Side light-emitting LED lamp bead structure

Abstract

The utility model provides a side light-emitting LED lamp bead structure which comprises a lamp bead side light-emitting base, a lamp bead chip, a heat dissipation silica gel pad and a side light-emitting lamp bead, the outer surface of the lamp bead side light-emitting base is fixedly provided with the lamp bead chip and the heat dissipation silica gel pad, and the heat dissipation silica gel pad is located between the lamp bead chip and the lamp bead side light-emitting base; the side light-emitting lamp beads are fixedly installed on the lamp bead chips. According to the utility model, efficient heat dissipation is realized by adopting an evaporation heat absorption principle, and heat generated by the chip is dissipated into air through the gasification of cooling liquid and the heat dissipation effect of the heat dissipation fins, so that continuous heat dissipation circulation is formed. The U-shaped circulating heat dissipation pipe is specially designed, the sealing seat and the circulating ball are combined, cooling liquid backflow is effectively prevented, and mutual influence of steam and cooling liquid is reduced. When the cooling liquid is accumulated to a certain degree, the circulating ball floats and flows back to a heat source, and heat dissipation circulation continues.

Description

Technical Field

[0001] The utility model belongs to the technical field of lamp beads, and in particular relates to a side-emitting LED lamp bead structure. Background Art

[0002] Side-emitting LED lamp beads are a type of LED lighting element with unique luminous properties. Its design allows light to radiate from the side, making it widely used in lighting and display applications. The luminous direction range of side-emitting LED lamp beads is relatively wide, which enables it to provide a more uniform and soft light distribution, suitable for a variety of lighting needs. Especially in occasions that require soft lighting, such as indoor lighting, side-emitting LED lamp beads can avoid strong light spots or glare, bringing users a more comfortable visual experience.

[0003] At present, the heat dissipation structure of side-emitting LED lamp beads mostly relies on thermal conductive materials and heat dissipation fin structures to achieve the heat dissipation effect. For example, the Chinese utility model patent document with announcement number CN217522035U describes a side-emitting LED lamp bead structure, whose working principle is mainly to transfer the heat generated by the chip to the copper tube column through the heat conduction plate and silica gel of graphene material, and then dissipate the heat into the air with the help of the heat dissipation fins outside the copper tube. This heat dissipation method mainly relies on the thermal conductivity of the material itself, and increases the contact area between the heat and the outside air through structural design, so as to achieve the purpose of heat dissipation. However, the heat dissipation efficiency of this method is relatively low, and it cannot effectively cope with the heat dissipation needs under the condition of high heat generated by the chip.

[0004] Therefore, it is very necessary to invent a side-emitting LED lamp bead structure. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a side-emitting LED lamp bead structure, including a lamp bead side-emitting base, a lamp bead chip, a heat dissipation silicone pad and a side-emitting lamp bead, wherein the lamp bead chip and the heat dissipation silicone pad are fixedly installed on the outer surface of the lamp bead side-emitting base, and the heat dissipation silicone pad is located between the lamp bead chip and the lamp bead side-emitting base; the side-emitting lamp bead is fixedly installed on the lamp bead chip;

[0006] The lamp bead side light-emitting base includes a wiring base, a circulating heat dissipation pipe, a sealing seat, a circulating ball and heat dissipation fins. The lamp bead chip and the heat dissipation silicone pad are fixedly installed on the outer surface of the wiring base. A circulating heat dissipation pipe is fixedly installed above the wiring base. A sealing seat is fixedly installed at one end of the circulating heat dissipation pipe, and the circulating ball is also arranged inside the circulating heat dissipation pipe. The sealing seat is located below the circulating ball, and the two are in contact with each other; a plurality of heat dissipation fins are fixedly installed on the outside of the circulating heat dissipation pipe.

[0007] Preferably, the heat dissipation silicone pad is respectively connected to the lamp bead side light-emitting base and the lamp bead chip heat capacitor, and the heat dissipation silicone pad allows heat transfer.

[0008] Preferably, the wiring base is a rectangular hollow structure, a coolant is injected into the hollow cavity of the wiring base, and wiring pins are installed below the wiring base.

[0009] Preferably, the hollow cavity inside the wiring base is connected to the two circulating heat dissipation pipes, the circulating heat dissipation pipes are "U"-shaped hollow heat pipes, and there is a distance between the heat dissipation fins fixedly installed outside the circulating heat dissipation pipes.

[0010] Preferably, the sealing seat and the circulating ball are located inside one end of the circulating heat dissipation pipe, and the sealing seat and the circulating ball are used to block one end of the circulating heat dissipation pipe. The blocked end of the circulating heat dissipation pipe only allows the liquefied coolant to flow, and does not allow the gas after the coolant is vaporized to enter.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] The utility model abandons the traditional heat dissipation method that relies on the thermal conductivity of materials, and innovatively adopts the principle of evaporative heat absorption to achieve efficient heat dissipation. Specifically, when the chip generates heat, this heat is quickly absorbed by the coolant and causes it to vaporize. The vaporized coolant effectively dissipates the heat into the air through the heat dissipation fin structure, and then cools and turns back into a liquid state. The coolant will then flow back to the heat source, continue to absorb and take away heat, thereby forming a continuous and efficient heat dissipation cycle. This design is particularly suitable for dealing with high heat generated by the chip, and effectively improves the heat dissipation effect. In addition, in order to prevent the reflux of the cooled coolant from interfering with the vaporized coolant, a unique "U"-shaped circulating heat dissipation pipe design is adopted. At one end of the heat dissipation pipe, a sealing seat and a circulating ball are set. This design can retain the cooled coolant at one end of the pipe body, significantly reducing the mutual influence between steam and coolant. When the coolant accumulates to a certain extent, its buoyancy is sufficient to float the circulating ball, thereby allowing the coolant to flow back to the heat source and continue to participate in the heat dissipation cycle. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0014] Figure 2 It is a structural schematic diagram of a half section of the utility model.

[0015] Figure 3 This utility model Figure 2 Schematic diagram of the local enlarged structure at A.

[0016] In the figure:

[0017] Lamp bead side luminous base 1, wiring base 11, circulating heat dissipation pipe 12, sealing seat 13, circulating ball 14, heat dissipation fin 15, lamp bead chip 2, heat dissipation silicone pad 3, side luminous lamp bead 4. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be described clearly and completely below. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0019] In the description of the embodiments, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0020] As attached Figure 1 To Attachment Figure 3 As shown:

[0021] The utility model provides a side-emitting LED lamp bead structure, comprising a lamp bead side-emitting base 1, a lamp bead chip 2, a heat dissipation silicone pad 3 and a side-emitting lamp bead 4. The lamp bead chip 2 and the heat dissipation silicone pad 3 are fixedly mounted on the outer surface of the lamp bead side-emitting base 1, and the heat dissipation silicone pad 3 is located between the lamp bead chip 2 and the lamp bead side-emitting base 1; the side-emitting lamp bead 4 is fixedly mounted on the lamp bead chip 2.

[0022] The lamp bead side-emitting base 1 includes a wiring base 11, a circulating heat dissipation pipe 12, a sealing seat 13, a circulating ball 14 and heat dissipation fins 15. The lamp bead chip 2 and the heat dissipation silicone pad 3 are fixedly installed on the outer surface of the wiring base 11. The circulating heat dissipation pipe 12 is fixedly installed on the top of the wiring base 11. The sealing seat 13 is fixedly installed at one end of the circulating heat dissipation pipe 12, and the circulating ball 14 is also arranged inside the circulating heat dissipation pipe. The sealing seat 13 is located below the circulating ball 14, and the two are in contact with each other; a plurality of heat dissipation fins 15 are fixedly installed on the outside of the circulating heat dissipation pipe 12. The lamp bead side-emitting base 1 abandons the traditional heat dissipation method that relies on the thermal conductivity of the material, and innovatively adopts the principle of evaporative heat absorption to achieve efficient heat dissipation. This design is particularly suitable for dealing with high heat generated by the chip and effectively improves the heat dissipation effect. Embodiment 1:

[0023] Specifically, the heat dissipation silicone pad 3 is thermally connected to the lamp bead side light emitting base 1 and the lamp bead chip 2, respectively, and the heat dissipation silicone pad 3 allows heat transfer to form an effective heat conduction path. This thermal connection ensures that heat can be quickly and efficiently transferred from the lamp bead chip 2 to the heat dissipation silicone pad 3, and then further conducted to the lamp bead side light emitting base 1.

[0024] Specifically, the wiring base 11 is a rectangular hollow structure, and a coolant is injected into the hollow cavity of the wiring base 11 for absorbing and conducting heat. Wiring pins are installed below the wiring base 11.

[0025] Specifically, the hollow cavity inside the wiring base 11 is connected to the two circulating heat dissipation pipes 12. The hollow cavity inside the wiring base 11 is the heat source. The circulating heat dissipation pipe 12 is a "U"-shaped hollow heat pipe, which not only increases the heat dissipation area, but also achieves efficient heat dissipation through its unique circulation mechanism. A sealing seat 13 and a circulation ball 14 are provided at one end of the circulating heat dissipation pipe 12. This design cleverly prevents the reflux of the coolant and ensures the smooth progress of the gasification process. There is a spacing between the heat dissipation fins 15 fixedly installed outside the circulating heat dissipation pipe 12.

[0026] Specifically, the sealing seat 13 and the circulation ball 14 are located in one end of the circulation heat dissipation tube 12. The sealing seat 13 and the circulation ball 14 are used to block one end of the circulation heat dissipation tube 12. The blocked end of the circulation heat dissipation tube 12 only allows the liquefied coolant to circulate, and does not allow the gas after the coolant is vaporized to enter. The combined design of the sealing seat 13 and the circulation ball 14 together forms an effective sealing mechanism. The sealing seat 13, as a fixed sealing component, fits tightly on the inner wall of the circulation heat dissipation tube 12 to ensure the sealing of one end of the tube body. The circulation ball 14 is a floating component, which is located above the sealing seat 13 and in close contact with it. This design allows the circulation ball 14 to float under certain conditions, thereby regulating the circulation of the coolant. Specifically, when the coolant absorbs heat and vaporizes in the circulation heat dissipation tube 12, the vaporized coolant will rise and dissipate the heat to the air through the heat dissipation fins 15. The liquefied coolant will accumulate at the other end of the circulation heat dissipation tube 12. When the liquefied coolant accumulates to a certain extent, the buoyancy generated by the liquefied coolant is sufficient to float the circulation ball 14 , thereby opening the seal and allowing the liquefied coolant to flow back into the hollow cavity in the wiring base 11 . Embodiment 2:

[0027] First, when the lamp bead chip 2 is working, a large amount of heat will be generated. This heat is first conducted through the heat dissipation silicone pad 3. As a medium for heat conduction, the heat dissipation silicone pad 3 quickly and effectively transfers the heat from the lamp bead chip 2 to the lamp bead side light-emitting base 1. When the heat is conducted to the wiring base 11, the coolant will quickly absorb the heat. As the heat continues to accumulate, the coolant gradually heats up and vaporizes. The vaporized coolant has a high heat conduction efficiency and can quickly bring the heat to the circulating heat dissipation pipe 12. When the vaporized coolant rises in the circulating heat dissipation pipe 12, the vaporized coolant dissipates the heat into the air through the heat dissipation fins 15. As the vaporized coolant continues to rise and dissipate heat, the other end of the circulating heat dissipation pipe 12 accumulates the liquefied coolant. When the liquefied coolant accumulates to a certain extent, the buoyancy it generates is sufficient to float the circulating ball 14, thereby opening the seal and allowing the liquefied coolant to flow back to the hollow cavity in the wiring base 11. At this point, a continuous and efficient heat dissipation cycle is formed.

[0028] Utilizing the technical solution described in the utility model, or those skilled in the art designing similar technical solutions inspired by the technical solution of the utility model to achieve the above-mentioned technical effects, all fall within the protection scope of the utility model.

Claims

1. A side-emitting LED lamp bead structure, characterized in that: The invention comprises a lamp bead side-light emitting base (1), a lamp bead chip (2), a heat dissipation silicone pad (3) and a side-light emitting lamp bead (4); the lamp bead chip (2) and the heat dissipation silicone pad (3) are fixedly mounted on the outer surface of the lamp bead side-light emitting base (1); the heat dissipation silicone pad (3) is located between the lamp bead chip (2) and the lamp bead side-light emitting base (1); and the side-light emitting lamp bead (4) is fixedly mounted on the lamp bead chip (2); The lamp bead side-light emitting base (1) comprises a wiring base (11), a circulating heat dissipation pipe (12), a sealing seat (13), a circulating ball (14) and a heat dissipation fin (15); the lamp bead chip (2) and the heat dissipation silicone pad (3) are fixedly mounted on the outer surface of the wiring base (11); the circulating heat dissipation pipe (12) is fixedly mounted above the wiring base (11); a sealing seat (13) is fixedly mounted at one end of the circulating heat dissipation pipe (12), and the circulating ball (14) is also arranged inside the circulating heat dissipation pipe; the sealing seat (13) is located below the circulating ball (14), and the two are in contact with each other; a plurality of heat dissipation fins (15) are fixedly mounted outside the circulating heat dissipation pipe (12).

2. A side-emitting LED lamp bead structure as claimed in claim 1, characterized in that: The heat dissipation silica gel pad (3) is thermally connected to the lamp bead side light emitting base (1) and the lamp bead chip (2) respectively, and the heat dissipation silica gel pad (3) allows heat transfer.

3. A side-emitting LED lamp bead structure as claimed in claim 1, characterized in that: The wiring base (11) is a rectangular hollow structure, a cooling liquid is injected into the hollow cavity of the wiring base (11), and wiring pins are installed below the wiring base (11).

4. A side-emitting LED lamp bead structure as claimed in claim 1, characterized in that: The hollow cavity inside the wiring base (11) is connected to the two circulating heat dissipation pipes (12); the circulating heat dissipation pipes (12) are "U"-shaped hollow heat pipes, and there is a spacing between the heat dissipation fins (15) fixedly installed outside the circulating heat dissipation pipes (12).

5. The side-emitting LED lamp bead structure according to claim 1, characterized in that: The sealing seat (13) and the circulating ball (14) are located inside one end of the circulating heat dissipation pipe (12). The sealing seat (13) and the circulating ball (14) are used to block one end of the circulating heat dissipation pipe (12). The blocked end of the circulating heat dissipation pipe (12) only allows the liquefied coolant to flow, and does not allow the gas after the coolant is vaporized to enter.

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