Integrated circuit chip connection protection pad

Abstract

The utility model discloses an integrated circuit chip connection protection pad, which relates to the technical field of integrated circuit chips and comprises a circuit board, an integrated circuit chip is mounted on the upper surface of the circuit board, a plurality of groups of pins are connected to the front surface and the rear surface of the integrated circuit chip, and protection pad assemblies are arranged on the front surface and the rear surface of the integrated circuit chip. The protection pad assembly comprises a lower protection pad making contact with the upper surface of the circuit board, adsorption cylinders are arranged at the left end and the right end of the lower protection pad, butt joint frames are embedded in the positions, close to the left edge and the right edge, of the upper surface of the lower protection pad, and an upper protection pad is arranged on the upper surface of the lower protection pad. According to the utility model, the pins of the integrated circuit chip are protected through the protection pad assembly, so that the acting force during external force impact can be reduced, the situation that the pins deform to cause loosening or falling of connecting points is prevented, the upper and lower protection pads are more concise to disassemble and assemble, and meanwhile, the sucker can be firmly adsorbed on a circuit board, so that the service life of the integrated circuit chip is prolonged. And the installation of the integrated circuit chip is more efficient.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit chips, in particular to an integrated circuit chip connection protection pad. Background Art

[0002] An integrated circuit chip is an electronic component that includes a silicon substrate, at least one circuit, a fixed sealing ring, a grounding ring and at least one guard ring; an integrated circuit chip is composed of a large number of transistors; different integrated circuit chips have different integration scales, ranging from hundreds of millions to tens or hundreds of transistors; today, integrated circuit chips have become an indispensable object in our work and life; integrated circuit chips are connected to external circuit boards through pins.

[0003] An existing patent (authorization announcement number: CN 218647913 U) discloses an integrated circuit chip connection protection pad, in which a pin rod can be rotated clockwise to insert the pin rod into a pin hole to lock a positioning rod, and the pins of the integrated circuit chip can be protected by an upper protection pad and a lower protection pad. When impacted by an external force, the external force first acts on the upper protection pad and the lower protection pad, reducing the force of the external force on the pins of the integrated circuit chip, thereby forming an integrated circuit chip connection protection pad with good protection effect, which plays a protective role on the pins of the integrated circuit chip.

[0004] However, the above technical solution still has certain defects. When the positioning rod is extended into the positioning sleeve and the pin hole is located in the positioning sleeve, it is impossible to determine whether the pin hole is aligned with the pin rod, resulting in multiple attempts to insert the end of the pin rod into the pin hole. Similarly, in order to achieve the purpose of adsorption and fixation of the suction cup, it is necessary to manually rotate the threaded rod one by one, which makes the fixation of the upper protection pad and the lower protection pad more time-consuming. For this reason, an integrated circuit chip connection protection pad is proposed. Utility Model Content

[0005] Based on this, the purpose of the utility model is to provide an integrated circuit chip connection protection pad to solve the technical problems raised in the above background.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an integrated circuit chip connection protection pad, comprising a circuit board, an integrated circuit chip is mounted on the upper surface of the circuit board, a plurality of groups of pins are connected to the front and rear surfaces of the integrated circuit chip, and a protection pad assembly is provided on the front and rear surfaces of the integrated circuit chip;

[0007] The protection pad assembly includes a lower protection pad in contact with the upper surface of the circuit board, adsorption cylinders are provided at the left and right ends of the lower protection pad, a docking frame is inlaid on the upper surface of the lower protection pad near the left and right edges, an upper protection pad is provided on the upper surface of the lower protection pad, a pair of ladder bars extending into the docking frame are provided at the bottom end of the upper protection pad, a docking hole is provided on the front surface of the ladder bar, a ladder block extending into the lower protection pad is slidably provided in the docking frame, one end of the ladder block extends into the docking hole, and the other end of the ladder block is provided with a handle rod extending out of the lower protection pad, and a third piston is slidably provided in the docking frame through a telescopic rod;

[0008] The outer wall of the adsorption cylinder is provided with an air pipe extending into the lower protection pad and connected to the docking frame. The bottom end of the adsorption cylinder is connected with a suction cup. A second piston is slidably provided at the lower position inside the adsorption cylinder. The top of the second piston is connected to the first piston through a longitudinal rod.

[0009] As a preferred technical solution of an integrated circuit chip connection protection pad of the utility model, the outer wall of the handle rod is located inside the lower protection pad and is sleeved with a reset spring, and the two ends of the reset spring are respectively fixed to the outer wall of the handle rod and the end of the ladder block.

[0010] As a preferred technical solution for an integrated circuit chip connection protection pad of the utility model, a pin groove is provided on the upper surface of the lower protection pad at the position where the pin contacts the lower protection pad, side panels are provided on both sides of the pin on the front surface of the lower protection pad, and a top plate in contact with the upper surface of the pin is provided on the front surface of the upper protection pad.

[0011] As a preferred technical solution of an integrated circuit chip connection protection pad of the utility model, the outer wall of the adsorption cylinder is sleeved with two groups of connecting arms, and one end of the connecting arm is fixed to the lower protection pad.

[0012] As a preferred technical solution of an integrated circuit chip connection protection pad of the utility model, the second piston is located below the end of the trachea, and the highest position of the second piston is lower than the horizontal plane of the end of the trachea.

[0013] As a preferred technical solution of an integrated circuit chip connection protection pad of the utility model, a plurality of groups of shielding rods are fixed between two groups of upper protection pads, and the shielding rods are located above the integrated circuit chip.

[0014] As a preferred technical solution for an integrated circuit chip connection protection pad of the utility model, two groups of telescopic springs are fixed on the inner wall of the adsorption cylinder on both sides of the through hole of the adsorption cylinder, and the bottom end of the telescopic spring is fixed to the top end of the first piston.

[0015] In summary, the utility model mainly has the following beneficial effects:

[0016] The utility model protects the pins of the integrated circuit chip through the protection pad assembly, which can reduce the force when an external force impacts, prevent the pins from being deformed and the connection points from being loose or falling off, and the disassembly and assembly of the upper and lower protection pads is simpler. At the same time, the suction cup can be firmly adsorbed on the circuit board, making the installation of the integrated circuit chip more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional diagram of the utility model;

[0018] Figure 2 This is a structural diagram of the chip and protection pad assembly of the utility model;

[0019] Figure 3 This is a structural diagram of the protection pad and integrated circuit chip of the utility model;

[0020] Figure 4 This is a bottom view of the upper protection pad of the utility model;

[0021] Figure 5 For the utility model Figure 4 Enlarged view of point A in the middle;

[0022] Figure 6 It is a front view of the lower protection pad of the utility model;

[0023] Figure 7 For the utility model Figure 6 Enlarged view of point B in the middle;

[0024] Figure 8 This is a cutaway view of the end portion of the lower protection pad of the present invention.

[0025] In the figure: 100, circuit board; 200, protection pad assembly;

[0026] 110. integrated circuit chip; 111. pin;

[0027] 210, upper protection pad; 211, shielding rod; 212, ladder bar; 213, docking hole; 220, lower protection pad; 221, docking frame; 222, pin slot; 223, third piston; 224, ladder block; 225, handle rod; 230, adsorption cylinder; 231, first piston; 232, second piston; 233, suction cup; 234, connecting arm; 235, air pipe; 236, telescopic spring. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The embodiments described below with reference to the drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model.

[0029] The following describes an embodiment of the utility model based on its overall structure.

[0030] An integrated circuit chip connection protection pad, such as Figures 1 to 8 As shown, it includes a circuit board 100, an integrated circuit chip 110 is mounted on the upper surface of the circuit board 100, a plurality of groups of pins 111 are connected to the front and rear surfaces of the integrated circuit chip 110, and a protection pad assembly 200 is provided on the front and rear surfaces of the integrated circuit chip 110;

[0031] The protection pad assembly 200 includes a lower protection pad 220 in contact with the upper surface of the circuit board 100, and adsorption cylinders 230 are provided at the left and right ends of the lower protection pad 220. A docking frame 221 is inlaid on the upper surface of the lower protection pad 220 near the left and right edges. An upper protection pad 210 is provided on the upper surface of the lower protection pad 220, and a pair of ladder bars 212 extending into the docking frame 221 are provided at the bottom end of the upper protection pad 210. A docking hole 213 is opened on the front surface of the ladder bar 212. A ladder block 224 extending into the lower protection pad 220 is slidably provided in the docking frame 221, one end of the ladder block 224 extends into the docking hole 213, and the other end of the ladder block 224 is provided with a handle bar 225 extending to the outside of the lower protection pad 220. A third piston 223 is slidably provided in the docking frame 221 through a telescopic rod;

[0032] An outer wall of the adsorption cylinder 230 is provided with an air pipe 235 extending into the lower protection pad 220 and connected to the docking frame 221. The bottom end of the adsorption cylinder 230 is connected with a suction cup 233. A second piston 232 is slidably provided at a lower position inside the adsorption cylinder 230. The top of the second piston 232 is connected to the first piston 231 through a longitudinal rod. Two groups of telescopic springs 236 are fixed on the inner wall of the adsorption cylinder 230 on both sides of the through hole of the adsorption cylinder 230, and the bottom end of the telescopic spring 236 is fixed to the top of the first piston 231.

[0033] First, two sets of lower protection pads 220 are placed on the circuit board 100, and the pins 111 are placed in the pin slots 222 and in contact with the circuit board 100. Then, the upper protection pad 210 is placed directly above the lower protection pad 220 and a downward external force is applied, so that the bottom end of the ladder bar 212 extends into the docking frame 221, and the ladder block 224 is squeezed to move horizontally and then snap into the docking hole 213, so that the upper protection pad 210 and the lower protection pad 220 are docked, and the pin leads can be protected from external force impact.

[0034] While the ladder bar 212 extends into the docking frame 221, it pushes the third piston 223 to lower in the docking frame 221, and squeezes the air in the docking frame 221 to flow into the air pipe 235, and finally enters the position between the first piston 231 and the second piston 232 in the adsorption cylinder 230. The gas supports the first piston 231 and the second piston 232 to move upward synchronously, so that the contact position between the suction cup 233 and the circuit board 100 is in a negative pressure state, thereby achieving the purpose of fixing the adsorption cylinder 230 and the circuit board 100, and finally fixing the lower protection pad 220 and the circuit board 100, thereby better avoiding the movement of the integrated circuit chip 110.

[0035] Please refer to Figure 8 The outer wall of the handle bar 225 is located in the lower protection pad 220 and is sleeved with a return spring, and the two ends of the return spring are respectively fixed to the outer wall of the handle bar 225 and the end of the ladder block 224.

[0036] The handle bar 225 can be used to apply external force to the ladder block 224 to move it, thereby contacting and locking the ladder bar 212, or when the ladder block 224 is squeezed by the ladder bar 212, it can move laterally and then recover and enter the docking hole 213 to achieve the locking effect.

[0037] Please refer to Figure 1 , Figure 2 and Figure 3 A pin groove 222 is provided at the position where the upper surface of the lower protection pad 220 contacts the pin 111, a side plate is provided on both sides of the front surface of the lower protection pad 220, and a top plate in contact with the upper surface of the pin 111 is provided on the front surface of the upper protection pad 210.

[0038] The pin grooves 222 can be used to facilitate the pins 111 to extend through the lower protection pad and connect to the circuit board 100 , while the side panels, the top panel and the circuit board 100 form a closed space, which provides all-round protection for the pins 111 .

[0039] Please refer to Figure 1 , Figure 2 and Figure 3 Two sets of connecting arms 234 are sleeved on the outer wall of the adsorption cylinder 230 , and one end of the connecting arm 234 is fixed to the lower protection pad 220 .

[0040] It has a certain fixing effect on the adsorption cylinder 230 and can move synchronously with the lower protection pad 220, thereby making it more convenient to fix the chip.

[0041] Please refer to Figure 7 The second piston 232 is located below the end of the air pipe 235 , and the highest position of the second piston 232 is lower than the horizontal plane of the end of the air pipe 235 .

[0042] Ensuring that the gas entering from the air pipe 235 is located between the first piston 231 and the second piston 232 can enable the first piston 231 to move upward while preventing the second piston 232 from blocking the air pipe 235 .

[0043] Please refer to Figure 1 , Figure 2 and Figure 4 A plurality of shielding rods 211 are fixed between the two sets of upper protection pads 210 , and the shielding rods 211 are located above the integrated circuit chip 110 .

[0044] The integrated circuit chip 110 is protected from being hit by external forces.

[0045] When in use, the parts of the device not involved are the same as those in the prior art or can be implemented using the prior art.

[0046] Although an embodiment of the utility model has been shown and described, this specific embodiment is merely an explanation of the utility model and is not a limitation of the utility model. The specific features, structures, materials or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions and variations to the embodiments without creative contributions as needed without departing from the principles and purpose of the utility model. However, as long as they are within the scope of the claims of the utility model, they are protected by patent law.

Claims

1. An integrated circuit chip connection protection pad, comprising a circuit board (100), characterized in that: An integrated circuit chip (110) is mounted on the upper surface of the circuit board (100), a plurality of groups of pins (111) are connected to the front and rear surfaces of the integrated circuit chip (110), and a protection pad assembly (200) is provided on the front and rear surfaces of the integrated circuit chip (110); The protective pad assembly (200) comprises a lower protective pad (220) in contact with the upper surface of the circuit board (100), the left and right ends of the lower protective pad (220) are both provided with adsorption cylinders (230), the upper surface of the lower protective pad (220) is inlaid with a docking frame (221) near the left and right edges, the upper surface of the lower protective pad (220) is provided with an upper protective pad (210), and the bottom end of the upper protective pad (210) is provided with a pair of ladder bars extending into the docking frame (221). (212), a docking hole (213) is provided on the front surface of the ladder bar (212), a ladder block (224) extending into the lower protection pad (220) is slidably provided in the docking frame (221), one end of the ladder block (224) extends into the docking hole (213), and the other end of the ladder block (224) is provided with a handle rod (225) extending out of the lower protection pad (220), and a third piston (223) is slidably provided in the docking frame (221) via a telescopic rod; An air pipe (235) extending into the lower protective pad (220) and connected to the docking frame (221) is provided on the outer wall of the adsorption cylinder (230); a suction cup (233) is connected to the bottom end of the adsorption cylinder (230); a second piston (232) is slidably provided at a lower position inside the adsorption cylinder (230); and the top of the second piston (232) is connected to the first piston (231) via a longitudinal rod.

2. The integrated circuit chip connection protection pad according to claim 1, characterized in that: The outer wall of the handle bar (225) is located inside the lower protection pad (220) and is sleeved with a return spring, and the two ends of the return spring are respectively fixed to the outer wall of the handle bar (225) and the end of the ladder block (224).

3. The integrated circuit chip connection protection pad according to claim 1, characterized in that: A pin groove (222) is provided at a position where the upper surface of the lower protection pad (220) contacts the pin (111); a side plate is provided on both sides of the front surface of the lower protection pad (220) located on the pin (111); and a top plate is provided on the front surface of the upper protection pad (210) that contacts the upper surface of the pin (111).

4. The integrated circuit chip connection protection pad according to claim 1, characterized in that: Two groups of connecting arms (234) are sleeved on the outer wall of the adsorption cylinder (230), and one end of the connecting arm (234) is fixed to the lower protection pad (220).

5. The integrated circuit chip connection protection pad according to claim 1, characterized in that: The second piston (232) is located below the end of the air pipe (235), and the highest position of the second piston (232) is lower than the horizontal plane of the end of the air pipe (235).

6. The integrated circuit chip connection protection pad according to claim 1, characterized in that: A plurality of groups of shielding rods (211) are fixed between the two groups of upper protection pads (210), and the shielding rods (211) are located above the integrated circuit chip (110).

7. The integrated circuit chip connection protection pad according to claim 1, characterized in that: Two groups of telescopic springs (236) are fixed on the inner wall of the adsorption cylinder (230) on both sides of the through hole of the adsorption cylinder (230), and the bottom end of the telescopic spring (236) is fixed to the top end of the first piston (231).

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