Light machine heat dissipation sealing structure and projection equipment

Abstract

The embodiment of the utility model provides an optical machine heat dissipation sealing structure and projection equipment, and relates to the technical field of projectors. The light machine heat dissipation sealing structure comprises a light machine cover body, a display chip, a thermoelectric refrigerating unit and at least one sealing piece, the light machine cover body is provided with an installation cavity, the display chip is arranged in the installation cavity, the thermoelectric refrigerating unit is connected with the display chip and used for conducting heat dissipation on the display chip, and the at least one sealing piece is arranged between the display chip and the thermoelectric refrigerating unit and used for conducting heat dissipation on the display chip. Therefore, the display chip is sealed. The thermoelectric refrigerating unit can dissipate heat of the display chip to prevent the temperature of the display chip from being too high, at the same time, at least one sealing element is arranged between the display chip and the thermoelectric refrigerating unit, and the sealing element can seal the display chip to prevent the temperature of the display chip from being too high. And a large temperature difference formed on the surface of the display chip due to the fact that external cold air enters the light machine cover body and reaches the position of the display chip is avoided, so that water mist is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of projectors, and in particular to an optical machine heat dissipation sealing structure and a projection device. Background Art

[0002] As the brightness of DLP projectors continues to increase, the heat dissipation problem of DLP projectors continues to rise. The heat dissipation design for the internal heat sources of the projector, such as the lamp group, laser, diffusion wheel and DMD chip, is generally air-cooled and TEC-cooled. Air-cooled heat dissipation is to install the heat source, such as the laser, on the back of a larger aluminum extrusion, and blow away the heat through a fan; TEC heat dissipation uses electronic semiconductor heat dissipation, but also relies on a combination of aluminum extrusions and fans for heat dissipation. Although the TEC heat dissipation design is wired inside the projector, the problem of condensed water caused by the temperature difference is inevitable. The water mist at the DMD will harm the electronic components and even cause damage to the entire projector system.

[0003] The projection device in the prior art has a technical problem that the display chip is prone to generate water mist during use, thereby affecting the projection imaging. Utility Model Content

[0004] The utility model provides an optical machine heat dissipation sealing structure and a projection device, which can avoid the generation of water mist, thereby avoiding the influence on projection imaging and ensuring the normal use of the projection device.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] The embodiment of the utility model provides an optical machine heat dissipation sealing structure, which includes:

[0007] An optical machine housing, wherein the optical machine housing has a mounting cavity;

[0008] A display chip, wherein the display chip is disposed in the mounting cavity;

[0009] A thermoelectric cooler, which is connected to the display chip and is used to dissipate heat from the display chip;

[0010] At least one sealing member is disposed between the display chip and the thermoelectric cooler to seal the display chip.

[0011] Optionally, the optical engine heat dissipation sealing structure further includes a locking component, and at least one of the sealing components is detachably locked to a position on the optical engine cover corresponding to the display chip by the locking component to seal the display chip.

[0012] Optionally, the thermoelectric cooler includes a heat sink, the heat sink is connected to the display chip, and the heat sink is connected to the optical engine cover through the locking member.

[0013] Optionally, the optical machine cover includes a connecting bracket, the display chip is mounted on the connecting bracket, the connecting bracket and the heat sink are connected via the locking piece, at least one seal is disposed between the heat sink and the connecting bracket, and the seal is used to squeeze the display chip to seal the display chip.

[0014] Optionally, the optical machine heat dissipation sealing structure also includes a lamp group element and a light combining lighting element, and the lamp group element and the light combining lighting element are both arranged in the installation cavity, the lamp group element and the light combining lighting element are connected, and at least one seal is arranged between the lamp group element and the light combining lighting element.

[0015] Optionally, the optical machine heat dissipation sealing structure also includes a lens element, the lens element is arranged in the installation cavity, the lens element is connected to the light combining lighting element, and at least one seal is arranged between the lens element and the light combining lighting element.

[0016] Optionally, the optical machine heat dissipation sealing structure further includes a lens barrel, the lens barrel is connected to the lens element, and at least one of the seals is disposed between the lens barrel and the lens element.

[0017] Optionally, the sealing element is waterproof foam.

[0018] Optionally, the sealing member is a silicone pad.

[0019] An embodiment of the utility model further provides a projection device, comprising a housing and an optical-mechanical heat dissipation sealing structure, wherein the optical-mechanical heat dissipation sealing structure is connected to the housing.

[0020] The beneficial effects of the optical machine heat dissipation sealing structure and the projection device of the embodiment of the utility model include, for example:

[0021] The optical machine heat dissipation sealing structure includes an optical machine cover, a display chip, a thermoelectric cooler and at least one sealing member, wherein the optical machine cover has an installation cavity, the display chip is arranged in the installation cavity, the thermoelectric cooler is connected to the display chip, and is used to dissipate heat for the display chip, and at least one sealing member is arranged between the display chip and the thermoelectric cooler to seal the display chip. When the optical machine heat dissipation sealing structure is in use, the display chip is arranged in the installation cavity of the optical machine cover, the thermoelectric cooler is connected to the display chip, and can dissipate heat for the display chip to prevent the display chip from being overheated. At the same time, at least one sealing member is arranged between the display chip and the thermoelectric cooler, and the sealing member can seal the display chip to prevent external cold air from entering the optical machine cover to reach the position of the display chip, resulting in a large temperature difference on the surface of the display chip, thereby avoiding the generation of water mist. The optical machine heat dissipation sealing structure will not affect the projection imaging, ensuring the normal use of the projection.

[0022] The projection device comprises a housing and an optical-mechanical heat dissipation sealing structure, wherein the optical-mechanical heat dissipation sealing structure is connected to the housing. When in use, a display chip is arranged in the installation cavity of the optical-mechanical cover, and a thermoelectric cooler is connected to the display chip, which can dissipate heat for the display chip to prevent the display chip from being overheated. At the same time, at least one seal is arranged between the display chip and the thermoelectric cooler, and the seal can seal the display chip to prevent external cold air from entering the optical-mechanical cover to reach the position of the display chip, resulting in a large temperature difference on the surface of the display chip, thereby preventing the generation of water mist. The optical-mechanical heat dissipation sealing structure will not affect the projection imaging, thereby ensuring the normal use of the projection. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic structural diagram of the optical-mechanical heat dissipation sealing structure provided in this embodiment from a first perspective;

[0025] Figure 2 A structural schematic diagram of the optical-mechanical heat dissipation sealing structure provided in this embodiment from a second viewing angle;

[0026] Figure 3 A schematic structural diagram of the optical mechanical heat dissipation sealing structure provided in this embodiment from a third perspective.

[0027] Icons: 10-display chip; 20-thermoelectric cooler; 21-heat sink; 30-seal; 40-locking piece; 50-connecting bracket; 60-lamp assembly component; 70-light combining lighting component; 80-lens component; 100-optical machine heat dissipation sealing structure. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present utility model, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present utility model.

[0032] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0033] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0034] As the brightness of DLP projectors continues to increase, the heat dissipation problem of DLP projectors continues to rise. The heat dissipation design for the internal heat sources of the projector, such as the lamp group, laser, diffusion wheel and DMD chip, is generally air-cooled and TEC-cooled. Air-cooled heat dissipation is to install the heat source, such as the laser, on the back of a larger aluminum extrusion, and blow away the heat through a fan; TEC heat dissipation uses electronic semiconductor heat dissipation, but also relies on a combination of aluminum extrusions and fans for heat dissipation. Although the TEC heat dissipation design is wired inside the projector, the problem of condensed water caused by the temperature difference is inevitable. The water mist at the DMD will harm the electronic components and even cause damage to the entire projector system.

[0035] The projection device in the prior art has a technical problem that the display chip is prone to generate water mist during use, thereby affecting the projection imaging.

[0036] Please refer to Figure 1-Figure 3 This embodiment provides a projection device, which includes a housing and an optical-mechanical heat dissipation sealing structure 100. The optical-mechanical heat dissipation sealing structure 100 is disposed in the housing and can perform heat dissipation during projection. The projection device can effectively improve the above-mentioned technical problems, avoid the generation of water mist, thereby avoiding affecting the projection imaging, and ensure the normal use of the projection device.

[0037] Please refer to Figure 1-Figure 3 The present embodiment provides an optical machine heat dissipation sealing structure 100 including an optical machine cover, a display chip 10, a thermoelectric cooler 20 and at least one seal 30. The optical machine cover has an installation cavity, the display chip 10 is arranged in the installation cavity, the thermoelectric cooler 20 is connected to the display chip 10 for dissipating heat from the display chip 10, and at least one seal 30 is arranged between the display chip 10 and the thermoelectric cooler 20 to seal the display chip 10.

[0038] Specifically, the upper limit of the allowable temperature of the display chip 10 during operation is 90°C, and the operating temperature range of the thermoelectric cooler 20 is between 40°C and 65°C. The cold end of the thermoelectric cooler 20 can be attached to the display chip 10, thereby dissipating the heat of the display chip 10. Since there is a large difference between the operating temperature of the display chip 10 and the operating temperature of the thermoelectric cooler 20, a large temperature difference will be formed during the heat dissipation operation of the thermoelectric cooler 20 for the display chip 10, resulting in water mist. The generated water mist will contaminate the circuit of the display chip 10 inside the projection device, thereby affecting the projection imaging. In order to solve this technical problem, when the optical machine heat dissipation sealing structure 100 provided in the present embodiment is in use, the display chip 10 is arranged in the installation cavity of the optical machine cover, and the thermoelectric cooler 20 is connected to the display chip 10, which can dissipate heat for the display chip 10 to prevent the display chip 10 from being overheated. At the same time, at least one seal 30 is arranged between the display chip 10 and the thermoelectric cooler 20. The seal 30 can seal the display chip 10 to prevent external cold air from entering the optical machine cover and reaching the position of the display chip 10, resulting in a large temperature difference on the surface of the display chip 10, thereby avoiding the generation of water mist. The optical machine heat dissipation sealing structure 100 will not affect the projection imaging, thereby ensuring the normal use of the projection.

[0039] In this embodiment, the optical engine heat dissipation sealing structure 100 further includes a locking member 40 , and at least one sealing member 30 is detachably locked to a position on the optical engine cover corresponding to the display chip 10 by the locking member 40 to seal the display chip 10 .

[0040] It should be noted that the thermoelectric cooler 20 includes a heat sink 21, which is connected to the display chip 10, and the heat sink 21 is connected to the optical engine cover through a locking member 40. After the heat sink 21 is locked to the optical engine cover through the locking member 40, the cold end of the heat sink 21 can fit the display chip 10, thereby achieving heat dissipation for the display chip 10.

[0041] Specifically, the optical machine cover includes a connecting bracket 50, the display chip 10 is installed on the connecting bracket 50, the connecting bracket 50 and the heat sink 21 are connected by a locking member 40, at least one seal 30 is arranged between the heat sink 21 and the connecting bracket 50, and the seal 30 is used to squeeze the display chip 10 to seal the display chip 10.

[0042] In this embodiment, the locking member 40 is a screw. The number of the locking members 40 is four. In other embodiments, the number of the locking members 40 can be increased or decreased, which is not specifically limited here.

[0043] It can be understood that the optical-mechanical heat dissipation sealing structure 100 further includes a circuit board and a silicon interposer, and the circuit board, the silicon interposer and the display chip 10 are stacked in sequence.

[0044] It should also be explained that the optical machine heat dissipation sealing structure 100 also includes a lamp assembly component 60 and a light-combining lighting component 70, both of which are arranged in the installation cavity, and the lamp assembly component 60 and the light-combining lighting component 70 are connected, and at least one seal 30 is arranged between the lamp assembly component 60 and the light-combining lighting component 70. The seal 30 can seal the gap between the lamp assembly component 60 and the light-combining lighting component 70, thereby preventing external cold air from entering the optical machine, thereby generating a temperature difference. Among them, the lamp assembly component 60 and the light-combining lighting component 70 are detachably connected by screws, so that the seal 30 can be squeezed between the lamp assembly component 60 and the light-combining lighting component 70, thereby achieving sealing.

[0045] In this embodiment, the optical machine heat dissipation sealing structure 100 further includes a lens element 80, which is disposed in the installation cavity, and the lens element 80 is connected to the light-combining lighting element 70, and at least one seal 30 is disposed between the lens element 80 and the light-combining lighting element 70. The lens element 80 and the light-combining lighting element 70 are detachably connected by screws, and the seal 30 can be squeezed between the lens element 80 and the light-combining lighting element 70, thereby sealing the gap between the lens element 80 and the light-combining lighting element 70, thereby preventing external cold air from entering the optical machine, thereby generating a temperature difference.

[0046] Furthermore, the optical engine heat dissipation sealing structure 100 further includes a lens barrel, which is connected to the lens element 80, and at least one seal 30 is disposed between the lens barrel and the lens element 80. Similarly, the lens barrel and the lens element 80 are detachably connected by screws, and the seal 30 can be squeezed between the lens barrel and the lens element 80, thereby sealing the gap between the lens barrel and the lens element 80, thereby preventing external cold air from entering the optical engine, thereby generating a temperature difference.

[0047] In this embodiment, the sealing member 30 is a waterproof foam. In other embodiments, the sealing member 30 may be a silicone pad. This is not specifically limited here.

[0048] The optical machine heat dissipation sealing structure 100 and the projection device provided in this embodiment have at least the following advantages:

[0049] The upper limit of the allowable temperature of the display chip 10 during operation is 90°C, and the operating temperature range of the thermoelectric cooler 20 is between 40°C and 65°C. The cold end of the thermoelectric cooler 20 can be attached to the display chip 10, thereby dissipating the heat of the display chip 10. Since there is a large difference between the operating temperature of the display chip 10 and the operating temperature of the thermoelectric cooler 20, a large temperature difference will be formed when the thermoelectric cooler 20 dissipates the heat of the display chip 10, resulting in water mist. The generated water mist will contaminate the circuit of the display chip 10 inside the projection device, thereby affecting the projection imaging. In order to solve this technical problem, when the optical machine heat dissipation sealing structure 100 provided in the present embodiment is in use, the display chip 10 is arranged in the installation cavity of the optical machine cover, and the thermoelectric cooler 20 is connected to the display chip 10, which can dissipate heat for the display chip 10 to prevent the display chip 10 from being overheated. At the same time, at least one seal 30 is arranged between the display chip 10 and the thermoelectric cooler 20. The seal 30 can seal the display chip 10 to prevent external cold air from entering the optical machine cover and reaching the position of the display chip 10, resulting in a large temperature difference on the surface of the display chip 10, thereby avoiding the generation of water mist. The optical machine heat dissipation sealing structure 100 will not affect the projection imaging, thereby ensuring the normal use of the projection.

[0050] The optical machine heat dissipation sealing structure 100 can use the seal 30 to seal between the display chip 10 and the thermoelectric cooler 20, use the seal 30 to seal between the lamp assembly element 60 and the light combining lighting element 70, use the seal 30 to seal between the lens element 80 and the light combining lighting element 70, and use the seal 30 to seal between the lens barrel and the lens element 80, thereby achieving overall sealing of the optical machine, preventing external cold air from entering the optical machine to generate temperature difference, thereby affecting projection imaging and optical machine performance.

[0051] In summary, an embodiment of the utility model provides an optical machine heat dissipation sealing structure 100 and a projection device. The optical machine heat dissipation sealing structure 100 includes an optical machine cover, a display chip 10, a thermoelectric cooler 20 and at least one seal 30. The optical machine cover has an installation cavity, the display chip 10 is arranged in the installation cavity, the thermoelectric cooler 20 is connected to the display chip 10 for dissipating heat from the display chip 10, and at least one seal 30 is arranged between the display chip 10 and the thermoelectric cooler 20 to seal the display chip 10. When the optical machine heat dissipation sealing structure 100 is in use, the display chip 10 is set in the installation cavity of the optical machine cover, and the thermoelectric cooler 20 is connected to the display chip 10, which can dissipate heat for the display chip 10 to prevent the display chip 10 from being overheated. At the same time, at least one seal 30 is provided between the display chip 10 and the thermoelectric cooler 20. The seal 30 can seal the display chip 10 to prevent external cold air from entering the optical machine cover and reaching the position of the display chip 10, resulting in a large temperature difference on the surface of the display chip 10, thereby avoiding the generation of water mist. The optical machine heat dissipation sealing structure 100 will not affect the projection imaging, ensuring the normal use of the projection.

[0052] The projection device includes a housing and an optical-mechanical heat dissipation sealing structure 100, which is connected to the housing. When in use, the display chip 10 is arranged in the installation cavity of the optical-mechanical housing, and the thermoelectric cooler 20 is connected to the display chip 10, which can dissipate heat for the display chip 10 to prevent the display chip 10 from being overheated. At the same time, at least one seal 30 is arranged between the display chip 10 and the thermoelectric cooler 20, and the seal 30 can seal the display chip 10 to prevent external cold air from entering the optical-mechanical housing to reach the position of the display chip 10, resulting in a large temperature difference on the surface of the display chip 10, thereby avoiding the generation of water mist. The optical-mechanical heat dissipation sealing structure 100 will not affect the projection imaging, ensuring the normal use of the projection.

[0053] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. An optical machine heat dissipation sealing structure, characterized in that: include: An optical machine housing, wherein the optical machine housing has a mounting cavity; A display chip (10), the display chip (10) being arranged in the mounting cavity; a thermoelectric cooler (20), the thermoelectric cooler (20) being connected to the display chip (10) and used for dissipating heat from the display chip (10); At least one sealing member (30), wherein at least one of the sealing members (30) is arranged between the display chip (10) and the thermoelectric cooler (20) to seal the display chip (10).

2. The optical machine heat dissipation sealing structure according to claim 1, characterized in that: The optical engine heat dissipation sealing structure (100) further comprises a locking component (40), through which at least one of the sealing components (30) is detachably locked to a position on the optical engine cover corresponding to the display chip (10) so as to seal the display chip (10).

3. The optical machine heat dissipation sealing structure according to claim 2, characterized in that: The thermoelectric cooler (20) comprises a heat sink (21), the heat sink (21) is connected to the display chip (10), and the heat sink (21) is connected to the optical engine cover via the locking component (40).

4. The optical machine heat dissipation sealing structure according to claim 3, characterized in that: The optical engine cover comprises a connecting bracket (50), the display chip (10) is mounted on the connecting bracket (50), the connecting bracket (50) and the heat sink (21) are connected via the locking member (40), at least one sealing member (30) is arranged between the heat sink (21) and the connecting bracket (50), and the sealing member (30) is used to press the display chip (10) to seal the display chip (10).

5. The optical machine heat dissipation sealing structure according to claim 1, characterized in that: The optical machine heat dissipation sealing structure (100) further comprises a lamp group element (60) and a light combining lighting element (70), wherein the lamp group element (60) and the light combining lighting element (70) are both arranged in the installation cavity, the lamp group element (60) and the light combining lighting element (70) are connected, and at least one sealing member (30) is arranged between the lamp group element (60) and the light combining lighting element (70).

6. The optical machine heat dissipation sealing structure according to claim 5, characterized in that: The optical machine heat dissipation sealing structure (100) further comprises a lens element (80), wherein the lens element (80) is arranged in the installation cavity, the lens element (80) is connected to the light-combining lighting element (70), and at least one of the seals (30) is arranged between the lens element (80) and the light-combining lighting element (70).

7. The optical machine heat dissipation sealing structure according to claim 6, characterized in that: The optical machine heat dissipation sealing structure (100) further comprises a lens barrel, the lens barrel and the lens element (80) are connected, and at least one sealing member (30) is arranged between the lens barrel and the lens element (80).

8. The optical machine heat dissipation sealing structure according to any one of claims 1 to 7, characterized in that: The sealing element (30) is waterproof foam.

9. The optical machine heat dissipation sealing structure according to any one of claims 1 to 7, characterized in that: The sealing member (30) is a silicone pad.

10. A projection device, characterized in that: It comprises a housing and the optical-mechanical heat dissipation sealing structure according to any one of claims 1 to 9, wherein the optical-mechanical heat dissipation sealing structure (100) is connected to the housing.

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