Semiconductor thermoelectric material cutting device

Abstract

The utility model relates to the technical field of semiconductor thermoelectric material processing, and discloses a semiconductor thermoelectric material cutting device which comprises a processing table, the top of the processing table is fixedly connected with an inverted-U-shaped plate, the top of the inverted-U-shaped plate is detachably provided with a push rod motor, and the driving end of the push rod motor is fixedly connected with a connecting plate. A rectangular connecting groove is formed in the front end of the connecting plate. The distance between the adjacent cutting knives can be adjusted by screwing the fixing bolts, then the connecting plate is pushed by the push rod motor to move downwards, then the U-shaped pressing plate is in contact with the semiconductor thermoelectric material firstly, and meanwhile, the spring is compressed to extrude and limit the semiconductor thermoelectric material; and then the connecting plate continues to move to enable the cutting knife to make contact with the semiconductor thermoelectric materials for cutting, then the U-shaped pressing plate can conduct limiting cutting on the semiconductor thermoelectric materials of different lengths, the semiconductor thermoelectric materials of different lengths can be cut at the same time, and the efficiency of cutting the semiconductor thermoelectric materials of different lengths is further improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor thermoelectric material processing, in particular to a semiconductor thermoelectric material cutting device. Background Art

[0002] Semiconductor thermoelectric materials refer to semiconductor materials with a large thermoelectric effect, also known as thermoelectric materials. They can directly convert thermal energy into electrical energy, or directly generate cooling from electrical energy. In the production process of semiconductor thermoelectric materials, it is often necessary to cut them.

[0003] The existing patent (publication number: CN202020667820.7) discloses a semiconductor thermoelectric material cutting device, comprising a workbench, to which a bracket is fixedly connected, and a first cylinder is arranged on the bracket, the output end of the first cylinder is fixedly connected to a concave frame, and a cutting blade is rotatably connected to the concave frame, and a driving motor is connected to a rotating shaft on one side of the cutting blade, two placement blocks are fixedly connected to the upper side wall of the workbench, two slots are provided on the placement blocks, and arc-shaped clamping blocks are inserted in the slots, a cavity is provided on the workbench, and a vacuum cleaner is arranged in the cavity.

[0004] In the process of realizing the utility model, the inventors found that there are at least the following problems in the prior art that have not been solved: the utility model can quickly stabilize semiconductor thermoelectric materials and avoid the labor loss of human support and stabilization. In addition, the device can eliminate the powder generated during the cutting process in real time to avoid powder pollution of the environment. However, the existing second cylinder is fixedly installed, and thus cannot clamp and cut semiconductor thermoelectric materials that are smaller than the distance between the two arc-shaped clamps. It has low applicability and can only cut semiconductor thermoelectric materials of the same length. It is impossible to cut semiconductor thermoelectric materials of different lengths at the same time. Furthermore, cutting semiconductor thermoelectric materials of different lengths requires multiple repeated operations, which affects the cutting efficiency. Therefore, we propose a semiconductor thermoelectric material cutting device. Utility Model Content

[0005] The purpose of the utility model is to provide a semiconductor thermoelectric material cutting device to solve the problems raised in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor thermoelectric material cutting device comprises a processing table, the top of the processing table is fixedly connected with an inverted U-shaped plate, the top of the inverted U-shaped plate is detachably installed with a push rod motor, the driving end of the push rod motor is fixedly connected with a connecting plate, the front end of the connecting plate is provided with a rectangular connecting groove, the bottom of the connecting plate is provided with a through hole, the through hole and the rectangular connecting groove are interconnected, and a plurality of sliders are slidably connected in the rectangular connecting groove, the front ends of the plurality of sliders are threadedly connected with fixing bolts, and the bottoms of the plurality of sliders are fixedly connected with fixing plates on both sides, and a cutting mechanism is installed between the two fixing plates; the opposite ends of the two fixing plates are provided with adjusting grooves, the adjusting grooves on the two fixing plates are slidably installed with adjusting blocks, the adjusting blocks on the two fixing plates are fixedly connected with U-shaped pressure plates, and the adjusting grooves on the two fixing plates are fixedly connected with springs.

[0007] As an optional solution of the technical solution of the present application, the surface of the processing table is engraved with scale lines, bolts are rotatably passed through both ends of the inverted U-shaped plate, and the two bolts are spirally connected to the inverted U-shaped plate, and the opposite ends of the two bolts are rotatably connected with clamps, and the two clamps are in contact with the surface of the processing table.

[0008] As an optional solution of the technical solution of the present application, the interior of the processing table is a hollow structure, an air collecting hopper is fixedly connected to the top of the inner cavity of the processing table, a vacuum cleaner is installed on one side of the bottom of the inner cavity of the processing table, a dust suction pipe is connected between the dust suction end of the vacuum cleaner and the air collecting hopper, and a dust suction port is opened on the surface of the processing table.

[0009] As an optional solution of the technical solution of the present application, an arc-shaped groove is opened at the bottom of the U-shaped pressure plate, and a rubber pad is fixedly connected in the arc-shaped groove.

[0010] As an optional solution of the technical solution of the present application, the cutting mechanism includes a driving motor and a cutting knife, the cutting knife is rotatably connected between the two fixed plates, the driving motor is detachably mounted on the outer side of the fixed plate, and the motor shaft of the driving motor is fixedly connected to the cutting knife.

[0011] As an optional solution of the technical solution of the present application, guide grooves are provided on both sides of the inner cavity of the inverted U-shaped plate, guide blocks are slidably connected in the two guide grooves, and the two guide blocks are fixedly connected to the two ends of the support plate respectively.

[0012] As an optional solution of the technical solution of the present application, an exhaust hole is opened on one side of the bottom of the processing table, and the exhaust hole is placed at the exhaust end of the vacuum cleaner.

[0013] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0014] The technical solution of the present application is provided with a push rod motor, a connecting plate, a rectangular connecting groove, a through hole, a slider, a fixing bolt, a fixing plate, a driving motor, a cutting knife, an adjusting groove, an adjusting block, a U-shaped pressure plate and a spring. By turning the fixing bolt, the spacing between adjacent cutting knives can be adjusted, and then the connecting plate is pushed downward by the push rod motor, so that the U-shaped pressure plate first contacts the semiconductor thermoelectric material, and at the same time compresses the spring to squeeze and limit the semiconductor thermoelectric material, and then the connecting plate continues to move to make the cutting knife contact the semiconductor thermoelectric material for cutting, and then the U-shaped pressure plate can limit the cutting of semiconductor thermoelectric materials of different lengths, and can cut semiconductor thermoelectric materials of different lengths at the same time, further improving the efficiency of cutting semiconductor thermoelectric materials of different lengths. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0016] Figure 1 This is an overall stereogram of a semiconductor thermoelectric material cutting device of the utility model;

[0017] Figure 2 This is a front view of the connection between the connecting plate and the fixing plate of a semiconductor thermoelectric material cutting device of the utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of a processing table of a semiconductor thermoelectric material cutting device of the utility model;

[0019] Figure 4 This is a front view of the connection between a fixing plate and a U-shaped pressing plate of a semiconductor thermoelectric material cutting device of the utility model;

[0020] Figure 5 This is an enlarged view of point A of a semiconductor thermoelectric material cutting device of the present utility model.

[0021] In the figure: 1. processing table; 101. dust suction port; 102. scale line; 103. exhaust hole; 2. inverted U-shaped plate; 201. bolt; 202. guide groove; 203. guide block; 3. push rod motor; 4. connecting plate; 401. rectangular connecting groove; 402. slider; 403. through hole; 5. fixing plate; 501. adjustment block; 502. adjustment groove; 6. splint; 7. fixing bolt; 8. U-shaped pressure plate; 801. arc groove; 802. rubber pad; 9. driving motor; 10. cutting knife; 11. air collecting hopper; 12. vacuum cleaner; 1201. dust suction pipe; 13. spring. DETAILED DESCRIPTION

[0022] Example 1

[0023] See also Figure 1-5 The utility model provides a technical solution: a semiconductor thermoelectric material cutting device, comprising a processing table 1, an inverted U-shaped plate 2 is fixedly connected to the top of the processing table 1, a push rod motor 3 is detachably installed on the top of the inverted U-shaped plate 2, a connecting plate 4 is fixedly connected to the driving end of the push rod motor 3, a rectangular connecting groove 401 is provided at the front end of the connecting plate 4, a through hole 403 is provided at the bottom of the connecting plate 4, the through hole 403 and the rectangular connecting groove 401 are communicated with each other, and a plurality of sliders 402 are slidably connected in the rectangular connecting groove 401, and the front ends of the plurality of sliders 402 are all threadedly connected with fixing bolts 7, the head size of the fixing bolt 7 is larger than the width of the rectangular connecting groove 401, and the plurality of sliders 402 are slidably connected in the rectangular connecting groove 401. Both sides of the bottom of the block 402 are fixedly connected with fixed plates 5, and a cutting mechanism is installed between the two fixed plates 5. The cutting mechanism includes a driving motor 9 and a cutting knife 10. The cutting knife 10 is rotatably connected between the two fixed plates 5. The driving motor 9 is detachably installed on the outer side of the fixed plate 5, and the motor shaft of the driving motor 9 is fixedly connected to the cutting knife 10; an adjustment groove 502 is opened at the opposite end of the two fixed plates 5, and an adjustment block 501 is slidably installed in the adjustment groove 502 on the two fixed plates 5, and a U-shaped pressure plate 8 is fixedly connected to the adjustment block 501 on the two fixed plates 5, and a spring 13 is fixedly connected in the adjustment groove 502 on the two fixed plates 5.

[0024] In this technical solution, through the arrangement of the push rod motor 3, the connecting plate 4, the rectangular connecting groove 401, the through hole 403, the slider 402, the fixing bolt 7, the fixing plate 5, the driving motor 9, the cutting knife 10, the adjusting groove 502, the adjusting block 501, the U-shaped pressure plate 8 and the spring 13, the spacing between adjacent cutting knives 10 can be adjusted by twisting the fixing bolt 7, and then the connecting plate 4 is pushed downward by the push rod motor 3, and then the U-shaped pressure plate 8 first contacts the semiconductor thermoelectric material, and at the same time compresses the spring 13 to squeeze and limit the semiconductor thermoelectric material, and then the connecting plate 4 continues to move to make the cutting knife 10 contact the semiconductor thermoelectric material for cutting, and then the U-shaped pressure plate 8 can limit the cutting of semiconductor thermoelectric materials of different lengths, and can simultaneously cut out semiconductor thermoelectric materials of different lengths, further improving the efficiency of cutting semiconductor thermoelectric materials of different lengths.

[0025] In some technical solutions, the interior of the processing table 1 is a hollow structure, and an air collecting hopper 11 is fixedly connected to the top of the inner cavity of the processing table 1. A vacuum cleaner 12 is installed on one side of the bottom of the inner cavity of the processing table 1. A dust suction pipe 1201 is connected between the dust suction end of the vacuum cleaner 12 and the air collecting hopper 11, and a dust suction port 101 is opened on the surface of the processing table 1.

[0026] In this technical solution, through the arrangement of the air collecting hopper 11, the vacuum cleaner 12, the vacuum pipe 1201 and the vacuum port 101, when the semiconductor thermoelectric material is cut, the vacuum cleaner 12 is started to generate negative pressure at the vacuum port 101, so that the debris generated by the cutting can be sucked into the vacuum cleaner 12 for collection, thereby preventing the debris generated by the cutting from being inhaled by personnel and causing injuries, and preventing the debris from splashing and polluting the working environment.

[0027] In some technical solutions, an arc-shaped groove 801 is provided at the bottom of the U-shaped pressing plate 8 , and a rubber pad 802 is fixedly connected in the arc-shaped groove 801 .

[0028] In this technical solution, by providing the arc groove 801 and the rubber pad 802, the arc groove 801 increases the contact area between the U-shaped pressure plate 8 and the semiconductor thermoelectric material, and the rubber pad 802 increases the friction between the U-shaped pressure plate 8 and the semiconductor thermoelectric material, further improving the stability of the U-shaped pressure plate 8 in limiting the semiconductor thermoelectric material.

[0029] In some technical solutions, guide grooves 202 are provided on both sides of the inner cavity of the inverted U-shaped plate 2, guide blocks 203 are slidably connected in the two guide grooves 202, and the two guide blocks 203 are fixedly connected to the two ends of the support plate respectively.

[0030] In this technical solution, by providing the guide groove 202 and the guide block 203 , the up and down movement of the connecting plate 4 can be guided, thereby further improving the stability of the up and down movement of the connecting plate 4 .

[0031] In some technical solutions, an exhaust hole 103 is opened on one side of the bottom of the processing table 1, and the exhaust hole 103 is placed at the exhaust end of the vacuum cleaner 12.

[0032] In this technical solution, the exhaust hole 103 is provided to facilitate the exhaust of the vacuum cleaner 12, which is further conducive to the vacuum cleaner 12 collecting the debris generated by cutting.

[0033] Example 2

[0034] The difference between this embodiment and embodiment 1 is that: the surface of the processing table 1 is engraved with scale lines 102, bolts 201 are rotatably passed through both ends of the inverted U-shaped plate 2, and the two bolts 201 are spirally connected to the inverted U-shaped plate 2, and the opposite ends of the two bolts 201 are rotatably connected to the clamping plates 6, and the two clamping plates 6 are in contact with the surface of the processing table 1.

[0035] In this technical solution, by setting the scale line 102, the bolt 201 and the clamp 6, the bolt 201 is turned to drive the clamp 6 to approach and contact the two ends of the semiconductor thermoelectric material, and then the length of the semiconductor thermoelectric material can be quickly measured in conjunction with the scale line 102, so that the position of the cutting knife 10 is adjusted according to the scale line 102 to achieve the required length of the semiconductor thermoelectric material to be cut.

[0036] When in use, first, place the semiconductor thermoelectric material on the processing table 1, then tighten the bolt 201 to drive the clamping plate 6 to approach and contact the two ends of the semiconductor thermoelectric material, and then cooperate with the scale line 102 to quickly measure the length of the semiconductor thermoelectric material, and then screw the fixing bolt 7 according to the scale line 102 to adjust the distance between adjacent cutting knives 10, so as to adjust the position of the cutting length of the semiconductor thermoelectric material cut by the cutting knife 10, and then push the connecting plate 4 downward by the push rod motor 3, and then the U-shaped pressure plate 8 first contacts the semiconductor thermoelectric material, and then the arc groove 801 increases the contact area of ​​the U-shaped pressure plate 8 and the semiconductor thermoelectric material, and at the same time the rubber pad 802 increases the friction between the U-shaped pressure plate 8 and the semiconductor thermoelectric material, further improving The high U-shaped pressure plate 8 limits the stability of the semiconductor thermoelectric material, and at the same time compresses the spring 13 to squeeze and limit the semiconductor thermoelectric material, and then the connecting plate 4 continues to move to make the cutting knife 10 contact the semiconductor thermoelectric material for cutting, so that the U-shaped pressure plate 8 can limit the cutting of semiconductor thermoelectric materials of different lengths, and can simultaneously cut out semiconductor thermoelectric materials of different lengths, further improving the efficiency of cutting semiconductor thermoelectric materials of different lengths, and when cutting the semiconductor thermoelectric material, start the vacuum cleaner 12 to generate negative pressure at the suction port 101, so that the debris generated by the cutting can be sucked into the vacuum cleaner 12 for collection, thereby avoiding the debris generated by the cutting from being inhaled by people and causing injuries, and avoiding the splashing of debris to pollute the working environment.

Claims

1. A semiconductor thermoelectric material cutting device, comprising a processing table (1), characterized in that: The top of the processing table (1) is fixedly connected to an inverted U-shaped plate (2), the top of the inverted U-shaped plate (2) is detachably mounted with a push rod motor (3), the driving end of the push rod motor (3) is fixedly connected to a connecting plate (4), the front end of the connecting plate (4) is provided with a rectangular connecting groove (401), the bottom of the connecting plate (4) is provided with a through hole (403), the through hole (403) and the rectangular connecting groove (401) are interconnected, and a plurality of sliders (402) are slidably connected in the rectangular connecting groove (401), the front ends of the plurality of sliders (402) are all threadedly connected with fixing bolts (7), and the bottoms of the plurality of sliders (402) are fixedly connected to fixing plates (5) on both sides, and a cutting mechanism is installed between the two fixing plates (5); An adjustment groove (502) is provided at the opposite end of the two fixing plates (5), an adjustment block (501) is slidably installed in the adjustment groove (502) on the two fixing plates (5), a U-shaped pressure plate (8) is fixedly connected to the adjustment block (501) on the two fixing plates (5), and a spring (13) is fixedly connected to the adjustment groove (502) on the two fixing plates (5).

2. A semiconductor thermoelectric material cutting device according to claim 1, characterized in that: The surface of the processing table (1) is engraved with scale lines (102); bolts (201) are rotatably passed through both ends of the inverted U-shaped plate (2), and the two bolts (201) are spirally connected to the inverted U-shaped plate (2); the opposite ends of the two bolts (201) are rotatably connected to clamps (6), and the two clamps (6) are in contact with the surface of the processing table (1).

3. A semiconductor thermoelectric material cutting device according to claim 1, characterized in that: The interior of the processing table (1) is a hollow structure, the top of the inner cavity of the processing table (1) is fixedly connected to an air collecting hopper (11), a vacuum cleaner (12) is installed on one side of the bottom of the inner cavity of the processing table (1), a vacuum pipe (1201) is connected between the vacuum end of the vacuum cleaner (12) and the air collecting hopper (11), and a vacuum port (101) is provided on the surface of the processing table (1).

4. A semiconductor thermoelectric material cutting device according to claim 1, characterized in that: An arc-shaped groove (801) is provided at the bottom of the U-shaped pressing plate (8), and a rubber pad (802) is fixedly connected inside the arc-shaped groove (801).

5. The semiconductor thermoelectric material cutting device according to claim 1, characterized in that: The cutting mechanism comprises a driving motor (9) and a cutting knife (10); the cutting knife (10) is rotatably connected between the two fixing plates (5); the driving motor (9) is detachably mounted on one side of the outside of the fixing plate (5); and the motor shaft of the driving motor (9) is fixedly connected to the cutting knife (10).

6. The semiconductor thermoelectric material cutting device according to claim 1, characterized in that: Guide grooves (202) are provided on both sides of the inner cavity of the inverted U-shaped plate (2), guide blocks (203) are slidably connected in the two guide grooves (202), and the two guide blocks (203) are fixedly connected to the two ends of the support plate respectively.

7. A semiconductor thermoelectric material cutting device according to claim 3, characterized in that: An exhaust hole (103) is provided on one side of the bottom of the processing table (1), and the exhaust hole (103) is placed at the exhaust end of the vacuum cleaner (12).

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