Processing apparatus

Abstract

The utility model discloses a processing device. The processing device comprises a conveying structure and a processing structure, the processing structure and the conveying structure are arranged at intervals in the first direction, and a first laser area formed by laser emitted by the processing structure is suitable for irradiating a dissimilar material assembly located between the processing structure and the conveying structure so as to form a matching hole. The central axis of the first laser area coincides with the central axis of the conveying structure. According to the processing device disclosed by the utility model, the requirement on assembly precision is reduced, so that the assembly difficulty is reduced, the assembly time is shortened, and the assembly efficiency is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, in particular to a processing device. Background Art

[0002] High-strength steel, aluminum, magnesium, carbon fiber and other high-specific-strength alloys are gradually being used in vehicle bodies, and the problem of dissimilar metal joining is inevitable. For example, fusion welding easily leads to the formation of brittle intermetallic compounds between aluminum and steel dissimilar metals, reducing the stability of the connection between aluminum and steel dissimilar metals.

[0003] In the related art, during the welding and assembly process of aluminum plates and steel plates, pre-punched holes are made on the aluminum plates and steel plates in advance. The pre-made holes of the aluminum plates and steel plates need to be on the same central axis, which places high demands on assembly. When connected by rivets, the rivets and the pre-made holes of the aluminum plates and steel plates also need to be on the same central axis. During welding, the welding position needs to be positioned according to the pre-made holes. Multiple positioning is required during the connection process, and the positioning accuracy is high, which increases the difficulty of connection. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a processing device that reduces the requirements for assembly accuracy, thereby reducing assembly difficulty, shortening assembly time, and improving assembly efficiency.

[0005] According to an embodiment of the utility model, the processing device includes: a conveying structure; a processing structure, wherein the processing structure and the conveying structure are arranged at intervals along a first direction, and a first laser zone formed by the laser emitted by the processing structure is suitable for irradiating a heterogeneous material component located between the processing structure and the conveying structure to form a matching hole, and a central axis of the first laser zone coincides with a central axis of the conveying structure.

[0006] According to the processing device of the utility model, a laser is used to directly form a matching hole on a heterogeneous material component, which reduces the requirements for assembly accuracy compared to the conventional technology, thereby reducing the difficulty of assembly. Moreover, the assembly steps in the conventional technology are reduced, the assembly time is shortened, and the labor cost is reduced, thereby reducing the production cost. In addition, the alignment operation between the transmission structure and the matching hole is omitted, the positioning accuracy of the assembly of the transmission structure and the matching hole is improved, and the assembly difficulty of the transmission structure and the matching hole of the heterogeneous material component is reduced, thereby improving the assembly efficiency and effect. Moreover, the assembly accuracy of the transmission structure and the matching hole is also improved, which is convenient for welding in the subsequent process and improves the welding accuracy.

[0007] According to some embodiments of the present invention, a central axis of the processing structure coincides with a central axis of the first laser zone.

[0008] According to some embodiments of the present invention, the conveying structure is adapted to be movable toward or away from the heterogeneous material component.

[0009] According to some embodiments of the present invention, the cross-sectional shape of the first laser zone is circular.

[0010] According to some embodiments of the present invention, the second laser zone formed by the laser emitted by the processing structure is used to weld the fastener placed in the matching hole and the dissimilar material component, and the central axis of the second laser zone coincides with the central axis of the transmission structure.

[0011] According to some embodiments of the present invention, the laser power for forming the second laser zone is less than the laser power for forming the first laser zone.

[0012] According to some embodiments of the present invention, the cross-sectional shape of the second laser zone is circular; or, the laser emitted by the processing structure extends in an S-shape along the circumference of the matching hole.

[0013] According to some embodiments of the present invention, the processing device further comprises: a fastener, which is detachably engaged with the conveying structure.

[0014] According to some embodiments of the present invention, a central axis of the fastener coincides with a central axis of the transmission structure.

[0015] According to some embodiments of the present invention, the processing structure is a laser instrument.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 is a schematic diagram of a processing device according to an embodiment of the utility model, wherein the laser formation of the processing structure is in a cutting state;

[0019] Figure 2 is a schematic diagram of a processing device according to an embodiment of the utility model, wherein a matching hole is formed on the dissimilar material component;

[0020] Figure 3 is a schematic diagram of a processing device according to an embodiment of the utility model, wherein a dissimilar material component is assembled with a fastener;

[0021] Figure 4 is a schematic diagram of a processing device according to an embodiment of the utility model, wherein the laser of the processing structure is in a welding state;

[0022] Figure 5 is a top view of a dissimilar material assembly according to an embodiment of the utility model, wherein a laser processing structure forms a first laser zone;

[0023] Figure 6 is a top view of a dissimilar material assembly according to an embodiment of the utility model, wherein a matching hole is formed on the dissimilar material assembly;

[0024] Figure 7 is a top view of a dissimilar material assembly according to an embodiment of the utility model, wherein the laser processing structure forms a second laser zone;

[0025] Figure 8 is a top view of a dissimilar material assembly according to an embodiment of the utility model, wherein laser oscillation welding of a processing structure is performed;

[0026] Fig. 9 It is a schematic diagram of the assembly of the fastener and the heterogeneous material component of the processing device according to the embodiment of the utility model;

[0027] Fig.10 is a schematic diagram of assembling a fastener and a dissimilar material component of a processing device according to another embodiment of the utility model;

[0028] Fig.11 It is an assembly flow chart of a processing device and a heterogeneous material component according to an embodiment of the utility model.

[0029] Reference numerals:

[0030] 100. Processing device;

[0031] 1. Transmission structure;

[0032] 2. Processing structure; 21. First laser zone; 22. Second laser zone;

[0033] 3. Fastener; 31. Limiting section; 32. Fixing section;

[0034] 200. Components of different materials;

[0035] 201, matching hole; 202, first plate; 203, second plate. DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. Figure 1-Figure 4 The processing device 100 according to the embodiment of the present invention is described.

[0037] like Figure 1 and Figure 2 As shown, the processing device 100 according to the embodiment of the present utility model includes a transmission structure 1 and a processing structure 2.

[0038] Specifically, the processing structure 2 and the transmission structure 1 are arranged along a first direction (eg Figure 1 The first laser zone 21 formed by the laser emitted by the processing structure 2 is suitable for irradiating the heterogeneous material component 200 located between the processing structure 2 and the conveying structure 1 to form a matching hole 201, and the central axis of the first laser zone 21 coincides with the central axis of the conveying structure 1.

[0039] For example, in Figure 1 , Figure 2 and Figure 6 In the example, the processing structure 2 is located above the heterogeneous material component 200, the transmission structure 1 is located below the heterogeneous material component 200, and the matching hole 201 penetrates the heterogeneous material component 200 in the vertical direction. It should be noted that the first laser area 21 refers to the area where the laser emitted by the processing structure 2 irradiates the heterogeneous material component 200, and the size of the first laser area 21 is the same as the size of the matching hole 201.

[0040] In this way, the matching hole 201 is directly formed on the heterogeneous material component 200 by using a laser. Compared with the conventional technology, the matching holes are first punched on the first plate and the second plate of the heterogeneous material component, and then the matching holes of the first plate and the matching holes of the second plate are compared in the vertical direction. This avoids the possibility of deviation and reduces the requirements for assembly accuracy, thereby reducing the difficulty of assembly. Moreover, the steps of aligning the matching holes 201 on the first plate 202 of the heterogeneous material component 200 with the matching holes 201 on the second plate 203 are also reduced, shortening the assembly time, reducing the labor cost, and thus reducing the production cost.

[0041] In addition, the central axis of the first laser zone 21 coincides with the central axis of the transmission structure 1, eliminating the need to align the fastener 3 placed on the transmission structure 1 with the matching hole 201. The transmission structure 1 can directly transmit the fastener 3 to the matching hole 201 to connect the heterogeneous material component 200, thereby improving the positioning accuracy of the transmission structure 1 and the matching hole 201, and reducing the difficulty of assembling the transmission structure 1 and the matching hole 201 of the heterogeneous material component 200, thereby improving the assembly efficiency and effect. In other words, the central axis of the first laser zone 21 coincides with the central axis of the transmission structure 1, so that the matching hole 201 coincides with the central axis of the transmission structure 1, thereby eliminating the need to align the fastener 3 with the matching hole 201. Through the coaxiality of the transmission structure 1 and the matching hole 201, the fastener 3 can be accurately transmitted to the matching hole 201. Moreover, the assembly accuracy of the transmission structure 1 and the matching hole 201 is also improved, which is convenient for welding in the subsequent process, improves the welding accuracy, and avoids the inability to assemble due to the tolerance accumulation caused by the welding process, which is convenient for subsequent assembly.

[0042] According to the processing device 100 of the utility model, a laser is used to directly form a matching hole 201 on the heterogeneous material component 200, which reduces the requirements for assembly accuracy compared to the conventional technology, thereby reducing the difficulty of assembly. Moreover, the assembly steps in the conventional technology are reduced, the assembly time is shortened, and the labor cost is reduced, thereby reducing the production cost. In addition, the alignment operation between the transmission structure 1 and the matching hole 201 is omitted, the positioning accuracy of the assembly of the transmission structure 1 and the matching hole 201 is improved, and the assembly difficulty of the transmission structure 1 and the matching hole 201 of the heterogeneous material component 200 is reduced, thereby improving the assembly efficiency and effect. Moreover, the assembly accuracy of the transmission structure 1 and the matching hole 201 is also improved, which is convenient for welding in the subsequent process and improves the welding accuracy.

[0043] According to some embodiments of the present invention, referring to Figure 2 , the central axis of the processing structure 2 coincides with the central axis of the first laser zone 21. Figure 2 In the example, the central axis of the processing structure 2 is opposite to the central axis of the first laser zone 21 in the vertical direction. Such a configuration effectively ensures that the central axis of the processing structure 2 coincides with the central axis of the matching hole 201, making it easy for the laser of the processing structure 2 to form the matching hole 201 in the first laser zone 21. In addition, it also effectively ensures that the central axis of the processing structure 2 is matched with the central axis of the conveying structure 1. After the matching hole 201 is formed by the processing structure 2, there is no need for positioning. The conveying structure 1 pushes the fastener 3 accurately into the matching hole 201, and only one assembly is required, which improves the assembly efficiency and the assembly accuracy.

[0044] According to some embodiments of the present invention, referring to Figure 2 and Figure 4 The conveying structure 1 is adapted to be movable toward or away from the heterogeneous material component 200. Figure 2 and Figure 4 In the example of , the conveying structure 1 can move in an upward or downward direction. The conveying structure 1 drives the fastener 3 to move upward until the fastener 3 is assembled into the matching hole 201, and then the conveying structure 1 moves downward, and the conveying structure 1 is separated from the fastener 3. In this way, the conveying structure 1 moves upward, which facilitates the initial assembly of the fastener 3 and the matching hole 201, and reduces the difficulty of assembling the fastener 3 and the matching hole 201. In addition, after the conveying structure 1 moves downward and the conveying structure 1 is separated from the fastener 3, it is convenient for the conveying structure 1 to be used next time, which improves the performance of the conveying structure 1.

[0045] Optionally, refer to Figure 5 , the cross-sectional shape of the first laser zone 21 is circular. With such arrangement, the laser of the processing structure 2 can rotate in the circumferential direction, and during the rotation, the distance between the laser emitting part of the processing structure 2 and the central axis of the processing structure 2 is equal, thereby reducing the difficulty of forming the first laser zone 21 and increasing the rate of forming the matching hole 201.

[0046] According to some embodiments of the present invention, referring to Figure 4 The second laser zone 22 formed by the laser emitted by the processing structure 2 is used to weld the fastener 3 placed in the matching hole 201 and the dissimilar material component 200, and the central axis of the second laser zone 22 coincides with the central axis of the transmission structure 1. Figure 4 In the example, the second laser area 22 is formed at substantially the same position as the first laser area 21. It should be noted that the second laser area 22 refers to the area where the laser emitted by the processing structure 2 irradiates the heterogeneous material component 200.

[0047] In this way, the same processing structure 2 is used to form and weld the matching hole 201. The formation path of the matching hole 201 is consistent with the welding path. Therefore, after the matching hole 201 is cut, the second laser zone 22 and the first laser zone 21 do not need to be accurately positioned, and direct welding can be performed in the second laser zone 22, which reduces the positioning steps and thus shortens the assembly time. Manual quick connection can also be used to improve the efficiency of welding, and it is also easy to realize industrial application in the vehicle industry. In addition, the processing structure 2 can realize the switching of cutting and welding, that is, the processing structure 2 uses laser to realize the integration of cutting and welding, which is easy to use, and also reduces the need for punching equipment, reduces the cost of equipment, and also reduces the space occupied by the processing device 100, which is convenient for the installation of the processing device 100. Among them, after the fastener 3 is inserted into the matching hole 201, the laser partially melts the upper end of the fastener 3 and the first plate 202, and the fastener 3 is fixed and connected with the heterogeneous material component 200, so that a welding riveting structure is formed between the heterogeneous material component 200 and the fastener 3. It should be noted that during the welding process, the penetration depth should be small, that is, the melting depth should be smaller than the thickness of the first plate 202 of the dissimilar material component 200 to avoid melting of the second plate 203 and only weld the fastener 3 to the first plate 202 .

[0048] According to some embodiments of the present invention, the laser power for forming the second laser zone 22 is less than the laser power for forming the first laser zone 21. Therefore, when forming the first laser zone 21, the power used is relatively large, which facilitates cutting the heterogeneous material component 200 to form the matching hole 201, thereby reducing the difficulty of forming the matching hole 201. In addition, when forming the second laser zone 22, the power used is relatively small, which facilitates welding and the welding operation, thereby reducing the difficulty of forming the second laser zone 22.

[0049] According to some embodiments of the present invention, referring to Figure 7 , the cross-sectional shape of the second laser zone 22 is circular. With such arrangement, the laser of the processing structure 2 can rotate in the circumferential direction, and during the rotation, the distance between the laser emitting part of the processing structure 2 and the central axis of the processing structure 2 is equal, thereby reducing the difficulty of forming the second laser zone 22 and increasing the rate of forming the matching hole 201.

[0050] According to some further embodiments of the present invention, in combination Figure 8 The laser emitted by the processing structure 2 extends in an S-shape along the circumference of the matching hole 201. With such a configuration, during the laser welding process, swing welding can be used to increase the width of the molten pool and reduce the molten depth. In addition, the width of the weld is also increased, further improving the reliability of welding.

[0051] According to some embodiments of the present invention, referring to Figure 2 and Figure 3The processing device 100 further includes a fastener 3, which can be detachably engaged with the conveying structure 1. For example, Figure 2 and Figure 3 In the example, the fastener 3 is located on the upper side of the conveying structure 1. During the assembly process, the conveying structure 1 drives the fastener 3 to move upward until the fastener 3 and the heterogeneous material component 200 are assembled. Then the conveying structure 1 moves downward, and the conveying structure 1 is separated from the fastener 3. Therefore, under the action of the conveying structure 1, it is easy to drive the fastener 3 to move, which improves the convenience of using the fastener 3. In addition, the first plate 202 and the second plate 203 of the heterogeneous material component 200 can be connected by the fastener 3, which improves the stability of the heterogeneous material component 200. It should be noted that the fastener 3 can be a rivet, but is not limited to this.

[0052] According to some embodiments of the present invention, referring to Figure 2 , the central axis of the fastener 3 coincides with the central axis of the transmission structure 1. This arrangement effectively ensures that the central axis of the fastener 3 coincides with the central axis of the matching hole 201, thereby reducing the difficulty of the fastener 3 extending into the matching hole 201, and further improving the assembly efficiency of the fastener 3 and the heterogeneous material component 200. In addition, the assembly accuracy of the fastener 3 and the heterogeneous material component 200 is also improved.

[0053] According to some embodiments of the present invention, the processing structure 2 is a laser instrument. The laser instrument can emit laser light, and has a simple structure and is easy to use, thereby facilitating the normal use of the processing structure 2 for a long time. In addition, the laser instrument is easy to obtain, thereby reducing the production cost of the processing structure 2.

[0054] Further, refer to Figure 1 The heterogeneous material assembly 200 includes a first plate 202 and a second plate 203. The first plate 202 and the second plate 203 are connected along the thickness direction of the first plate 202 (eg Figure 1 The first plate 202 and the second plate 203 are stacked in the vertical direction shown in the figure, and the materials of the first plate 202 and the second plate 203 are different. Figure 1 In the example, the first plate 202 is located on the upper side of the second plate 203. In this way, the first plate 202 and the second plate 203 are connected to form a dissimilar material assembly 200, which improves the structural strength of the dissimilar material assembly 200 and extends the service life of the dissimilar material assembly 200. But it is not limited to this. It should be noted that the first plate 202 can be placed on the upper part, and the second plate 203 can also be placed on the upper part, which is determined according to the weldability of the first plate 202 and the second plate 203 and the fastener 3 in actual use, and the one with good weldability is placed on the upper part. Among them, the dissimilar material assembly 200 can be aluminum alloy parts, high-strength steel parts, magnesium alloy parts, titanium alloy parts, carbon fiber material parts, etc.

[0055] According to some embodiments of the present invention, referring to Figure 1 and Figure 3 The fastener 3 includes a limiting section 31 and a fixing section 32 connected to each other. The limiting section 31 is located on the side of the second plate 203 away from the first plate 202, and one end of the fixing section 32 away from the limiting section 31 extends into and fits in the fitting hole 201. Figure 1 and Figure 3 In the example, the lower end of the fixing section 32 is connected to the upper side of the limiting section 31, the cross-sectional shape of the fastener 3 is roughly "T"-shaped, the limiting section 31 is located on the lower side of the second plate 203, and the upper end of the fixing section 32 extends into and fits in the fitting hole 201.

[0056] With such a configuration, after the fixing section 32 extends into the matching hole 201, the first plate 202 and the second plate 203 are preliminarily connected, which facilitates the subsequent welding of the upper end of the fixing section 32 with the first plate 202, and helps to further improve the connection stability between the fixing section 32 and the first plate 202. In addition, the limiting section 31 limits the fixing section 32 and the second plate 203. During the assembly of the fastener 3 and the matching hole 201, the limiting section 31 limits the fixing section 32 from continuing to move upward to define the assembly position of the fixing section 32. Moreover, after the fastener 3 is assembled with the heterogeneous material assembly 200, the second plate 203 is prevented from moving downward, thereby improving the stability of the connection between the first plate 202 and the second plate 203 and improving the use stability of the heterogeneous material assembly 200.

[0057] According to some optional embodiments of the present invention, referring to Fig. 9 and Fig.10 , along the direction from the first plate 202 to the second plate 203, the aperture of the matching hole 201 remains unchanged, or the aperture of the matching hole 201 gradually increases or decreases. Fig. 9 and Fig.10 In the example, along the direction from top to bottom, the aperture of the matching hole 201 remains unchanged, or the aperture of the matching hole 201 gradually increases or decreases. Fig. 9 ), the structure of the matching hole 201 is simple and easy to form, which reduces the difficulty of producing the matching hole 201. Moreover, the diameter of the fixing section 32 in the up-down direction remains unchanged, which also reduces the difficulty of producing the fastener 3. In addition, when the diameter of the matching hole 201 gradually increases from the top to the bottom (as shown in FIG. Fig.10When the fastener 3 is assembled with the mating hole 201, the side wall of the fixing section 32 is fitted with the side wall of the matching hole 201, and the diameter of the matching hole 201 at one end facing the fastener 3 is larger, which reduces the difficulty of assembling the fastener 3 with the matching hole 201, thereby improving the assembly efficiency of the fastener 3 and the heterogeneous material assembly 200. In addition, when the aperture of the matching hole 201 gradually decreases from the top to the bottom (not shown in the figure), the side wall of the fixing section 32 is fitted with the side wall of the matching hole 201, and the side wall of the matching hole 201 limits the fastener 3, thereby preventing the fastener 3 from falling off from the heterogeneous material assembly 200, and further improving the stability of the assembly of the fastener 3 and the heterogeneous material assembly 200. It should be noted that the angle between the side wall of the matching hole 201 and the straight line along the vertical direction can be 0° to 80°, that is, along the top to the bottom, the diameter of the fixing section 32 remains unchanged, or the diameter of the fixing section 32 gradually increases or decreases. The length of the fixing section 32 of the fastener 3 along the vertical direction is substantially equal to the thickness of the heterogeneous material component 200 along the vertical direction. The fastener 3 is made of a material having good weldability with the first plate 202 .

[0058] The steps for connecting the first plate 202 and the second plate 203 of the heterogeneous material assembly 200 are roughly as follows: Fig.11 As shown:

[0059] S1 , assembling the first plate 202 and the second plate 203 in the up and down direction into a heterogeneous material assembly 200 , and placing the heterogeneous material assembly 200 between the processing structure 2 and the conveying structure 1 .

[0060] S2, selecting a welding position, irradiating the first laser zone 21 formed by the laser of the processing structure 2 to the side of the first plate 202 away from the second plate 203, and then laser cutting the dissimilar material component 200 to form a matching hole 201 penetrating the dissimilar material component 200.

[0061] S3, move the conveying structure 1 upward, extend the fixing section 32 of the fastener 3 into the matching hole 201, and press it tightly.

[0062] S4, reducing the power of the laser for processing the structure 2, and the second laser zone 22 formed by the laser for processing the structure 2 is used for welding the fastener 3 placed in the matching hole 201 and the dissimilar material component 200.

[0063] S5, after the welding is completed, the conveying structure 1 moves downward and separates from the fastener 3, completing the connection between the dissimilar material assembly 200 and the fastener 3.

[0064] In the conventional technology, first, matching holes are formed on the first plate and the second plate of the heterogeneous material assembly respectively. Then, the first plate and the second plate are overlapped in the up and down direction, and the matching holes of the first plate and the matching holes of the second plate are aligned. Subsequently, the rivet is positioned with the matching hole, and the rivet is pushed to be assembled into the matching hole. Then, after positioning to the welding position, welding is performed. Three positionings are required. In the present application, the first plate 202 and the second plate 203 are first overlapped into a heterogeneous material assembly 200, and then a matching hole 201 is formed on the heterogeneous material assembly 200, and the central axis of the matching hole 201 coincides with the central axis of the conveying structure 1, and then the assembly is continued according to the above steps. During the assembly process, it is only necessary to position the processing structure 2 and the conveying structure 1 on the same central axis, which reduces the number of positionings, thereby helping to improve the assembly accuracy, shorten the assembly time, and improve the assembly efficiency.

[0065] The following two examples are used to explain in detail. When the heterogeneous material component 200 uses two different materials, the material of the fastener 3 can be selected according to the corresponding material to be welded with the fastener 3 (for example, a fastener 3 with a material having good welding performance with the heterogeneous material component 200 is selected) to improve the welding performance. At the same time, the operating parameters of the processing structure 2 during opening and welding can be adjusted accordingly:

[0066] Embodiment 1

[0067] Taking 5082 aluminum alloy parts and DP980 high-strength steel parts as an example, the cutting, riveting and welding hybrid welding device is used to achieve the connection:

[0068] S1, assembling a 5082 aluminum alloy part and a DP980 high-strength steel part to form a dissimilar material assembly 200, wherein the DP980 high-strength steel part is on the top and the 5082 aluminum alloy part is on the bottom, and then other components (such as a clamp) are used to clamp the welding position;

[0069] S2, the laser emitted by the processing structure 2 cuts the matching hole 201 with a diameter of 5 mm at the welding position of the assembled dissimilar material component 200. During the cutting process: the laser power is 1200 W, the speed is 50 mm / s, the defocus amount is +1.5 mm, and the cutting gas is argon;

[0070] S3, the conveying structure 1 delivers the fastener 3 (such as a rivet) with good weldability with the DP980 high-strength steel piece from the bottom into the matching hole 201, and presses the fastener 3.

[0071] S4, the laser emitted by the processing structure 2 performs swing welding on the cut part, with a swing width of 1.5 mm, to achieve the connection between the fastener 3 and the DP980 high-strength steel part. During the welding process: the laser power is 500 W, the speed is 80 mm / s, the defocus is +2 mm, and the welding gas is argon.

[0072] Embodiment 2

[0073] Taking 5082 aluminum alloy parts and carbon fiber composite parts as an example, the cutting, riveting and welding composite welding device is used to achieve the connection:

[0074] S1, assembling a 5082 aluminum alloy part and a carbon fiber composite part to form a dissimilar material assembly 200, wherein the 5082 aluminum alloy part is on top and the carbon fiber composite part is on the bottom, and then other components (such as a clamp) are used to clamp the welding position;

[0075] S2, the laser emitted by the processing structure 2 cuts the matching hole 201 with a diameter of 6 mm at the welding position of the assembled dissimilar material component 200. During the cutting process: the laser power is 2000 W, the speed is 50 mm / s, the defocus amount is -2 mm, and the cutting gas is argon;

[0076] S3, the conveying structure 1 delivers the fastener 3 having good weldability with the 5082 aluminum alloy part from the bottom into the matching hole 201, and pushes the fastener 3;

[0077] S4, the laser emitted by the processing structure 2 performs swing welding on the cut part, and the swing width is 1.5mm, so as to realize the connection between the fastener 3 and the 5082 aluminum alloy part. During the welding process: the laser power is 1000W, the speed is 100mm / s, the defocus is -4mm, and the welding gas is argon.

[0078] Other structures and operations of the processing device 100 according to the embodiment of the present invention are known to those skilled in the art and will not be described in detail here.

[0079] In the description of the present invention, it should be understood that the terms "center", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0080] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0081] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A processing device, characterized in that: include: Transmission structure; A processing structure, wherein the processing structure and the conveying structure are arranged at intervals along a first direction, and a first laser zone formed by the laser emitted by the processing structure is suitable for irradiating a heterogeneous material component located between the processing structure and the conveying structure to form a matching hole, and a central axis of the first laser zone coincides with a central axis of the conveying structure.

2. The processing device according to claim 1, characterized in that A central axis of the processing structure coincides with a central axis of the first laser zone.

3. The processing device according to claim 1, characterized in that The conveying structure is adapted to be movable toward or away from the dissimilar material assembly.

4. The processing device according to claim 1, characterized in that The cross-sectional shape of the first laser zone is circular.

5. The processing device according to claim 1, characterized in that The second laser zone formed by the laser emitted by the processing structure is used to weld the fastener placed in the matching hole and the dissimilar material component, and the central axis of the second laser zone coincides with the central axis of the transmission structure.

6. The processing device according to claim 5, characterized in that The laser power for forming the second laser region is lower than the laser power for forming the first laser region.

7. The processing device according to claim 5, characterized in that The cross-sectional shape of the second laser zone is circular; or The laser emitted by the processing structure extends in an S shape along the circumference of the matching hole.

8. The processing device according to claim 1, characterized in that Further including: A fastener is detachably engaged on the conveying structure.

9. The processing device according to claim 8, characterized in that The central axis of the fastener coincides with the central axis of the transmission structure.

10. The processing device according to any one of claims 1 to 9, characterized in that: The processing structure is a laser instrument.

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