Local gold plating device

Abstract

The utility model discloses a local gold plating device which comprises a gold plating wheel and a material belt, the material belt is located on the outer wall of the gold plating wheel, two circles of wheel flanges are symmetrically arranged on the outer wall of the gold plating wheel, a containing groove is formed between the two wheel flanges, an annular groove is formed in the outer circle of each wheel flange, and a shielding belt fixedly connected with the gold plating wheel is arranged on the outer wall of each annular groove. A plurality of spot plating holes are formed in the outer wall of the shielding belt along the circumference of the shielding belt, the inner sides of the spot plating holes are in a boss shape, a plurality of flow equalizing holes are formed in the inner wall of the gold plating wheel along the circumference of the gold plating wheel and communicate with the annular groove, a connecting plate is arranged between every two flow equalizing holes, and a plurality of positioning pins are fixed to the outer wall of the containing groove along the circumference of the containing groove. The material belt comprises a material, a connecting belt and a positioning hole, the width of a spot plating hole in the shielding belt is set to be 1 mm, the hole diameter of the spot plating hole is reduced, meanwhile, insufficient liquid medicine spraying caused by a single spot plating hole is effectively prevented, meanwhile, sprayed liquid medicine is hindered through the shielding belt, and the sprayed liquid medicine is prevented from polluting a non-electroplating area on a product.

Description

Technical Field

[0001] The utility model relates to the technical field of spot plating, in particular to a local gold plating device. Background Art

[0002] Spot plating equipment is electroplating equipment for electronic components. In order to ensure the electrical performance of the contacts of electronic components, precious metals are usually spot plated on the contacts of electronic components. Since the contacts of electronic components are usually small and are usually stamped out by strip before assembly, wheel-type spot plating machines came into being.

[0003] Spot plating wheel is a kind of spot plating mold, also known as selective plating ring, spray head, spot plating fixture or spot plating fixture small wheel plating. It is a special tool used for selective electroplating of lead frames of specific electronic products on a general reel-to-reel spot plating machine. Spot plating with a spot plating wheel is a high-speed and economical electroplating method, suitable for lead frame electroplating of electronic components such as IC, diodes, transistors, connectors and LEDs. Because it can achieve targeted selective electroplating of functional areas, the electroplating area is small, which can achieve the purpose of saving precious metals such as gold and silver.

[0004] The spot plating wheel is usually set on the spot plating machine panel through the anode shaft. The outer ring of the spot plating wheel is provided with spot plating holes along the circumferential direction. An anode water bag for storing the electroplating liquid is provided on the anode shaft. The anode water bag is disc-shaped. The outer peripheral side of the anode water bag is provided with spray holes. When electroplating is carried out, the anode water bag radially sprays the electroplating liquid, and the electroplating liquid is sprayed to the electroplating area on the product to be electroplated through the spot plating holes.

[0005] However, the existing electroplating wheels will encounter the following problems during use:

[0006] 1. The plating solution splashes out from the gap between the spot plating wheel and the product to be plated through the spot plating hole, causing waste of plating solution and even contaminating the non-plating area on the product.

[0007] 2. In order to save precious metals, the aperture of the spot-plating holes is usually smaller. During use, the spot-plating solution is easy to adhere to the edge of the spot-plating hole, and crystals grow inside the spot-plating hole, causing the spot-plating hole to be blocked. The solution cannot be sprayed out, or the spray force is not enough, resulting in abnormal batch gold plating and reduced output. Utility Model Content

[0008] In view of the above problems, the utility model provides a local gold plating device, which can prevent the electroplating liquid from splashing out and causing waste, and prevent the point-plated holes from being blocked.

[0009] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a partial gold-plating device, comprising a gold-plating wheel and a material belt, the material belt is located on the outer wall of the gold-plating wheel, the outer wall of the gold-plating wheel is symmetrically provided with two circles of wheel rims, a placement groove is formed between the two wheel rims, the outer circle of the wheel rim is provided with an annular groove, the outer wall of the annular groove is provided with a shielding belt fixedly connected to the gold-plating wheel, the outer wall of the shielding belt is provided with a plurality of point-plated holes along its circumference, the inner side of the point-plated holes is in a boss shape, the inner wall of the gold-plating wheel is provided with a plurality of flow-equalizing holes along its circumference, the flow-equalizing holes are respectively connected to the annular grooves, a connecting plate is provided between the plurality of flow-equalizing holes, and the outer wall of the placement groove is fixed with a plurality of positioning pins along its circumference.

[0010] Preferably, the material belt comprises material, a connecting belt and positioning holes, the connecting belt is located between two materials, and the front ends of the connecting belt are respectively provided with positioning holes, and the positioning holes correspond one-to-one with the positioning pins.

[0011] Preferably, the point-plated holes correspond to the positioning pins one by one and the positioning pins are located between any two of the point-plated holes.

[0012] Preferably, a plurality of fixing holes are provided at the upper end of the gold-plated wheel along its circumference, and the flow-equalizing hole is a right-angled trapezoid and the inclined surface is a flow-guiding inclined surface.

[0013] Preferably, the masking tape is rectangular and has a width of 1 mm.

[0014] Preferably, the positioning pin is composed of a combination of a cylinder and a cone.

[0015] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0016] 1. By setting the width of the point-plated hole on the masking tape to 1mm, the aperture of the point-plated hole is reduced, and insufficient spraying of the solution caused by a single point-plated hole is effectively prevented. At the same time, the masking tape is used to block the sprayed solution to prevent the sprayed solution from contaminating the non-electroplating area on the product.

[0017] 2. By setting the inner side of the point-plated hole to a boss shape, the inner walls of the point-plated hole are inclined surfaces to prevent the liquid from adhering to the point-plated through hole and facilitate the flow of the liquid. By setting a guide slope at the lower end of the flow-equalizing hole, it is beneficial to guide the liquid that is more than sprayed out, quickly guide the excess liquid away, and prevent the liquid from adhering to the point-plated hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the masking belt of the utility model;

[0020] Figure 3 It is a partial enlarged schematic diagram of the material strip of the utility model;

[0021] Figure 4 It is a cross-sectional schematic diagram of the utility model.

[0022] Explanations in the figure: 1. Gold-plated wheel; 2. Material strip; 101. Wheel rim; 102. Placement groove; 103. Positioning pin; 104. Shielding strip; 105. Flow equalizing hole; 106. Guide slope; 107. Annular groove; 108. Connecting plate; 109. Fixing hole; 201. Material; 202. Connecting strip; 203. Positioning hole; 1041. Point-plated hole. DETAILED DESCRIPTION

[0023] The following is a further detailed description of the implementation of the present utility model in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0024] See also Figure 1 ,and Figure 2A local gold plating device includes a gold plating wheel 1 and a material belt 2. The material belt 2 is located on the outer wall of the gold plating wheel 1. The material belt 2 is inserted into the gold plating wheel 1 and fixed thereon, so that the gold plating wheel 1 can drive the material belt 2 to move when the gold plating wheel 1 rotates, ensuring that the material belt 2 can be spot plated as a whole. The outer wall of the gold plating wheel 1 is symmetrically provided with two rims 101. A placement groove 102 is formed between the two rims 101. The two rims 101 protrude outwards. A placement groove 102 is formed between the two rims 101. The groove is a placement groove 102, and the placement groove 102 is used to place the material strip 2. At the same time, because the two wheel rims 101 protrude outward, the placement groove 102 formed between the two wheel rims 101 also plays a role in limiting the material strip 2, preventing the material strip 2 from escaping from the placement groove 102, ensuring that the material strip 2 can be normally spot plated. The outer ring of the wheel rim 101 is provided with an annular groove 107, and the annular groove 107 is circular, connecting the inner wall and the outer wall of the gold-plated wheel 1, ensuring The liquid medicine sprayed from the inner wall of the gold-plating wheel 1 can be sprayed onto the surface of the material strip 2 through the annular groove 107 for spot plating, thereby ensuring uniformity of the spot plating of the material strip 2. The outer wall of the annular groove 107 is provided with a masking belt 104 fixedly connected to the gold-plating wheel 1. The masking belt 104 is rectangular and has a width of 1 mm. The outer wall of the masking belt 104 is provided with a plurality of spot-plating holes 1041 along its circumference. The inner side of the spot-plating hole 1041 is in a boss shape. By setting the width of the spot-plating hole 1041 on the masking belt 104 to 1 mm, the aperture of the spot-plating hole 1041 is reduced while effectively preventing a single spot-plating hole 1041 from causing insufficient liquid medicine spraying. At the same time, the masking belt 104 is used to block the sprayed liquid medicine to prevent the sprayed liquid medicine from contaminating the non-electroplating area on the product. By setting the inner side surface of the spot-plating hole 1041 to a boss shape, the inner wall of the spot-plating hole 1041 is respectively an inclined surface, thereby preventing the liquid medicine from adhering to the spot-plating through hole and facilitating the liquid medicine to flow away.

[0025] See also Figure 2 , Figure 3 and Figure 4The inner wall of the gold-plated wheel 1 is provided with a plurality of flow-equalizing holes 105 along its circumference, and the flow-equalizing holes 105 are respectively connected with the annular groove 107. The flow-equalizing holes 105 are used to disperse the sprayed medicine evenly into the annular groove 107, and achieve the effect of spot plating on the material strip 2 through the point-plating holes 1041 on the masking belt 104, so as to ensure that the point-plating thickness of the material strip 2 is consistent. A connecting plate 108 is provided between the plurality of flow-equalizing holes 105, and the connecting plate 108 is used to space the plurality of flow-equalizing holes 105 apart. At the same time, the connecting plate 108 is used to reinforce the gold-plated wheel 1, so as to ensure the firmness of the gold-plated wheel 1 and prolong the service life of the gold-plated wheel 1. The outer wall of the placement groove 102 is fixed with multiple positioning pins 103 along its circumference. The positioning pins 103 are used to position the material strip 2. When the material strip 2 is placed in the placement groove 102, the material strip 2 is matched with the positioning pins 103 one by one to determine the position. At the same time, the positioning pins 103 effectively prevent the material strip 2 from being placed upside down, and the installation direction of the material strip 2 can be determined more quickly. The positioning pins 103 are composed of a cylinder and a cone. The outer side of the positioning pin 103 is conical and the inner side is cylindrical. The cylindrical part is fixed on the gold-plated wheel 1, and the conical end is conducive to quick insertion into the positioning hole 203, which is convenient for quick positioning of the material strip 2.

[0026] See also Figure 2 , Figure 3 and Figure 4 The material strip 2 includes material 201, a connecting strip 202 and positioning holes 203. The connecting strip 202 is located between the materials 201. Positioning holes 203 are respectively opened at the front ends of the connecting strip 202. The positioning holes 203 correspond to the positioning pins 103 one by one. The material 201 is sword-shaped, which ensures that it is convenient to gold-plate and plug and fix it on the component. The connecting strip 202 is used to connect multiple materials 201 to form a material strip 2, which is conducive to continuous gold plating. At the same time, positioning holes 203 are opened on the connecting strip 202. The positioning holes 203 correspond one-to-one with the positioning pins 103, so as to realize the positioning of the material 201, and make the material 201 correspond one-to-one with the spot plating holes 1041, so as to realize the spot plating of the material 201. The spot plating holes 1041 correspond one-to-one with the positioning pins 103, and the positioning pins 103 are located between the spot plating holes 1041. The positioning pins 103 are set between the spot plating holes 1041, so as to ensure that the spot plating holes 1041 only spot-plate the material 201, avoid wasting the plating solution or even polluting the non-plating area on the product, and ensure the spot plating effect of the material 201.

[0027] See also Figure 1 and Figure 4The upper end of the gold-plating wheel 1 is provided with a plurality of fixing holes 109 along its circumference, and the fixing holes 109 are used to fix the device on the spot plating machine to ensure the firmness of the fixation between the gold-plating wheel 1 and the spot plating machine. The spot plating machine is an existing device and will not be described in detail here. The flow-equalizing hole 105 is a right-angled trapezoid and the inclined surface is a guide inclined surface 106. By arranging the guide inclined surface 106 at the lower end of the flow-equalizing hole 105, it is beneficial to guide the excess medicine sprayed out, quickly guide away the excess medicine, and prevent the medicine from adhering to the spot plating hole 1041.

[0028] When the utility model is used:

[0029] First, the masking belt 104 is placed outside the annular groove 107 and fixedly connected to the gold plating wheel 1, and the gold plating wheel 1 is fixed to the existing spot plating machine through the fixing hole 109;

[0030] Then, the material strip 2 is wound on the spot plating machine and passed through the gold plating wheel 1. The positioning holes 203 of the material strip 2 correspond one-to-one with the positioning pins 103 of the gold plating wheel 1, and the material 201 corresponds one-to-one with the spot plating holes 1041 on the masking tape 104.

[0031] Next, the spot plating machine is started to work. The spot plating machine drives the gold plating wheel 1 to rotate and sprays the liquid medicine at the same time. The sprayed liquid medicine is dispersed into the annular groove 107 through the flow-averaging hole 105. Due to the obstruction of the shielding belt 104, the liquid medicine can only adhere to the material 201 through the spot plating hole 1041, so as to achieve the effect of spot plating. At the same time, the gold plating wheel 1 rotates and drives the material belt 2 to move, so that the material belt 2 can be connected for spot plating.

[0032] Finally, the boss shape of the inner side surface of the point-plated hole 1041 makes the inner wall of the point-plated hole 1041 a slope, which prevents the medicine from adhering to the point-plated through hole and allows the excess medicine to flow away quickly. A guide slope 106 is set at the lower end of the flow-equalizing hole 105 to guide the excess medicine that is sprayed out and quickly guide the excess medicine away to prevent the medicine from adhering to the point-plated hole 1041 and causing blockage.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A local gold plating device, characterized in that: The invention comprises a gold-plated wheel (1) and a material belt (2), wherein the material belt (2) is located on the outer wall of the gold-plated wheel (1), the outer wall of the gold-plated wheel (1) is symmetrically provided with two rims (101), a placement groove (102) is formed between the two rims (101), the outer ring of the rim (101) is provided with an annular groove (107), the outer wall of the annular groove (107) is provided with a masking belt (104) fixedly connected to the gold-plated wheel (1), and the masking belt (104) is provided with a masking belt (104) fixedly connected to the gold-plated wheel (1). The outer wall of the gold-plated wheel (102) is provided with a plurality of spot-plated holes (1041) along its circumference, the inner side of the spot-plated holes (1041) is in a boss shape, the inner wall of the gold-plated wheel (1) is provided with a plurality of flow-equalizing holes (105) along its circumference, the flow-equalizing holes (105) are respectively connected to the annular groove (107), connecting plates (108) are provided between the plurality of flow-equalizing holes (105), and the outer wall of the placement groove (102) is fixed with a plurality of positioning pins (103) along its circumference.

2. A local gold plating device according to claim 1, characterized in that: The material belt (2) comprises a material (201), a connecting belt (202) and positioning holes (203); the connecting belt (202) is located between two materials (201); the front ends of the connecting belts (202) are respectively provided with positioning holes (203); the positioning holes (203) correspond one to one with the positioning pins (103).

3. A partial gold plating device according to claim 1, characterized in that: The point-plated holes (1041) correspond to the positioning pins (103) one by one, and the positioning pins (103) are located between two of the point-plated holes (1041).

4. A partial gold plating device according to claim 1, characterized in that: The upper end of the gold-plated wheel (1) is provided with a plurality of fixing holes (109) along its circumference, and the flow-balancing hole (105) is a right-angled trapezoid and the inclined surface is a flow-guiding inclined surface (106).

5. A partial gold plating device according to claim 1, characterized in that: The masking tape (104) is rectangular and has a width of 1 mm.

6. A partial gold plating device according to claim 1, characterized in that: The positioning pin (103) is composed of a cylinder and a cone.

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