Millimeter wave isolation transmission packaging structure

Abstract

The utility model discloses a millimeter wave isolation transmission packaging structure, which comprises a first base island, a second base island, a first chip, a second chip, a first plastic package body, a second plastic package body, a first antenna and a second antenna, and is characterized in that the bottom of the first base island is provided with a first material reduction area; a second subtractive area is arranged at the bottom of the second base island, and a gap is formed between the second base island and the first base island; the first chip is arranged on the first base island and corresponds to the first subtractive area; the second chip is arranged on the second base island and corresponds to the second subtractive area; the first plastic package body is connected with the first base island and the second base island and fills the first subtractive material area and the second subtractive material area. The second plastic package body is positioned above the first base island and the second base island and is respectively connected with the first base island, the second base island and the first plastic package body; the first antenna is arranged at the gap; and the second antenna is arranged at the gap and is in wireless communication connection with the first antenna. According to the millimeter wave isolation transmission packaging structure, the carrier strength and the voltage-withstanding isolation level are both considered.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging, in particular to a millimeter wave isolation transmission packaging structure. Background Art

[0002] Millimeter wave transmission requires transceiver chip + transceiver antenna as an overall solution. The traditional millimeter wave isolation transmission packaging structure is generally large and thick. If the thin and small QFN / DFN packaging process is applied to the millimeter wave isolation transmission packaging structure, the bottom carrier pad used for support needs to be hidden or even removed, otherwise the exposed bottom carrier pad will make the packaging structure fail to meet the isolation requirements. Currently, there are two processes in the industry to solve this problem: MIS process and HFBP process. The MIS process generates a carrier by combining a substrate RDL process with an EMC process, while the HFBP process uses the traditional QFN / DFN process and finally etches away a small part of the bottom carrier pad. The plate is covered with ink; both the MIS process and the HFBP process have certain disadvantages for isolated packaging products. In the MIS process, the metal layer and the connection between layers are almost all achieved through electroplating, and the metal thickness and connection strength cannot be compared with the traditional frame; although the HFBP process ensures the consistency with the QFN process in terms of integrity, the supporting metal at the chip position still exists, and the corresponding withstand voltage level will be affected by the thickness of the bottom oil film, and the withstand voltage strength of the isolated packaging product cannot be achieved; in addition, in the application of millimeter wave isolated transmission, metal is not allowed to exist at the antenna position, and the HFBP process cannot be used. The substrate strength and current carrying capacity in the MIS process will be weaker. Therefore, a frame packaging solution that does not rely on frame support and can meet the corresponding withstand voltage and stress strength is needed to fill the technical gap. Utility Model Content

[0003] The technical problem solved by the utility model is to provide a millimeter wave isolation transmission packaging structure that takes into account both carrier strength and withstand voltage isolation level.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is: a millimeter wave isolation transmission packaging structure, comprising:

[0005] A first base island, wherein a first material reduction area is provided at the bottom of the first base island;

[0006] A second base island, wherein a second material reduction area is provided at the bottom of the second base island, and a gap is provided between the second base island and the first base island;

[0007] A first chip, the first chip is disposed on the first base island and is disposed corresponding to the first material reduction area;

[0008] A second chip, the second chip is disposed on the second base island and is disposed corresponding to the second material reduction area;

[0009] a first plastic encapsulation body, the first plastic encapsulation body respectively connecting the first base island and the second base island and filling the first material reduction area and the second material reduction area;

[0010] A second plastic sealing body, the second plastic sealing body is located above the first base island and the second base island and is respectively connected to the first base island, the second base island and the first plastic sealing body;

[0011] A first antenna, which is disposed at the gap and located at an interface between the first plastic package and the second plastic package, and is electrically connected to the first chip;

[0012] The second antenna is arranged at the gap and located at the interface between the first plastic package and the second plastic package. The second antenna is electrically connected to the second chip and is wirelessly connected to the first antenna.

[0013] In one embodiment, the first antenna and the second antenna are disposed close to each other.

[0014] In one embodiment, the first antenna is arranged opposite to the second antenna.

[0015] In one embodiment, the entire area of ​​the first antenna is located in the first plastic package, or the entire area of ​​the first antenna is located in the second plastic package.

[0016] In one embodiment, a portion of the first antenna is located in the first plastic package, and another portion of the first antenna is located in the second plastic package.

[0017] In one embodiment, the first base island has a first extension leg extending into the gap.

[0018] In one embodiment, the second base island has a second extension foot extending into the gap, and when the millimeter wave isolation transmission packaging structure is viewed from above, the first antenna and the second antenna are both located between the first extension foot and the second extension foot.

[0019] In one embodiment, the first chip is located on the top surface of the first base island, and the second plastic package covers the first chip.

[0020] In one embodiment, the first chip is located in the first material reduction area, and the first plastic package covers the first chip.

[0021] In one embodiment, the first plastic packaging body and / or the second plastic packaging body fills the gap.

[0022] The beneficial effects of the utility model are as follows: the millimeter-wave isolation transmission packaging structure has a novel structure, and a prefabricated frame can be obtained by the first injection molding of the first plastic package body. The presence of the first plastic package body in the prefabricated frame effectively improves the strength of the frame's material reduction area, thereby solving the problems of chip bonding and wire bonding stability in the material reduction area in the application of the millimeter-wave isolation transmission packaging structure; the prefabricated frame improves the freedom of frame design and production, and material reduction can be performed except for the pin area. The creepage distance has strong support, which is conducive to ensuring the withstand voltage isolation level; the first antenna and the second antenna are both in the gap, which can ensure that there is no metal in the radiation area of ​​the antenna, which is conducive to improving the signal transmission quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0024] Figure 1 It is a cross-sectional view of the millimeter wave isolation transmission packaging structure of the first embodiment of the utility model;

[0025] Figure 2 This is a simplified schematic diagram of the structure of the millimeter wave isolation transmission packaging structure of the first embodiment of the utility model from a top view;

[0026] Figure 3 A cross-sectional view of another structure of a millimeter wave isolation transmission packaging structure according to the first embodiment of the utility model;

[0027] Figure 4 It is a cross-sectional view of the millimeter wave isolation transmission packaging structure of the second embodiment of the utility model.

[0028] Description of Figure Numbers:

[0029] 1. First base island; 11. First material reduction area; 12. First extension leg;

[0030] 2. Second base island; 21. Second material reduction area; 22. Second extension foot;

[0031] 3. The first chip;

[0032] 4. The second chip;

[0033] 5. The first plastic sealing body;

[0034] 6. The second plastic sealing body;

[0035] 7. The first antenna;

[0036] 8. Second antenna;

[0037] 9. Gap. DETAILED DESCRIPTION

[0038] The purpose, features and advantages of the present invention will be further described in conjunction with the embodiments and with reference to the accompanying drawings.

[0039] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0040] It should be noted that if the embodiments of the present invention involve directional indications such as up, down, left, right, front, back, etc., then the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture as shown in the accompanying drawings. If the specific posture changes, the directional indication will also change accordingly.

[0041] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0042] In addition, if the meaning of "and / or" appears in the full text is to include three parallel solutions, taking "and / or" as an example, it includes solutions, or solutions, or solutions that are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this utility model.

[0043] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0044] Embodiment 1

[0045] Please refer to Figures 1 to 3 The first embodiment of the utility model is: a millimeter wave isolation transmission packaging structure, including a first base island 1, a second base island 2, a first chip 3, a second chip 4, a first plastic package 5, a second plastic package 6, a first antenna 7 and a second antenna 8, the bottom of the first base island 1 is provided with a first material reduction area 11, the bottom of the second base island 2 is provided with a second material reduction area 21, and a gap 9 is provided between the second base island 2 and the first base island 1; the first chip 3 is arranged on the first base island 1 and corresponds to the first material reduction area 11, the second chip 4 is arranged on the second base island 2 and corresponds to the second material reduction area 21; the first plastic package 5 is divided into The first base island 1 and the second base island 2 are respectively connected and the first material reduction area 11 and the second material reduction area 21 are filled. The second plastic packaging body 6 is located above the first base island 1 and the second base island 2 and respectively connects the first base island 1, the second base island 2 and the first plastic packaging body 5; the first antenna 7 is arranged at the gap 9 and located at the interface between the first plastic packaging body 5 and the second plastic packaging body 6, the first antenna 7 is electrically connected to the first chip 3, the second antenna 8 is arranged at the gap 9 and located at the interface between the first plastic packaging body 5 and the second plastic packaging body 6, the second antenna 8 is electrically connected to the second chip 4 and is wirelessly connected to the first antenna 7.

[0046] The material of the first plastic sealing body 5 may be selected from EMC materials, and similarly, the material of the second plastic sealing body 6 may be selected from EMC materials, and similarly.

[0047] In order to improve the signal transmission effect and ensure the miniaturization of the millimeter wave isolation transmission packaging structure, it is preferred that the first antenna 7 and the second antenna 8 are arranged close to each other. Further preferably, the first antenna 7 and the second antenna 8 are arranged opposite to each other.

[0048] In this embodiment, the entire area of ​​the first antenna 7 is located in the second plastic package 6 (eg, Figure 1 Alternatively, the entire area of ​​the first antenna 7 is located within the first plastic package 5 (as shown in Figure 3 As shown). In other embodiments, it is acceptable that a portion of the first antenna 7 is located in the first plastic package 5, and another portion of the first antenna 7 is located in the second plastic package 6. Similarly, the entire area of ​​the second antenna 8 is located in the first plastic package 5, or the entire area of ​​the second antenna 8 is located in the second plastic package 6. In other embodiments, it is acceptable that a portion of the second antenna 8 is located in the first plastic package 5, and another portion of the second antenna 8 is located in the second plastic package 6. It can be seen that there are many specific settings for the first antenna 7 / second antenna 8 at the interface between the first plastic package 5 and the second plastic package 6, which is conducive to enriching the diversity of the millimeter wave isolation transmission packaging structure.

[0049] Optionally, the first base island 1 has a first extension leg 12 extending into the gap 9, and the second base island 2 has a second extension leg 22 extending into the gap 9. When the millimeter wave isolation transmission packaging structure is viewed from above, the first antenna 7 and the second antenna 8 are both located between the first extension leg 12 and the second extension leg 22. The provision of the first extension leg 12 and / or the second extension leg 22 can improve the strength of the prefabricated frame when it is large in size, which is conducive to improving the yield rate. It is easy to understand that the first extension leg 12 / the second extension leg 22 can be formed during the metal frame subtractive processing process.

[0050] The first chip 3 is located on the top surface of the first base island 1 , and the second plastic package 6 covers the first chip 3 . The second chip 4 is located on the top surface of the second base island 2 , and the second plastic package 6 covers the second chip 4 .

[0051] In order to improve the structural stability and isolation effect of the millimeter wave isolation transmission packaging structure, the first plastic packaging body 5 and / or the second plastic packaging body 6 fills the gap 9.

[0052] Preferably, both the first chip 3 and the second chip 4 are full-duplex communication chips. In actual products, the first chip 3 may be a data sending chip and the second chip 4 may be a data receiving chip.

[0053] When manufacturing the millimeter wave isolation transmission packaging structure of this embodiment, the non-pin area at the bottom of the metal frame is first subjected to material reduction processing to form the first material reduction area 11, the second material reduction area 21 and the gap 9. The specific method of material reduction processing includes but is not limited to chemical etching, controlled depth milling groove, etc., and then the first plastic packaging is performed to form the first plastic packaging body 5 to the prefabricated frame, and then the first chip 3 is installed on the first base island 1, the second chip 4 is installed on the second base island 2, and the first antenna 7 and the second antenna 8 are installed on the first plastic packaging body 5 (or in the process of the first plastic packaging, the first antenna 7 and the second antenna 8 are directly fixedly connected to the first plastic packaging body 5, so that the step of mounting the first antenna 7 and the second antenna 8 can be omitted), and finally the second plastic packaging is performed to form the second plastic packaging body 6 to obtain the millimeter wave isolation transmission packaging structure. The strength of the millimeter wave isolation transmission packaging structure depends on the thickness and material of the metal frame and the plastic packaging material, and the withstand voltage isolation level depends on the spacing of the pins and the thickness of the plastic packaging material.

[0054] Embodiment 2

[0055] Please refer to Figure 4Embodiment 2 of the present invention is a parallel technical solution of embodiment 1, and the only difference from embodiment 1 is that: the first chip 3 is located in the first material reduction zone 11, the first plastic package 5 covers the first chip 3, the second chip 4 is located in the second material reduction zone 21, and the first plastic package 5 covers the second chip 4.

[0056] Placing the first chip 3 in the first reduced material area 11 and the second chip 4 in the second reduced material area 21 can reduce the thickness of the millimeter wave isolation transmission packaging structure to a greater extent, making the millimeter wave isolation transmission packaging structure more miniaturized.

[0057] The above are only optional embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A millimeter wave isolation transmission packaging structure, characterized in that: include A first base island, wherein a first material reduction area is provided at the bottom of the first base island; A second base island, wherein a second material reduction area is provided at the bottom of the second base island, and a gap is provided between the second base island and the first base island; A first chip, the first chip is disposed on the first base island and is disposed corresponding to the first material reduction area; A second chip, the second chip is disposed on the second base island and is disposed corresponding to the second material reduction area; a first plastic encapsulation body, the first plastic encapsulation body respectively connecting the first base island and the second base island and filling the first material reduction area and the second material reduction area; A second plastic sealing body, the second plastic sealing body is located above the first base island and the second base island and is respectively connected to the first base island, the second base island and the first plastic sealing body; A first antenna, which is disposed at the gap and located at an interface between the first plastic package and the second plastic package, and is electrically connected to the first chip; The second antenna is arranged at the gap and located at the interface between the first plastic package and the second plastic package. The second antenna is electrically connected to the second chip and is wirelessly connected to the first antenna.

2. The millimeter wave isolation transmission packaging structure according to claim 1 is characterized in that: The first antenna and the second antenna are arranged close to each other.

3. The millimeter wave isolation transmission packaging structure according to claim 1 is characterized in that: The first antenna is arranged opposite to the second antenna.

4. The millimeter wave isolation transmission packaging structure according to claim 1 is characterized in that: The entire area of ​​the first antenna is located in the first plastic package, or the entire area of ​​the first antenna is located in the second plastic package.

5. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: A portion of the first antenna is located in the first plastic package, and another portion of the first antenna is located in the second plastic package.

6. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first base island has a first extension leg extending into the gap.

7. The millimeter wave isolation transmission packaging structure according to claim 6, characterized in that: The second base island has a second extension foot extending into the gap, and when the millimeter wave isolation transmission packaging structure is viewed from above, the first antenna and the second antenna are both located between the first extension foot and the second extension foot.

8. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first chip is located on the top surface of the first base island, and the second plastic package covers the first chip.

9. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first chip is located in the first material reduction area, and the first plastic package covers the first chip.

10. The millimeter wave isolation transmission packaging structure according to claim 1, characterized in that: The first plastic packaging body and / or the second plastic packaging body fills the gap.

Images