Device for coupling heat, electricity, force, magnetism and corrosion fields of tin-based solder

Abstract

The utility model discloses a tin-based solder heat, electricity, force, magnetism and corrosion field coupling device, and belongs to the technical field of welding spot quality detection. The device comprises a direct-current power supply, an annular magnetic tube coil, a spring lock, a copper wire, a heating table, a corrosion tank, a spring and a box body, the spring lock is fixedly installed on the inner side wall of the middle of the box body and connected with a solder sample through the copper wire, the solder sample is connected with the spring through the copper wire, and the spring is fixedly connected with the inner side wall of the box body. The positive electrode and the negative electrode of the direct-current power source are electrically connected with copper wires at the two ends of the solder sample respectively, the annular magnetic tube coil is fixedly installed on the inner side wall of the box and surrounds the solder sample, the heating table is located below the solder sample and fixedly installed on the inner side wall of the box, and the corrosion tank is arranged at the bottom of the box and filled with corrosion liquid. By using the device provided by the utility model, an experiment can be carried out under the environmental condition closer to the actual working environmental condition of the welding flux, and more reliable experimental data with greater guiding significance can be obtained.

Description

Technical Field

[0001] The utility model belongs to the technical field of solder joint quality detection, and relates to a tin-based solder heat, electricity, force, magnetism and corrosion field coupling device. Background Art

[0002] During the preparation and operation of electronic products or equipment, they are inevitably subjected to loads of different strain rates in service environments such as high temperature, strong magnetism, and strong corrosion. Electronic products often contain a large number of solder joints. When quality problems occur in the solder joints, it will directly lead to the electronic products not working properly. Therefore, in order to ensure the safety and reliability of related products during long-term use, it is necessary to evaluate the service performance of micro solder joints in relatively complex environments to ensure that the products can be manufactured based on high solder joint quality.

[0003] At present, the performance and failure mechanism of solder joints under single environmental conditions have a relatively rich research foundation. However, the performance and failure mechanism of solder joints under multiple environmental conditions are quite different from those under single environmental conditions, and the service environment conditions of solder joints are usually relatively complex. Although some devices can detect the quality of solder joints under the coupling of heat, electricity and force fields, for example, the patent with application number 202321694001.1 discloses a tin-based lead-free solder heat, electricity and force field coupling device, which applies force, electricity and heat field coupling on the sample at the same time to simulate the service performance of solder joints in the real environment, so as to realize the prediction of lead-free solder joint life. However, it can only provide three physical field effects, which is a certain gap compared with the real environment of solder joint service, and the environmental conditions are not perfect, resulting in a certain gap between the experimental results and the real situation, so the guidance and reliability of the experimental data are low.

[0004] Therefore, it is necessary to provide a device for coupling the thermal, electrical, mechanical, magnetic and corrosion fields of tin-based solders to further enhance the complexity of the service environment during solder experiments, make the complexity of the experimental environment closer to the actual service environment of the solder joint, and provide more reliable data support and theoretical basis for the structural design, product evaluation and life prediction of tin-based solders. Utility Model Content

[0005] In order to overcome the problems in the background technology, the utility model proposes a tin-based solder heat, electricity, force, magnetism, and corrosion field coupling device. During the experiment on tin-based solder, in addition to providing heat, electricity, and force field effects, a magnetic field and corrosion field environment are simultaneously formed, thereby increasing the complexity of environmental conditions during the experiment and making the experimental environment closer to the real environment, thereby improving the guidance and reliability of the experimental data.

[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0007] The device includes a DC power supply 1, an annular magnetic tube coil 2, a spring lock 3, a copper wire 5, a heating platform 7, a corrosion tank 8, a spring 9, and a box 10. The spring lock 3 is fixedly installed on the inner wall of the middle part of the box 10. The spring lock 3 is connected to one end of a solder sample 6 through the copper wire 5. The other end of the solder sample 6 is connected to one end of a spring 9 through the copper wire 5. The other end of the spring 9 is fixedly connected to the inner wall of the box 10. The positive and negative electrodes of the DC power supply 1 are electrically connected to the copper wires 5 at both ends of the solder sample 6, respectively. The annular magnetic tube coil 2 is fixedly installed on the inner wall of the box 10 and surrounds the solder sample 6. The heating platform 7 is located below the solder sample 6 and fixedly installed on the inner wall of the box 10. The corrosion tank 8 is arranged at the bottom of the box 10, and the corrosion tank 8 is filled with corrosion liquid.

[0008] Preferably, the axis of the copper wire 5 coincides with that of the spring 9 .

[0009] Preferably, the DC power supply 1 has an adjustable current, and the DC power supply 1 is located outside the box 10 and installed on the top surface of the box 10 .

[0010] Preferably, the device further comprises a temperature control platform 4 , which is communicatively connected to the corrosion tank 8 , and is communicatively connected to the heating platform 7 , and is installed at the bottom of the outer side wall of the box body 10 .

[0011] Preferably, the device further comprises an electromagnetic controller, the annular magnetic tube coil 2 is in communication connection with the electromagnetic controller, and the electromagnetic controller is located outside the box 10 and mounted on the top surface of the box 10 .

[0012] Preferably, the springs 9 and spring locks 3 are in three groups, and the copper wires 5 connecting the springs 9 and the solder samples 6 in each group are parallel to each other.

[0013] Preferably, the solder sample 6 is made by welding a copper sheet and a tin-based solder sheet, and the copper sheet is connected to the copper wire 5 .

[0014] Beneficial effects of the utility model:

[0015] 1. The utility model forms an experimental environment with coupled effects of heat, electricity, force, magnetism and corrosion fields during the experiment, so that the complexity of the experimental environment is closer to the complexity of the actual service environment of the solder, thereby obtaining a solder joint quality condition closer to the actual service, providing more reliable and more instructive data support for solder joint quality evaluation and life prediction.

[0016] 2. The utility model controls the temperature of the heating table and the heating temperature of the corrosion tank through the temperature control table, adjusts the DC power supply current, adjusts the magnetic field of the annular magnetic tube coil through the electromagnetic controller, and adjusts the tension of the solder sample through the spring lock, so as to meet the needs of the solder sample for different experimental conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the box body and its internal structure of the utility model.

[0018] In the figure, 1-DC power supply, 2-annular magnetic tube coil, 3-spring lock, 4-temperature control table, 5-copper wire, 6-solder sample, 7-heating table, 8-corrosion tank, 9-spring, 10-box. DETAILED DESCRIPTION

[0019] The present invention will be further described in detail below in conjunction with specific embodiments.

[0020] like Figure 1 As shown, the device includes a DC power supply 1, an annular magnetic tube coil 2, a spring lock 3, a copper wire 5, a heating platform 7, a corrosion tank 8, a spring 9, and a box 10. The spring lock 3 is fixedly installed on the inner wall of the middle part of the box 10. The spring lock 3 is connected to one end of the solder sample 6 through the copper wire 5. The other end of the solder sample 6 is connected to one end of the spring 9 through the copper wire 5. The other end of the spring 9 is fixedly connected to the inner wall of the box 10. The positive and negative electrodes of the DC power supply 1 are electrically connected to the copper wires 5 at both ends of the solder sample 6 respectively. The annular magnetic tube coil 2 is fixedly installed on the inner wall of the box 10 and surrounds the solder sample 6. The heating platform 7 is located below the solder sample 6 and fixedly installed on the inner wall of the box 10. The corrosion tank 8 is arranged at the bottom of the box 10, and the corrosion tank 8 is filled with corrosion liquid.

[0021] The axis of the copper wire 5 coincides with the axis of the spring 9 .

[0022] During the experiment, the two ends of the solder sample 6 are connected to the spring 9 and the spring lock 3 respectively through the copper wire 5, and the spring 9 and the spring lock 3 are fixedly connected to the inner wall of the box 10, so that the spring 9 and the spring lock 3 form a pulling force on the solder sample 6, thereby forming a force field during the experiment. The spring lock 3 can tighten or loosen the copper wire 5 to increase or reduce the pulling force on the solder sample 6. The pulling force on the solder sample 6 can be calculated by the elastic coefficient and elongation of the spring 9; the positive and negative poles of the DC power supply 1 are electrically connected to the copper wire 5 at both ends of the solder sample 6 respectively. The copper wire 5 is a conductive material, so the current will flow through the copper wire 5 through the solder sample 6 to form an electric field; the heating table 7 heats the solder sample 6 to form a thermal field; the annular magnetic tube coil 2 surrounds the solder sample 6, and the annular magnetic tube coil 2 generates a magnetic field to provide a magnetic field environment for the solder sample 6 during the experiment. The corrosion tank 8 evaporates the corrosion liquid by heating. After the corrosion liquid evaporates into gas, it moves freely in the box 10 to form a corrosion environment. Therefore, during the experiment, an environment in which thermal field, force field, electric field, magnetic field and corrosion field coexist is formed in the box 10, so that the solder sample 6 is experimented in the aforementioned complex environment, which is closer to the actual working environmental conditions of the solder sample 6, and the difference between the experimental results and the actual results is reduced, making the experimental data more reliable, and providing more scientific support for the subsequent evaluation of the quality of solder joints and life prediction.

[0023] A box door is provided on the side wall of the box body 10. During the experiment, the box door is closed to maintain a relatively stable experimental environment condition in the box body 10. The box door can be opened to perform operations such as replacing the solder sample 6 and adding and extracting the etching liquid.

[0024] The DC power supply 1 has an adjustable current and is located outside the box 10 and mounted on the top surface of the box 10 .

[0025] By adjusting the current of the DC power supply 1, the electric field conditions during the experiment can be adjusted to meet the requirements of different solder samples 6 for the electric field conditions.

[0026] The device further comprises a temperature control platform 4 , which is in communication connection with the corrosion tank 8 , and is in communication connection with the heating platform 7 , and is installed at the bottom of the outer side wall of the box body 10 .

[0027] The heating platform 7 is controlled by the temperature control platform 4, so that the heating temperature of the heating platform 7 can be adjusted conveniently to change the thermal field conditions during the experiment; the etching tank 8 is controlled by the temperature control platform 4, so that the heating temperature of the etching tank 8 can be adjusted, so that the etching tank 8 can heat and evaporate different etching liquids.

[0028] The device further comprises an electromagnetic controller, the annular magnetic tube coil 2 is in communication connection with the electromagnetic controller, and the electromagnetic controller is located outside the box 10 and mounted on the top surface of the box 10 .

[0029] The magnetic field generated by the annular magnetic tube coil 2 can be conveniently controlled and adjusted by the electromagnetic controller to meet the different magnetic field condition requirements of the solder sample 6 .

[0030] The springs 9 and spring locks 3 are divided into three groups, and the copper wires 5 connecting the spring locks 3 and springs 9 and the solder samples 6 in each group are parallel to each other.

[0031] When testing multiple solder samples 6, interference caused by the crossing of copper wires 5 can be avoided, and the experimental results of each solder sample 6 can be easily confirmed, avoiding confusion in the recording of experimental results caused by line confusion.

[0032] The solder sample 6 is made by welding a copper sheet and a tin-based solder sheet, and the copper sheet is connected to the copper wire 5 .

[0033] The working process of the utility model is as follows: before the experiment is needed, first connect the solder sample with the copper wire, and tighten the copper wire through the spring lock so that the copper wire pulls the solder sample, and then adjust the degree of tightening of the copper wire by the spring lock according to the required experimental conditions, so that the tension on the solder sample meets the experimental conditions, and then close the box door, turn on the heating table and the corrosion tank heating system, and set the heating temperature of the heating table and the corrosion tank heating system, wait for the temperature to rise to the set temperature, turn on the DC power supply and the annular magnetic tube coil, at this time, the solder sample is tested under the environmental conditions of thermal field, electric field, force field, magnetic field, and corrosion field. After the experiment is over, turn off the DC power supply, the annular magnetic tube coil, the heating table, and the corrosion tank heating system, open the box door, and take out the solder sample.

[0034] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made in form and details without departing from the scope defined by the claims of the utility model.

Claims

1. A tin-based solder heat, electricity, force, magnetism, and corrosion field coupling device, characterized in that: The device comprises a direct current power supply (1), an annular magnetic tube coil (2), a spring lock (3), a copper wire (5), a heating platform (7), a corrosion groove (8), a spring (9), and a box (10). The spring lock (3) is fixedly mounted on the inner wall of the middle part of the box (10). The spring lock (3) is connected to one end of a solder sample (6) through the copper wire (5). The other end of the solder sample (6) is connected to one end of a spring (9) through the copper wire (5). The other end of the spring (9) is fixedly connected to the inner wall of the box (10). The positive and negative electrodes of the direct current power supply (1) are respectively electrically connected to the copper wires (5) at both ends of the solder sample (6). The annular magnetic tube coil (2) is fixedly mounted on the inner wall of the box (10) and surrounds the solder sample (6). The heating platform (7) is located below the solder sample (6) and fixedly mounted on the inner wall of the box (10). The corrosion groove (8) is arranged at the bottom of the box (10). The corrosion groove (8) is filled with corrosion liquid.

2. The device for coupling heat, electricity, force, magnetism and corrosion field of tin-based solder according to claim 1, characterized in that: The axis of the copper wire (5) coincides with the axis of the spring (9).

3. The device for coupling heat, electricity, force, magnetism and corrosion field of tin-based solder according to claim 1, characterized in that: The DC power supply (1) has an adjustable current; the DC power supply (1) is located outside the box (10) and is installed on the top surface of the box (10).

4. The device for coupling heat, electricity, force, magnetism and corrosion field of tin-based solder according to claim 1, characterized in that: The device further comprises a temperature control platform (4), wherein the temperature control platform (4) is connected to the corrosion tank (8) in communication, the temperature control platform (4) is connected to the heating platform (7) in communication, and the temperature control platform (4) is installed at the bottom of the outer side wall of the box body (10).

5. The device for coupling heat, electricity, force, magnetism and corrosion field of tin-based solder according to claim 1, characterized in that: The device also includes an electromagnetic controller, the annular magnetic tube coil (2) is communicatively connected to the electromagnetic controller, and the electromagnetic controller is located outside the box (10) and installed on the top surface of the box (10).

6. A tin-based solder heat, electricity, force, magnetism, and corrosion field coupling device according to any one of claims 1 to 5, characterized in that: The springs (9) and spring locks (3) are divided into three groups, and the copper wires (5) connecting the spring locks (3) and springs (9) of each group and the solder sample (6) are parallel to each other.

7. A tin-based solder heat, electricity, force, magnetism, and corrosion field coupling device according to any one of claims 1 to 5, characterized in that: The solder sample (6) is made by welding a copper sheet and a tin-based solder sheet, and the copper sheet is connected to the copper wire (5).

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