Laser packaging structure

Abstract

The embodiment of the utility model provides a laser packaging structure, and relates to the technical field of photoelectricity. The laser packaging structure comprises a bottom plate, an annular packaging piece, a plurality of light-emitting chips and a reflector, the annular packaging piece is arranged on the bottom plate, the light-emitting chips are all installed on the bottom plate, the light-emitting chips are arranged in the annular packaging piece in the circumferential direction of the annular packaging piece, the reflector is arranged on the bottom plate, the reflector is provided with a plurality of reflecting surfaces, and the reflecting surfaces are arranged on the annular packaging piece. The reflector is located in the annular structure defined by the multiple light-emitting chips, and the reflector is used for reflecting light beams of all the light-emitting chips. The reflecting mirror is used for reflecting and vertically emitting light, so that the light beams emitted by the plurality of light-emitting chips are all emitted towards the axial direction of the annular packaging piece, the plurality of light beams are concentrated together, and finally small light spots are formed. The laser packaging structure can solve the problem of large dispersion of emergent light spots of the laser, and is simple in overall structure and more convenient to use.

Description

Technical Field

[0001] The utility model relates to the field of optoelectronic technology, and in particular to a laser packaging structure. Background Art

[0002] With the continuous development and progress of optoelectronic technology, lasers are widely used in daily life. A laser is a device that can emit laser light. Lasers need to be packaged before use. The laser packaging method in the prior art generally adopts chip array or BOX arrangement for packaging.

[0003] The laser packaging structure in the prior art has the problem of large dispersion of the light spot, which leads to the technical problem of complex overall optical system. Utility Model Content

[0004] The utility model provides a laser packaging structure, which can solve the problem of large dispersion of laser light spots and simplify the overall structure.

[0005] The embodiments of the present invention can be implemented as follows:

[0006] An embodiment of the utility model provides a laser packaging structure, which includes:

[0007] Base plate;

[0008] An annular packaging member, the annular packaging member is arranged on the bottom plate;

[0009] A plurality of light-emitting chips, wherein the plurality of light-emitting chips are mounted on the bottom plate, and the plurality of light-emitting chips are arranged in the annular package along the circumferential direction of the annular package;

[0010] A reflector is arranged on the bottom plate and is located in a ring structure surrounded by a plurality of the light-emitting chips. The reflector has a plurality of reflecting surfaces and is used to reflect the light beams of all the light-emitting chips.

[0011] Optionally, the annular package includes an annular portion and a connecting portion, the connecting portion is connected to an outer wall of the annular portion, and the plurality of light-emitting chips are arranged in the annular portion and connected to electrodes on an inner wall of the annular portion.

[0012] Optionally, the laser packaging structure further includes a conductive structure, wherein the conductive structure is electrically connected to an electrode on an inner wall of the annular portion, and the conductive structure is connected to the connecting portion for external power connection.

[0013] Optionally, the conductive structure includes at least one pin needle, and at least one of the pin needles is welded to the connecting portion.

[0014] Optionally, the laser packaging structure further includes a sealing cover, which is connected to the top of the annular packaging component. The sealing cover, the annular packaging component and the base plate are used to jointly form a sealing structure, and the plurality of light-emitting chips are located in the sealing structure.

[0015] Optionally, the sealing cover is a glass cover plate, and the laser packaging structure further includes a collimating lens, which is arranged above the sealing cover and is used to collimate the light beam reflected by the reflector.

[0016] Optionally, the laser packaging structure further includes a plurality of collimating lenses, the number of the collimating lenses corresponds one-to-one to the number of the light-emitting chips, the collimating lenses are arranged between the reflector and the light-emitting chip, and the collimating lenses are used to collimate the light beams emitted by the light-emitting chips.

[0017] Optionally, the laser packaging structure also includes a step plate, which is arranged on the base plate and located inside the annular package. The step plate is provided with a plurality of the light-emitting chips, and the reflector is used to reflect the light beams emitted by the light-emitting chips on the step plate and the light-emitting chips on the base plate.

[0018] Optionally, the step plate is an annular structure, a mounting groove is provided on the step plate or between the step plates, and the electrode of the annular package is installed in the mounting groove.

[0019] Optionally, the reflector is a conical prism.

[0020] The beneficial effects of the laser packaging structure of the embodiment of the utility model include, for example:

[0021] The laser packaging structure includes a base plate, an annular package, a plurality of light-emitting chips and a reflector, wherein the annular package is arranged on the base plate, the plurality of light-emitting chips are mounted on the base plate, the plurality of light-emitting chips are arranged in the annular package along the circumferential direction of the annular package, the reflector is arranged on the base plate, and the reflector is located in the annular structure surrounded by the plurality of light-emitting chips, the reflector has a plurality of reflective surfaces, and the reflector is used to reflect the light beams of all the light-emitting chips. When in use, an annular package is arranged on the base plate, the plurality of light-emitting chips are mounted in the annular package, and the plurality of light-emitting chips are arranged along the circumferential direction of the annular package, and the reflector is arranged in the annular structure surrounded by the plurality of light-emitting chips, the reflector has a plurality of reflective surfaces, so that the reflector can simultaneously emit the light beams emitted by the plurality of light-emitting chips, and the reflector is used to reflect the light vertically, so that the light beams emitted by the plurality of light-emitting chips are all emitted toward the axial direction of the annular package, so that the plurality of light beams are concentrated together, and finally form a small light spot. The laser packaging structure can solve the problem of large dispersion of the laser light spot, and the overall structure is simple and more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 A structural schematic diagram of a laser packaging structure provided by the first embodiment from a first viewing angle;

[0024] Figure 2 A schematic structural diagram of a laser packaging structure provided by the first embodiment from a second viewing angle;

[0025] Figure 3 A schematic structural diagram of a laser packaging structure provided by the second embodiment from a first viewing angle;

[0026] Figure 4 A schematic structural diagram of a laser packaging structure provided by the second embodiment from a second viewing angle;

[0027] Figure 5 A schematic structural diagram of a laser packaging structure provided in the third embodiment;

[0028] Figure 6 It is a schematic diagram of the structure of the bottom plate and the step plate in the third embodiment;

[0029] Figure 7FIG. 4 is a cross-sectional view of the laser packaging structure in the third embodiment.

[0030] Icons: 10-base plate; 20-ring-shaped package; 21-ring portion; 22-connecting portion; 201-electrode; 30-light-emitting chip; 40-reflector; 50-conductive structure; 60-sealing cover; 70-collimating lens; 80-step plate; 81-mounting groove; 100-laser packaging structure. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0032] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present utility model, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. appear, the orientation or position relationship indicated is based on the orientation or position relationship shown in the accompanying drawings, or is the orientation or position relationship in which the utility model product is usually placed when used. It is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present utility model.

[0035] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0036] It should be noted that, in the absence of conflict, the features in the embodiments of the present invention may be combined with each other.

[0037] Example 1

[0038] With the continuous development and progress of optoelectronic technology, lasers are widely used in daily life. A laser is a device that can emit laser light. Lasers need to be packaged before use. The laser packaging method in the prior art generally adopts chip array or BOX arrangement for packaging.

[0039] The laser packaging structure in the related art has the problem of large dispersion of the light spot, which leads to the technical problem of complex overall optical system.

[0040] Please refer to Figure 1-Figure 2 This embodiment provides a laser packaging structure 100, which can effectively improve the above-mentioned technical problems, solve the problem of large dispersion of laser light spots, and simplify the overall structure.

[0041] Please refer to Figure 1-Figure 2 The laser packaging structure 100 includes a base plate 10, an annular package 20, a plurality of light-emitting chips 30 and a reflector 40. The annular package 20 is arranged on the base plate 10. The plurality of light-emitting chips 30 are installed on the base plate 10. The plurality of light-emitting chips 30 are arranged in the annular package 20 along the circumferential direction of the annular package 20 and are electrically connected to the annular package 20. The reflector 40 is arranged on the base plate 10, and the reflector 40 is located in the annular structure surrounded by the plurality of light-emitting chips 30. The reflector 40 is used to reflect the light beams of all the light-emitting chips 30.

[0042] In this embodiment, a plurality of light emitting chips 30 are arranged in a ring shape in the ring package 20. The ring package 20 can concentrate the light beams emitted by the plurality of light emitting chips 30, and use a reflector 40 to vertically reflect the light beams emitted by all the light emitting chips 30, so that the light beams emitted by the plurality of light emitting chips 30 are all emitted in the same direction, thereby reducing the light spot formed in the end. The reflector 40 is disposed at the light emitting port of the light emitting chip 30, and the light beams emitted by the plurality of light emitting chips 30 are all directed toward the same reflector 40, thereby preventing the light beams from being dispersed during the propagation process.

[0043] In this embodiment, the reflector 40 is a conical prism. The reflector 40 has a plurality of reflective surfaces, and the number of the reflective surfaces corresponds to the number of the light-emitting chips 30. The reflector 40 can be made of optical glass, metal, silicon carbide or the like.

[0044] At the same time, the assembly of the laser packaging structure 100 is more integrated, which reduces the overall volume and is more convenient to use.

[0045] In this embodiment, the base plate 10 is made of copper material, and the plurality of light-emitting chips 30 are arranged on the base plate 10 . The heat generated during operation can be effectively dissipated through the base plate 10 .

[0046] In this embodiment, the annular package 20 is made of ceramic material. The annular package 20 is electrically connected to a plurality of light emitting chips 30 . The annular package 20 can conduct electricity externally, thereby achieving electrical connection with the light emitting chips 30 .

[0047] It should be noted that the annular package 20 includes an annular portion 21 and a connecting portion 22 , the connecting portion 22 is connected to the outer wall of the annular portion 21 , and a plurality of light-emitting chips 30 are arranged in the annular portion 21 and connected to the electrode 201 on the inner wall of the annular portion 21 .

[0048] The laser packaging structure 100 further includes a conductive structure 50 , which is electrically connected to the electrode 201 on the inner wall of the annular portion 21 , and is connected to the connecting portion 22 for external electrical connection.

[0049] Specifically, the inner wall of the annular portion 21 has a built-in circuit, and multiple light-emitting chips 30 are connected to the electrode 201 on the inner wall of the annular portion 21, so that the positive and negative poles of the light-emitting chip 30 are bonded by gold wire, and then the electrical connection with the outside is achieved through the conductive structure 50 connected to the connecting portion 22.

[0050] In this embodiment, the conductive structure 50 includes at least one pin, and at least one pin is welded to the connection portion 22. Specifically, the conductive structure 50 includes two pins, and both pins are welded to the connection portion 22. In other embodiments, the number of pins may be increased or decreased, which is not specifically limited here.

[0051] In this embodiment, the ceramic ring package 20 and the copper base plate 10 are used in combination, which can not only achieve effective heat dissipation during operation, but also realize the power connection between the light-emitting chip 30 and the outside. The entire electrical connection method is relatively simple, which reduces the process difficulty and improves reliability.

[0052] Furthermore, the laser packaging structure 100 further includes a sealing cover 60, the sealing cover 60 is connected to the top of the annular package 20, the sealing cover 60, the annular package 20 and the bottom plate 10 are used to form a sealing structure together, and a plurality of light-emitting chips 30 are located in the sealing structure. The sealing cover 60 covers the top of the annular portion 21, and the sealing cover 60 and the annular portion 21 are welded by brazing, thereby ensuring that the light-emitting chip 30 is in a clean and closed environment.

[0053] In this embodiment, the sealing cover 60 is a glass cover plate, and the laser packaging structure 100 further includes a collimating lens 70, which is disposed above the sealing cover 60 and is used to collimate the light beam reflected by the reflector 40. Since the light beam emitted by the light emitting chip 30 still has a divergence angle after being reflected by the reflector 40, and the angle is relatively large, the collimating lens 70 is disposed above the sealing cover 60, and the collimating lens 70 can collimate the light beam reflected by the reflector 40, thereby further solving the problem of light beam dispersion.

[0054] In this embodiment, the collimating lens 70 is disposed directly above the reflector 40 , so as to facilitate collimation of the light beam reflected by the reflector 40 .

[0055] In this embodiment, the number of the light emitting chips 30 is eight. In other embodiments, the number of the light emitting chips 30 may be increased or decreased, which is not specifically limited here.

[0056] The laser packaging structure 100 provided in this embodiment has at least the following advantages:

[0057] The laser packaging structure 100 uses a reflector 40 to reflect the light beams emitted by multiple light-emitting chips 30, which reduces the number of components of the laser packaging structure 100 and avoids material waste, while increasing the ease of installation and the reliability of packaging, thereby improving packaging efficiency.

[0058] In summary, an embodiment of the utility model provides a laser packaging structure 100, which includes a base plate 10, an annular package 20, a plurality of light-emitting chips 30 and a reflector 40. The annular package 20 is arranged on the base plate 10, and the plurality of light-emitting chips 30 are all installed on the base plate 10. The plurality of light-emitting chips 30 are arranged in the annular package 20 along the circumferential direction of the annular package 20 and are connected to the annular package 20. The reflector 40 is arranged on the base plate 10, and the reflector 40 is located at the midpoint of the annular structure surrounded by the plurality of light-emitting chips 30. The reflector 40 is used to reflect the light beams of all the light-emitting chips 30 at the same time. When in use, an annular package 20 is arranged on the bottom plate 10, and multiple light-emitting chips 30 are installed in the annular package 20, and multiple light-emitting chips 30 are arranged along the circumferential direction of the annular package 20, and a reflector 40 is arranged at the midpoint of the annular structure surrounded by multiple light-emitting chips 30. The reflector 40 can simultaneously reflect the light beams emitted by multiple light-emitting chips 30, and the reflector 40 is used to reflect the light vertically, so that the light beams emitted by multiple light-emitting chips 30 are all emitted toward the axial direction of the annular package 20, so that multiple light beams are concentrated together, and finally a small light spot is formed. The laser packaging structure 100 can solve the problem of large dispersion of laser light spots, and the overall structure is simple and more convenient to use.

[0059] Example 2

[0060] Please refer to Figure 3-Figure 4 This embodiment provides a laser packaging structure 100. The difference between the laser packaging structure 100 in this embodiment and that in Embodiment 1 is as follows:

[0061] The laser packaging structure 100 provided in this embodiment also includes a plurality of collimating lenses 70 , the number of the collimating lenses 70 corresponds one to one with the number of the light-emitting chips 30 , the collimating lenses 70 are arranged between the reflector 40 and the light-emitting chip 30 , and the collimating lenses 70 are used to collimate the light beams emitted by the light-emitting chip 30 .

[0062] It should be noted that since the light beam emitted by the light-emitting chip 30 has a certain divergence angle, the height of the reflector 40 and the mirror area of ​​the reflector 40 are required to be relatively high. In order to reduce the light loss of the collimating lens 70 during the packaging process, the laser packaging structure 100 in this embodiment is provided with a collimating lens 70 at the light-emitting port of each light-emitting chip 30. Before the light beam emitted by the light-emitting chip 30 reaches the reflector 40, the collimating lens 70 is first used to collimate the light beam, thereby further solving the problem of large dispersion of the laser light spot.

[0063] In this embodiment, the collimating lens 70 is an 8 PCS collimating lens.

[0064] In this embodiment, the laser packaging structure 100 further includes a sealing cover 60, which is connected to the top of the annular package 20, and the sealing cover 60, the annular package 20 and the bottom plate 10 are used to form a sealing structure together, and a plurality of light-emitting chips 30 are located in the sealing structure. The sealing cover 60 covers the top of the annular portion 21, and the sealing cover 60 and the annular portion 21 are welded by brazing, thereby ensuring that the light-emitting chip 30 is in a clean and closed environment.

[0065] In this embodiment, the sealing cover 60 is a sealing glass cover plate, and the sealing cover 60 is no longer provided with a collimating lens 70 .

[0066] Example 3

[0067] Please refer to Figure 5-Figure 7 This embodiment provides a laser packaging structure 100. The difference between the laser packaging structure 100 in this embodiment and that in Embodiment 1 is as follows:

[0068] The laser packaging structure 100 provided in this embodiment also includes a step plate 80, which is arranged on the base plate 10 and is located inside the annular packaging member 20. The step plate 80 is provided with a plurality of light-emitting chips 30, and the reflector 40 is used to jointly reflect the light beams emitted by the light-emitting chips 30 located on the step plate 80 and the light-emitting chips 30 located on the base plate 10.

[0069] It should be noted that a step plate 80 is provided on the base plate 10, and light-emitting chips 30 of different colors can be installed on the step plate 80 and the base plate 10 respectively. The light-emitting ports of the light-emitting chips 30 of different colors are all facing the reflector 40, and the same reflector 40 is used for reflection, so that the packaged laser can form light spots of various colors.

[0070] It can be understood that the apex of the reflector 40 is higher than the height of the light emitting chip 30 on the step plate 80 , so that the reflector 40 can reflect the light beams emitted by the light emitting chip 30 on the step plate 80 and the light emitting chip 30 on the base plate 10 .

[0071] Of course, there can be multiple step plates 80, and the multiple step plates 80 are arranged in a stepped manner along the height direction. Light-emitting chips 30 of different colors can be installed on each step plate 80, so that the laser finally forms light spots of different colors.

[0072] In this embodiment, the step plate 80 is an annular structure, and the step plate 80 is provided with a mounting groove 81, and the electrode 201 of the annular package 20 is installed in the mounting groove 81. Among them, the mounting groove 81 extends along the diameter direction of the step plate 80, and the mounting groove 81 passes through the step plate 80. In this embodiment, the number of the mounting grooves 81 is three. In other embodiments, the number of the mounting grooves 81 can be increased or decreased, which is not specifically limited here.

[0073] In other embodiments, the step plate 80 may be a single component, and the mounting groove 81 may be arranged along the circumferential direction of the step plate 80 , or a plurality of step plates 80 may be arranged in an annular pattern, with the mounting groove 81 formed between two adjacent step plates 80 .

[0074] Furthermore, the laser packaging structure 100 in this embodiment further includes a conductive structure 50 , which is connected to the connecting portion 22 for external power connection.

[0075] In this embodiment, the conductive structure 50 includes three pins, and the three pins are all welded to the connecting portion 22 .

[0076] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A laser packaging structure, characterized in that: include: Bottom plate (10); an annular packaging member (20), the annular packaging member (20) being arranged on the bottom plate (10); a plurality of light-emitting chips (30), wherein the plurality of light-emitting chips (30) are all mounted on the base plate (10), and the plurality of light-emitting chips (30) are arranged in the annular package (20) along the circumferential direction of the annular package (20); A reflector (40), wherein the reflector (40) is arranged on the base plate (10), and the reflector (40) is located in a ring structure surrounded by a plurality of the light-emitting chips (30), and the reflector (40) has a plurality of reflecting surfaces, and the reflector (40) is used to reflect the light beams of all the light-emitting chips (30).

2. The laser packaging structure according to claim 1, characterized in that: The annular package (20) comprises an annular portion (21) and a connecting portion (22), wherein the connecting portion (22) is connected to the outer wall of the annular portion (21), and the plurality of light-emitting chips (30) are arranged in the annular portion (21) and connected to the electrode (201) on the inner wall of the annular portion (21).

3. The laser packaging structure according to claim 2, characterized in that: The laser packaging structure (100) further comprises a conductive structure (50), wherein the conductive structure (50) is electrically connected to an electrode (201) on the inner wall of the annular portion (21), and the conductive structure (50) is connected to the connecting portion (22) for external electrical connection.

4. The laser packaging structure according to claim 3, characterized in that: The conductive structure (50) comprises at least one pin needle, and the at least one pin needle is welded to the connecting portion (22).

5. The laser packaging structure according to any one of claims 1 to 4, characterized in that: The laser packaging structure (100) further comprises a sealing cover (60), wherein the sealing cover (60) is connected to the top of the annular packaging component (20), and the sealing cover (60), the annular packaging component (20) and the base plate (10) are used to form a sealing structure together, and the plurality of light-emitting chips (30) are located in the sealing structure.

6. The laser packaging structure according to claim 5, characterized in that: The sealing cover (60) is a glass cover plate, and the laser packaging structure (100) further comprises a collimating lens (70), which is arranged above the sealing cover (60) and is used to collimate the light beam reflected by the reflector (40).

7. The laser packaging structure according to claim 5, characterized in that: The laser packaging structure (100) further comprises a plurality of collimating lenses (70), the number of the collimating lenses (70) corresponding to the number of the light-emitting chips (30), the collimating lenses (70) being arranged between the reflector (40) and the light-emitting chip (30), and the collimating lenses (70) being used to collimate the light beam emitted by the light-emitting chip (30).

8. The laser packaging structure according to any one of claims 1 to 4 and 6 to 7, characterized in that: The laser packaging structure (100) further comprises a step plate (80), wherein the step plate (80) is arranged on the base plate (10), and the step plate (80) is located inside the annular packaging component (20), and the step plate (80) is provided with a plurality of the light-emitting chips (30), and the reflector (40) is used to reflect light beams emitted by the light-emitting chips (30) located on the step plate (80) and the light-emitting chips (30) located on the base plate (10).

9. The laser packaging structure according to claim 8, characterized in that: The step plate (80) is an annular structure, a mounting groove (81) is provided on the step plate (80) or between the step plates (80), and the electrode (201) of the annular packaging component (20) is installed in the mounting groove (81).

10. The laser packaging structure according to any one of claims 1 to 4 and 6 to 7, characterized in that: The reflector (40) is a conical prism.

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