BMS heat dissipation structure

Abstract

The utility model discloses a BMS heat dissipation structure. The BMS heat dissipation structure comprises a BMS board. The plastic bracket is connected with the BMS plate; the plastic bracket is connected with the battery compartment wall; a first heat conduction pad is arranged between the BMS plate and the plastic bracket perpendicular to the BMS plate, and a cooling fin is arranged between the first heat conduction pad and the battery compartment wall; and / or a first heat conduction pad is arranged between the BMS plate and the battery compartment wall parallel to the BMS plate, heat of the BMS plate can be transmitted to the battery compartment wall through the cooling fins and / or the first heat conduction pad, an efficient heat dissipation channel is formed, heat conduction between the BMS and the battery compartment box body is achieved, and the heat dissipation efficiency of the battery compartment box body is improved. And meanwhile, efficient heat dissipation can still be achieved after the battery compartment is filled with a pouring sealant.

Description

Technical Field

[0001] The utility model relates to the technical field related to batteries, and in particular to a BMS heat dissipation structure. Background Art

[0002] In battery pack design, the heat dissipation performance of the battery management system (BMS) is a key factor affecting its operational stability and safety. Especially in applications where the battery compartment is filled with potting compound, ensuring effective heat dissipation within a sealed environment filled with potting compound with poor thermal conductivity has become a pressing issue in battery pack design.

[0003] In existing battery pack designs, in order to address the negative impact of potting compound on BMS heat dissipation, a common practice is to divide the interior of the battery pack into separate battery compartments and electrical compartments. Although this design prevents the potting compound from directly contacting the BMS, it also introduces a series of new problems. First, the separation of the battery compartment and the electrical compartment requires independent heat dissipation devices for electrical components (such as the BMS) and battery cells, which undoubtedly increases the number of components required for the system, thereby increasing the overall cost of the battery pack. In addition, a complex heat dissipation design may also make the battery pack structure more complex, thereby affecting its overall performance and reliability.

[0004] On the other hand, if the BMS is directly set in the battery compartment and filled with potting compound, although the structural design of the battery pack is simplified, the thermal conductivity of the potting compound is usually poor, which easily forms a thermal resistance between the BMS and the potting compound, resulting in the heat generated by the BMS unable to be dissipated in a timely and effective manner, thereby seriously affecting the working stability of the BMS and the safety of the battery pack. Utility Model Content

[0005] To overcome at least one of the above-mentioned drawbacks of the prior art, the present invention provides a BMS heat dissipation structure. The BMS and heat dissipation structure are directly mounted in the battery compartment and encapsulated by potting compound, thereby reducing the number of heat dissipation components while achieving effective heat dissipation for the BMS.

[0006] The technical solution adopted by the present invention to solve the problem is:

[0007] A BMS heat dissipation structure includes: a BMS board; a plastic bracket connected to the BMS board; and a battery compartment wall to which the plastic bracket is connected; a first thermal pad is provided between the BMS board and the plastic bracket perpendicular to the BMS board, and a heat sink is provided between the first thermal pad and the battery compartment wall; and / or a first thermal pad is provided between the BMS board and the battery compartment wall parallel to the BMS board.

[0008] By adopting the above solution, the heat of the BMS board can be transferred to the battery compartment wall through the heat sink and / or the first thermal pad, forming an efficient heat dissipation channel, realizing heat conduction between the BMS and the battery compartment body, and at the same time, efficient heat dissipation can still be achieved after the battery compartment is filled with potting glue.

[0009] Furthermore, the plastic bracket includes a first surface and a second surface opposite to the first surface, the first surface is equipped with a BMS board, and a first support buckle is provided between the first surface and the BMS board; and / or, the second surface is equipped with a BMS board, and a second support buckle is provided between the second surface and the BMS board.

[0010] By adopting the above solution, the first support buckle and / or the second support buckle are conducive to transferring heat to the battery compartment wall through the heat sink and / or the first thermal pad for heat dissipation.

[0011] Furthermore, a mounting piece is vertically extended from one side edge of the plastic bracket toward the first surface, and the mounting piece is provided with an assembly hole.

[0012] By adopting the above solution, the plastic bracket can be conveniently installed in the battery compartment and can be fixed to other components through the assembly holes, thereby improving the stability and reliability of the system.

[0013] Furthermore, the mounting member includes a first mounting member and a second mounting member that are spaced apart from each other, a clamping device is provided between the first mounting member and the second mounting member, and the heat sink is clamped between the clamping device.

[0014] By adopting the above solution, the clamping device can fix the heat dissipation surface, thereby stably transferring the heat of the first thermal pad to the battery compartment wall for heat dissipation.

[0015] Furthermore, the heat sink includes: a clamped portion connected and fixed to the clamping device; a heat transfer portion, which is arranged in contact with the first surface; and a thermal contact portion, which is clamped between the first surface and the first thermal pad.

[0016] By adopting the above solution, the heat of the first thermal pad can be transferred to the clamped part through the thermal contact part and the heat transfer part in sequence, thereby achieving a heat dissipation effect through contact with the battery compartment wall.

[0017] Furthermore, the area of ​​the thermal contact portion is not less than the area of ​​the first thermal pad.

[0018] By adopting the above solution, the heat exchange area of ​​the thermal contact portion is increased, thereby improving the heat exchange effect.

[0019] Furthermore, the clamped part is arranged perpendicularly to the heat transfer part, and the clamping device includes a first clamping block and a second clamping block. The first clamping block and the second clamping block are provided with clamping grooves arranged opposite to each other, and the two ends of the clamped part are respectively plugged into the two clamping grooves.

[0020] By adopting the above solution, the assembly efficiency of the clamped part can be improved through insertion and clamping, while the clamping stability of the clamped part can be met.

[0021] Furthermore, the battery compartment wall includes a vertical plate and a bottom plate vertically connected to each other, the plastic bracket is provided with an extended clip connected to the vertical plate, the vertical plate is provided with a bayonet corresponding to the vertical plate, and the mounting part of the plastic bracket is fitted and connected to the bottom plate.

[0022] By adopting the above solution, the plastic bracket is connected to both the vertical plate and the bottom plate of the battery compartment wall, further enhancing the connection stability between the plastic bracket and the battery compartment wall. At the same time, the connection between the extended clip and the bayonet can achieve a quick and stable connection between the plastic bracket and the vertical plate, simplifying the installation process and improving the overall stability and reliability of the system.

[0023] Furthermore, a second thermal pad is provided between the bottom plate and the clamped portion.

[0024] By adopting the above solution, the heat transfer efficiency between the clamped part and the bottom plate is improved.

[0025] Furthermore, the first support buckle and the second support buckle both include: a support column, one end of which is fixedly connected to the plastic bracket, and the other end is provided with a card joint, and the card joint is clamped with the BMS board; a triangular rib, which is provided on the side wall of the support column and distributed axially along the support column.

[0026] By adopting the above solution, the design of the card joint enables the support column to be snapped into the BMS board, thereby ensuring that the BMS board is firmly installed on the plastic bracket. The triangular ribs are distributed circumferentially along the axial direction of the support column. This design can effectively prevent the support column from deforming or breaking when subjected to force, while increasing the contact area between the support column and the plastic bracket, thereby further enhancing the connection stability between the BMS board and the plastic bracket.

[0027] In summary, the BMS heat dissipation structure provided by the present invention has the following technical effects:

[0028] 1. By placing the BMS and heat dissipation structure directly inside the battery compartment, the separation of the battery compartment and the electrical compartment is avoided, thereby reducing the need for independent heat dissipation devices, reducing the number of components required for the system, and thus reducing the overall cost of the battery pack. At the same time, the simplified design also makes the battery pack structure simpler, improving its overall performance and reliability;

[0029] 2. A first thermal pad and heat sink are installed between the BMS board and the plastic bracket, or between the plastic bracket and the battery compartment wall, forming an efficient heat dissipation channel. These heat dissipation elements can quickly transfer the heat generated by the BMS board to the battery compartment wall, achieving heat conduction between the BMS and the battery compartment body. Even if the battery compartment is filled with potting compound with poor thermal conductivity, efficient heat dissipation can still be guaranteed, ensuring the stability of the BMS and the safety of the battery pack.

[0030] 3. The heat dissipation structure can prevent the BMS from malfunctioning or being damaged due to overheating, thereby improving the safety of the battery pack. In addition, the stable heat dissipation performance also helps to extend the service life of the BMS, reduce the failure rate and maintenance costs;

[0031] 4. This heat dissipation structure is highly adaptable and can be applied to BMS and battery packs of different specifications and models. By adjusting the size and layout of the heat dissipation components, different heat dissipation requirements can be flexibly met. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a schematic diagram of the three-dimensional structure of Example 1 of the present utility model;

[0033] Figure 2 This is a schematic diagram of the partial explosion structure of Example 1 of the present utility model;

[0034] Figure 3 This is a schematic diagram of the top structure of Example 1 of the present utility model;

[0035] Figure 4 This is a schematic diagram of the partial explosion structure of Example 2 of the present utility model;

[0036] Figure 5 This is a schematic diagram of the partial explosion structure of Example 3 of the present utility model;

[0037] Figure 6 This is a schematic structural diagram of the first side of the plastic bracket of Example 3 of the present utility model;

[0038] Figure 7 This is a schematic diagram of the top structure of Example 3 of the present utility model.

[0039] Among them, the meanings of the figure marks are as follows: 1. BMS board; 2. Plastic bracket; 21. First surface; 22. Second surface; 23. Spacing space; 24. Mounting part; 241. First mounting part; 242. Second mounting part; 243. Assembly hole; 25. Extended clip; 3. Battery compartment wall; 31. Vertical plate; 311. Clip; 32. Bottom plate; 4. First thermal pad; 5. Heat sink; 51. Clamped part; 52. Heat transfer part; 53. Thermal contact part; 6. First support buckle; 61. Support column; 62. Card joint; 63. Triangular rib; 7. Second support buckle; 8. Clamping device; 81. First clamping block; 82. Second clamping block; 83. Clamping groove; 9. Second thermal pad. DETAILED DESCRIPTION

[0040] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described and discussed below in conjunction with the drawings of the present invention. Obviously, what is described here is only a part of the examples of the present invention, not all the examples. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0041] In order to facilitate the understanding of the embodiments of the present invention, the following will be further explained with reference to specific embodiments as examples in conjunction with the drawings, and each embodiment does not constitute a limitation on the embodiments of the present invention.

[0042] In the description of the present invention, it should be noted that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0043] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0044] See Figure 1-3As shown, a BMS heat dissipation structure is disclosed, including a BMS board 1, a plastic bracket 2 and a battery compartment wall 3, the battery compartment wall 3 includes a vertical plate 31 and a bottom plate 32 vertically connected to each other, the vertical plate 31 and the bottom plate 32 are the side wall and bottom wall of the battery pack, the plastic bracket 2 includes a first surface 21 and a second surface 22 opposite to the first surface 21, the second surface 22 faces the vertical plate 31, the BMS board 1 is connected to the first surface 21 at intervals, specifically, a first support buckle 6 is provided between the first surface 21 and the BMS board 1, and an interval space 23 is formed between the first surface 21 and the BMS board 1. When the battery compartment is filled with potting glue, it can be filled to the interval space. Due to the heat resistance of the potting glue, the heat energy between the plastic bracket and the BMS board can be avoided. A first thermal pad 4 is provided between the BMS board 1 and the plastic bracket 2, and a heat sink 5 is provided between the first thermal pad 4 and the battery compartment wall 3. Preferably, a heat sink 5 is provided between the first thermal pad 4 and the bottom plate 32. The heat of the BMS board 1 can be transferred to the bottom wall of the battery compartment wall 3 through the heat sink 5 and the first thermal pad 4, forming an efficient heat dissipation channel, realizing heat conduction between the BMS and the battery compartment box, and at the same time, efficient heat dissipation can still be achieved after the battery compartment is filled with potting glue.

[0045] To improve the assembly stability between the plastic bracket 2 and the battery compartment wall 3, in some embodiments, a mounting member 24 extends perpendicularly toward the first surface 21 from a side edge of the plastic bracket 2 near the base plate 32. The mounting member 24 is provided with an assembly hole 243. The mounting member 24 can be assembled and fixed to the base plate 32 using fasteners such as screws. This allows the plastic bracket 2 to be conveniently installed in the battery compartment and can be fixed to other components through the assembly hole 243, thereby improving the stability and reliability of the system. Optionally, an extension clip 25 can be provided on the second surface 22 of the plastic bracket 2, and the vertical plate 31 is provided with a bayonet 311 corresponding to the extension clip 25, which can be clipped and fixed to the vertical plate 31 of the battery compartment wall 3. In this embodiment, two mounting members 24 are provided, namely a first mounting member 241 and a second mounting member 242, and the first mounting member 241 and the second mounting member 242 are spaced apart.

[0046] In order to improve the assembly stability of the heat sink 5, in some embodiments, a clamping device 8 is provided between the first mounting member 241 and the second mounting member 242, and the heat sink 5 is clamped between the clamping device 8. Specifically, the heat sink 5 includes a clamped portion 51, a heat transfer portion 52, and a thermal contact portion 53 connected in sequence. The clamping device 8 includes a first clamping block 81 and a second clamping block 82. The first clamping block 81 and the second clamping block 82 are provided with clamping grooves 83 arranged opposite to each other. The two ends of the clamped portion 51 are respectively plugged into the two clamping grooves 83. The clamped portion 51 is connected and fixed to the clamping device 8. Through insertion and clamping, the assembly efficiency of the clamped portion 51 can be improved, and the clamping stability of the clamped portion 51 can be met. The heat transfer portion 52 is arranged in contact with the first surface 21, and the thermal contact portion 53 is clamped between the first surface 21 and the first thermal pad 4, so that the heat of the first thermal pad 4 can be transferred to the clamped portion 51 through the thermal contact portion 53 and the heat transfer portion 52 in sequence, thereby achieving a contact heat dissipation effect with the battery compartment wall 3.

[0047] In this embodiment, a second thermal pad 9 is provided between the bottom plate 32 and the clamped portion 51 to improve the heat transfer efficiency between the clamped member and the bottom plate 32 .

[0048] It should be noted that the area of ​​the thermal contact portion 53 is not less than the area of ​​the first thermal pad 4. Preferably, the area of ​​the thermal contact portion 53 is larger than the area of ​​the first thermal pad 4 to increase the heat exchange area of ​​the thermal contact portion 53, thereby improving the heat exchange effect.

[0049] Optionally, the clamped portion 51 and the heat transfer portion 52 are arranged vertically to adapt to the vertically connected vertical plate 31 and the bottom plate 32. Of course, in some battery boxes, the vertical plate 31 and the bottom plate 32 are not vertical. Therefore, the clamped portion 51 and the heat transfer portion 52 are arranged to fit the vertical plate 31 and the bottom plate 32 to meet the angle between the two and improve the assembly stability.

[0050] In some embodiments, the first support buckle 6 includes a support column 61 and a triangular rib 63. One end of the support column 61 is fixedly connected to the first surface 21 of the plastic bracket 2, and the other end is provided with a clamping joint 62. Preferably, the clamping joint 62 comprises two spaced apart clamping blocks with curved outer surfaces that can move toward each other under force, facilitating clamping to the perforations of the BMS board 1, thereby achieving a clamping effect between the clamping joint 62 and the BMS board 1. The design of the clamping joint 62 enables the support column 61 to be clamped to the BMS board 1, thereby ensuring that the BMS board 1 is securely mounted on the plastic bracket 2. The triangular ribs 63 are provided on the sidewalls of the support column 61 and are distributed circumferentially along the axial direction of the support column 61. Preferably, there are four triangular ribs 63. This design effectively prevents deformation or breakage of the support column 61 under force, while increasing the contact area between the support column 61 and the plastic bracket 2, thereby further enhancing the connection stability between the BMS board 1 and the plastic bracket 2.

[0051] See Figure 4 As shown, a BMS heat dissipation structure is disclosed, including a BMS board 1, a plastic bracket 2 and a battery compartment wall 3, wherein the battery compartment wall 3 includes a vertical plate 31 and a bottom plate 32 vertically connected to each other, and the vertical plate 31 and the bottom plate 32 are the side wall and bottom wall of the battery pack, respectively. The plastic bracket 2 includes a first surface 21 and a second surface 22 opposite to the first surface 21, and the second surface 22 faces the vertical plate 31. The two BMS boards 1 are connected to the second surface 22 at intervals. Specifically, a second support buckle 7 is provided between the second surface 22 and the BMS board 1, and an interval space 23 is formed between the second surface 22 and the vertical plate 31. A first thermal pad 4 is provided between the BMS board 1 and the vertical plate 31, and the heat of the BMS board 1 can be transferred to the side wall of the battery compartment wall 3 through the first thermal pad 4, thereby forming an efficient heat dissipation channel, realizing heat conduction between the BMS and the battery compartment box, and at the same time, efficient heat dissipation can still be achieved after the battery compartment is filled with potting glue. Optionally, there may be multiple BMS boards 1 . In this embodiment, there are two BMS boards 1 .

[0052] To improve the assembly stability between the plastic bracket 2 and the battery compartment wall 3, in some embodiments, a mounting member 24 extends perpendicularly toward the first surface 21 from a side edge of the plastic bracket 2 near the base plate 32. The mounting member 24 is provided with an assembly hole 243. The mounting member 24 can be assembled and fixed to the base plate 32 using fasteners such as screws. This allows the plastic bracket 2 to be conveniently installed in the battery compartment and can be fixed to other components through the assembly hole 243, thereby improving the stability and reliability of the system. Optionally, an extension clip 25 can be provided on the second surface 22 of the plastic bracket 2, and the vertical plate 31 is provided with a bayonet 311 corresponding to the extension clip 25, which can be clipped and fixed to the vertical plate 31 of the battery compartment wall 3. In this embodiment, two mounting members 24 are provided, namely a first mounting member 241 and a second mounting member 242, and the first mounting member 241 and the second mounting member 242 are spaced apart.

[0053] In some embodiments, the first support buckle 6 includes a support column 61 and a triangular rib 63. One end of the support column 61 is fixedly connected to the first surface 21 of the plastic bracket 2, and the other end is provided with a clamping joint 62. Preferably, the clamping joint 62 comprises two spaced apart clamping blocks with curved outer surfaces that can move toward each other under force, facilitating clamping to the perforations of the BMS board 1, thereby achieving a clamping effect between the clamping joint 62 and the BMS board 1. The design of the clamping joint 62 enables the support column 61 to be clamped to the BMS board 1, thereby ensuring that the BMS board 1 is securely mounted on the plastic bracket 2. The triangular ribs 63 are provided on the sidewalls of the support column 61 and are distributed circumferentially along the axial direction of the support column 61. Preferably, there are four triangular ribs 63. This design effectively prevents deformation or breakage of the support column 61 under force, while increasing the contact area between the support column 61 and the plastic bracket 2, thereby further enhancing the connection stability between the BMS board 1 and the plastic bracket 2.

[0054] See Figure 5-7As shown, specifically, a BMS heat dissipation structure is disclosed, including a BMS board 1, a plastic bracket 2 and a battery compartment wall 3, the battery compartment wall 3 includes a vertical plate 31 and a bottom plate 32 vertically connected to each other, the vertical plate 31 and the bottom plate 32 are the side wall and bottom wall of the battery pack, the plastic bracket 2 includes a first surface 21 and a second surface 22 opposite to the first surface 21, the second surface 22 faces the vertical plate 31, the first surface 21 and the second surface 22 are both provided with a BMS board 1, in this embodiment, the first surface 21 is provided with a BMS board 1, the second surface 22 is provided with two BMS boards 1, and the three BMS boards 1 are staggered. Specifically, the first surface 21 is provided with a BMS board 1, and the second surface 22 is provided with two BMS boards 1. At the same time, the three BMS boards 1 are staggered. A first support buckle 6 is provided between one side 21 and the BMS board 1, and a spacing space 23 is formed between the first side 21 and the BMS board 1. A first thermal pad 4 is provided between the BMS board 1 and the plastic bracket 2, and a heat sink 5 is provided between the first thermal pad 4 and the battery compartment wall 3. A second support buckle 7 is provided between the second side 22 and the BMS board 1, and a spacing space 23 is also formed between the second side 22 and the vertical plate 31. A first thermal pad 4 is also provided between the BMS board 1 and the vertical plate 31. Each BMS board 1 is connected to the battery compartment wall 3, and heat transfer between the BMS board 1 and the battery compartment wall 3 is used to dissipate heat from the BMS board 1.

[0055] The plastic bracket 2 is provided with an extension clip 25 that engages with the vertical plate 31. The vertical plate 31 is provided with a bayonet 311 corresponding to the extension clip 25. The extension clip 25 is located between the two BMS boards 1 on the second surface 22 to avoid interference with the assembly of the BMS. The plastic bracket 2 is provided with a mounting member 24 and is in close contact with the bottom plate 32. With this arrangement, the plastic bracket 2 is connected to both the vertical plate 31 and the bottom plate 32 of the battery compartment wall 3, further enhancing the stability of the connection between the plastic bracket 2 and the battery compartment wall 3. At the same time, the connection between the extension clip 25 and the bayonet 311 enables a quick and stable connection between the plastic bracket 2 and the vertical plate 31, simplifying the installation process and improving the overall stability and reliability of the system.

[0056] In summary, the BMS heat dissipation structure provided by the present invention has the following technical effects:

[0057] 1. By placing the BMS and heat dissipation structure directly inside the battery compartment, the separation of the battery compartment and the electrical compartment is avoided, thereby reducing the need for independent heat dissipation devices, reducing the number of components required for the system, and thus reducing the overall cost of the battery pack. At the same time, the simplified design also makes the battery pack structure simpler, improving its overall performance and reliability;

[0058] 2. A first thermal pad 4 and heat sink 5 are installed between the BMS board 1 and the plastic bracket 2, or a first thermal pad 4 is installed between the plastic bracket 2 and the battery compartment wall 3, forming an efficient heat dissipation channel. These heat dissipation elements can quickly transfer heat generated by the BMS board 1 to the battery compartment wall 3, achieving heat conduction between the BMS and the battery compartment body. Even if the battery compartment is filled with potting compound with poor thermal conductivity, efficient heat dissipation can still be guaranteed, ensuring the operational stability of the BMS and the safety of the battery pack.

[0059] 3. The heat dissipation structure can prevent the BMS from malfunctioning or being damaged due to overheating, thereby improving the safety of the battery pack. In addition, the stable heat dissipation performance also helps to extend the service life of the BMS, reduce the failure rate and maintenance costs;

[0060] 4. This heat dissipation structure is highly adaptable and can be applied to BMS and battery packs of different specifications and models. By adjusting the size and layout of the heat dissipation components, different heat dissipation requirements can be flexibly met.

[0061] The technical means disclosed in the present invention are not limited to those disclosed in the above-mentioned embodiments, but also include technical solutions composed of any combination of the above-mentioned technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention, and such improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A BMS heat dissipation structure, characterized in that: include: BMS board (1); A plastic bracket (2), wherein the plastic bracket (2) is connected to the BMS board (1); A battery compartment wall (3), the plastic bracket (2) being connected to the plastic bracket (2); A first thermal pad (4) is arranged between the BMS board (1) and the plastic bracket (2), and a heat sink (5) is arranged between the first thermal pad (4) and the battery compartment wall (3) perpendicular to the BMS board (1); and / or a first thermal pad (4) is arranged between the BMS board (1) and the battery compartment wall (3) parallel to the BMS board (1).

2. A BMS heat dissipation structure according to claim 1, characterized in that: The plastic bracket (2) comprises a first surface (21) and a second surface (22) opposite to the first surface (21), wherein the first surface (21) is equipped with a BMS board (1), and a first supporting buckle (6) is arranged between the first surface (21) and the BMS board (1); and / or, the second surface (22) is equipped with a BMS board (1), and a second supporting buckle (7) is arranged between the second surface (22) and the BMS board (1).

3. A BMS heat dissipation structure according to claim 2, characterized in that: A mounting piece (24) is vertically extended from one side edge of the plastic bracket (2) toward the first surface (21), and the mounting piece (24) is provided with an assembly hole (243).

4. A BMS heat dissipation structure according to claim 3, characterized in that: The mounting member (24) comprises a first mounting member (241) and a second mounting member (242) which are arranged at an interval, a clamping device (8) is arranged between the first mounting member (241) and the second mounting member (242), and the heat sink (5) is clamped between the clamping devices (8).

5. A BMS heat dissipation structure according to claim 4, characterized in that: The heat sink (5) comprises: A clamped portion (51), the clamped portion (51) being connected and fixed to the clamping device (8); a heat transfer portion (52), the heat transfer portion (52) being disposed in contact with the first surface (21); A thermal contact portion (53), wherein the thermal contact portion (53) is sandwiched between the first surface (21) and the first thermal pad (4).

6. A BMS heat dissipation structure according to claim 5, characterized in that: The area of ​​the thermal contact portion (53) is not less than the area of ​​the first thermal conductive pad (4).

7. A BMS heat dissipation structure according to claim 5, characterized in that: The clamped portion (51) is arranged perpendicularly to the heat transfer portion (52); the clamping device (8) comprises a first clamping block (81) and a second clamping block (82); clamping grooves (83) arranged opposite to each other are arranged on the first clamping block (81) and the second clamping block (82); and the two ends of the clamped portion (51) are respectively plugged into the two clamping grooves (83).

8. A BMS heat dissipation structure according to claim 7, characterized in that: The battery compartment wall (3) comprises a vertical plate (31) and a bottom plate (32) which are vertically connected to each other, the plastic bracket (2) is provided with an extended buckle (25) which is engaged with the vertical plate (31), the vertical plate (31) is provided with a bayonet (311) corresponding to the vertical plate (31), and the mounting piece (24) of the plastic bracket (2) is fitted and connected with the bottom plate (32).

9. A BMS heat dissipation structure according to claim 8, characterized in that: A second heat-conducting pad (9) is provided between the bottom plate (32) and the clamped portion (51).

10. A BMS heat dissipation structure according to claim 2, characterized in that: The first supporting buckle (6) and the second supporting buckle (7) both comprise: A support column (61), one end of the support column (61) is fixedly connected to the plastic bracket (2), and the other end is provided with a clamping joint (62), and the clamping joint (62) is clamped to the BMS board (1); The triangular ribs (63) are arranged on the side wall of the support column (61) and are distributed along the axial circumference of the support column (61).

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