Positioning device for parallel sealing and welding of semiconductor packaging shell

Abstract

The utility model discloses a positioning device for parallel seal welding of a semiconductor packaging shell, which comprises an upper positioning block and a lower positioning block, and the upper positioning block is provided with a limiting groove; the lower positioning block is movably installed on a linear guide rail and provided with a right-angle notch. The horizontal position of the bottom of the right-angle notch is higher than the upper surface of the tube shell placed on the semiconductor packaging shell placement position and lower than the upper surface of the metal cover plate placed on the semiconductor packaging shell placement position. According to the positioning device for parallel sealing and welding of the semiconductor packaging shell, the upper positioning block is used for positioning the tube shell, the lower positioning block is used for positioning the metal cover plate, the welding positions of the tube shell and the metal cover plate on the tube shell are more accurate after positioning, and compared with manual positioning, the positioning device has the advantages that the positioning efficiency is improved, and the labor intensity is reduced. The welding fixture is better in positioning stability and welding quality.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging equipment, in particular to a positioning device for parallel sealing of a semiconductor packaging shell. Background Art

[0002] The semiconductor package shell is welded by a tube shell and a metal cover plate covering the tube shell. The commonly used welding equipment for semiconductor package shells is a parallel sealing machine. When using a parallel sealing machine to weld the tube shell and the metal cover plate, the welding process requires that the roller of the parallel sealing machine must be accurately pressed on the metal cover plate and cannot touch any other parts outside the metal cover plate; the welding quality also requires that the metal cover plate and the tube shell must be flat and attached together, and the metal cover plate cannot exceed the edge of the tube shell, otherwise the airtightness cannot be achieved after welding. In other words, whether from the perspective of welding process requirements or from the perspective of the final welding quality of the semiconductor package shell, the tube shell and the metal cover plate are required to be accurately aligned during the welding process.

[0003] In the semiconductor package shell, although the edge width of the tube shell is 0.8~0.9mm, the edge width of the metal cover plate is about 0.32mm smaller than the edge width of the tube shell, resulting in a relatively small width of the welding surface between the tube shell and the metal cover plate of only about 0.6mm. In the case of a small welding surface, a slight positional deviation between the tube shell and the metal cover plate can have a greater impact on the welding, and the alignment of the tube shell and the metal cover plate is difficult. In the case of a high difficulty in alignment, the welding of existing semiconductor package shells is mostly done by workers. Worker positioning is time-consuming and labor-intensive, inefficient, and not suitable for large-scale mass production. In addition, the stability and accuracy are poor, making it difficult to achieve high-quality production. Utility Model Content

[0004] The utility model aims to provide a positioning device for parallel sealing of a semiconductor packaging shell.

[0005] The technical solution to achieve the purpose of the utility model is: a positioning device for parallel sealing welding of a semiconductor package shell, used to position the semiconductor package shell during welding, the semiconductor package shell comprising a tube shell with lead angle frames extending outward and downward on both sides and a metal cover plate covering the tube shell;

[0006] The positioning device for parallel sealing of the semiconductor package shell comprises an upper positioning block and a lower positioning block, wherein the upper positioning block is fixedly arranged, and a semiconductor package shell placement position is provided on the upper positioning block, and two horizontal and parallel limiting grooves are opened on the upper positioning block, and the two limiting grooves are located on the semiconductor package shell placement position and are used to limit the lead angle frames on both sides of the tube shell; the lower positioning block is movably installed on a straight line guide rail, and the straight line guide rail is horizontal and has an angle α with the limiting grooves, and the semiconductor package shell placement position is located on the moving path of the lower positioning block, and a right-angle notch is provided on the lower positioning block toward the semiconductor package shell placement position, and one side of the right-angle notch is parallel to the limiting groove, and the horizontal position of the bottom of the right-angle notch is higher than the upper surface of the tube shell placed on the semiconductor package shell placement position and lower than the upper surface of the metal cover plate placed on the semiconductor package shell placement position.

[0007] Furthermore, the upper positioning block is fixedly mounted on the welding table. Under this arrangement, the semiconductor package shell is placed on the semiconductor package shell placement position, and after being positioned by the positioning device for parallel sealing of the semiconductor package shell, it can be directly welded by the welding machine without moving, which can greatly improve the convenience and efficiency of operation.

[0008] Furthermore, the spacing between the two limiting grooves is consistent with the spacing between the angle frames on both sides of the tube shell. After the angle frames on both sides of the tube shell correspond to the two limiting grooves one by one and are inserted into the limiting grooves, the tube shell can be positioned by the angle frames on one side or by the angle frames on both sides. When the spacing between the two limiting grooves is consistent with the spacing between the angle frames on both sides of the tube shell, after the angle frames on both sides of the tube shell are inserted into the limiting grooves, the angle frames on both sides of the tube shell cannot be moved, and bilateral positioning is performed. Compared with unilateral positioning, bilateral positioning is directly fixed and cannot be moved, and its stability is better.

[0009] Furthermore, the lower positioning block is slidably or rollingly mounted on the linear guide rail.

[0010] Furthermore, the bottom surface of the lower positioning block is also provided with a clearance opening for making way for the tube shell. During operation, after the right-angle notch touches the metal cover plate, in order to prevent the tube shell from blocking the movement of the lower positioning block, the lower positioning block can smoothly push the metal cover plate forward to put the metal cover plate in place. Preferably, the bottom surface of the lower positioning block is also provided with a clearance opening for making way for the tube shell.

[0011] Furthermore, the linear guide rail and the upper positioning block are an integrated structure. The linear guide rail can be separated from the upper positioning block and provided separately, or it can be an integrated structure with the upper positioning block. Compared with the split structure, the integrated structure is convenient for installation and can also ensure the accuracy and stability of the relative position of the lower positioning block and the upper positioning block.

[0012] Furthermore, the linear guide rail is located on a side of the upper positioning block.

[0013] Furthermore, the angle α is an acute angle.

[0014] Furthermore, the angle α is 45°. In the 45° structure, after the right-angle notch touches the metal cover plate, under the pushing action of the right-angle notch, the metal cover plate pushes at the same speed and distance in two directions parallel to the two sides of the right-angle notch, which makes the setting simpler.

[0015] The positioning device for parallel welding of semiconductor package shells of the utility model is provided with the limiting groove on the upper positioning block, so that after the lead angle frame of the tube shell is inserted into the limiting groove, the upper positioning block can position the tube shell; at the same time, the lower positioning block is movably installed on the linear guide rail, so that after the metal cover plate is placed on the tube shell, the lower positioning block can be moved to approach and push the metal cover plate, push the metal cover plate into place, and position the metal cover plate. In this way, the tube shell and the metal cover plate thereon are both positioned, and after positioning, the welding position of the tube shell and the metal cover plate thereon is more accurate, and compared with manual positioning, the positioning device for parallel welding of semiconductor package shells of the utility model has better positioning stability, and the final welding quality is also more stable and better.

[0016] The positioning device for parallel welding of semiconductor package shell of the utility model is provided with a right-angled notch on the lower positioning block, one side of which is parallel to the limiting groove, so that the right-angled notch can limit one corner of the metal cover plate, and at the same time, an angle α is formed between the linear guide and the limiting groove, and the linear guide is inclined and non-parallel relative to the limiting groove of the upper positioning block. Under the structure of the inclined and non-parallel setting of the linear guide, the operation of the lower positioning block can be decomposed into movement in two directions, and the metal cover plate is pushed in two directions at the same time, that is, the lower positioning block can achieve the pushing and positioning of the metal cover plate in two directions with one movement. Compared with the structure of positioning the metal cover plate in two directions in sequence with two movements, the structure of the utility model that simultaneously achieves the positioning of the metal cover plate in two directions with one movement is simpler and has higher operation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1It is a schematic diagram of the structure of the semiconductor package shell in the positioning device for parallel sealing welding of the semiconductor package shell of the utility model;

[0018] Figure 2 It is a structural schematic diagram of a positioning device for parallel sealing welding of a semiconductor package shell of the utility model;

[0019] Figure 3 It is a three-dimensional structural schematic diagram of an upper positioning block and a linear guide rail in a positioning device for parallel sealing welding of a semiconductor package shell of the utility model;

[0020] Figure 4 It is a schematic diagram of the top structure of the upper positioning block and the linear guide rail in the positioning device for parallel sealing welding of the semiconductor package shell of the utility model;

[0021] Figure 5 It is a schematic diagram of the three-dimensional structure of the lower positioning block in the positioning device for parallel sealing welding of the semiconductor package shell of the utility model;

[0022] Figure 6 The utility model is a schematic structural diagram of the height relationship between the right-angle notch in the positioning device for parallel sealing welding of the semiconductor package shell, and the tube shell and the metal cover plate on the placement position of the semiconductor package shell. DETAILED DESCRIPTION

[0023] The preferred embodiment of the positioning device for parallel sealing of a semiconductor package shell of the present invention is described in detail below in conjunction with the accompanying drawings.

[0024] like Figures 1 to 6 As shown, a semiconductor package shell parallel sealing welding positioning device is used to position the semiconductor package shell 100 during the welding process, the semiconductor package shell 100 includes a tube shell 101 with lead angle frames 1011 extending outward and downward on both sides and a metal cover plate 102 covering the tube shell 101;

[0025] The positioning device for parallel sealing of the semiconductor package shell comprises an upper positioning block 1 and a lower positioning block 2. The upper positioning block 1 is fixedly arranged. The upper positioning block 1 is provided with a semiconductor package shell placement position 11. The upper positioning block 1 is provided with two horizontal and parallel limiting grooves 12. The two limiting grooves 12 are located on the semiconductor package shell placement position 11 and are used to limit the lead angle frame 1011 on both sides of the tube shell 101; the lower positioning block 2 can be movably installed on a straight line guide rail 3, and the straight line guide rail 3 is horizontal and parallel to the limiting grooves. There is an angle α between the grooves 12, the semiconductor package shell placement position 11 is located on the moving path of the lower positioning block 2, and the lower positioning block 2 is provided with a right-angle notch 21 facing the semiconductor package shell placement position 11, and one side 211 of the right-angle notch 21 is parallel to the limiting groove 12, and the horizontal position of the bottom of the right-angle notch 21 is higher than the upper surface of the tube shell 101 placed on the semiconductor package shell placement position 11, and lower than the upper surface of the metal cover plate 102 placed on the semiconductor package shell placement position 11.

[0026] The positioning device for parallel welding of semiconductor package shell of the utility model is used in welding of the semiconductor package shell 100. The semiconductor package shell 100 comprises the tube shell 101 and the metal cover plate 102 covering the tube shell 101, and the two sides of the tube shell 101 extend outward and downward to form the lead angle frame 1011. The positioning device for parallel welding of semiconductor package shell of the utility model is used to position the tube shell 101 and the metal cover plate 102 to be welded to form the semiconductor package shell 100.

[0027] The positioning device for parallel sealing of semiconductor package shell of the utility model comprises the upper positioning block 1 and the lower positioning block 2. After the limiting groove 12 is provided on the upper positioning block 1, the guide angle frame 1011 of the tube shell 101 is inserted into the limiting groove 12 to position the tube shell 101. The lower positioning block 2 is used to position the metal cover plate 102; the right-angle notch 21 is provided on the lower positioning block 2, and the right-angle notch 21 is used to adapt to one corner of the metal cover plate 102; the lower positioning block 2 is installed on the linear guide rail 3 and can move horizontally along the linear guide rail 3; the semiconductor package shell placement position 11 is located on the moving path of the lower positioning block 2, and the lower positioning block 2 moving horizontally along the linear guide rail 3 can move away from and approach the upper positioning block 1 to realize opening and closing with the upper positioning block 1; there is an angle α between the linear guide rail 3 and the limiting groove 12, and the linear guide rail 3 is relative to the limiting groove of the upper positioning block 1. 12 is arranged tilted and non-parallel. After moving along the tilted and non-parallel linear guide rail 3, the operation of the lower positioning block 2 can be decomposed into movement in two directions, so as to simultaneously realize the pushing of the metal cover plate 102 in two directions; the semiconductor package shell 100 is placed on the semiconductor package shell placement position 11, and the horizontal position of the bottom of the right-angle notch 21 is higher than the upper surface of the tube shell 101 placed on the semiconductor package shell placement position 11, and lower than the upper surface of the metal cover plate 102 placed on the semiconductor package shell placement position 11. This arrangement enables the lower positioning block 2 to push the metal cover plate 102 without pushing the tube shell 101.

[0028] The positioning device for parallel sealing of semiconductor package shells of the utility model, when in use, firstly places the semiconductor package shell 100 on the semiconductor package shell placement position 11 of the upper positioning block 1, specifically, the lead angle frames 1011 on both sides of the tube shell 101 correspond to the two limiting grooves 12 on the upper positioning block 1 one by one, the lead angle frames 1011 are inserted into the corresponding limiting grooves 12, and under the limiting action of the lead angle frames 1011 and the limiting grooves 12, the tube shell 101 is positioned on the upper positioning block 1; then, the metal cover plate 102 is placed on the tube shell 101, and the metal cover plate 102 placed on the tube shell 101 slightly deviates from the tube shell 10 1, and placed toward the side close to the lower positioning block 2; then, move the lower positioning block 2 to make it close to the semiconductor package shell placement position 11; in the process of the lower positioning block 2 approaching the semiconductor package shell placement position 11, the right-angle notch 21 of the lower positioning block 2 is adapted to a corner of the metal cover plate 102, and while correcting the position of the metal cover plate 102, it also touches the metal cover plate 102 to push the metal cover plate 102; the end point of the stroke of the lower positioning block 2 is set as the position where the metal cover plate 102 is to be positioned, and after the metal cover plate 102 reaches the end point of the stroke, the metal cover plate 102 is also in place to achieve the final positioning. After the tube shell 101 and the metal cover plate 102 covering it are positioned, the lower positioning block 2 is moved to move away from the semiconductor package shell placement position 11, away from the tube shell 101 and the metal cover plate 102 covering it, and then the positioned tube shell 101 and the metal cover plate 102 are welded.

[0029] The positioning device for parallel welding of semiconductor package shells of the utility model is provided with the limiting groove 12 on the upper positioning block 1, so that after the lead angle frame 1011 of the tube shell 101 is inserted into the limiting groove 12, the upper positioning block 1 can position the tube shell 101; at the same time, by movably installing the lower positioning block 2 on the linear guide rail 3, after the metal cover plate 102 is placed on the tube shell 101, the lower positioning block 2 can be moved to approach and push the metal cover plate 102, push the metal cover plate 102 into place, and position the metal cover plate 102. In this way, the tube shell 101 and the metal cover plate 102 thereon are both positioned, and after positioning, the welding positions of the tube shell 101 and the metal cover plate 102 thereon are more accurate, and compared with manual positioning, the positioning device for parallel welding of semiconductor package shells of the utility model has better positioning stability, and the final welding quality is also more stable and better.

[0030] The positioning device for parallel sealing of semiconductor package shell of the utility model is provided with the right-angled notch 21 whose side 211 is parallel to the limiting groove 12 on the lower positioning block 2, so that the right-angled notch 21 can limit one corner of the metal cover plate 102, and at the same time, the linear guide rail 3 and the limiting groove 12 have an angle α, and the linear guide rail 3 is inclined and non-parallel relative to the limiting groove 12 of the upper positioning block 1. Under the structure of the inclined and non-parallel setting of the linear guide rail 3, the operation of the lower positioning block 2 can be decomposed into movement in two directions, and the metal cover plate 102 is pushed in two directions at the same time, that is, the lower positioning block 2 can realize the pushing and positioning of the metal cover plate 102 in two directions with one movement. Compared with the structure of positioning the metal cover plate 102 in two directions in sequence with two movements, the structure of the utility model that realizes the positioning of the metal cover plate 102 in two directions with one movement at the same time is simpler and has higher operation efficiency.

[0031] The positioning device for parallel welding of semiconductor package shells of the utility model is preferably configured such that the upper positioning block 1 is fixedly mounted on the welding table 10. Under this configuration, the semiconductor package shell 100 is placed on the semiconductor package shell placement position 11, and after being positioned by the positioning device for parallel welding of the semiconductor package shell, it can be directly welded by the welding machine without moving, which can greatly improve the convenience and efficiency of operation.

[0032] In the positioning device for parallel welding of the semiconductor package shell of the utility model, preferably, the spacing between the two limiting grooves 12 is consistent with the spacing between the lead angle frames 1011 on both sides of the tube shell 101. After the lead angle frames 1011 on both sides of the tube shell 101 correspond to the two limiting grooves 12 one by one and are inserted into the limiting grooves 12, the tube shell 101 can be positioned by the single-sided lead angle frame 1011 or by the double-sided lead angle frame 1011. When the spacing between the two limiting grooves 12 is consistent with the spacing between the lead angle frames 1011 on both sides of the tube shell 101, after the lead angle frames 1011 on both sides of the tube shell 101 are inserted into the limiting grooves 12, the lead angle frames 1011 on both sides of the tube shell 101 cannot be moved, and double-sided positioning is performed. Compared with single-sided positioning, double-sided positioning is directly fixed and cannot be moved, and its stability is better.

[0033] In the positioning device for parallel sealing of semiconductor package shells of the utility model, the lower positioning block 2 is slidably or rollingly installed on the linear guide rail 3 (not shown).

[0034] The positioning device for parallel sealing of semiconductor package shell of the utility model is preferably provided with a clearance opening 22 on the bottom surface of the lower positioning block 2 for making way for the tube shell 101. During operation, after the right-angle notch 21 touches the metal cover plate 102, in order to prevent the tube shell 101 from blocking the movement of the lower positioning block 2, the lower positioning block 2 can smoothly push the metal cover plate 102 forward to put the metal cover plate 102 in place. Preferably, the bottom surface of the lower positioning block 2 is also provided with a clearance opening 22 for making way for the tube shell 101.

[0035] In the positioning device for parallel sealing of semiconductor package shell of the utility model, preferably, the linear guide 3 and the upper positioning block 1 are an integral structure. The linear guide 3 can be separated from the upper positioning block 1 and set separately, or it can be an integral structure with the upper positioning block 1. Compared with the split structure, the integral structure is convenient for installation and can also ensure the accuracy and stability of the relative position of the lower positioning block 2 and the upper positioning block 1.

[0036] In the positioning device for parallel sealing of a semiconductor package shell of the utility model, preferably, the linear guide rail 3 is located on the side of the upper positioning block 1 .

[0037] The utility model discloses a positioning device for parallel sealing welding of a semiconductor packaging shell, wherein the angle α is an acute angle.

[0038] In the positioning device for parallel sealing of semiconductor package shell of the utility model, preferably, the angle α is 45°. In the 45° structure, after the right-angle notch 21 touches the metal cover plate 102, under the pushing action of the right-angle notch 21, the metal cover plate 102 has the same pushing speed and the same pushing distance in two directions parallel to the two sides of the right-angle notch 21, which is simpler to set.

[0039] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, is also included in the patent protection scope of the present invention.

Claims

1. A positioning device for parallel sealing of a semiconductor package shell, used for positioning a semiconductor package shell during welding, wherein the semiconductor package shell comprises a tube shell with lead frames extending outward and downward on both sides and a metal cover plate covering the tube shell; characterized in that: The positioning device for parallel sealing of the semiconductor package shell comprises an upper positioning block and a lower positioning block, wherein the upper positioning block is fixedly arranged, and a semiconductor package shell placement position is provided on the upper positioning block, and two horizontal and parallel limiting grooves are opened on the upper positioning block, and the two limiting grooves are located on the semiconductor package shell placement position and are used to limit the lead angle frames on both sides of the tube shell; the lower positioning block is movably installed on a straight line guide rail, and the straight line guide rail is horizontal and has an angle α with the limiting grooves, and the semiconductor package shell placement position is located on the moving path of the lower positioning block, and a right-angle notch is provided on the lower positioning block toward the semiconductor package shell placement position, and one side of the right-angle notch is parallel to the limiting groove, and the horizontal position of the bottom of the right-angle notch is higher than the upper surface of the tube shell placed on the semiconductor package shell placement position and lower than the upper surface of the metal cover plate placed on the semiconductor package shell placement position.

2. The positioning device for parallel welding of a semiconductor package shell according to claim 1, characterized in that: The upper positioning block is fixedly installed on the welding table.

3. The positioning device for parallel sealing of a semiconductor package shell according to claim 1, characterized in that: The distance between the two limiting grooves is consistent with the distance between the lead angle frames on both sides of the tube shell.

4. The positioning device for parallel sealing of a semiconductor package shell according to claim 1, characterized in that: The lower positioning block is slidably or rollingly mounted on the linear guide rail.

5. The positioning device for parallel sealing of a semiconductor package shell according to claim 1, characterized in that: The bottom surface of the lower positioning block is also provided with a making way opening for making way for the tube shell.

6. The positioning device for parallel sealing of a semiconductor package shell according to claim 1, characterized in that: The linear guide rail and the upper positioning block are an integrated structure.

7. The positioning device for parallel sealing of a semiconductor package shell according to claim 1, characterized in that: The linear guide rail is located on the side of the upper positioning block.

8. The positioning device for parallel sealing of a semiconductor package shell according to claim 1, characterized in that: The angle α is an acute angle.

9. The positioning device for parallel sealing of a semiconductor package shell according to claim 8, characterized in that: The angle α is 45°.

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