Quartz wafer surface cleaning device

Abstract

The utility model belongs to a cleaning device, and particularly relates to a cleaning device for a quartz wafer. The quartz wafer surface cleaning device comprises a cleaning box (1) and a support (2) installed above the cleaning box, and is characterized in that the support (2) is provided with a clamp conveying groove (21), a clamp conveying device is installed on the support (2), scrubbing devices are installed on the lower end faces of the two long edges of the support (2), a cleaning frame (4) is installed in the cleaning box (1), and the cleaning box (1) is provided with a cleaning groove (5). At least one ultrasonic transducer (5) is installed on the outer end face of the bottom of the cleaning frame (4). By adopting the structure, pollutants on the surface of the quartz wafer are cleaned, and the purity of the surface of the quartz wafer is ensured.

Description

Technical Field

[0001] The utility model belongs to a cleaning device, in particular to a cleaning device for quartz wafers. Background Art

[0002] Quartz wafer refers to a thin slice made of high-purity quartz crystal through a specific process, which has high physical stability and excellent chemical properties. At present, quartz wafers are widely used in electronics, optoelectronics, communications and other fields.

[0003] When in use, the purity of quartz wafers is required to be high, and there must not be any contaminants on the surface. However, during use, quartz wafers will be contaminated on the surface due to contact with gases, chemicals and other factors. These contaminants will affect the quality of semiconductor production and accelerate the aging of quartz materials. Therefore, the purpose of cleaning quartz wafers is to remove surface contaminants and ensure the purity of materials in the semiconductor manufacturing process.

[0004] The current cleaning method generally involves assembling the quartz wafer in a coating fixture before coating, and immersing the entire assembly in an ultrasonic water tank. However, this method is not very effective in cleaning foreign matter adhering to the surface of the wafer. Utility Model Content

[0005] The utility model provides a quartz wafer surface cleaning device, which aims to thoroughly clean the pollutants on the surface of the quartz wafer and ensure the purity of the surface of the quartz wafer.

[0006] In order to solve the above problems, the utility model provides a quartz wafer surface cleaning device, comprising a cleaning box, a bracket installed above the cleaning box, characterized in that: the bracket is provided with a clamp conveying groove, a clamp conveying device is installed on the bracket, a brushing device is installed on the lower end surfaces of two long sides of the bracket, a cleaning frame is installed in the cleaning box, at least one ultrasonic transducer is installed on the bottom outer end surface of the cleaning frame, and support rods are also installed around and at the center of the bottom outer end surface. The upper end of the cleaning frame wall is vertically folded outward to form a limiting folded edge, a sleeve rod matching the number of the support rods is provided on the inner bottom surface of the cleaning box, and an insertion interface is provided on the sleeve rod, the support rod is inserted into the insertion interface, a spring is sleeved on the support rod and the outer ring of the sleeve rod, a step is provided on the upper end surface of the cleaning box, and the limiting folded edge is installed on the step.

[0007] The quartz wafer surface cleaning device is characterized in that: the fixture conveying device includes a fixture, a slide bar, a guide rail, a mobile motor, and a wafer mold clamp. A mobile motor mounting frame is fixedly installed on the short side of the bracket, the mobile motor is fixedly installed on the mobile motor mounting frame, a push block is fixed on the telescopic end of the mobile motor, the guide rail is installed on the inner wall of the motor mounting frame, the slide bar is slidably connected to the guide rail, the fixture is fixed on the slide bar, the wafer mold clamp is clamped in the fixture, and the push block is fixedly connected to the back cover. .

[0008] The quartz wafer surface cleaning device is characterized in that: the clamp is a frame, including a front cover and a rear cover, which are hinged by hinges, the rear cover is fixed on the sliding rod, and the front cover and the rear cover are fastened by buckles, and an installation groove is provided on the inner frame wall of the rear cover, and the wafer mold clamp is installed in this groove, and the height of the installation groove wall is consistent with the height of the wafer mold clamp.

[0009] The quartz wafer surface cleaning device is characterized in that the scrubbing device includes a brush and a telescopic motor, the brush is cylindrical and has brush handles at both ends, bearings are mounted on the brush handles, a rotating motor is installed on one of the brush handles at both ends of the brush, and the lower end surfaces of the two long sides of the bracket are each installed with the brush through the telescopic motor.

[0010] The quartz wafer surface cleaning device is characterized in that the bristles of the brush can brush the wafer mold clamp.

[0011] The quartz wafer surface cleaning device is characterized in that the telescopic rod of the telescopic motor is sleeved on the bearing.

[0012] The quartz wafer surface cleaning device is characterized in that the brush is an ultra-soft cleaning brush.

[0013] The quartz wafer surface cleaning device is characterized in that a certain gap is left between the step wall of the step platform and the side wall of the limiting folded edge.

[0014] With the above structure, the fixture conveying device delivers the quartz wafer into the cleaning frame, and starts the ultrasonic transducer to clean the quartz wafer for the first time. Then start the telescopic motor, push the brush into the cleaning frame, start the rotating motor to rotate the brush, pull back the conveying device, and slowly move the quartz wafer upward from the cleaning frame. When the quartz wafer moves upward, when it touches the rotating brush, the brush cleans the foreign matter remaining on the quartz wafer, completing the second brushing of the quartz wafer. In this way, the surface of the quartz wafer can be brushed clean to improve the purity of the quartz wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 : The utility model is a schematic structural diagram of a quartz wafer surface cleaning device.

[0016] Figure 2 : Schematic diagram of the fixture structure of the utility model.

[0017] Figure 3 : Schematic diagram of the structure of the inner surface of the bottom of the cleaning box and the outer surface of the cleaning frame of the utility model.

[0018] Figure 4 : Figure 1 Enlarged view of point A in the middle.

[0019] Figure 5 : Quartz wafer cleaned only with ultrasonic waves.

[0020] Figure 6 : A quartz wafer cleaned by the cleaning device of the utility model. DETAILED DESCRIPTION

[0021] The following is a further detailed description of a quartz wafer surface cleaning device of the present invention in conjunction with the accompanying drawings and specific implementation methods.

[0022] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, a quartz wafer surface cleaning device comprises a cleaning box 1 and a support 2 installed above the cleaning box 1. The support 2 is provided with a fixture conveying slot 21, a fixture conveying device is installed on the support 2, and a brushing device is installed on the lower end surfaces of the two long sides of the support 2.

[0023] A cleaning frame 4 is installed in the cleaning box 1. The fixture conveying device is pushed into the cleaning box 1 through the fixture conveying groove 21. At least one ultrasonic transducer 5 is installed on the outer end surface of the bottom of the cleaning frame 4. A support rod 6 is also installed around and at the center of the outer end surface of the bottom. The upper end of the frame wall of the cleaning frame 4 is vertically folded outward to form a limit fold 41. The bottom surface of the cleaning box 1 is provided with a sleeve rod 7 matching the number of the support rods 6, and a plug interface 71 is provided on it. The support rod 6 is inserted into the plug interface 71 and can move freely in the plug interface 71. A spring 8 is set on the outer circle of the support rod 6 and the sleeve rod 7. Due to the action of the spring 8, the bottom surface of the support rod 6 cannot contact the bottom of the plug interface 71. A step 101 is provided on the upper end surface of the cleaning box 1, and the limit fold 41 is installed on the step 101. The step wall of the step 101 and the side wall of the limit fold 41 leave a certain gap. When the ultrasonic transducer 5 is working, the cleaning frame 4 will shake due to the interaction between the spring 8, the support rod 6 and the sleeve rod 7, because a gap is left between the step wall of the step 101 and the side wall of the limiting fold 41 so that the shaking of the cleaning frame 4 is not restricted.

[0024] The fixture conveying device includes a fixture 9, a slide bar 10, a guide rail 11, a mobile motor 12, and a wafer mold clamp 13. A mobile motor mounting frame 1201 is fixedly mounted on the short side of the bracket 2, the mobile motor 12 is fixedly mounted on the mobile motor mounting frame 1201, a push block 1202 is fixedly mounted on the telescopic end of the mobile motor 12, and the push block 1202 is fixedly connected to the back cover 902. The guide rail 11 is mounted on the inner wall of the motor mounting frame 1201, the slide bar 10 is slidably connected to the guide rail 11, the fixture 9 is fixed on the slide bar 10, and the wafer mold clamp 13 is clamped in the fixture 9.

[0025] The fixture 9 is a frame structure, including a front cover 901 and a rear cover 902, which are hinged by hinges. The rear cover 902 is fixed on the slide bar 10, and the front cover 901 and the rear cover 902 are fastened by the buckle 903. A placement groove 904 is provided on the inner frame wall of the rear cover 902, and the wafer mold clamp 13 is placed in this groove, and the height of the groove wall of the placement groove 904 is consistent with the height of the wafer mold clamp 13. The front cover 901 is opened by the buckle 903, and the wafer mold clamp 13 with the quartz wafer 15 is placed in the placement groove 904, and then the front cover 901 is fastened. When the motor of the mobile motor mounting frame 1201 is working, it pushes the push block 1202 downward to move downward, and the push block 1202 further drives the slide bar 10 to move, and the fixture 9 drives the wafer mold clamp 13 to pass through the fixture conveying groove 21 into the cleaning box 1.

[0026] The scrubbing device includes a brush 14 and a telescopic motor 3. The brush 4 is cylindrical, and is provided with a brush handle 1401 at both ends thereof, and a bearing 1402 is mounted on the brush handle 1401. A rotating motor 1403 is mounted on one of the brush handles 1401 at both ends of the brush 14. The lower end surfaces of the two long sides of the bracket 2 are each mounted with a brush 14 through the telescopic motor 3. The telescopic rod of the telescopic motor 3 is mounted on the bearing 1402.

[0027] The bristles of the hairbrush 14 can scrub the wafer mold clamp 13. The hairbrush 14 is a super soft cleaning brush, so that when the quartz crystal 15 surfaces are scrubbed, the wafer surface can not be damaged.

[0028] When cleaning the quartz wafer 15, first install the wafer mold clamp 13 with the quartz wafer 15 in the fixture 9, start the moving motor 12 to push the fixture 9 into the cleaning frame 4. Start the ultrasonic transducer 5 to perform ultrasonic cleaning on the quartz wafer 15. Then turn off the ultrasonic transducer 5, start the telescopic motor 3 to push the brush into the cleaning frame 4, and at the same time, let the brush 14 start to rotate through the rotating motor 1403, start the moving motor 12 to slowly raise the fixture 9, and during the process of the fixture 9 rising, the brush 4 brushes the quartz wafer 15 row by row.

[0029] like Figure 5 , Figure 6 As shown, Figure 5This is a picture showing the effect of a quartz wafer being cleaned by the utility model. As shown in the picture, the surface of the quartz wafer has been cleaned. Figure 6 In the image, the surface of the quartz wafer clearly shows black spots.

[0030] The preferred specific modes or embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned implementation modes and embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the concept of the present invention.

Claims

1. A quartz wafer surface cleaning device, comprising a cleaning box (1), a support (2) mounted above the cleaning box, characterized in that: The support (2) is provided with a fixture conveying groove (21), a fixture conveying device is installed on the support (2), a scrubbing device is installed on the lower end surfaces of the two long sides of the support (2), a cleaning frame (4) is installed in the cleaning box (1), at least one ultrasonic transducer (5) is installed on the outer end surface of the bottom of the cleaning frame (4), and a support rod (6) is also installed around and at the center of the outer end surface of the bottom, and the upper end of the frame wall of the cleaning frame (4) is vertically folded outward to form a limiting folding edge (41), the inner bottom surface of the cleaning box (1) is provided with sleeve rods (7) matching the number of the support rods (6), and an insertion interface (71) is provided on the sleeve rods, and the support rods (6) are inserted into the insertion interface (71), and a spring (8) is sleeved on the outer ring of the support rod (6) and the sleeve rod (7), and the upper end surface of the cleaning box (1) is provided with a step (101), and the limiting folding edge (41) is installed on the step (101).

2. A quartz wafer surface cleaning device according to claim 1, characterized in that: The clamp conveying device comprises a clamp (9), a slide bar (10), a guide rail (11), a mobile motor (12), and a wafer mold clamp (13). A mobile motor mounting frame (1201) is fixedly installed on the short side of the bracket (2), the mobile motor (12) is fixedly installed on the mobile motor mounting frame (1201), a push block (1202) is fixed on the telescopic end of the mobile motor (12), the guide rail (11) is installed on the inner wall of the motor mounting frame (1201), the slide bar (10) is slidably connected to the guide rail (11), the clamp (9) is fixed on the slide bar (10), and the wafer mold clamp (13) is clamped in the clamp (9).

3. A quartz wafer surface cleaning device according to claim 2, characterized in that: The clamp (9) is a frame, comprising a front cover (901), a rear cover (902), a buckle (903), and a placement groove (904). The front cover (901) and the rear cover (902) are hinged by hinges, and the rear cover (902) is fixed to the slide bar (10). The front cover (901) and the rear cover (902) are fastened by the buckle (903). A placement groove (904) is provided on the inner frame wall of the rear cover (902), and the wafer mold clamp (13) is installed in the groove, and the groove wall height of the placement groove (904) is consistent with the height of the wafer mold clamp (13). The pushing block (1202) is fixedly connected to the rear cover (902).

4. A quartz wafer surface cleaning device according to claim 3, characterized in that: The scrubbing device comprises a brush (14) and a telescopic motor (3); the brush is cylindrical and has brush handles (1401) at both ends; bearings (1402) are mounted on the brush handles (1401); a rotating motor (1403) is mounted on one of the brush handles (1401) at both ends of the brush (14); and the lower end surfaces of the two long sides of the bracket (2) are each mounted with the brush (14) via the telescopic motor (3).

5. A quartz wafer surface cleaning device according to claim 4, characterized in that: The bristles of the brush (14) can brush the wafer mold clamp (13).

6. A quartz wafer surface cleaning device according to claim 4, characterized in that: The telescopic rod of the telescopic motor (3) is sleeved on the bearing (1402).

7. A quartz wafer surface cleaning device according to claim 4, characterized in that: The brush (14) is an ultra-soft cleaning brush.

8. A quartz wafer surface cleaning device according to claim 1, characterized in that: A certain gap is left between the step wall of the step platform (101) and the side wall of the limiting folded edge (41).

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