Heat dissipation mechanism of high-power laser

Abstract

The utility model discloses a heat dissipation mechanism of a high power laser, which comprises a lower heat dissipation block and an upper heat dissipation block, the bottom end of the lower heat dissipation block is provided with a lower heat dissipation sheet, the four corners of the top end of the lower heat dissipation block are fixedly connected with connecting guide columns, and the top ends of the connecting guide columns are provided with connecting screw holes. The upper heat dissipation block and the lower heat dissipation block are arranged to improve the heat dissipation effect, during use, the lower heat dissipation block is arranged at the bottom end of the laser main board, then the upper heat dissipation block is arranged above the laser main board, the connecting guide columns are inserted into the connecting holes in the bottom end of the upper heat dissipation block, and then the connecting bolts are fixed to the connecting screw holes from the notches. At the moment, the upper heat dissipation block and the lower heat dissipation block are located above and below the mainboard respectively, heat dissipation is better carried out, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of lasers, in particular to a heat dissipation mechanism of a high-power laser. Background Art

[0002] The working principle of high-power lasers is to convert electrical energy into light energy through semiconductors. For lasers made of semiconductors, the photoelectric conversion efficiency is 50-60%, and the remaining electrical energy will generate heat. If the heat generated by the semiconductor laser cannot be discharged in time, the PN junction temperature will increase significantly, which will lead to a higher threshold current of the semiconductor laser, a significant decrease in quantum efficiency, and a decrease in the electro-optical conversion efficiency of the device, thereby generating more heat.

[0003] In the related art, heat dissipation is performed by using heat dissipation fins on the outer shell of the laser. Since no heat conductor is provided between the mainboard and the outer shell of the laser, it is difficult to effectively dissipate the heat through air transfer.

[0004] Therefore, how to provide a heat dissipation mechanism for a high-power laser to solve the problems existing in the prior art is of great significance to its application. Utility Model Content

[0005] In view of this, the purpose of the present application is to provide a heat dissipation mechanism for a high-power laser to solve the problem in the related art that heat dissipation is performed by using heat dissipation fins on the outer casing of the laser. Since no heat conductor is arranged between the mainboard and the outer casing of the laser, it is difficult to effectively dissipate the heat through air transfer.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A heat dissipation mechanism for a high-power laser comprises a lower heat dissipation block and an upper heat dissipation block, wherein a lower heat dissipation fin is arranged at the bottom end of the lower heat dissipation block, four corners of the top end of the lower heat dissipation block are fixedly connected with connecting guide pillars, the top end of the connecting guide pillars is provided with connecting screw holes, an upper heat dissipation fin is arranged at the top end of the upper heat dissipation block, four corners of the upper heat dissipation fin are provided with notches, connecting holes are opened at the four corners of the upper heat dissipation block, and the connecting holes are fixedly connected to the connecting guide pillars by connecting bolts.

[0008] Preferably, the top end of the connecting bolt is elastically connected to the top end of the upper heat dissipation block via a spring.

[0009] Preferably, the bottom end of the connecting bolt is threadedly connected to the connecting screw hole.

[0010] Preferably, the notch is located directly above the connecting hole.

[0011] Compared with the prior art, the beneficial effects of the utility model are:

[0012] The utility model improves the heat dissipation effect by arranging an upper heat dissipation block and a lower heat dissipation block. When in use, the lower heat dissipation block is placed at the bottom end of the laser main board, and then the upper heat dissipation block is placed above the laser main board, and the connecting guide column is inserted into the connecting hole at the bottom end of the upper heat dissipation block, and then the connecting bolt is fixed to the connecting screw hole through the missing groove. At this time, the upper heat dissipation block and the lower heat dissipation block are respectively located above and below the main board, thereby better heat dissipation is performed and the heat dissipation efficiency is improved.

[0013] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.

[0014] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is a cross-sectional view of the utility model.

[0018] In the figure: 1. Lower heat sink; 2. Connecting guide column; 3. Connecting screw hole; 4. Lower heat sink; 5. Connecting bolt; 6. Upper heat sink; 7. Slot; 8. Upper heat sink; 9. Spring. DETAILED DESCRIPTION

[0019] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.

[0020] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0021] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.

[0022] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0023] See also Figure 1-2 The present invention provides a technical solution for a heat dissipation mechanism of a high-power laser: it includes a lower heat dissipation block 1 and an upper heat dissipation block 6, the bottom end of the lower heat dissipation block 1 is provided with a lower heat dissipation fin 4, the four corners of the top of the lower heat dissipation block 1 are fixedly connected with connecting guide pillars 2, the top of the connecting guide pillars 2 are provided with connecting screw holes 3, the top of the upper heat dissipation block 6 is provided with an upper heat dissipation fin 8, the four corners of the upper heat dissipation fin 8 are provided with notches 7, the four corners of the upper heat dissipation block 6 are provided with connecting holes, and the connecting holes and the connecting guide pillars 2 are fixedly connected by connecting bolts 5.

[0024] The top end of the connecting bolt 5 is elastically connected to the top end of the upper heat sink 6 via a spring 9, so that the upper heat sink 6 and the lower heat sink 1 are more closely attached to the mainboard.

[0025] The bottom end of the connecting bolt 5 is threadedly connected to the connecting screw hole 3 .

[0026] The notch 7 is located just above the connecting hole.

[0027] During specific use, the lower heat sink 1 is placed at the bottom of the laser main board, and then the upper heat sink 6 is placed above the laser main board, and the connecting guide column 2 is inserted into the connecting hole at the bottom of the upper heat sink 6, and then the connecting bolt 5 is fixed to the connecting screw hole 3 through the notch 7. At this time, the upper heat sink 6 and the lower heat sink 1 are respectively located above and below the main board, thereby better dissipating heat and improving heat dissipation efficiency.

[0028] The above description is only the preferred embodiment of the utility model, which does not limit the protection scope of the utility model. For those skilled in the art, the utility model can be modified and varied in various ways. Any changes, modifications, substitutions, integrations and parameter changes to these embodiments within the spirit and principle of the utility model through conventional substitutions or capable of achieving the same functions without departing from the principles and spirit of the utility model shall fall within the protection scope of the utility model.

Claims

1. A heat dissipation mechanism for a high-power laser, characterized in that: The invention comprises a lower heat dissipation block (1) and an upper heat dissipation block (6), wherein a lower heat dissipation fin (4) is arranged at the bottom end of the lower heat dissipation block (1), the four corners of the top end of the lower heat dissipation block (1) are fixedly connected with connecting guide pillars (2), the top end of the connecting guide pillars (2) are provided with connecting screw holes (3), the top end of the upper heat dissipation block (6) is provided with upper heat dissipation fins (8), the four corners of the upper heat dissipation fins (8) are provided with notches (7), the four corners of the upper heat dissipation block (6) are provided with connecting holes, and the connecting holes are fixedly connected to the connecting guide pillars (2) by connecting bolts (5).

2. A heat dissipation mechanism for a high power laser as claimed in claim 1, characterized in that: The top end of the connecting bolt (5) is elastically connected to the top end of the upper heat dissipation block (6) via a spring (9).

3. A heat dissipation mechanism for a high power laser as claimed in claim 2, characterized in that: The bottom end of the connecting bolt (5) is threadedly connected to the connecting screw hole (3).

4. The heat dissipation mechanism of a high power laser as claimed in claim 3, characterized in that: The notch (7) is located directly above the connecting hole.

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