility model further provides a reflow oven, comprising a main body, a conveyor belt assembly arranged in the main body, and the above-mentioned LED substrate.

[0017] Furthermore, the conveyor belt assembly includes a plurality of roller structures which are arranged at equal intervals and are used to fix the substrate body in the front-to-back direction, and the diameter of the roller structure is less than or equal to the width of the first card slot and the depth of the first card slot.

[0018] Furthermore, stoppers for abutting against the substrate body in left and right directions are provided at both ends of the roller structure, and the height of the stoppers plus the diameter of the roller structure is greater than the depth of the first groove.

[0019] Furthermore, the interval between two adjacent first slots is equal to the interval between two adjacent roller structures.

[0020] Compared with the prior art, the beneficial effects of the utility model are as follows: by movably setting a cover plate on the top of the substrate body, the cover plate covers a part of the top of the substrate body, and only the base is exposed, so that the solder paste is only applied to the base for attaching the LED lamp beads, thereby making it unnecessary to spend a lot of time to clean the excess solder paste applied on the substrate body after the lighting test, thereby increasing production efficiency; specifically, by moving the cover plate toward the substrate body until it abuts against the substrate body, the first groove corresponds to the base one by one, the bottom frame abuts against the glue containing groove, and the hollow part of the bottom frame The side wall of the base is fitted, and when the cover plate is against the substrate body, part of the top of the substrate body is covered, leaving only the base exposed, so that the solder paste will only be applied to the base and the cover plate for attaching the LED lamp beads, and excess solder paste on the base will flow through the side walls of the base to the bottom frame at the top of the glue tank, so that after the lighting test, you only need to lift the cover plate, and the inner wall of the bottom frame will scrape off the excess solder paste on the side wall of the base, so that after the lighting test, you do not need to spend a lot of time cleaning the excess solder paste smeared on the substrate body, thereby increasing production efficiency. By providing a prying structure, there is no need to use tweezers or other clamps to pick up the LED lamp beads from the substrate body for transfer, thereby avoiding the situation where the LED lamp beads are accidentally damaged; specifically, a notch for prying up the LED lamp beads is provided on the base, and a prying structure for prying up the LED lamp beads is hingedly provided on both sides of the first groove close to the notch, and the prying structure is movably arranged in the notch, so that the LED lamp beads can be pried out from the substrate body from the bottom of the LED lamp beads by the prying structure, thereby eliminating the need to use tweezers or other clamps to pick up the LED lamp beads from the substrate body for transfer, thereby avoiding the situation where the LED lamp beads are accidentally damaged. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of the substrate body in the first embodiment of the utility model;

[0022] Figure 2 for Figure 1 A magnified schematic diagram of the local A in the middle;

[0023] Figure 3 This is a schematic diagram of the overall structure of the cover plate in the first embodiment of the utility model;

[0024] Figure 4 for Figure 3 A magnified schematic diagram of the part B in the middle;

[0025] Figure 5 This is a schematic diagram of the overall structure of the reflow furnace in the second embodiment of the present utility model;

[0026] Figure 6 for Figure 5 A magnified schematic diagram of the local C in the middle;

[0027] Description of main component symbols:

[0028]

[0029]

[0030] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0031] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0032] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] Embodiment 1

[0035] See also Figures 1 to 4 The LED substrate in the first embodiment of the present invention includes a substrate body 10 and a cover plate 20 movably disposed on the top of the substrate body 10 .

[0036] Among them, a plurality of bases 11 for attaching LED lamp beads and a glue containing groove 12 arranged around the base 11 are arranged on the top of the substrate body 10, a power terminal 13 for electrically connecting the LED lamp beads and a notch 14 for prying the LED lamp beads are arranged on the base 11, and the notch 14 is arranged on both sides of the power terminal 13, and a socket structure 15 electrically connected to the power terminal 13 for accessing the power supply is arranged at one end of the substrate body 10, and a plurality of first grooves 21 corresponding to the base 11 are arranged on the cover plate 20, and a bottom frame 22 adapted to the glue containing groove 12 is arranged at the bottom of the first groove 21, and the hollow part of the bottom frame 22 is adapted to the base 11, and a prying structure 23 for prying the LED lamp beads is hinged on both sides of the first groove 21 close to the notch 14, and the prying structure 23 is movably arranged in the notch 14.

[0037] It can be understood that by movably setting the cover plate 20 on the top of the substrate body 10, the cover plate 20 covers a part of the top of the substrate body 10, and only the base 11 is exposed, so that the solder paste will only be applied to the base 11 for attaching LED lamp beads, thereby eliminating the need to spend a lot of time cleaning the excess solder paste smeared on the substrate body 10 after the lighting test, thereby increasing production efficiency; specifically, by moving the cover plate 20 toward the substrate body 10 until it abuts against the substrate body 10, the first groove 21 corresponds to the base 11 one by one, the bottom frame 22 abuts against the glue containing groove 12, and the hollow part of the bottom frame 22 fits the base 11 When the cover plate 20 is against the substrate body 10, part of the top of the substrate body 10 is covered, and only the base 11 is exposed, so that the solder paste will only be coated on the base 11 for attaching the LED lamp beads and the cover plate 20, and the excess solder paste on the base 11 will flow through the side walls of the base 11 to the bottom frame 22 at the top of the glue containing groove 12, so that after the lighting test, it is only necessary to lift the cover plate 20, and the inner wall of the bottom frame 22 will scrape off the excess solder paste on the side wall of the base 11, so that after the lighting test, there is no need to spend a lot of time cleaning the excess solder paste smeared on the substrate body 10, thereby increasing production efficiency.

[0038] It can be understood that by providing a notch 14 for prying the LED lamp bead on the base 11, and by hingedly providing a prying structure 23 for prying the LED lamp bead on both sides of the first groove 21 close to the notch 14, the prying structure 23 is movably arranged in the notch 14, so that the LED lamp bead can be pried out from the bottom of the LED lamp bead from the substrate body 10 by the prying structure 23, thereby eliminating the need to remove the LED lamp bead from the substrate body 10 for transfer by a clamp such as tweezers, thereby avoiding the LED lamp bead from being accidentally damaged.

[0039] Furthermore, the width of the notch 14 is greater than or equal to the width of the prying structure 23 , the length of the prying structure 23 is x, the length of the notch 14 is y, the width of the first groove 21 is z, and y+z>x>z.

[0040] It can be understood that such a configuration ensures that the prying structure 23 will not be interfered by the notch 14 during the movement and can rest against the bottom of the LED lamp bead.

[0041] Furthermore, the depth of the glue containing groove 12 is equal to the sum of the depth of the first groove 21 and the thickness of the bottom frame 22 .

[0042] It can be understood that by setting the depth of the glue containing groove 12 equal to the sum of the depth of the first groove 21 and the thickness of the bottom frame 22, the bottom surface of the bottom frame 22 can be against the top of the glue containing groove 12, and the bottom surface of the cover plate 20 can be against the top of the substrate body 10.

[0043] Furthermore, a plurality of first fixing slots 16 are provided at equal intervals at the bottom of the substrate body 10 for fixing, and the length of the first fixing slots 16 is equal to the width of the substrate.

[0044] It can be understood that by providing the first card slot 16 , the LED substrate can be fixed on other devices or components through the first card slot 16 .

[0045] Furthermore, a second card slot 17 is provided at one end of the substrate body 10 away from the socket structure 15, a holding block 30 is connected to the second card slot 17, and a second groove 31 for lifting the cover 20 and a label slot 32 for attaching a label are provided on the top of the holding block 30.

[0046] Furthermore, a handle 40 for holding the cover plate 20 is connected to one end of the cover plate 10 facing the second groove 31 , and the handle 40 is disposed above the second groove 31 .

[0047] It can be understood that by connecting a holding block 30 to the second card slot 17, the operator can move the substrate body 10 through the holding block 30, by providing a second groove 31 for lifting the cover plate 20 on the top of the holding block 30, and by connecting a handle 40 for holding the cover plate 20 at one end of the cover plate 10 facing the second groove 31, and the handle 40 is provided above the second groove 31, the operator can move the cover plate 20 through the handle 40.

[0048] Embodiment 2

[0049] See also Figures 5 and 6 The reflow furnace in the second embodiment of the present invention includes a main body 50, a conveyor belt assembly 60 arranged in the main body 50 and the LED substrate in the first embodiment, the conveyor belt assembly 60 includes a plurality of roller structures 61 arranged at equal intervals for fixing the front and rear directions of the substrate body 10, the diameter of the roller structure 61 is less than or equal to the width of the first card groove 16 and the depth of the first card groove 16, and stoppers 62 for abutting against the left and right directions of the substrate body 10 are arranged at both ends of the roller structure 61, the height of the stopper 62 plus the diameter of the roller structure 61 is greater than the depth of the first card groove 16, and the interval between two adjacent first card grooves 16 is equal to the interval between two adjacent roller structures 61.

[0050] It can be understood that by setting the roller structure 61, the LED substrate can be inserted into the roller structure 61 through the first card slot 16 and the front and rear directions of the LED substrate can be fixed by the roller structure 61. By setting the stop plates 62 at both ends of the roller structure 61, the action direction of the LED substrate can be fixed by the stop plates 62, and the LED substrate can be fixed in the front and rear directions and the left and right directions on the reflow furnace, thereby avoiding production accidents caused by collisions between the front and rear LED substrates in the reflow furnace.

[0051] In summary, the LED substrate and the reflow furnace using the substrate in the above embodiments of the utility model: by movably setting a cover plate on the top of the substrate body, the cover plate covers a part of the top of the substrate body, and only the base is exposed, so that the solder paste will only be applied to the base for attaching the LED lamp beads, so that after the lighting test, it is not necessary to spend a lot of time to clean up the excess solder paste applied on the substrate body, thereby increasing production efficiency; specifically, by moving the cover plate toward the substrate body until it abuts against the substrate body, the first groove corresponds to the base one by one, the bottom frame abuts against the glue storage groove, and the bottom The hollow part of the frame fits the side wall of the base, and when the cover plate is against the substrate body, part of the top of the substrate body is covered, leaving only the base exposed, so that the solder paste will only be applied to the base and the cover plate for attaching the LED lamp beads, and the excess solder paste on the base will flow through the side wall of the base to the bottom frame at the top of the glue tank, so that after the lighting test, you only need to lift the cover plate, and the inner wall of the bottom frame will scrape off the excess solder paste on the side wall of the base, so that after the lighting test, you do not need to spend a lot of time cleaning the excess solder paste smeared on the substrate body, thereby increasing production efficiency. By providing a prying structure, there is no need to use tweezers or other clamps to pick up the LED lamp beads from the substrate body for transfer, thereby avoiding the situation where the LED lamp beads are accidentally damaged; specifically, a notch for prying up the LED lamp beads is provided on the base, and a prying structure for prying up the LED lamp beads is hingedly provided on both sides of the first groove close to the notch, and the prying structure is movably arranged in the notch, so that the LED lamp beads can be pried out from the substrate body from the bottom of the LED lamp beads by the prying structure, thereby eliminating the need to use tweezers or other clamps to pick up the LED lamp beads from the substrate body for transfer, thereby avoiding the situation where the LED lamp beads are accidentally damaged.

[0052] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0053] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. An LED substrate, characterized in that: include: substrate body; A plurality of bases for attaching LED lamp beads and a glue holding groove arranged around the base are arranged on the top of the substrate body, a power terminal for electrically connecting the LED lamp beads and a notch for prying the LED lamp beads are arranged on the base, the notch is arranged on both sides of the power terminal, and a socket structure electrically connected to the power terminal for connecting to the power supply is arranged at one end of the substrate body; Cover plate; The cover plate is movably arranged on the top of the substrate body, and a plurality of first grooves corresponding to the base are arranged on the cover plate, a bottom frame adapted to the glue containing groove is arranged at the bottom of the first groove, and the hollow part of the bottom frame is adapted to the base, and a prying structure for prying the LED lamp bead is hinged on both sides of the first groove close to the notch, and the prying structure is movably arranged in the notch.

2. The LED substrate according to claim 1, characterized in that: The width of the notch is greater than or equal to the width of the prying structure, the length of the prying structure is x, the length of the notch is y, the width of the first groove is z, and y+z>x>z.

3. The LED substrate according to claim 1, characterized in that: The depth of the glue containing groove is equal to the sum of the depth of the first groove and the thickness of the bottom frame.

4. The LED substrate according to claim 1, characterized in that: A plurality of first clamping grooves for fixing are arranged at equal intervals at the bottom of the substrate body, and the length of the first clamping grooves is equal to the width of the substrate body.

5. The LED substrate according to claim 1, characterized in that: A second card slot is arranged at one end of the base body away from the socket structure, a holding block is connected to the second card slot, and a second groove for lifting the cover plate and a label slot for attaching a label are arranged on the top of the holding block.

6. The LED substrate according to claim 5, characterized in that: A handle for holding the cover plate is connected to one end of the cover plate facing the second groove, and the handle is arranged above the second groove.

7. A reflow oven, characterized in that: It comprises a main body, a conveyor belt assembly arranged in the main body and the LED substrate according to any one of claims 1-6.

8. The reflow oven according to claim 7, characterized in that: The conveyor belt assembly includes a plurality of roller structures which are arranged at equal intervals and are used to fix the substrate body in the front-to-back direction. The diameter of the roller structure is less than or equal to the width of the first card slot and the depth of the first card slot.

9. The reflow oven according to claim 8, characterized in that: Stopping pieces for abutting against the left and right directions of the substrate body are arranged at both ends of the roller structure, and the height of the stopping pieces plus the diameter of the roller structure is greater than the depth of the first clamping groove.

10. The reflow oven according to claim 7, characterized in that: The interval between two adjacent first clamping grooves is equal to the interval between two adjacent roller structures.

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