Liquid cooling heat dissipation device for DIMM

Abstract

The utility model belongs to the technical field of memory banks, and discloses a liquid cooling heat dissipation device for a DIMM, which comprises a heat conduction assembly, a liquid cooling assembly and a rotating assembly, and is characterized in that the heat conduction assembly comprises a heat conduction plate and a heat pipe, and the heat conduction plate is arranged between the heat pipe and the DIMM; the liquid cooling assembly comprises a first water collector, a second water collector and a circulating pipe, two ends of the circulating pipe are respectively communicated with the first water collector and the second water collector, one end of the heat pipe is fixedly connected with one of the first water collector and the second water collector, and the other end of the heat pipe is selectively connected with the other one of the first water collector and the second water collector; the rotating assembly is connected with the first water collector or the second water collector. Thus, the heat conducting plate and the DIMM are assembled, then the DIMM is inserted into the memory slot, the heat conducting plate can well transfer heat of the DIMM by adjusting connection between the heat conducting plate and the DIMM, the heat pipe can rotate in the direction close to or away from the heat conducting plate under the action of the rotating assembly, and enough space is conveniently reserved around the DIMM to assemble and disassemble the DIMM.

Description

Technical Field

[0001] The utility model relates to the technical field of memory sticks, in particular to a liquid cooling device for DIMM. Background Art

[0002] DIMM stands for Dual-Inline-Memory-Modules, and its Chinese name is dual inline memory module. It is a memory stick with a 64-bit data channel.

[0003] DIMM will generate a lot of heat during use. In order to cool down the DIMM in time to ensure the normal operation of the DIMM, it is usually necessary to use a liquid cooling device to cool and dissipate the heat of the DIMM. The existing liquid cooling device includes a water collector, a cooling channel and a thermal conductive material. The water collector and the cooling channel are connected. The cooling channel is fixedly connected to the water collector by soldering, and the cooling channel is installed on the chassis PCB (Printed Circuit Board); the thermal conductive material is arranged on both sides of the cooling channel, so that after the DIMM is assembled into the memory slot, the heat generated by the DIMM can be transferred to the cooling channel through the thermal conductive material, so that the liquid in the cooling channel takes away the heat of the DIMM to achieve the function of cooling and dissipating heat.

[0004] However, after multiple DIMMs are assembled into the memory slots respectively, the gaps between the DIMMs are narrow, and tools are needed for installation and removal. In addition, due to factors such as machining tolerances, the space where the DIMMs are located will cause deviations in the dimensions after assembly, so that there will be gaps between the DIMMs and the thermal conductive material, or the DIMMs cannot be installed into the reserved space. The soldering connection between the cooling channel and the water collector is not only inconvenient to assemble, but may also cause leakage due to poor welding, making it inconvenient to disassemble and assemble the DIMMs and the liquid cooling device. Utility Model Content

[0005] The utility model aims to provide a liquid cooling and heat dissipation device for DIMM, so as to solve the problem that it is inconvenient to disassemble and assemble DIMM and the liquid cooling and heat dissipation device.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] A liquid cooling device for DIMM, comprising: a heat conduction component, the heat conduction component comprising a heat conduction plate and a heat pipe, the heat conduction plate is arranged between the heat pipe and the DIMM, and is used to transfer the heat of the DIMM to the heat pipe; a liquid cooling component, the liquid cooling component comprising a first water collector, a second water collector and a circulation pipe, the two ends of the circulation pipe are respectively connected to the first water collector and the second water collector, one end of the heat pipe is fixedly connected to one of the first water collector and the second water collector, and the other end of the heat pipe is selectively connected to the other of the first water collector and the second water collector; a rotating component, the rotating component is connected to the first water collector or the second water collector, and is used to make the first water collector or the second water collector connected to the rotating component drive the heat pipe to rotate.

[0008] Preferably, a plurality of the heat-conducting components are provided, and the plurality of the heat-conducting components are arranged in an interval manner. A first mounting groove is provided on the first water collector, and a second mounting groove is provided on the second water collector. Both ends of each of the heat pipes are respectively provided in the first mounting groove and the second mounting groove.

[0009] Preferably, the heat pipe comprises a first portion and two second portions both connected to the first portion, and the two second portions are respectively arranged at two ends of the first portion and are both located on a side of the first portion facing the DIMM.

[0010] Preferably, two rotating assemblies are provided, and the two rotating assemblies are respectively arranged at two ends of the first water collector, so as to enable the first water collector to drive the heat pipe to rotate.

[0011] Preferably, the second water collector is connected to a limiting member for selectively limiting the relative position of one end of the heat pipe facing the second water collector and the second water collector.

[0012] Preferably, the limiting member is a limiting plate, and the limiting plate is detachably connected to the second water collector. When the limiting plate is connected to the second water collector, the heat pipe is located between the limiting plate and the second water collector.

[0013] Preferably, the rotating assembly comprises a rotating drum, and two rotating drums are provided. The two rotating drums are respectively arranged at two ends of the first water collector, and the rotating drum is rotatably connected to the circulation pipe.

[0014] Preferably, the rotating assembly further comprises a rotating base, the rotating base is arranged in one-to-one correspondence with the rotating cylinder, and the rotating cylinder is rotatably connected to the rotating base.

[0015] Preferably, the rotating assembly further comprises a positioning member, which is selectively connected to the rotating cylinder and is used to limit the relative position of the rotating cylinder and the rotating base.

[0016] Preferably, the heat-conducting assembly further includes a first heat-conducting member, which is disposed between the heat-conducting plate and the DIMM and is used to transfer the heat of the DIMM to the heat-conducting plate; and / or the heat-conducting assembly further includes a second heat-conducting member, which is disposed between the heat pipe and the heat-conducting plate and is used to transfer the heat of the heat-conducting plate to the heat pipe.

[0017] Beneficial effects of the utility model:

[0018] A liquid cooling device for DIMM includes a heat conduction component, a liquid cooling component and a rotating component. The heat conduction component includes a heat conduction plate and a heat pipe. The heat conduction plate is arranged between the heat pipe and the DIMM and is used to transfer the heat of the DIMM to the heat pipe. The liquid cooling component includes a first water collector, a second water collector and a circulation pipe. The two ends of the circulation pipe are respectively connected to the first water collector and the second water collector. One end of the heat pipe is fixedly connected to one of the first water collector and the second water collector, and the other end of the heat pipe is selectively connected to the other of the first water collector and the second water collector. The rotating component is connected to the first water collector or the second water collector and is used to make the first water collector or the second water collector connected to the rotating component drive the heat pipe to rotate.

[0019] In this way, inserting the DIMM equipped with the heat conductive plate into the memory slot can improve the assembly efficiency of the DIMM, and the heat pipe is connected to the first water collector and the second water collector respectively, so that the heat of the DIMM can be transferred to the first water collector and the second water collector through the heat conductive plate and the heat pipe, thereby realizing liquid cooling of the DIMM; under the action of the rotating component, the heat pipe can rotate in the direction close to or away from the heat conductive plate, so that the heat pipe can selectively abut against the heat conductive plate, so that when the heat pipe abuts against the heat conductive plate, the heat of the DIMM can be well transferred to the heat pipe, and when the heat pipe and the heat conductive plate are released from abutment, sufficient disassembly space can be left around the DIMM, avoiding the need to use tools for disassembly due to the small gap between the DIMM and the heat pipe, reducing the interference between the DIMM and the heat pipe during maintenance, and improving the loading and unloading efficiency of the DIMM and the liquid cooling device for the DIMM. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of a liquid cooling device for DIMM in one embodiment of the utility model;

[0021] Figure 2 It is a partial structural schematic diagram of a liquid cooling and heat dissipation device for DIMM in one embodiment of the utility model;

[0022] Figure 3In one embodiment of the utility model Figure 2 A magnified image of point A;

[0023] Figure 4 is a cross-sectional view of a liquid cooling device for DIMM in one embodiment of the utility model;

[0024] Figure 5 It is a partial structural schematic diagram of a liquid cooling heat dissipation device for DIMM in one embodiment of the utility model.

[0025] In the figure:

[0026] 1. Heat-conducting assembly; 11. Heat-conducting plate; 111. Heat-conducting groove; 12. Heat pipe; 121. First part; 122. Second part; 13. First heat-conducting member; 14. Second heat-conducting member; 2. Liquid-cooling assembly; 21. First water collector; 211. First mounting groove; 22. Second water collector; 221. Second mounting groove; 222. Stopper; 23. Circulation pipe; 24. Connecting pipe; 3. Rotating assembly; 31. Rotating cylinder; 311. Sealing ring; 312. Positioning groove; 32. Rotating base; 321. Rotating hole; 33. Positioning member. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only the parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0028] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0030] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0031] See also Figure 1 The utility model provides a liquid cooling device for DIMM, including a heat conduction component 1, a liquid cooling component 2 and a rotating component 3. The heat conduction component 1 includes a heat conduction plate 11 and a heat pipe 12. The heat conduction plate 11 is arranged between the heat pipe 12 and the DIMM, and is used to transfer the heat of the DIMM to the heat pipe 12; the liquid cooling component 2 includes a first water collector 21, a second water collector 22 and a circulation pipe 23, and the two ends of the circulation pipe 23 are respectively connected to the first water collector 21 and the second water collector 22. One end of the heat pipe 12 is fixedly connected to one of the first water collector 21 and the second water collector 22, and the other end of the heat pipe 12 is selectively connected to the other of the first water collector 21 and the second water collector 22; the rotating component 3 is connected to the first water collector 21 or the second water collector 22, and is used to make the first water collector 21 or the second water collector 22 connected to the rotating component 3 drive the heat pipe 12 to rotate.

[0032] In this embodiment, the heat conducting plate 11 is provided with a heat conducting groove 111 whose shape is adapted to the DIMM, so that the DIMM can be placed in the heat conducting groove 111, the length direction of the heat conducting plate 11 and the length direction of the heat pipe 12 are parallel to the length direction of the DIMM, the length of the heat pipe 12 is greater than the length of the heat conducting plate 11, and the heat conducting plate 11 is a VC (vapor chamber, vacuum chamber heat sink heat dissipation technology) temperature equalizing plate; the first water collector 21 and the second water collector 22 are respectively arranged at both ends of the heat conducting plate 11, and the two ends of the circulation pipe 23 are respectively connected to the ends on the same side of the first water collector 21 and the second water collector 22, and the liquid cooling component 2 also includes two connecting pipes 24 made of copper material, and the ends on the same side of the two connecting pipes 24 are respectively connected to the end of the first water collector 21 away from the circulation pipe 23 and the end of the second water collector 22 away from the circulation pipe 23.

[0033] Furthermore, one end of the heat pipe 12 is welded to the first water collector 21, and the other end is selectively abutted against the second water collector 22. The rotating assembly 3 is connected to the first water collector 21 so that the first water collector 21 drives the heat pipe 12 to rotate with the length direction of the first water collector 21 as the axis.

[0034] It should be noted that the cooling medium is transported to the first water collector 21 or the second water collector 22 through the connecting pipe 24, so that the liquid cooling medium can flow in the circulation pipe 23. The heat pipe 12 stores a cooling medium that can change between the liquid phase and the gas phase. In this embodiment, the cooling medium is cooling water. When the DIMM generates heat during operation, the heat on the surface of the DIMM is transferred to the heat pipe 12 through the heat transfer plate 11, so that the liquid cooling medium in the heat pipe 12 absorbs heat and vaporizes, realizing a phase change process from liquid to gas. The gaseous cooling medium flows to the ends of the heat pipe 12 close to the first water collector 21 and the second water collector 22, and is liquefied under the action of the liquid cooling medium with lower temperature in the first water collector 21 and the second water collector 22, so that the heat carried by the cooling medium in the heat pipe 12 is transferred to the cooling medium in the circulation pipe 23, thereby realizing liquid cooling of the heat transfer plate 11 and the DIMM.

[0035] In this way, the heat conducting plate 11 is assembled on the DIMM, and the DIMM is inserted into the memory slot, which is convenient for assembling the DIMM, and the DIMM can be adjusted to always abut against the heat conducting plate 11, thereby improving the heat conduction efficiency of the heat conducting plate 11. One end of the heat pipe 12 is fixedly connected to the first water collector 21, and the other end can be selectively connected to the second water collector 22. The heat pipe 12 can be assembled with the first water collector 21 first, and then the heat pipe 12 is rotated by the rotating component 3 until it is located above the heat conducting plate 11 and abuts against the heat conducting plate 11, thereby realizing the assembly of the heat pipe 12 and the DIMM. When the DIMM is to be disassembled, the heat pipe 12 can be rotated in a direction away from the heat conducting plate 11 under the action of the rotating assembly 3 and the connection between the heat pipe 12 and the heat conducting plate 11 can be released to leave enough space for disassembly, so as to avoid the need to use tools for disassembly due to a small gap between the DIMM and the heat pipe 12, and to facilitate disassembly of the DIMM from both ends of the DIMM. In addition, the heat pipe 12 is far away from the DIMM, so it is easy to disassemble the heat pipe 12, reduce interference between the heat pipe 12 and the DIMM during maintenance, and avoid damage to the heat pipe 12 or the DIMM.

[0036] It can be understood that the heat conducting plate 11 can also be an aluminum plate, a copper plate, a stainless steel plate, etc. In this embodiment, the heat conducting plate 11 adopts a VC temperature equalizing plate, the purpose of which is to make the heat conducting plate 11 have a higher structural strength. The materials of the connecting pipe 24, the heat pipe 12, and the heat conducting plate 11 can be flexibly adjusted according to actual needs, as long as the temperature transfer effect can be achieved; the cooling medium in the heat pipe 12 is not limited to cooling water, but can also be other coolants, and this embodiment does not make too many restrictions here.

[0037] Furthermore, the connecting pipe 24 connected to the first water collector 21 can be used as a cooling medium input end or as a cooling medium output end, that is, the cooling medium can flow from the first water collector 21 to the second water collector 22, or from the second water collector 22 to the first water collector 21. A plurality of circulation pipes 23 can also be provided, and the first water collector 21 and the second water collector 22 can both be cooling medium input ends or cooling medium output ends, so as to realize the heat transfer of the heat pipe 12, which will not be elaborated here.

[0038] See also Figure 1 In some embodiments, a plurality of heat-conducting components 1 are provided, and the plurality of heat-conducting components 1 are arranged in an alternating pattern. A first mounting groove 211 is provided on the first water collector 21, and a second mounting groove 221 is provided on the second water collector 22. Both ends of each heat pipe 12 are respectively provided in the first mounting groove 211 and the second mounting groove 221.

[0039] In this embodiment, 6 DIMMs are provided, and the 6 DIMMs are evenly spaced along the length direction of the first water collecting groove; correspondingly, the number of the first mounting groove 211 and the second mounting groove 221 are both 6, one heat-conducting component 1 is connected to one DIMM, and one heat-conducting component 1 includes a heat-conducting plate 11 and a heat pipe 12, that is, each DIMM is connected to one heat pipe 12; the two ends of each heat pipe 12 extend into a first mounting groove 211 and a second mounting groove 221 respectively.

[0040] In this way, the heat conducting plate 11 is assembled to each DIMM accordingly, and multiple DIMMs are inserted into the memory slots, the corresponding heat pipes 12 are assembled to the first water collector 21 and the first water collector 21 is rotated, so that the first water collector 21 drives the multiple heat pipes 12 to move to the corresponding heat conducting plate 11 respectively, which can realize the rapid assembly of the heat pipes 12 and the heat conducting plate 11, improve the assembly efficiency, and facilitate the adjustment of the relative position of the heat conducting plate 11 and the DIMM, and the relative position of the heat pipes 12 and the heat conducting plate 11, so that the DIMM, the heat conducting plate 11, and the heat pipes 12 are kept in contact, improve the thermal conductivity efficiency, and avoid the influence of liquid cooling due to the existence of assembly gaps; the first water collector 21 is rotated so that the first water collector 21 drives the heat pipes 12 to rotate away from the heat conducting plate 11, so that both ends of the multiple DIMMs have sufficient loading and unloading space, which is convenient for the staff to remove the DIMMs from the memory slots from both ends of the DIMMs, and improve the loading and unloading efficiency of the DIMMs and the liquid cooling device for the DIMMs in the chassis.

[0041] It can be understood that the first mounting groove 211 and the second mounting groove 221 can also be set as a through groove, so that the ends of the same side of multiple heat pipes 12 are respectively located in the same first mounting groove 211 or the second mounting groove 221. In this embodiment, the heat pipe 12 is arranged in a one-to-one correspondence with the first mounting groove 211 and the second mounting groove 221 in order to enhance the limiting effect of the first mounting groove 211 and the second mounting groove 221 on the two ends of the heat pipe 12, avoid collision or friction between the multiple heat pipes 12, thereby affecting the service life of the heat pipe 12, and facilitate the loading and unloading of the heat pipe 12.

[0042] See also Figure 2 In some embodiments, the heat pipe 12 includes a first portion 121 and two second portions 122 connected to the first portion 121. The two second portions 122 are respectively arranged at both ends of the first portion 121 and are both located on the side of the first portion 121 facing the DIMM, that is, the second portion 122 extends downward.

[0043] Among them, the connection between the first part 121 and the second part 122 is a smooth transition, the second part 122 facing the first water collector 21 is located in the first mounting groove 211 and is welded to the first water collector 21, and when the heat pipe 12 is rotated toward the direction close to the heat conducting plate 11 so that the first part 121 abuts against the heat conducting plate 11, the second part 122 facing the second water collector 22 is clamped with the second water collector 22.

[0044] In this way, the liquid cooling medium in the first part 121 is converted into a gas phase after absorbing the heat of the heat conducting plate 11, and the downwardly extending second part 122 facilitates the gas cooling medium to flow from the second part 122 to the first part 121. The heat of the gas cooling medium is absorbed by the cooling medium in the first collector 21 and the second collector 22, and the gas cooling medium is converted back into a liquid cooling medium, thereby realizing liquid cooling of the heat conducting plate 11 and the DIMM, and improving the liquid cooling effect of the heat pipe 12.

[0045] It can be understood that the downward extension distance of the second part 122 can be adjusted according to the setting position of the first collector 21 and the second collector 22, and the first part 121 and the second part 122 can also be coaxially arranged (that is, the first part 121 and the second part 122 form a straight tube-shaped heat pipe 12), which will not be listed in detail here.

[0046] See also Figure 2 In some embodiments, two rotating assemblies 3 are provided, and the two rotating assemblies 3 are respectively provided at two ends of the first water collector 21, so as to enable the first water collector 21 to drive the heat pipe 12 to rotate.

[0047] In this way, the two rotating components 3 can make the first water collector 21 rotate stably with the length direction of the first water collector 21 as the axis, and stably support the first water collector 21 and the heat pipe 12, so that the heat pipe 12 can rotate toward or away from the heat conductive plate 11, which is convenient for loading and unloading DIMM and heat pipe 12.

[0048] It can be understood that, the rotating assembly 3 can also be provided with one, and one rotating assembly 3 is connected to one end of the first water collector 21 to rotate the first water collector 21. The rotating assembly 3 can also be provided in both the first water collector 21 and the second water collector 22 so that both ends of the heat pipe 12 can rotate. The specific number and setting position of the rotating assembly 3 can be flexibly adjusted according to actual needs, and no more examples are given here.

[0049] See also Figure 2In some embodiments, the second water collector 22 is connected to a limiting member 222 for selectively limiting the relative position of one end of the heat pipe 12 facing the second water collector 22 and the second water collector 22. Further, the limiting member 222 is a limiting plate, which is detachably connected to the second water collector 22. When the limiting plate is connected to the second water collector 22, the heat pipe 12 is located between the limiting plate and the second water collector 22.

[0050] In this embodiment, the limiting plate is disposed above the second water collector 22 and is detachably connected to the second water collector 22 by bolts. The length direction of the limiting plate is parallel to the length direction of the second water collector 22 .

[0051] In this way, by rotating the first water collector 21, the first water collector 21 drives the heat pipe 12 to rotate toward the direction close to the heat conducting plate 11. When the first part 121 abuts against the heat conducting plate 11, the second part 122 facing the second water collector 22 is inserted into the second mounting groove 221. The limit plate is assembled to the top surface of the second water collector 22, which can limit the position of the second part 122 in the second mounting groove 221, and avoid the second part 122 from detaching from the second mounting groove 221 during use, which affects the heat dissipation of the heat conducting plate 11 and the DIMM; when it is necessary to disassemble the DIMM liquid cooling device or DIMM, the limit plate is removed from the second water collector 22 and the restriction on the second part 122 is released. The first water collector 21 is rotated in the opposite direction to move the second part 122 out of the second mounting groove 221. Sufficient operating space can be provided, which is convenient for staff to maintain and load and unload the DIMM and the DIMM liquid cooling device.

[0052] It can be understood that the limit plate can also be provided with an insert block, and the second water collector 22 is correspondingly provided with a slot for inserting the insert block, so that the limit plate and the second water collector 22 can be plugged in; the limit member 222 can also be a limit buckle set on the second water collector 22, and the heat pipe 12 can be connected to the second water collector 22 by snapping into the limit buckle. The specific structure of the limit member 222 and the connection method with the second water collector 22 can be flexibly adjusted according to actual needs, and no more examples are listed here.

[0053] See also Figure 2 and Figure 3 In some embodiments, the rotating assembly 3 includes a rotating drum 31 . Two rotating drums 31 are provided. The two rotating drums 31 are respectively provided at two ends of the first water collector 21 . The rotating drum 31 is rotatably connected to the circulation pipe 23 .

[0054] In this embodiment, the water inlet and outlet ends of the first water collector 21 are respectively inserted into two rotating drums 31 and communicate with the interior of the rotating drum 31 , and the rotating drum 31 is fixedly connected to the first water collector 21 , and the rotating drum 31 and the first water collector 21 are coaxially arranged.

[0055] In this way, the two ends of the first water collector 21 are respectively connected to the rotating cylinder 31, so that the first water collector 21 can be assembled. When the first water collector 21 is rotated, the rotating cylinder 31 fixedly connected to the first water collector 21 rotates synchronously, which can improve the structural strength of the two ends of the first water collector 21, so that the first water collector 21 can rotate stably, thereby improving the loading and unloading efficiency of DIMM and the liquid cooling device for DIMM, and reducing the difficulty of loading and unloading.

[0056] See also Figure 4 In some embodiments, the rotating assembly 3 further includes a rotating base 32 , and the rotating base 32 is disposed in a one-to-one correspondence with the rotating cylinder 31 , and the rotating cylinder 31 is rotatably connected to the rotating base 32 .

[0057] In this embodiment, the rotating base 32 is provided with a rotating hole 321 coaxial with the first water collector 21, and the ends of the two rotating cylinders 31 facing away from the first water collector 21 are respectively located in the rotating holes 321 of the two rotating bases 32 and are rotatably connected to the rotating bases 32, and one end of the connecting pipe 24 extends into the rotating hole 321 and is fixedly connected to the rotating base 32.

[0058] It should be noted that when the staff rotates the first water collector 21, the rotating cylinder 31 rotates synchronously with the first water collector 21, and the end of the rotating cylinder 31 away from the first water collector 21 rotates in the rotating hole 321; when the liquid cooling medium is transported to the rotating cylinder 31 through the connecting pipe 24, the cooling medium flows into the first water collector 21 or the second water collector 22 through the rotating hole 321.

[0059] In this way, the rotating base 32 can provide support for the rotating cylinder 31, so that the rotating cylinder 31 can rotate stably in the rotating hole 321, thereby making the first water collector 21 and the heat pipe 12 rotate stably, improving the assembly stability of the heat pipe 12 and the DIMM, avoiding collision between the heat pipe 12 or the first water collector 21 and other structures due to unstable rotation, and facilitating the staff to load and unload the DIMM.

[0060] See also Figure 3 and Figure 4 In some embodiments, the rotating assembly 3 further includes a positioning member 33 , which can be selectively connected to the rotating cylinder 31 to limit the relative position of the rotating cylinder 31 and the rotating base 32 .

[0061] Among them, the positioning piece 33 is a U-shaped positioning pin, and a hole (not shown in the figure) for inserting the positioning piece 33 is opened on the top surface of the rotating base 32. The hole opened on the top surface of the rotating base 32 is connected to the rotating hole 321. A positioning groove 312 is opened on the rotating cylinder 31. The positioning groove 312 is circumferentially opened on the outer wall of the rotating cylinder 31. When one end of the rotating cylinder 31 is located in the rotating hole 321, the positioning piece 33 can extend into the rotating cylinder 31 through the hole and be stuck in the positioning groove 312, thereby limiting the relative position of the rotating cylinder 31 in the rotating hole 321.

[0062] In this way, under the limiting action of the positioning member 33, the rotating cylinder 31 is not easy to generate linear motion along the axial direction of the rotating hole 321 in the rotating hole 321, thereby avoiding the displacement of the rotating cylinder 31 in the rotating hole 321 and affecting the normal use and rotation of the first water collector 21 and the heat pipe 12. At the same time, it is convenient to assemble the rotating cylinder 31 into the rotating base 32, thereby improving the loading and unloading efficiency of DIMM and DIMM liquid cooling device in the chassis.

[0063] It is understandable that the positioning member 33 can also be a positioning block, and a groove for inserting a positioning pin can be opened on the rotating cylinder 31 so that the positioning member 33 can be plugged into the rotating cylinder 31. The specific structure of the positioning member 33 can be flexibly adjusted to achieve the limitation of the rotating cylinder 31, and no more details will be listed here.

[0064] See also Figure 3 and Figure 4 In some embodiments, a sealing ring 311 may be further provided on the rotating cylinder 31. The sealing ring 311 is sleeved on the outer wall of the rotating cylinder 31. When one end of the rotating cylinder 31 is located in the rotating hole 321, the outer wall of the sealing ring 311 is tightly abutted against the inner wall of the rotating hole 321 to improve the sealing performance between the rotating cylinder 31 and the rotating base 32 and avoid leakage of the cooling medium.

[0065] See also Figure 1 and Figure 5 In some embodiments, the heat-conducting assembly 1 further includes a first heat-conducting member 13 and a second heat-conducting member 14. The first heat-conducting member 13 is disposed between the heat-conducting plate 11 and the DIMM to transfer the heat of the DIMM to the heat-conducting plate 11; the second heat-conducting member 14 is disposed between the heat pipe 12 and the heat-conducting plate 11 to transfer the heat of the heat-conducting plate 11 to the heat pipe 12.

[0066] Among them, the first heat conductive member 13 and the second heat conductive member 14 are both heat conductive gaskets, and further, the heat conductive gaskets are made of silicone material; each DIMM is configured with two first heat conductive members 13 and one second heat conductive member 14, the two first heat conductive members 13 are respectively arranged on both sides of the DIMM, and the two first heat conductive members 13 are both located in the heat conductive groove 111, the second heat conductive member 14 is arranged on the top surface of the heat conductive plate 11, and the length direction of the second heat conductive member 14 is parallel to the length direction of the heat conductive plate 11.

[0067] In this way, the first heat conductive member 13 can fill the gap between the heat conductive plate 11 and the DIMM, so that the heat generated by the DIMM can be quickly transferred to the heat conductive plate 11. Similarly, the second heat conductive member 14 can fill the gap between the heat conductive plate 11 and the heat pipe 12, so that the heat generated by the DIMM can be transferred to the heat pipe 12 through the second heat conductive member 14, thereby improving the liquid cooling and heat dissipation efficiency of the DIMM. At the same time, the first heat conductive member 13 and the second heat conductive member 14 have a certain deformation amount, so that the DIMM and the heat conductive plate 11, and the heat conductive plate 11 and the heat pipe 12 can always maintain good abutment when assembled, and the first heat conductive member 13 and the second heat conductive member 14 can be quickly assembled on the heat conductive plate 11 and connected to the DIMM, which is convenient for improving the loading and unloading efficiency of the DIMM and the liquid cooling and heat dissipation device for the DIMM.

[0068] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the scope of protection of the present invention. It is not necessary and impossible to list all implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the scope of protection of the claims of the present invention.

Claims

1. A liquid cooling device for DIMM, characterized in that: include: A heat conduction component (1), the heat conduction component (1) comprising a heat conduction plate (11) and a heat pipe (12), the heat conduction plate (11) being arranged between the heat pipe (12) and the DIMM and being used for transferring heat of the DIMM to the heat pipe (12); A liquid cooling assembly (2), the liquid cooling assembly (2) comprising a first water collector (21), a second water collector (22) and a circulation pipe (23), the two ends of the circulation pipe (23) being respectively connected to the first water collector (21) and the second water collector (22), one end of the heat pipe (12) being fixedly connected to one of the first water collector (21) and the second water collector (22), and the other end of the heat pipe (12) being selectively connected to the other of the first water collector (21) and the second water collector (22); A rotating assembly (3), the rotating assembly (3) being connected to the first water collector (21) or the second water collector (22), and being used to enable the first water collector (21) or the second water collector (22) connected to the rotating assembly (3) to drive the heat pipe (12) to rotate.

2. The liquid cooling device for DIMM according to claim 1, characterized in that: A plurality of the heat-conducting components (1) are provided, and the plurality of the heat-conducting components (1) are arranged in an alternating manner; a first mounting groove (211) is provided on the first water collector (21), and a second mounting groove (221) is provided on the second water collector (22); and two ends of each of the heat pipes (12) are respectively arranged in the first mounting groove (211) and the second mounting groove (221).

3. The liquid cooling device for DIMM according to claim 1, characterized in that: The heat pipe (12) comprises a first portion (121) and two second portions (122) both connected to the first portion (121); the two second portions (122) are respectively arranged at two ends of the first portion (121) and are both located on a side of the first portion (121) facing the DIMM.

4. The DIMM liquid cooling device according to any one of claims 1 to 3, characterized in that: Two rotating assemblies (3) are provided, and the two rotating assemblies (3) are respectively provided at two ends of the first water collector (21), and are used to enable the first water collector (21) to drive the heat pipe (12) to rotate.

5. The liquid cooling device for DIMM according to claim 4, characterized in that: The second water collector (22) is connected to a limiting member (222) for selectively limiting the relative position of one end of the heat pipe (12) facing the second water collector (22) and the second water collector (22).

6. The liquid cooling device for DIMM according to claim 5, characterized in that: The limiting member (222) is a limiting plate, and the limiting plate is detachably connected to the second water collector (22); when the limiting plate is connected to the second water collector (22), the heat pipe (12) is located between the limiting plate and the second water collector (22).

7. The liquid cooling device for DIMM according to claim 4, characterized in that: The rotating assembly (3) comprises a rotating cylinder (31), two rotating cylinders (31) are provided, and the two rotating cylinders (31) are respectively arranged at two ends of the first water collector (21), and the rotating cylinder (31) is rotatably connected to the circulation pipe (23).

8. The liquid cooling device for DIMM according to claim 7, characterized in that: The rotating assembly (3) further comprises a rotating base (32), the rotating base (32) being arranged in a one-to-one correspondence with the rotating cylinder (31), and the rotating cylinder (31) is rotatably connected to the rotating base (32).

9. The liquid cooling device for DIMM according to claim 8, characterized in that: The rotating assembly (3) further comprises a positioning member (33), wherein the positioning member (33) is selectively connected to the rotating cylinder (31) and is used to limit the relative position of the rotating cylinder (31) and the rotating base (32).

10. The liquid cooling device for DIMM according to any one of claims 1 to 3, characterized in that: The heat-conducting component (1) further comprises a first heat-conducting member (13), which is arranged between the heat-conducting plate (11) and the DIMM and is used to transfer the heat of the DIMM to the heat-conducting plate (11); and / or the heat-conducting component (1) further comprises a second heat-conducting member (14), which is arranged between the heat pipe (12) and the heat-conducting plate (11) and is used to transfer the heat of the heat-conducting plate (11) to the heat pipe (12).

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