Common antenna assembly and electronic equipment

Abstract

The embodiment of the utility model provides a common antenna assembly and electronic equipment, and aims to reduce the influence of a metal plate on a radiation pattern and efficiency of an antenna structure. In the co-body antenna assembly provided by the embodiment of the invention, the metal plate and the antenna structure are arranged on the same side of the circuit board, and the metal plate is used for realizing heat dissipation of the co-body antenna assembly; the metal plate and the antenna structure are adjacently arranged in the direction parallel to the circuit board, the heat dissipation fins are arranged around the antenna structure, the antenna structure can be exposed while the metal plate and the heat dissipation fins achieve heat dissipation of the antenna structure, the influence of the metal plate on the radiation pattern and efficiency of the antenna structure is reduced, and the antenna structure is more compact. And the radiation pattern and the efficiency of the antenna structure and the metal plate are improved. According to the electronic equipment provided by the embodiment of the invention, two-way communication between the user equipment and the communication system can be realized, so that fiber to the room (Fiber To Room, short for FTTR) is realized.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of antenna technology, and specifically to a common antenna assembly and electronic equipment. Background Art

[0002] The antenna assembly includes a circuit board and an antenna structure printed on the circuit board, and a heat dissipation structure for dissipating heat from the antenna assembly. The heat dissipation structure covers the circuit board, which affects the radiation pattern and efficiency of the antenna structure on the circuit board. Utility Model Content

[0003] The embodiments of the present application provide a co-body antenna assembly and an electronic device, which are intended to reduce the influence of the metal plate on the radiation pattern and efficiency of the antenna structure, and to generate horizontally polarized radiation using an equivalent magnetic dipole.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] On the one hand, an embodiment of the present application provides a co-body antenna assembly, which includes a circuit board, an antenna structure, a metal plate, and heat dissipation fins; the antenna structure is located on one side of the circuit board, and the antenna structure is coupled to the circuit board; the metal plate and the antenna structure are arranged on the same side of the circuit board, the metal plate and the antenna structure are arranged adjacent to each other in a direction parallel to the circuit board, and the metal plate and the antenna structure are an integral structure; the heat dissipation fins are arranged on the side of the metal plate away from the circuit board, and on a plane parallel to the metal plate, the heat dissipation fins are arranged around the antenna structure.

[0006] In the co-body antenna assembly provided in the embodiment of the present application, the metal plate and the antenna structure are arranged on the same side of the circuit board, and the metal plate and the antenna structure are an integrated structure. The metal plate is used to achieve heat dissipation of the co-body antenna assembly. The metal plate and the antenna structure are arranged adjacent to each other in a direction parallel to the circuit board. While the metal plate can achieve heat dissipation of the antenna structure, the antenna structure can also be exposed, reducing the influence of the metal plate on the radiation pattern and efficiency of the antenna structure, thereby improving the radiation pattern and efficiency of the antenna structure and the metal plate (i.e., the co-body antenna assembly).

[0007] At the same time, the heat dissipation fins are arranged around the antenna structure, thereby improving the heat dissipation efficiency of the common antenna assembly.

[0008] In some embodiments, the antenna structure includes a first radiator, a second radiator and a third radiator, the second radiator is located between the first radiator and the circuit board, the third radiator connects the first radiator and the second radiator, and the first radiator and the second radiator are located on the same side of the third radiator; the first radiator, the second radiator and the third radiator are surrounded to form a radiation opening; and the heat dissipation fins avoid the radiation opening.

[0009] In some embodiments, the metal plate and the second radiator are located in the same plane, and the metal plate is connected to the second radiator. Since the second radiator is closer to the circuit board than the first radiator, the connection between the metal plate and the second radiator can make the metal plate closer to the circuit board than the connection between the metal plate and the first radiator, which is convenient for the arrangement of the metal plate.

[0010] In an embodiment where the heat dissipation fins are arranged around the antenna structure, the heat dissipation fins include a first heat dissipation fin, a second heat dissipation fin, and a third heat dissipation fin, and the first heat dissipation fin, the second heat dissipation fin, and the third heat dissipation fin are all arranged on a metal plate; in the extension direction of the first radiator, the first heat dissipation fin is located on one side of the antenna structure, and the second heat dissipation fin is located on the other side of the antenna structure; and the third heat dissipation fin is located on the side of the antenna structure away from the radiation opening. The first heat dissipation fin, the second heat dissipation fin, and the third heat dissipation fin can be arranged around the antenna structure while preventing the radiation opening of the antenna structure from facing the heat dissipation fins, thereby preventing the heat dissipation fins from affecting the radiation pattern and efficiency of the antenna structure.

[0011] In some embodiments, the co-body antenna assembly further includes a feeding unit, a first feeding point is provided on the first radiator, a second feeding point is provided on the second radiator, and the feeding unit is used to feed the first feeding point and the second feeding point.

[0012] The antenna structure provided in the embodiment of the present application has two feeding points (a first feeding point and a second feeding point), and the working bandwidth of the antenna structure can be expanded by tuning different feeding points; the radiation pattern can also be controlled and the coverage range can be optimized by adjusting the feeding amplitude and phase.

[0013] In some embodiments, the feeding unit includes a screw and a nut, the screw is connected to the first feeding point, and the nut is connected to the second feeding point.

[0014] In the implementation mode where the feeding unit includes screws and nuts, since the impedance of the electrical connection is relatively high and the current transmission capability is relatively strong, it is suitable for low-frequency and high-current power supply.

[0015] In some embodiments, the feeding unit further includes a coaxial line, an inner conductor of the coaxial line is coupled to the first feeding point, and an outer conductor of the coaxial line is coupled to the second feeding point.

[0016] In the implementation mode where the feeding unit includes a coaxial line, since the outer conductor can serve as a shielding layer to effectively reduce electromagnetic interference, the impedance matching is good and is suitable for high-frequency signal transmission.

[0017] In some embodiments, a resonant slot is provided on the first radiator, which can more effectively couple electromagnetic energy out of the first radiator, reduce energy loss inside the first radiator, and thus improve the radiation pattern and efficiency of the antenna structure.

[0018] In some embodiments, an extension direction of the resonant slot is parallel to an extension direction of the low radiator.

[0019] In some embodiments, the resonant slot includes a first slot, a second slot and a third slot, the extension direction of the first slot is parallel to the extension direction of the low-radiator, the extension directions of the second slot and the third slot are both perpendicular to the extension direction of the first slot, and the second slot is connected to one end of the first slot, the third slot is connected to the other end of the first slot, and the second slot and the third slot are both located on the same side of the first slot.

[0020] In some embodiments, the first feeding point is located on the side of the resonant slot away from the third radiator, so as to shorten the distance between the first feeding point and the resonant slot, so that the current fed from the first feeding point can directly act on the edge of the slot, reduce the loss of the current on the first radiator, and improve the radiation pattern and efficiency of the antenna structure.

[0021] In some embodiments, the antenna assembly is a horizontally polarized antenna.

[0022] On the other hand, an embodiment of the present application further provides an electronic device, which includes a controller and a co-body antenna assembly as described above, and the controller is coupled to the co-body antenna assembly. The electronic device is a FTTR (Fiber To The Room) device. It can be understood that the beneficial effects that can be achieved by the electronic device can refer to the beneficial effects of the co-body antenna assembly in the above text, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the present application, the following is a brief introduction to the drawings required for use in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0024] Figure 1 is a block diagram of an electronic device in an embodiment of the present application;

[0025] Figure 2 The structure of the antenna assembly in the embodiment of the present application is shown in FIG. Figure 1 ;

[0026] Figure 3 This is a schematic diagram of the structure of the antenna in the embodiment of the present application;

[0027] Figure 4 for Figure 2A side view of a first embodiment;

[0028] Figure 5 for Figure 2 A side view of a second embodiment;

[0029] Figure 6 for Figure 2 A side view of a third embodiment;

[0030] Figure 7 for Figure 2 A side view of a fourth embodiment;

[0031] Figure 8 The structure of the antenna assembly in the embodiment of the present application is shown in FIG. Figure 2 ;

[0032] Fig. 9 The structure of the antenna assembly in the embodiment of the present application is shown in FIG. Figure 3 ;

[0033] Fig.10 This is the directional diagram of the common antenna assembly in the embodiment of the present application on a plane perpendicular to the circuit board.

[0034] Explanation of the reference numerals: 100, electronic device; 10, common antenna assembly; 20, controller; 110, antenna structure; 111, first radiator; 101, first feeding point; 102, second feeding point; 112, second radiator; 113, third radiator; 114, radiation opening; 120, circuit board; 130, metal plate; 131, first metal plate; 132, second metal plate; 140, feeding unit; 141, screw; 142, nut; 150, resonant slot; 151, first slot; 152, second slot; 153, third slot; 160, heat sink fin; 161, first heat sink fin; 162, second heat sink fin; 163, third heat sink fin; 171, first antenna structure; 172, second antenna structure. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiment is a gap embodiment of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] In the following, the terms "first", "second", etc. are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0037] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left", "right", "horizontal" and "vertical" are defined relative to the orientation of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to changes in the orientation of the components placed in the drawings.

[0038] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0039] It should be noted that in the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or an integral connection; it can also be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0040] The following explains the terms that may appear in the embodiments of the present application.

[0041] Coupling: can be understood as direct coupling and / or indirect coupling, and "coupled connection" can be understood as direct coupling connection and / or indirect coupling connection. Direct coupling can also be called "electrical connection", which is understood as the physical contact and electrical conduction between components; it can also be understood as the connection between different components in the circuit structure through physical lines such as printed circuit board (PCB) copper foil or wires that can transmit electrical signals; "indirect coupling" can be understood as two conductors being electrically conductive in an airless / non-contact manner. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by coupling between the gaps between two conductive parts to form an equivalent capacitor.

[0042] Radiator, or antenna branch: is a device in the antenna used to receive / send electromagnetic wave radiation. In some cases, the narrow sense of "antenna" is the radiator, which converts the waveguide energy from the transmitter into radio waves, or converts radio waves into waveguide energy, which is used to radiate and receive radio waves. The modulated high-frequency current energy (or waveguide energy) generated by the transmitter is transmitted to the transmitting radiator via the feeder line, and converted into a certain polarized electromagnetic wave energy by the radiator and radiated in the desired direction. The receiving radiator converts a certain polarized electromagnetic wave energy from a specific direction in space into modulated high-frequency current energy, which is transmitted to the receiver input via the feeder line.

[0043] The radiator (or antenna branch) may include a conductor with a specific shape and size, such as a linear or sheet shape, etc. The present application does not limit the specific shape. In one embodiment, the linear radiator may be referred to as a linear antenna. In one embodiment, the linear radiator may be implemented by a conductive frame, and may also be referred to as a frame antenna. In one embodiment, the linear radiator may be implemented by a bracket conductor, and may also be referred to as a bracket antenna. In one embodiment, the linear radiator, or the radiator of the linear antenna, has a wire diameter (for example, including thickness and width) much smaller than the wavelength (for example, the dielectric wavelength) (for example, less than 1 / 16 of the wavelength), and the length may be comparable to the wavelength (for example, the dielectric wavelength) (for example, the length is about 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). The main forms of linear antennas are dipole antennas, half-wave oscillator antennas, monopole antennas, loop antennas, and inverted F antennas (also known as IFA, Inverted F Antenna). For example, for a dipole antenna, each dipole antenna generally includes two radiating branches, and each branch is fed by a feeding unit from the feeding end of the radiating branch. For example, an inverted-F antenna (IFA) can be regarded as a monopole antenna with a ground path added. The IFA antenna has a feeding point and a grounding point, and is called an inverted-F antenna because its side view is an inverted F shape. In one embodiment, the sheet radiator may include a microstrip antenna, or a patch antenna, such as a planar inverted F antenna (also known as PIFA, Planar Inverted F Antenna). In one embodiment, the sheet radiator may be implemented by a planar conductor (such as a conductive sheet or a conductive coating). In one embodiment, the sheet radiator may include a conductive sheet, such as a copper sheet. In one embodiment, the sheet radiator may include a conductive coating, such as a silver paste. The shape of the sheet radiator includes a circle, a rectangle, a ring, etc., and the present application does not limit the specific shape. The structure of the microstrip antenna is generally composed of a dielectric substrate, a radiator and a floor, wherein the dielectric substrate is arranged between the radiator and the floor.

[0044] The radiator (or antenna branch) may also include a slot or a slit formed on the conductor, for example, a closed or semi-closed slot or slit formed on the grounded conductor surface. In one embodiment, a slotted or slitted radiator may be referred to as a slot antenna or a slot antenna. In one embodiment, the radial dimension (for example, including the width) of the slot or slit of the slot antenna / slot antenna is much smaller than the wavelength (for example, the dielectric wavelength) (for example, less than 1 / 16 of the wavelength), and the length dimension may be comparable to the wavelength (for example, the dielectric wavelength) (for example, the length is about 1 / 8 of the wavelength, or 1 / 8 to 1 / 4, or 1 / 4 to 1 / 2, or longer). In one embodiment, a radiator with a closed slot or slit may be referred to as a closed slot antenna. In one embodiment, a radiator with a semi-closed slot or slit (for example, an opening is added to a closed slot or slit) may be referred to as an open slot antenna. In some embodiments, the slot shape is a long strip. In some embodiments, the length of the slot is about half a wavelength (for example, the dielectric wavelength). In some embodiments, the length of the slot is about an integer multiple of the wavelength (for example, one times the dielectric wavelength). In some embodiments, the slot can be fed by a transmission line connected across one or both sides thereof, thereby exciting a radio frequency electromagnetic field on the slot and radiating electromagnetic waves into space. In one embodiment, the radiator of the slot antenna or slot antenna can be realized by a conductive frame with both ends grounded, which can also be called a frame antenna; in this embodiment, it can be regarded as that the slot antenna or slot antenna includes a linear radiator, which is spaced apart from the floor and grounded at both ends of the radiator, thereby forming a closed or semi-closed slot or slot. In one embodiment, the radiator of the slot antenna or slot antenna can be realized by a bracket conductor with both ends grounded, which can also be called a bracket antenna.

[0045] The feed line, also called the transmission line, refers to the connection line between the antenna's transceiver and the radiator. The transmission line can directly transmit current waves or electromagnetic waves depending on the frequency and form. The connection point on the radiator where the transmission line is connected is usually called the feeding point. Transmission lines include wire transmission lines, coaxial transmission lines, waveguides, or microstrip lines. Depending on the implementation form, the transmission line can include a bracket antenna body, a glass antenna body, etc. Depending on the carrier, the transmission line can be implemented by LCP (Liquid Crystal Polymer), FPC (Flexible Printed Circuit), or PCB (Printed Circuit Board).

[0046] Ground / floor: It can refer to at least a part of any grounding layer, grounding plate, or grounding metal layer in an electronic device (such as a mobile phone), or at least a part of any combination of any of the above grounding layers, grounding plates, or grounding components, etc. "Ground / floor" can be used for grounding components in electronic devices. In one embodiment, the "ground / floor" may include any one or more of the following: the grounding layer of the circuit board of the electronic device, the grounding plate formed by the middle frame of the electronic device, the grounding metal layer formed by the metal film under the screen, the conductive grounding layer of the battery, and the conductive parts or metal parts electrically connected to the above grounding layer / grounding plate / metal layer. In one embodiment, the circuit board may be a printed circuit board (PCB), such as an 8-layer, 10-layer or 12-14-layer board having 8, 10, 12, 13 or 14 layers of conductive material, or an element separated and electrically insulated by a dielectric layer or insulating layer such as glass fiber, polymer, etc. In one embodiment, the circuit board includes a dielectric substrate, a grounding layer and a wiring layer, and the wiring layer and the grounding layer are electrically connected through vias. In one embodiment, components such as a display, a touch screen, input buttons, a transmitter, a processor, a memory, a battery, a charging circuit, a system on chip (SoC) structure, etc. can be mounted on or connected to a circuit board; or electrically connected to a wiring layer and / or a ground layer in the circuit board. For example, a radio frequency source is disposed on the wiring layer.

[0047] Any of the above-mentioned grounding layers, grounding plates, or grounding metal layers are made of conductive materials. In one embodiment, the conductive material can be any of the following materials: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil and tin-plated copper on an insulating substrate, cloth impregnated with graphite powder, graphite-coated substrates, copper-plated substrates, brass-plated substrates, and aluminum-plated substrates. It will be appreciated by those skilled in the art that the grounding layer / grounding plate / grounding metal layer can also be made of other conductive materials.

[0048] Grounding: refers to coupling with the above-mentioned ground / floor through a grounding structure and / or a grounding circuit. In one embodiment, grounding can be achieved through physical grounding, such as physical grounding (or physical ground) at a specific position on the frame through some structural parts of the middle frame. In one embodiment, grounding can be achieved through device grounding, such as grounding through devices such as capacitors / inductors / resistors connected in series or in parallel (or device ground).

[0049] Reference Figure 1, an embodiment of the present application provides an electronic device 100, which includes a co-body antenna assembly 10 and a controller 20 coupled to the co-body antenna assembly 10, and the controller 20 is used to control the co-body antenna assembly 10 to radiate electromagnetic waves to generate signals. Among them, the electronic device 100 may include wireless devices such as Wi-Fi routers, gateways, APs (Access Points), and FTTRs (Fiber To The Room). The electronic device provided in the embodiment of the present application can realize two-way communication between user equipment and a communication system, thereby realizing fiber to the room. The co-body antenna assembly 10 in the electronic device 100 may include a vertically polarized antenna and a horizontally polarized antenna, and adopt MIMO (Multiple-Input, Multiple-Output) diversity technology to increase the overall polarization diversity of the co-body antenna assembly 10, improve channel capacity and anti-interference capability, and thereby improve throughput performance and system stability.

[0050] Reference Figure 2 In the above embodiment, the co-body antenna assembly 10 includes an antenna structure 110 of a horizontally polarized antenna and a circuit board 120. The antenna structure 110 is located on one side of the circuit board 120, and the antenna structure 110 is coupled to the circuit board 120. The circuit board 120 serves as a ground plane in the co-body antenna assembly 10, and the antenna structure 110 is grounded through the circuit board 120. The co-body antenna assembly 10 also includes a metal plate 130. The metal plate 130 and the antenna structure 110 are arranged on the same side of the circuit board 120, and the metal plate 130 and the antenna structure 110 are an integral structure. The metal plate 130 is used to achieve heat dissipation of the co-body antenna assembly 10. Compared to the antenna manufactured by laser direct structuring (LDS), the antenna is directly formed on the circuit board 120, and the heat sink for dissipating heat for the antenna covers the circuit board 120. In this embodiment, the metal plate 130 used to dissipate heat for the antenna is arranged adjacent to the antenna structure 110 in a direction parallel to the circuit board 120. While the metal plate 130 can dissipate heat for the antenna structure 110, the antenna structure 110 can also be exposed, thereby reducing the influence of the metal plate 130 on the radiation pattern and efficiency of the antenna structure 110, thereby improving the radiation pattern and efficiency of the antenna structure 110 and the metal plate 130 (i.e., the common antenna assembly 10).

[0051] Reference Figure 2 and Figure 3In some embodiments, the antenna structure 110 includes a first radiator 111, a second radiator 112 and a third radiator 113, wherein the first radiator 111 and the second radiator 112 both extend on a plane parallel to the circuit board 120, and the second radiator 112 is located between the first radiator 111 and the circuit board 120; the third radiator 113 extends on a plane perpendicular to the circuit board 120, the third radiator 113 connects the first radiator 111 and the second radiator 112, and the first radiator 111 and the second radiator 112 are both located on the same side of the third radiator 113, so that the first radiator 111, the second radiator 112 and the third radiator 113 can enclose a radiation opening 114.

[0052] In an embodiment in which the antenna structure 110 and the metal plate 130 are an integrated structure, the metal plate 130 can be connected to the first radiator 111, the second radiator 112, and the third radiator 113, but the metal plate 130 needs to avoid the radiation opening 114 formed by the first radiator 111, the second radiator 112 and the third radiator 113 to prevent the metal plate 130 from affecting the radiation pattern and efficiency of the antenna structure 110.

[0053] For example, refer to Figure 4 In an embodiment where the metal plate 130 is connected to the first radiator 111 , the metal plate 130 is located on a side of the third radiator 113 away from the first radiator 111 . In this embodiment, the radiation opening 114 of the antenna structure 110 faces away from the metal plate 130 .

[0054] Reference Figure 5 In an embodiment where the metal plate 130 is connected to the second radiator 112, the metal plate 130 may be located on a side of the third radiator 113 away from the second radiator 112. In this embodiment, the radiation opening 114 of the antenna structure 110 faces away from the metal plate 130. Figure 6 In another embodiment in which the metal plate 130 is connected to the second radiator 112, the metal plate 130 and the second radiator 112 may be located on the same side of the third radiator 113, for example, the second radiator 112 is located between the metal plate 130 and the third radiator 113. In this embodiment, the radiation opening 114 of the antenna structure 110 faces the metal plate 130.

[0055] In the above two embodiments, since the second radiator 112 is closer to the circuit board 120 than the first radiator 111, the connection between the metal plate 130 and the second radiator 112 can make the metal plate 130 closer to the circuit board 120 than the connection between the metal plate 130 and the first radiator 111, which facilitates the installation of the metal plate 130.

[0056] Reference Figure 7In an embodiment where the metal plate 130 is connected to the third radiator 113 , the metal plate 130 is located on a side of the third radiator 113 away from the first radiator 111 and the second radiator 112 . In this embodiment, the radiation opening 114 of the antenna structure 110 faces away from the metal plate 130 .

[0057] Continue to refer to Figure 3 In the above embodiment, the common antenna assembly 10 further includes a feeding unit 140, a first feeding point 101 is provided on the first radiator 111, and a second feeding point 102 is provided on the second radiator 112, and the feeding unit 140 is used to feed the first feeding point 101 and the second feeding point 102. Compared with the antenna structure 110 with a single feeding point, the antenna structure 110 provided in the embodiment of the present application has two feeding points (the first feeding point 101 and the second feeding point 102), and the working bandwidth of the antenna structure 110 can be expanded by tuning different feeding points; the radiation pattern can also be controlled by adjusting the feeding amplitude and phase to optimize the coverage range.

[0058] In some embodiments, the feed unit 140 may include a screw 141 and a nut 142, wherein the screw 141 is connected to the first feed point 101, and the nut 142 is connected to the second feed point 102; illustratively, the nut 142 is located on the side of the second radiator 112 away from the first radiator 111, and fits the second feed point 102 on the second radiator 112, the screw 141 passes through the nut 142 and the second radiator 112 and is connected to the first feed point 101 on the first radiator 111, and the screw 141 and the nut 142 are matched to connect to ensure that the screw 141 is in contact with the first feed point 101, and the nut 142 is in contact with the second feed point 102; wherein the connection between the screw 141 and the nut 142 is insulated. In the embodiment where the feed unit 140 includes the screw 141 and the nut 142, since the impedance of the electrical connection is high and the ability to transmit current is strong, it is suitable for low-frequency and high-current power supply.

[0059] In other embodiments, the feeding unit 140 may include a coaxial line (not shown), the coaxial line having an inner conductor and an outer conductor, the inner conductor of the coaxial line being coupled to the first feeding point 101, and the outer conductor of the coaxial line being coupled to the second feeding point 102. In the embodiment where the feeding unit 140 includes a coaxial line, since the outer conductor can be used as a shielding layer to effectively reduce electromagnetic interference, the impedance matching is good, and it is suitable for high-frequency signal transmission.

[0060] In some embodiments, a resonant slot 150 may be provided on the first radiator 111, and the resonant slot 150 may couple electromagnetic energy out of the first radiator 111 more effectively, reduce energy loss inside the first radiator 111, and thereby improve the radiation pattern and efficiency of the antenna structure 110. In conjunction with the above-mentioned embodiment of the connection between the metal plate 130 and the antenna structure 110, the metal plate 130 should not block the resonant slot 150 provided on the first radiator 111 after being connected to any one of the first radiator 111, the second radiator 112, and the third radiator 113.

[0061] Reference Figure 2 and Figure 3 In the above embodiment, the extension direction of the resonant slot 150 is parallel to the extension direction of the first radiator 111; or, referring to Figure 3 and Figure 8 The resonant slot 150 may include a first slot 151, a second slot 152 and a third slot 153, wherein an extension direction of the first slot 151 is parallel to an extension direction of the first radiator 111, and extension directions of the second slot 152 and the third slot 153 are both perpendicular to the extension direction of the first slot 151, and the second slot 152 is connected to one end of the first slot 151, and the third slot 153 is connected to the other end of the first slot 151, and the second slot 152 and the third slot 153 are both located on the same side of the first slot 151.

[0062] Reference Figure 3 In the above embodiment, the first feeding point 101 is located on the side of the resonant slot 150 away from the third radiator 113 to shorten the distance between the first feeding point 101 and the resonant slot 150, so that the current fed from the first feeding point 101 can directly act on the edge of the resonant slot 150, reduce the current loss on the first radiator 111, and improve the radiation pattern and efficiency of the antenna structure 110.

[0063] Continue to refer to Figure 2 and Figure 3In the above embodiment, the shared antenna assembly 10 further includes a heat dissipation fin 160, which is disposed on the side of the metal plate 130 away from the circuit board 120, and can improve the heat dissipation efficiency of the shared antenna assembly 10; on a plane parallel to the metal plate, the heat dissipation fin 160 is disposed around the antenna structure 110, increasing the number of the heat dissipation fin 160, and further improving the heat dissipation efficiency of the shared antenna assembly 10. In this embodiment, the radiation opening 114 of the antenna structure 110 needs to be away from the heat dissipation fin 160 to prevent the heat dissipation fin 160 from affecting the heat dissipation efficiency of the antenna structure 110. Exemplarily, the heat dissipation fin 160 includes a first heat dissipation fin 161, a second heat dissipation fin 162 and a third heat dissipation fin 163, and the first heat dissipation fin 161, the second heat dissipation fin 162 and the third heat dissipation fin 163 are all arranged on the metal plate 130; in the extension direction of the first radiator 111, the first heat dissipation fin 161 is located on one side of the antenna structure 110, and the second heat dissipation fin 162 is located on the other side of the antenna structure 110; the third heat dissipation fin 163 is located on the side of the antenna structure 110 away from the radiation opening 114. The first heat dissipation fin 161, the second heat dissipation fin 162 and the third heat dissipation fin 163 can be arranged around the antenna structure 110 while preventing the radiation opening 114 of the antenna structure 110 from facing the heat dissipation fin 160, thereby preventing the heat dissipation fin 160 from affecting the radiation pattern and efficiency of the antenna structure 110.

[0064] Combined with reference Fig. 9 In some other embodiments, the co-body antenna assembly 10 may include two antenna structures 110 (a first antenna structure 171 and a second antenna structure 172) and two metal plates 130 (a first metal plate 131 and a second metal plate 132); wherein the first antenna structure 171 and the first metal plate 131 are an integral structure, and the second antenna structure 172 and the second metal plate 132 are an integral structure; the first antenna structure 171 and the first metal plate 131 are located on one side of the circuit board 120, and the second antenna structure 172 and the second metal plate 132 are located on the other side of the circuit board 120, and the first metal plate 131 and the second metal plate 132 penetrate the circuit board 120 and are connected to each other. The first antenna structure 171 and the second antenna structure 172 are located on both sides of the circuit board 120, respectively, so that the antenna structure 110 can achieve omnidirectional coverage in a direction perpendicular to the circuit board 120, thereby expanding the coverage range of the embodiment structure, and the design that the antenna structure 110 protrudes from the circuit board 120 is not required, and the antenna structure 110 can be set within the projection range of the circuit board 120, thereby reducing the overall size of the co-body antenna assembly 10.

[0065] In the above embodiment, Fig.10 is the directional diagram of the common antenna assembly 10 on a plane perpendicular to the circuit board, and L1 is Figure 2 The directional diagram of the antenna structure in, L2 is combined Fig. 9 It can be seen that the first antenna structure 171 and the second antenna structure 172 are respectively located on both sides of the circuit board 120. Compared with the first antenna structure 171 being arranged on one side of the circuit board 120, the antenna structure 110 can achieve omnidirectional coverage in the direction perpendicular to the circuit board 120.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace the gaps or all the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A common antenna assembly, characterized in that: include: Circuit boards; An antenna structure, the antenna structure is located on one side of the circuit board, and the antenna structure is coupled to the circuit board; A metal plate, wherein the metal plate and the antenna structure are arranged on the same side of the circuit board, the metal plate and the antenna structure are arranged adjacent to each other in a direction parallel to the circuit board, and the metal plate and the antenna structure are an integral structure; The heat dissipation fins are arranged on a side of the metal plate away from the circuit board, and are arranged around the antenna structure on a plane parallel to the metal plate.

2. The shared antenna assembly according to claim 1, characterized in that: The antenna structure comprises a first radiator, a second radiator and a third radiator, wherein the second radiator is located between the first radiator and the circuit board, the third radiator connects the first radiator and the second radiator, and the first radiator and the second radiator are located on the same side of the third radiator; The first radiator, the second radiator and the third radiator together form a radiation opening; the heat dissipation fins avoid the radiation opening.

3. The shared antenna assembly according to claim 2, characterized in that: The metal plate and the second radiator are located in the same plane, and the metal plate is connected to the second radiator.

4. The shared antenna assembly according to claim 2, characterized in that: The heat dissipation fins include a first heat dissipation fin, a second heat dissipation fin and a third heat dissipation fin, and the first heat dissipation fin, the second heat dissipation fin and the third heat dissipation fin are all arranged on the metal plate; in the extension direction of the first radiator, the first heat dissipation fin is located on one side of the antenna structure, and the second heat dissipation fin is located on the other side of the antenna structure; the third heat dissipation fin is located on the side of the antenna structure away from the radiation opening.

5. The shared antenna assembly according to any one of claims 1 to 4, characterized in that: The projection of the antenna structure on the circuit board is located inside the circuit board.

6. The shared antenna assembly according to any one of claims 2 to 4, characterized in that: The co-body antenna assembly further includes a feeding unit. A first feeding point is provided on the first radiator, and a second feeding point is provided on the second radiator. The feeding unit is used to feed the first feeding point and the second feeding point.

7. The shared antenna assembly according to claim 6, characterized in that: The feeding unit includes a screw and a nut, the screw is connected to the first feeding point, and the nut is connected to the second feeding point.

8. The shared antenna assembly according to claim 6, characterized in that: The feeding unit further includes a coaxial line, an inner conductor of the coaxial line is coupled to the first feeding point, and an outer conductor of the coaxial line is coupled to the second feeding point.

9. The shared antenna assembly according to claim 6, characterized in that: The first radiator is provided with a resonant slot.

10. The shared antenna assembly according to claim 9, characterized in that: An extension direction of the resonant slot is parallel to an extension direction of the first radiator.

11. The shared antenna assembly according to claim 9, characterized in that: The resonant slot includes a first slot, a second slot and a third slot, the extension direction of the first slot is parallel to the extension direction of the first radiator, the extension directions of the second slot and the third slot are both perpendicular to the extension direction of the first slot, and the second slot is connected to one end of the first slot, the third slot is connected to the other end of the first slot, and the second slot and the third slot are both located on the same side of the first slot.

12. The shared antenna assembly according to claim 9, characterized in that: The first feeding point is located on a side of the resonant slot away from the third radiator.

13. The shared antenna assembly according to claim 9, characterized in that: The antenna assembly is a horizontally polarized antenna.

14. An electronic device, characterized in that: The electronic device comprises a controller and a shared-body antenna assembly according to any one of claims 1 to 13, wherein the controller is coupled to the shared-body antenna assembly.

15. The electronic device according to claim 14, characterized in that: The electronic device is a FTTR device.

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