Light emitter

Abstract

The utility model relates to the technical field of optical modules, in particular to a light emitter. The light emitter comprises a tube shell, a heat sink arranged in the tube shell, a laser chip directly arranged on the heat sink, a collimating lens, a light splitting part and a light detector; specifically, the four optical components, namely the laser chip, the collimating lens, the light splitting part and the light detector, are all directly arranged on the same heat sink, so that compared with the prior art that the four optical components are arranged on a plurality of structures and at least part of the four optical components are indirectly arranged on the heat sink, the heat sink has the advantages that the structure is simple, and the cost is low. According to the utility model, the structure for assembling the laser chip, the collimating lens, the light splitting piece and the optical detector is less, and the assembly complexity is lower, so that the assembly error can be effectively reduced, and the accuracy of optical path transmission is improved.

Description

Technical Field

[0001] The utility model relates to the field of optical modules, in particular to a light transmitter. Background Art

[0002] An optical transmitter is a device that can convert electrical signals into optical signals and transmit them. It is usually used in optical communications, optical sensing, optical measurement and other fields.

[0003] An optical transmitter generally includes components such as a laser chip, a collimating lens, and a beam splitter. In existing optical transmitters, the assembly errors of these components are relatively large, so that the accuracy of optical path transmission needs to be improved. Utility Model Content

[0004] The technical problem to be solved by the embodiments of the utility model is to provide a light transmitter to solve the problem in the prior art that the assembly errors of components such as laser chips, collimating lenses, and splitters are relatively large, so that the accuracy of light path transmission needs to be improved.

[0005] The optical transmitter provided by the embodiment of the utility model includes: a tube shell, a heat sink installed in the tube shell, a laser chip directly installed on the heat sink, a collimating lens, a spectrometer and a light detector; the collimating lens is located in the emission direction of the laser chip; the spectrometer is installed in the emission direction of the collimating lens and is set at an angle with the emission direction of the collimating lens; the optical coating on the spectrometer can transmit a part of the light and reflect another part of the light; a light outlet is provided on the tube shell, the light outlet is located in the reflection direction of the spectrometer, and the light detector is located in the transmission direction of the spectrometer.

[0006] Optionally, a first boss is integrally provided on the heat sink, the laser chip is mounted on the first boss, a depression is formed next to the first boss, and the collimating lens is mounted on the depression so that the center position of the collimating lens can be opposite to the light emitting position of the laser chip.

[0007] Optionally, a second boss is integrally provided on the heat sink, the second boss is located on a side of the depression away from the first boss, and the light detector is mounted on the second boss so that the incident position of the light detector can face the center position of the collimating lens.

[0008] Optionally, the beam splitter is a coated glass slide, the coated glass slide is set at an angle with the emission direction of the collimating lens, and the optical coating on the coated glass slide can transmit a part of the light and reflect another part of the light.

[0009] Optionally, a mounting bump is integrally provided on the heat sink, and the mounting bump is located between the laser chip and the light detector, and a side of the mounting bump facing the laser chip is an inclined surface, and the coated glass sheet includes a light-transmitting portion and a mounting portion, the light-transmitting portion is located in the emitting direction of the collimating lens, and the mounting portion is located in a first direction of the light-transmitting portion, the first direction is perpendicular to the emitting direction of the collimating lens, and the mounting portion is mounted on the inclined surface.

[0010] Optionally, two mounting protrusions are provided, and the two mounting protrusions are spaced apart in the first direction. Two mounting portions are correspondingly provided, and the light-transmitting portion is sandwiched between the two mounting portions.

[0011] Optionally, an impedance matching structure is provided on the heat sink, and the laser chip is electrically connected to the impedance matching structure.

[0012] Optionally, it also includes a semiconductor refrigerator installed in the tube shell, and the heat sink is installed on the cold surface of the semiconductor refrigerator.

[0013] Optionally, a mounting groove is provided on the inner wall of the tube shell, and the hot surface of the semiconductor refrigerator is installed at the bottom of the mounting groove.

[0014] Optionally, a coupling lens is also included which is arranged at the light outlet.

[0015] Compared with the prior art, the optical transmitter provided by the embodiment of the utility model has the following beneficial effects: the optical transmitter provided by the embodiment of the utility model includes a tube shell, a heat sink installed in the tube shell, and a laser chip, a collimating lens, a spectrometer and a light detector directly installed on the heat sink; specifically, since the four optical components of the laser chip, the collimating lens, the spectrometer and the light detector are directly installed on the same heat sink, compared with the prior art in which the four optical components are installed on multiple structures, and the prior art in which at least some of the four optical components are indirectly installed on the heat sink, the embodiment of the utility model involves relatively few structures for assembling the laser chip, the collimating lens, the spectrometer and the light detector, and the assembly complexity is relatively low, so the assembly error can be effectively reduced and the accuracy of the optical path transmission is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The specific implementation of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0017] Figure 1 It is a three-dimensional schematic diagram of a light emitter provided in an embodiment of the utility model;

[0018] Figure 2 yes Figure 1The illustrated three-dimensional schematic diagram of the light transmitter omitting the coupling lens and part of the tube shell;

[0019] Figure 3 yes Figure 1 The illustrated three-dimensional schematic diagram of the light transmitter omitting the coupling lens and the tube housing;

[0020] Figure 4 It is an exploded schematic diagram of a heat sink and a coated glass slide provided in an embodiment of the utility model.

[0021] The reference numerals in the figures are:

[0022] 1000, light emitter; 100, tube shell; 110, light outlet; 120, mounting groove; 200, heat sink; 210, mounting bump; 211, inclined plane; 220, first boss; 230, depression; 240, second boss; 250, impedance matching structure; 300, laser chip; 400, collimating lens; 500, spectrometer; 510, coated glass; 511, light-transmitting part; 512, mounting part; 600, light detector; 700, semiconductor refrigerator; 710, cold surface; 800, coupling lens; 900, thermistor. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.

[0024] The present utility model embodiment provides a light transmitter 1000, such as Figure 1-Figure 3 As shown, the optical transmitter 1000 includes a tube shell 100, a heat sink 200, a laser chip 300, a collimating lens 400, a beam splitter 500 and a light detector 600. The heat sink 200 is installed in the tube shell 100, and the laser chip 300, the collimating lens 400, the beam splitter 500 and the light detector 600 are all installed on the heat sink 200. The beam splitter 500 is installed in the emission direction of the collimating lens 400 and is set at an angle with the emission direction of the collimating lens 400. The optical coating (not shown in the figure) on the beam splitter 500 can transmit part of the light and reflect another part of the light. The tube shell 100 is provided with a light outlet 110, and the light outlet 110 is located in the reflection direction of the beam splitter 500, and the light detector 600 is located in the transmission direction of the beam splitter 500. With this arrangement, the light emitted from the laser chip 300 passes through the collimating lens 400 and the beam splitter 500 in sequence, and is then split into two beams by the beam splitter 500 , one of which is reflected by the beam splitter 500 toward the light outlet 110 , and the other passes through the beam splitter 500 and is incident on the light detector 600 .

[0025] The collimator lens 400 is an optical device that can be used to focus a light beam into a parallel light beam or a nearly parallel light beam. The collimator lens 400 is arranged in the emission direction of the laser chip 300 to control the propagation direction and range of the light beam, ensure the accuracy of the propagation direction of the light, reduce the defocusing of the light, and improve the transmission efficiency.

[0026] The photodetector 600 is an optical device for detecting incident light. In this embodiment, the incident light of the photodetector 600 comes from the laser chip 300, so the photodetector 600 can be used to monitor the emission state of the laser chip 300.

[0027] The four optical components of the laser chip 300, the collimating lens 400, the beam splitter 500 and the photodetector 600 of this embodiment are all directly mounted on the same heat sink 200. Compared with the prior art in which the four optical components are mounted on multiple structures, and the prior art in which at least some of the four optical components are indirectly mounted on the heat sink 200, the structures involved in assembling the laser chip 300, the collimating lens 400, the beam splitter 500 and the photodetector 600 of this embodiment are relatively few, and the assembly complexity is relatively low, so the assembly error can be effectively reduced and the accuracy of optical path transmission can be improved.

[0028] Since the assembly error and the optical path deviation are small, the present embodiment can provide more assembly tolerances when the coupling flat area is the same, and can guarantee the production yield of the product to a greater extent during mass production, thereby indirectly reducing the cost of mass-produced products.

[0029] refer to Figure 2-Figure 4 In a specific embodiment, a first boss 220 is integrally provided on the heat sink 200, the laser chip 300 is mounted on the first boss 220, a depression 230 is formed next to the first boss 220, and the collimating lens 400 is mounted on the depression 230 so that the center position of the collimating lens 400 can be directly opposite to the light emitting position of the laser chip 300.

[0030] Specifically, the center position of the collimating lens 400 is opposite to the light emitting position of the laser chip 300, which is conducive to controlling the diameter and divergence angle of the light beam passing through the collimating lens 400, and helps to produce a stable and high-quality light beam. In order to make the center position of the collimating lens 400 opposite to the light emitting position of the laser chip 300, the prior art will place a gasket between the heat sink 200 and the laser chip 300, which will increase the complexity of assembly and make it easier to produce larger assembly errors. In this embodiment, a first boss 220 is integrally provided on the heat sink 200, and the laser chip 300 is mounted on the first boss 220, so as to achieve that the center position of the collimating lens 400 is opposite to the light emitting position of the laser chip 300 without increasing the complexity of assembly. It can be seen that the implementation of this embodiment is conducive to reducing assembly errors and improving the accuracy of optical path transmission.

[0031] refer to Figure 2-Figure 4 In a specific embodiment, a second boss 240 is integrally provided on the heat sink 200, and the second boss 240 is located on a side of the depression 230 away from the first boss 220. The light detector 600 is mounted on the second boss 240 so that the incident position of the light detector 600 can be directly opposite to the central area of ​​the collimating lens 400.

[0032] Specifically, the center position of the collimating lens 400 is directly opposite to the incident position of the light detector 600, which is beneficial for the light detector 600 to receive the light signal and improve the monitoring accuracy and stability. In order to make the center position of the collimating lens 400 directly opposite to the incident position of the light detector 600, the prior art will place a gasket between the heat sink 200 and the light detector 600, which will increase the complexity of assembly and make it easier to produce larger assembly errors. In this embodiment, a second boss 240 is integrally provided on the heat sink 200, and the light detector 600 is installed on the second boss 240, so as to achieve that the center position of the collimating lens 400 is directly opposite to the incident position of the light detector 600 without increasing the complexity of assembly. It can be seen that the implementation of this embodiment is conducive to reducing assembly errors and improving the accuracy of optical path transmission.

[0033] refer to Figure 2-Figure 4 In one embodiment, the beam splitter 500 is a coated glass slide 510, and the coated glass slide 510 is set at an angle with the emission direction of the collimating lens 400. The optical coating on the coated glass slide 510 can transmit a part of the light and reflect another part of the light. In another embodiment, the beam splitter 500 is a beam splitter prism, which can separate the incident light beam into light beams of different wavelengths.

[0034] refer to Figure 2-Figure 4In a specific embodiment, a mounting protrusion 210 is integrally provided on the heat sink 200, and the mounting protrusion 210 is located between the laser chip 300 and the light detector 600. The side of the mounting protrusion 210 facing the laser chip 300 is an inclined surface 211. The coated glass slide 510 includes a light-transmitting portion 511 and a mounting portion 512. The light-transmitting portion 511 is located in the emission direction of the collimating lens 400, and the mounting portion 512 is located in the first direction of the light-transmitting portion 511 (the X direction in the figure), the first direction is perpendicular to the emission direction of the collimating lens 400, and the mounting portion 512 is installed on the inclined surface 211.

[0035] Since the side of the mounting bump 210 facing the laser chip 300 is a slope 211, after the mounting portion 512 of the beam splitter 500 is installed on the slope 211, the beam splitter 500 will be set at an angle with the emission direction of the collimating lens 400, so that the light incident on the beam splitter 500 will be split into two beams by the optical coating on the beam splitter 500, one of which is reflected by the coated glass slide 510 to the light outlet 110, and the other is incident on the light detector 600 through the coated glass slide 510.

[0036] Since the mounting protrusion 210 is integrally arranged on the heat sink 200, compared with the embodiment in which the mounting protrusion 210 and the heat sink 200 are separately arranged, the mounting protrusion 210 is integrally arranged on the heat sink 200 without increasing the complexity of assembly, which is helpful to reduce assembly errors and improve the accuracy of optical path transmission.

[0037] refer to Figure 2-Figure 4 In one embodiment, two mounting protrusions 210 are provided, and the two mounting protrusions 210 are spaced apart in the first direction. Two mounting portions 512 are correspondingly provided, and the light-transmitting portion 511 is sandwiched between the two mounting portions 512 .

[0038] Specifically, the present embodiment is provided with two mounting protrusions 210 for mounting the coated glass slide 510. Compared with the embodiment with only one mounting protrusion 210, the present embodiment can increase the mounting stability of the coated glass slide 510. Since the two mounting protrusions 210 are arranged at intervals in the first direction, a spaced position for light propagation is formed between the two mounting protrusions 210, which will not affect the light propagation.

[0039] refer to Figure 2-Figure 4 In one embodiment, the heat sink 200 is provided with an impedance matching structure 250, and the laser chip 300 is electrically connected to the impedance matching structure 250. By impedance matching of the laser chip 300, signal reflection and loss can be reduced, and the quality and transmission efficiency of the optical signal can be improved.

[0040] In a specific embodiment, the impedance matching structure 250 is a gold-plated microstrip line. The gold-plated microstrip line can provide good high-frequency characteristics, including low loss, accurate impedance matching and stable signal transmission.

[0041] refer to Figure 2-Figure 4 In one embodiment, the light emitter 1000 further includes a semiconductor cooler 700 , and the heat sink 200 is mounted on a cold surface 710 of the semiconductor cooler 700 .

[0042] Specifically, the semiconductor refrigerator 700 is a device that uses the thermo-electric effect of semiconductors to generate cooling, also known as a thermoelectric refrigerator. The semiconductor refrigerator 700 has a cold surface 710 and a hot surface (not shown in the figure). When the semiconductor refrigerator 700 is powered on, the cold surface 710 will become cold and the hot surface will heat up. In this embodiment, the heat sink 200 is installed on the cold surface 710, thereby effectively reducing the temperature of the optical element installed on the heat sink 200 during use, so that the light emitter 1000 can work continuously and stably.

[0043] refer to Figure 2-Figure 4 In one embodiment, a mounting groove 120 is provided on the inner wall of the tube shell 100 , and the hot surface of the semiconductor cooler 700 is installed at the bottom of the mounting groove 120 .

[0044] Specifically, compared with the embodiment in which the mounting groove 120 is not provided, the mounting groove 120 is provided on the inner wall of the tube shell 100, and the hot surface of the semiconductor cooler 700 is installed at the bottom of the mounting groove 120, which can reduce the distance between the hot surface and the outside of the tube shell 100, which is conducive to using the tube shell 100 to discharge heat in time.

[0045] refer to Figure 1 In one embodiment, the light transmitter 1000 further includes a coupling lens 800 , and the coupling lens 800 is installed at the light outlet 110 .

[0046] Specifically, the coupling lens 800 can be used to focus and adjust the direction of the light beam so that it is aligned with the interface of the optical fiber and achieves efficient coupling, so that the output light of the optical transmitter 1000 can be captured and transmitted by the optical fiber as much as possible.

[0047] refer to Figure 2-Figure 4 In one embodiment, the light emitter 1000 further includes a thermistor 900 . The thermistor 900 is mounted on the cold surface 710 . The thermistor 900 is electrically connected to the semiconductor cooler 700 .

[0048] Specifically, the thermistor 900 is used to form a closed-loop control with the semiconductor refrigerator 700, so that the semiconductor refrigerator 700 can adjust the current according to the feedback of the thermistor 900, thereby controlling the temperature within a preset range.

[0049] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.

Claims

1. A light transmitter, characterized in that: include: A tube shell, a heat sink installed in the tube shell, a laser chip, a collimating lens, a beam splitter and a light detector directly installed on the heat sink; The collimating lens is located in the emission direction of the laser chip; the beam splitter is installed in the emission direction of the collimating lens and is set at an angle with the emission direction of the collimating lens; the optical coating on the beam splitter can transmit a part of the light and reflect another part of the light; a light outlet is provided on the tube shell, the light outlet is located in the reflection direction of the beam splitter, and the light detector is located in the transmission direction of the beam splitter.

2. The optical transmitter according to claim 1, characterized in that The heat sink is integrally provided with a first boss, the laser chip is mounted on the first boss, a depression is formed next to the first boss, and the collimating lens is mounted on the depression so that the center position of the collimating lens can face the light emitting position of the laser chip.

3. The optical transmitter according to claim 2, characterized in that The heat sink is integrally provided with a second boss, which is located on a side of the depression away from the first boss, and the light detector is mounted on the second boss so that the incident position of the light detector can face the center position of the collimating lens.

4. The optical transmitter according to claim 1, characterized in that The light splitter is a coated glass slide, and the coated glass slide is set at an angle with the emission direction of the collimating lens. The optical coating on the coated glass slide can transmit a part of the light and reflect another part of the light.

5. The optical transmitter according to claim 4, characterized in that A mounting protrusion is integrally provided on the heat sink, and the mounting protrusion is located between the laser chip and the light detector. The side of the mounting protrusion facing the laser chip is an inclined surface. The coated glass sheet includes a light-transmitting portion and a mounting portion. The light-transmitting portion is located in the emitting direction of the collimating lens. The mounting portion is located in a first direction of the light-transmitting portion, and the first direction is perpendicular to the emitting direction of the collimating lens. The mounting portion is mounted on the inclined surface.

6. The optical transmitter according to claim 5, characterized in that There are two mounting protrusions, which are spaced apart in the first direction, and there are two mounting portions correspondingly, and the light-transmitting portion is sandwiched between the two mounting portions.

7. The optical transmitter according to any one of claims 1 to 6, characterized in that: An impedance matching structure is disposed on the heat sink, and the laser chip is electrically connected to the impedance matching structure.

8. The optical transmitter according to any one of claims 1 to 6, characterized in that: It also includes a semiconductor refrigerator installed in the tube shell, and the heat sink is installed on the cold surface of the semiconductor refrigerator.

9. The optical transmitter according to claim 8, characterized in that An installation groove is arranged on the inner wall of the tube shell, and the hot surface of the semiconductor refrigerator is arranged on the bottom of the installation groove.

10. The optical transmitter according to any one of claims 1 to 6, characterized in that: It also includes a coupling lens installed at the light outlet.

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