Novel composite aging test board

Abstract

The utility model discloses a novel composite aging test board, which relates to the technical field of electronic equipment and comprises an aging board body, a plurality of aging seats are uniformly arranged on the surface of the aging board body, and jumper test assemblies are arranged on the surfaces of the aging seats. The jumper wire test assembly comprises a first jumper wire hole assembly, a second jumper wire hole assembly, a third jumper wire hole assembly, a fourth jumper wire hole assembly, a fifth jumper wire hole assembly, a sixth jumper wire hole assembly and a seventh jumper wire hole assembly which are arranged on the periphery of the surface of the aging seat. According to the utility model, the HTRB test and the HTGB test are freely switched on the burn-in board body, so that the rapid conversion of test conditions is ensured, the test process is simplified, test equipment does not need to be replaced or devices do not need to be connected again, circuits and devices can be protected in the burn-in test, the risk of burnout is reduced, the detection voltage is conveniently monitored in the test, and the test efficiency is improved. And thus, the safety of the test process is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, in particular to a novel composite aging test board. Background Art

[0002] The new composite HTRB (high temperature reverse bias) and HTGB (high temperature gate bias) aging test board is a tool for evaluating the reliability and stability of semiconductor devices in high temperature and high voltage environments. This test board is usually used to simulate extreme conditions in long-term operation to predict the failure mode and life of semiconductor devices. The HTRB test is mainly used to detect the reliability of semiconductor devices under high temperature and high reverse voltage conditions. This test can help identify potential failures caused by electron migration, interface degradation and other stresses; the HTGB test focuses on the performance of gate insulation materials at high temperatures. By applying a high voltage to the gate, the damage to the gate insulation layer can be observed, thereby evaluating the reliability of the device.

[0003] However, the aging board in the prior art can only perform HTGB test or HTRB test, and cannot switch HTGB / HTRB, nor can it perform HTRB / HTGB test on the product type (N type or P type) of MOS / IBGT. At the same time, the aging board in the prior art uses a socket test base with a fixed packaging type, which not only limits the diversity of product types and packaging types, but also cannot make adjustments according to the changes in the pin electrodes of the device, thereby reducing the test efficiency.

[0004] Currently, no effective solution has been proposed for the problems in the related technologies. Utility Model Content

[0005] In view of the problems in the related technology, the utility model proposes a novel composite aging test board to overcome the above technical problems existing in the existing related technology.

[0006] To this end, the specific technical solutions adopted by the utility model are as follows:

[0007] A novel composite aging test board comprises an aging board body, a plurality of aging seats are evenly arranged on the surface of the aging board body, and a jumper test assembly is arranged on the surface of the aging seats.

[0008] Furthermore, in order to freely switch between HTRB and HTGB tests on the aging board body and ensure rapid conversion of test conditions, not only the test process is simplified, but also there is no need to replace test equipment or reconnect devices, saving time and human resources. At the same time, circuits and devices can be protected during the aging test, reducing the risk of burning, and it is convenient to monitor the detection voltage during the test, thereby improving the safety of the test process. The jumper test assembly includes a first jumper hole assembly, a second jumper hole assembly, a third jumper hole assembly, a fourth jumper hole assembly, a fifth jumper hole assembly, a sixth jumper hole assembly and a seventh jumper hole assembly arranged around the surface of the aging seat; the first jumper hole assembly includes a first jumper hole and a second jumper hole arranged on one side of the surface of the aging seat; the second jumper hole assembly includes a first jumper hole and a second jumper hole arranged on the other side of the surface of the aging seat and The present invention relates to a third jumper hole and a fourth jumper hole which are symmetrical to the first jumper hole and the second jumper hole respectively; the third jumper hole assembly includes a fifth jumper hole and a sixth jumper hole which are arranged on one side of the surface of the aging seat and located at the bottom of the first jumper hole assembly; the fourth jumper hole assembly includes a seventh jumper hole and an eighth jumper hole which are arranged on the other side of the surface of the aging seat and are symmetrical to the fifth jumper hole and the sixth jumper hole respectively; the fifth jumper hole assembly includes a ninth jumper hole and a tenth jumper hole which are arranged on one side of the surface of the aging seat and are located at the bottom of the third jumper hole assembly; the sixth jumper hole assembly includes an eleventh jumper hole and a twelfth jumper hole which are arranged on the other side of the surface of the aging seat and are symmetrical to the ninth jumper hole and the tenth jumper hole respectively; the seventh jumper hole assembly includes a thirteenth jumper hole and a fourteenth jumper hole which are arranged on one side of the surface of the aging seat and located at the bottom of the fifth jumper hole assembly.

[0009] Furthermore, in order to support the transmission of electrical signals between each jumper hole assembly through jumper communication connection, no additional electronic components are required, which not only reduces the complexity of the layout but also improves the versatility and flexibility of the test board. The first jumper hole assembly, the second jumper hole assembly, the third jumper hole assembly, the fourth jumper hole assembly, the fifth jumper hole assembly, the sixth jumper hole assembly and the seventh jumper hole assembly all adopt jumper communication connection.

[0010] The beneficial effects of the utility model are:

[0011] 1. The utility model ensures the rapid conversion of test conditions by freely switching between HTRB and HTGB tests on the aging board body, which not only simplifies the test process, but also does not require replacement of test equipment or reconnection of devices, saving time and human resources. At the same time, circuits and devices can be protected during the aging test, reducing the risk of burning, and conveniently monitoring the detection voltage during the test, thereby improving the safety of the test process.

[0012] 2. The utility model can quickly adapt to different test requirements and device types by setting up test components, which not only enhances the flexibility and scope of application of the test process, improves the test efficiency, but also ensures the accuracy and reliability of the test data. At the same time, the use of safety measures such as fuses and current-limiting resistors can effectively reduce the damage caused by excessive current, further improving the safety of the test process. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a structural schematic diagram of a novel composite aging test board according to an embodiment of the utility model;

[0015] Figure 2 yes Figure 1 A partial enlarged view of the middle A;

[0016] Figure 3 yes Figure 1 A partial enlarged view of point B in the middle;

[0017] Figure 4 yes Figure 1 A partial enlarged view of point C in the middle.

[0018] In the figure:

[0019] 1. Aging board body; 2. Aging seat; 3. Jumper test assembly; 301. First jumper hole assembly; 3011. First jumper hole; 3012. Second jumper hole; 302. Second jumper hole assembly; 3021. Third jumper hole; 3022. Fourth jumper hole; 303. Third jumper hole assembly; 3031. Fifth jumper hole; 3032. Sixth jumper hole; 304. Fourth jumper hole assembly; 3041. Seventh jumper hole; 3042. Eighth jumper hole; 305. Fifth jumper hole assembly; 3051. Ninth jumper hole; 3052. Tenth jumper hole; 306. Sixth jumper hole assembly; 3061. Eleventh jumper hole; 3062. Twelfth jumper hole; 307. Seventh jumper hole assembly; 3071. Thirteenth jumper hole; 3072. Fourteenth jumper hole. DETAILED DESCRIPTION

[0020] To further illustrate each embodiment, the present invention provides drawings, which are part of the disclosure of the present invention and are mainly used to illustrate the embodiments. They can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, ordinary technicians in the field should be able to understand other possible implementation methods and advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are generally used to represent similar components.

[0021] According to an embodiment of the utility model, a novel composite aging test board is provided.

[0022] The present invention is now further described in conjunction with the accompanying drawings and specific implementation methods. Figure 1-Figure 4 As shown, the new composite aging test board according to the embodiment of the utility model includes an aging board body 1, a plurality of aging seats 2 are evenly arranged on the surface of the aging board body 1, and a jumper test assembly 3 is arranged on the surface of the aging seat 2.

[0023] It should be noted that the utility model realizes the assessment of P-type or N-type semiconductor device products through the jumper on the aging board body 1 (PCB board), thereby realizing the type change of the aging board body 1 (HTRB / HTGB switching) and the arbitrary switching of the device pins (such as the electrodes are GSD, GDS, DGS, DSG, SGD, SDG, etc.), which not only simplifies the test process, but also does not need to replace the test equipment or reconnect the device, saving time and human resources.

[0024] In one embodiment, for the above-mentioned jumper test assembly 3, the jumper test assembly 3 includes a first jumper hole assembly 301, a second jumper hole assembly 302, a third jumper hole assembly 303, a fourth jumper hole assembly 304, a fifth jumper hole assembly 305, a sixth jumper hole assembly 306 and a seventh jumper hole assembly 307 arranged around the surface of the aging seat 2; the first jumper hole assembly 301 includes a first jumper hole 3011 and a second jumper hole 3012 arranged on one side of the surface of the aging seat 2; the second jumper hole assembly 3 02 includes a third jumper hole 3021 and a fourth jumper hole 3022 which are arranged on the other side of the surface of the aging seat 2 and are symmetrical to the first jumper hole 3011 and the second jumper hole 3012 respectively; the third jumper hole assembly 303 includes a fifth jumper hole 3031 and a sixth jumper hole 3032 which are arranged on one side of the surface of the aging seat 2 and are located at the bottom of the first jumper hole assembly 301; the fourth jumper hole assembly 304 includes a fifth jumper hole 3031 and a sixth jumper hole 3032 which are arranged on the other side of the surface of the aging seat 2 and are symmetrical to the fifth jumper hole 3031 and the sixth jumper hole 3032 respectively. The seventh jumper hole 3041 and the eighth jumper hole 3042; the fifth jumper hole assembly 305 includes a ninth jumper hole 3051 and a tenth jumper hole 3052 which are arranged on one side of the surface of the aging seat 2 and located at the bottom of the third jumper hole assembly 303; the sixth jumper hole assembly 306 includes an eleventh jumper hole 3061 and a twelfth jumper hole 3061 which are arranged on the other side of the surface of the aging seat 2 and are symmetrical to the ninth jumper hole 3051 and the tenth jumper hole 3052 respectively; the seventh jumper hole assembly 307 includes a thirteenth jumper hole 3071 and a fourteenth jumper hole 3072 which are arranged on one side of the surface of the aging seat 2 and located at the bottom of the fifth jumper hole assembly 305, so as to freely switch between HTRB and HTGB tests on the aging board body 1 and ensure rapid conversion of test conditions, which not only simplifies the test process, but also does not require replacement of test equipment or reconnection of devices, saving time and human resources. At the same time, circuits and devices can be protected during the aging test to reduce the risk of burning, and the detection voltage can be easily monitored during the test, thereby improving the safety of the test process.

[0025] It should be noted that a universal TO3P aging seat 2 (socket aging seat) is installed on the PCB structure of the aging board body 1. 80 aging seats 2 are placed on the entire aging board body 1. Seven groups of jumper holes are placed around the aging seat 2, which are the first jumper hole assembly 301 (including the first jumper hole 3011 and the second jumper hole 3012), the second jumper hole assembly 302 (including the third jumper hole 3021 and the fourth jumper hole 3022), the third jumper hole assembly 303 (including the fifth jumper hole 3031 and the sixth jumper hole 3032), the fourth jumper hole assembly 304 (including the seventh jumper hole 3041 and the eighth jumper hole 3042), the fifth jumper hole assembly 305 (including the ninth jumper hole 3051 and the tenth jumper hole 3052), the sixth jumper hole assembly 306 (including the eleventh jumper hole 3061 and the twelfth jumper hole 3062) and the seventh jumper hole assembly 307 (including the thirteenth jumper hole 3071 and the fourteenth jumper hole 3072).

[0026] In one embodiment, for the above-mentioned first jumper hole assembly 301, the first jumper hole assembly 301, the second jumper hole assembly 302, the third jumper hole assembly 303, the fourth jumper hole assembly 304, the fifth jumper hole assembly 305, the sixth jumper hole assembly 306 and the seventh jumper hole assembly 307 all adopt jumper communication connections, thereby supporting the transmission of electrical signals between each jumper hole assembly through jumper communication connections, without the need for additional electronic components, which not only reduces the complexity of the layout, but also improves the versatility and flexibility of the test board.

[0027] It should be noted that the jumper combinations of the first jumper hole assembly 301, the second jumper hole assembly 302, the third jumper hole assembly 303, the fourth jumper hole assembly 304, the fifth jumper hole assembly 305 and the sixth jumper hole assembly 306 are selected according to the product test category. Generally, it is not necessary to place electronic components, but jumpers (i.e., wires) are used to connect electrical signals.

[0028] It should be noted that the seventh jumper hole component 307 is enabled when the product is selected. For MOS / IGBT products, a jumper can be placed there. If the product is a thyristor (SCR), a current limiting resistor needs to be placed, and the resistance is fixed at 10KΩ; Figure 2 As shown, the bottom of the aging seat 2 is the fuse mark position, which is used to protect the device from burning due to overcurrent.

[0029] It should be noted that in actual applications, MOS / IGBT / SCR devices all have three pin electrodes. For general devices, such as MOS products (placed on the front, that is, the printed side), the electrode pin order from left to right is G, D, S, the electrode pin order from left to right for thyristor devices (SCR) is A, K, G, and the electrode pin order from left to right for IGBT devices is G, C, E. When performing HTRB / HTGB testing, this type of device needs to be biased as a diode, that is, the control electrode needs to be short-circuited with one of the electrodes. Therefore, when designing the circuit, you only need to short-circuit the control electrode to one of the electrodes. The category of device testing can be determined by changing the position according to different products.

[0030] In order to facilitate understanding of the above technical solution of the present invention, the working principle or operation method of the present invention in the actual process is described in detail below.

[0031] In actual application, the working principle of HTRB (high temperature reverse bias) test is as follows: first, short-circuit GS of MOS products, short-circuit GE of IGBT products, connect current limiting resistors in series with KG of SCR products, and select to short-circuit the first jumper hole 3011 and the second jumper hole 3012, the ninth jumper hole 3051 and the tenth jumper hole 3052, the thirteenth jumper hole 3071 and the fourteenth jumper hole 3072, and the seventh jumper hole 3041 and the eighth jumper hole 3042. Among them, the thirteenth jumper hole 3071 and the fourteenth jumper hole 3072 are directly jumpered and shorted, so that MOS / IGBT products can be tested; the thirteenth jumper hole 3071 and the fourteenth jumper hole 3072 are connected in series with a 10K or 1K resistor, so that SCR products can be tested.

[0032] The working principle of the HTGB (high temperature gate bias) test is as follows: first, short-circuit the DS of the MOS product and the CE of the IGBT product, and select to short-circuit the first jumper hole 3011 and the second jumper hole 3012, the thirteenth jumper hole 3071 and the fourteenth jumper hole 3072, the seventh jumper hole 3041 and the eighth jumper hole 3042, the eleventh jumper hole 3061 and the twelfth jumper hole 3062, among which the thirteenth jumper hole 3071 and the fourteenth jumper hole 3072 are directly jumpered and short-circuited, so that the MOS / IGBT products can be tested; the above HTRB / HTGB connects V+ and V- to switch between N and P type products according to the jumper positions on the left and right sides. At the same time, a fuse socket is placed in the circuit design to ensure that the overcurrent will not cause the device to burn out or the aging board to burn out during the aging test.

[0033] To sum up, with the aid of the above-mentioned technical scheme of the utility model, the utility model ensures the rapid conversion of test conditions by freely switching the HTRB and HTGB tests on the aging board body 1, thereby not only simplifying the test process, but also eliminating the need to replace test equipment or reconnect devices, saving time and human resources. At the same time, both circuits and devices can be protected during the aging test, reducing the risk of burning, and conveniently monitoring the detection voltage during the test, thereby improving the safety of the test process; the utility model can quickly adapt to different test requirements and device types by setting a jumper test component 3, thereby not only enhancing the flexibility and scope of application of the test process, improving the test efficiency, but also ensuring the accuracy and reliability of the test data. At the same time, the use of safety measures such as fuses and current limiting resistors can effectively reduce the damage caused by excessive current, further improving the safety of the test process.

[0034] In the present utility model, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the utility model according to the specific circumstances.

[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A novel composite aging test board, comprising an aging board body (1), characterized in that: A plurality of aging seats (2) are evenly arranged on the surface of the aging board body (1), and a jumper test assembly (3) is arranged on the surface of the aging seat (2).

2. A novel composite aging test board according to claim 1, characterized in that: The jumper test assembly (3) comprises a first jumper hole assembly (301), a second jumper hole assembly (302), a third jumper hole assembly (303), a fourth jumper hole assembly (304), a fifth jumper hole assembly (305), a sixth jumper hole assembly (306) and a seventh jumper hole assembly (307) which are arranged around the surface of the aging seat (2).

3. A novel composite aging test board according to claim 2, characterized in that: The first jumper hole assembly (301) comprises a first jumper hole (3011) and a second jumper hole (3012) arranged on one side of the surface of the aging seat (2); the second jumper hole assembly (302) comprises a third jumper hole (3021) and a fourth jumper hole (3022) arranged on the other side of the surface of the aging seat (2) and symmetrical to the first jumper hole (3011) and the second jumper hole (3012), respectively.

4. A novel composite aging test board according to claim 3, characterized in that: The third jumper hole assembly (303) comprises a fifth jumper hole (3031) and a sixth jumper hole (3032) which are arranged on one side of the surface of the aging seat (2) and located at the bottom of the first jumper hole assembly (301); the fourth jumper hole assembly (304) comprises a seventh jumper hole (3041) and an eighth jumper hole (3042) which are arranged on the other side of the surface of the aging seat (2) and are symmetrical to the fifth jumper hole (3031) and the sixth jumper hole (3032), respectively.

5. A novel composite aging test board according to claim 4, characterized in that: The fifth jumper hole assembly (305) comprises a ninth jumper hole (3051) and a tenth jumper hole (3052) which are arranged on one side of the surface of the aging seat (2) and located at the bottom of the third jumper hole assembly (303); the sixth jumper hole assembly (306) comprises an eleventh jumper hole (3061) and a twelfth jumper hole (3062) which are arranged on the other side of the surface of the aging seat (2) and are symmetrical to the ninth jumper hole (3051) and the tenth jumper hole (3052), respectively.

6. A novel composite aging test board according to claim 5, characterized in that: The seventh jumper hole assembly (307) comprises a thirteenth jumper hole (3071) and a fourteenth jumper hole (3072) which are arranged on one side of the surface of the aging seat (2) and located at the bottom of the fifth jumper hole assembly (305).

7. A novel composite aging test board according to claim 6, characterized in that: The first jumper hole assembly (301), the second jumper hole assembly (302), the third jumper hole assembly (303), the fourth jumper hole assembly (304), the fifth jumper hole assembly (305), the sixth jumper hole assembly (306) and the seventh jumper hole assembly (307) are all connected by jumper communication.

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