Lamp panel and display device

Abstract

The utility model discloses a lamp panel and a display device. Wherein the lamp panel comprises a circuit board, a plurality of light-emitting devices, a light absorption layer and an anti-reflection layer, and the light-emitting devices are installed on the circuit board at intervals; the light absorption layer and the light emitting devices are installed on the same side of the circuit board, and the light absorption layer is at least located between the adjacent light emitting devices. The anti-reflection layer is arranged in the light emitting direction of the light emitting device and covers the light absorption layer. According to the technical scheme, light can be effectively absorbed, light reflection of the circuit board is reduced, it is guaranteed that the display frame of the display screen is clear, and the display effect is improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and specifically relates to a light board and a display device. Background Art

[0002] LED (Light-Emitting Diode) display screens are usually used to display various information such as text, images, videos and recordings. However, LED display screens are affected by ambient light when working. The LED circuit board will reflect light, and the reflected light will intersect with the display light of the LED display screen, affecting the normal display of the LED display screen, causing the LED display screen to be blurred, and reducing the display effect of the LED display screen. Utility Model Content

[0003] The purpose of the present application is to provide a light board and a display device that can effectively reduce reflections, ensure clear display images, and improve display effects.

[0004] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0005] According to one aspect of an embodiment of the present application, the present application provides a light board, the light board comprising:

[0006] Circuit boards;

[0007] A plurality of light emitting devices are installed on the circuit board at intervals;

[0008] A light absorbing layer is mounted on the same side of the circuit board as the light emitting device, and the light absorbing layer is at least located between adjacent light emitting devices;

[0009] The anti-reflection layer is arranged in the light emitting direction of the light emitting device and covers the light absorbing layer.

[0010] In one aspect, the light absorbing layer surrounds each of the light emitting devices.

[0011] In one aspect, the light absorbing layer has a light absorbing surface facing away from the circuit board, the light emitting device has a forward light emitting surface facing away from the circuit board, and the light absorbing surface of the light absorbing layer is closer to the circuit board than the forward light emitting surface of the light emitting device.

[0012] In one aspect, the light panel further comprises a plurality of brightness enhancement parts, the brightness enhancement parts are located between the light emitting device and the anti-reflection layer, each of the brightness enhancement parts covers one of the light emitting devices, and each of the brightness enhancement parts comprises a top wall and a side wall, the top wall is located on the positive light emitting surface of the light emitting device, the side wall surrounds the light emitting device, one end of the side wall is connected to the top wall, and the other end of the side wall is connected to the light absorbing layer;

[0013] The surface of the side wall away from the light emitting device is an inclined surface, and the side of the inclined surface facing the circuit board is inclined away from the light emitting device, so as to refract the inclined light emitted from the side of the light emitting device into light emitted vertically upward.

[0014] In one aspect, an inclination angle between the inclined sidewall and the light absorbing layer ranges from 50° to 60°.

[0015] In one aspect, gaps are set between adjacent brightening parts, and the light board also includes a light-evening layer, wherein the light-evening layer is located between the brightening part and the anti-reflection layer, and the light-evening layer includes a filling part and a flat part, wherein any gap between adjacent brightening parts is filled with the filling part, and the surface of the filling part facing away from the circuit board and the surface of each brightening part facing away from the circuit board are covered by the flat part.

[0016] In one aspect, the refractive index of the brightness enhancement portion is greater than the refractive index of the light homogenizing layer.

[0017] In one aspect, the light absorbing layer is black ink, and the visible light absorption rate of the light absorbing layer is 95.0%-99.5%.

[0018] In one aspect, the circuit board includes a main board body and a solder pad, wherein the solder pad is arranged on the surface of the main board body, the light-emitting device includes a light-emitting body and a pin, one end of the pin is connected to the light-emitting body, and the other end is connected to the solder pad, and the light-absorbing layer covers the solder pad and the pin.

[0019] In addition, in order to solve the above-mentioned problem, the present application also provides a display device, which includes a shell such as the lamp board described above, the shell forms a protection space, and the lamp board is arranged in the protection space.

[0020] In the present application, the light absorbing layer can absorb light and reduce the reflection of light. The anti-reflection layer has an anti-reflection effect. When ambient light is directed toward the light board, it can reduce the reflection of ambient light after passing through the anti-reflection layer. On this basis, the light absorbing layer can also absorb the light that enters the interior of the light board, further reducing the reflection of light. In this way, when the user is watching the display screen, the reflection of ambient light is reduced, avoiding the reflected light from affecting the outgoing light of the light-emitting device, making the display picture seen by the user clearer and improving the display effect.

[0021] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 The cross-sectional structure diagram of the light board of the present application is schematically shown.

[0024] Figure 2 The present application is schematically shown Figure 1 Schematic diagram of the structure of part A of the middle light board.

[0025] The following are the descriptions of the reference numerals:

[0026] 100, circuit board; 200, light emitting device; 300, light absorbing layer; 500, light averaging layer; 600, anti-reflection layer;

[0027] 210, forward light emitting surface; 220, lateral light emitting surface; 401, brightening portion; 410, top wall; 420, side wall; 421, inclined surface; 510, filling portion; 520, flat portion; 610, first dielectric layer; 620, second dielectric layer. DETAILED DESCRIPTION

[0028] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0029] See also Figure 1 and Figure 2As shown, the present application provides a light board, which includes: a circuit board 100, a light emitting device 200, a light absorbing layer 300 and an anti-reflection layer 600. The circuit board 100 is used to supply power to the light emitting device 200, which can be an LED or other structure capable of emitting light.

[0030] A plurality of light emitting devices 200 are provided, and the plurality of light emitting devices 200 are installed at intervals on the circuit board 100. The light emitting devices 200 are generally provided on the circuit board 100 by welding. The light emitting devices 200 may be provided in a matrix distribution at equal intervals on the circuit board 100.

[0031] The light absorbing layer 300 is used to absorb light and reduce light reflection. The light absorbing layer 300 and the light emitting device 200 are installed on the same side of the circuit board 100, and the light absorbing layer 300 is at least located between adjacent light emitting devices 200. When external light is directed to the light board, the light absorbing layer 300 can absorb the light and reduce light reflection, so that more light emitted from the light board is directly emitted by the light emitting device 200. Moreover, the light absorbing layer 300 is between two adjacent light emitting devices 200, and can also act on the two light emitting devices 200 at the same time, while reducing the interference of reflected light on the two adjacent light emitting devices 200.

[0032] The anti-reflection layer 600 is arranged in the light emitting direction of the light emitting device 200 and covers the light absorbing layer 300. It can be said that the anti-reflection layer 600 covers the entire surface of the light board. The anti-reflection layer 600 and the light emitting device 200 can be in direct contact with each other, or other functional film layers can be arranged in between. Similarly, the anti-reflection layer 600 and the light absorbing layer 300 can also be in direct contact with each other, or other functional film layers can be arranged in between.

[0033] In this embodiment, the light absorbing layer 300 can absorb light and reduce the reflection of light. The anti-reflection layer 600 has the effect of reducing reflection and increasing transmittance. When ambient light is directed to the light board, after passing through the anti-reflection layer 600, the reflected light on the surface of the light board can be reduced or eliminated, thereby increasing the light transmittance of the light board. On this basis, the light absorbing layer 300 can also absorb the light that enters the interior of the light board, further reducing the reflection of light. In this way, when the user watches the LED display screen, the reflection of ambient light is reduced, avoiding the reflected light from affecting the outgoing light of the light-emitting device 200, making the display picture seen by the user clearer and improving the display effect.

[0034] It should be noted that the light absorbing layer 300 can also absorb light from the light emitting device 200 and reduce the glare of the light emitting device 200. In addition, the light absorbing layer 300 is a black light absorbing layer. When setting the light absorbing layer 300, the black light absorbing ink can be set on the circuit board 100 by inkjet printing or glue filling, so as to solidify and form a black light absorbing layer. Moreover, by setting the black light absorbing layer, when the display screen is turned off, the blackness and contrast of the display screen can be improved, so that the display effect of the display screen is better. The black light absorbing ink includes a base resin, a curing agent and a black filler, wherein the base resin is an epoxy resin and its modified resin, the curing agent is an acid anhydride curing agent, and the black filler is carbon black. Among them, the black light absorbing layer 300 mainly absorbs light in the visible light band, and the visible light absorption rate of the black light absorbing layer is 95.0%-99.5%, for example, it can be 95.0%, 96%, 97%, 98% or 99.5%, etc.

[0035] In one embodiment of the present application, the light absorbing layer 300 surrounds each light emitting device 200. That is to say, each light emitting device 200 is surrounded by the light absorbing layer 300, so that the reflection of light can be reduced in all directions at the same time, and the light absorption effect of the light absorbing layer 300 on light can be improved. The surrounding path can be set according to the structure of the light emitting device 200. For example, if the projection of the light emitting device 200 on the circuit board 100 is a square, the surrounding path is a square. If the projection of the light emitting device 200 on the circuit board 100 is a circle, the surrounding path can be a circle.

[0036] In another embodiment of the present application, the light absorbing layer 300 has a light absorbing surface facing away from the circuit board 100, and the light emitting device 200 has a forward light emitting surface 210 facing away from the circuit board 100, and the light absorbing surface of the light absorbing layer 300 is closer to the circuit board 100 than the forward light emitting surface 210 of the light emitting device 200. The light absorbing surface can be understood as the upper surface of the light absorbing layer 300. The light emitting device 200 has a forward light emitting surface 210 and a lateral light emitting surface 220. The forward light emitting surface 210 of the light emitting device 200 can be understood as the upper surface of the light emitting device 200.

[0037] Because the upper surface of the light absorbing layer 300 is closer to the circuit board 100 than the upper surface of the light emitting device 200. That is to say, the height of the light absorbing layer 300 is lower than the height of the light emitting device 200, so that the upper surface of the light absorbing layer 300 forms a certain distance with the upper surface of the light emitting device 200, and the light absorbing layer 300 is prevented from being flush with the upper surface of the light emitting device 200. Such a setting can make the light absorbing surface of the light absorbing layer 300 lower than the light emitting surface of the light emitting device 200, and prevent the light absorbing layer 300 from directly absorbing the light of the light emitting device 200, resulting in a reduction in the amount of light emitted by the light emitting device 200.

[0038] Furthermore, the distance between the upper surface of the light absorbing layer 300 and the upper surface of the light emitting device 200 can be adjusted so that the light absorbing layer 300 can absorb light to reduce glare without affecting the normal light emission of the light emitting device 200 .

[0039] In one embodiment of the present application, the light board further includes a brightening portion 401, which is located between the light emitting device 200 and the anti-reflection layer 600. A plurality of brightening portions 401 are provided, and each brightening portion 401 covers a light emitting device 200. The brightening portion 401 can increase the amount of light emitted from the front of the light emitting device 200, improve the light emitting efficiency of the light emitting device 200, and improve the image contrast of the light board imaging. Moreover, by providing the brightening portion 401, under the same brightness requirement, electric energy can be saved and the consumption of electric energy can be reduced.

[0040] Further, each brightness enhancement portion 401 includes a top wall 410 and a side wall 420, wherein the top wall 410 is located on the positive light emitting surface 210 of the light emitting device 200, and the side wall 420 surrounds the light emitting device 200, and one end of the side wall 420 is connected to the top wall 410, and the other end of the side wall 420 is connected to the light absorbing layer 300; wherein the surface of the side wall 420 away from the light emitting device 200 is an inclined surface 421, and the side of the inclined surface 421 facing the circuit board 100 is inclined in a direction away from the light emitting device 200, and is used to refract the inclined light emitted from the side of the light emitting device 200 into light emitted vertically upward. The inclined surface 421 can be a plane or an arc surface.

[0041] Specifically, the top wall 410 is located on the forward light emitting surface 210 of the light emitting device 200, and the top wall 410 is parallel to the forward light emitting surface 210; the side wall 420 is located on the lateral light emitting surface 220 of the light emitting device 200, and the light emitted from the lateral light emitting surface 220 of the light emitting device 200 is emitted toward the side wall 420, and the light is deflected toward the vertical direction after passing through the inclined surface 421 of the side wall 420.

[0042] Generally speaking, the light from the forward light-emitting surface 210 of the light-emitting device 200 will be directly emitted to the top wall 410, and transmitted through the top wall 410, that is, the light from the forward light-emitting surface 210 will be emitted vertically upward. The side of the light-emitting device 200 will also emit light, and this part of the light is scattered in all directions, which is difficult to be effectively used. Through the provision of the side wall 420, the light emitted from the lateral light-emitting surface 220 of the light-emitting device 200 will be emitted to the side wall 420, and the light will be refracted at the side wall 420, and the forward direction of the light will be deflected, and adjusted from the inclined direction to the vertical direction, that is, the same direction as the light from the forward light-emitting surface 210, thereby increasing the amount of light emitted from the front side of the light-emitting device 200. This embodiment makes full use of the light emitted from the lateral light-emitting surface 220 of the light-emitting device 200, thereby improving the brightness of the front light output of the light-emitting device 200.

[0043] In another embodiment of the present application, the inclination angle between the inclined surface 421 and the light absorbing layer 300 ranges from 0° to 90°. Further, the inclination angle between the inclined surface 421 and the light absorbing layer 300 can also range from 50° to 60°; after encountering the inclined surface 421, the direction of the forward propagation of the light changes and converges toward the top wall 410. Specifically, the angle can be 0°, 20°, 50°, 55°, 60° or 90°.

[0044] In another embodiment of the present application, for the setting method of the brightening part 401, the brightening material can be set on the light-emitting device 200 by molding or injection molding, and then solidified on the circuit board 100. The brightening part 401 is also set toward the side of the light-emitting device 200, so as to form a side wall 420. The side wall 420 can be located on the sides of the light-emitting device 200 and surround the light-emitting device 200. The top wall 410 of the brightening part 401 is located on the positive light-emitting surface 210 of the light-emitting device 200, and the top wall 410 has a certain thickness. Among them, the thickness of the top wall 410 is generally 0.05mm to 0.10mm, such as 0.05mm, 0.06mm, 0.08mm or 0.10mm. In addition, the side wall 420 of the brightening portion 401 also has a certain thickness, and the bottom thickness of the side wall 420 is generally 0.15 mm to 0.30 mm, and can be 0.15 mm, 0.20 mm, 0.25 mm or 0.30 mm. The brightening portion 401 is mainly an optical encapsulation adhesive, and the optical encapsulation adhesive includes acrylic acid and its modified resin, and its light transmittance is 95%-98%, and its light transmittance can be 95%, 96%, 97% or 98%.

[0045] It can be seen from the above that the brightness enhancement part 401 has a large size at the lower end and a small size at the upper end, and the brightness enhancement part 401 is arranged around the light emitting device 200 to form a trapezoidal structure.

[0046] In addition, the side wall 420 can also gradually move away from the lateral light emitting surface 220 of the light emitting device 200 from the light absorbing layer 300 to the top wall 410. As a result, the brightness enhancement portion 401 forms an inverted trapezoid on the light emitting device 200. The brightness enhancement portion 401 of this structure has a small size at the lower end and a large size at the upper end. With this structural setting, the side wall 420 faces both the lateral light emitting surface 220 of the light emitting device 200 and the forward light emitting surface 210 of the light emitting device 200, which is more conducive to guiding the side light of the light emitting device 200 to the front.

[0047] In another embodiment of the present application, gaps are set between adjacent brightness enhancement parts 401, and the light board further includes a light-distributing layer 500, and the light-distributing layer 500 includes a filling part 510 and a flat part 520, wherein the gaps between any adjacent brightness enhancement parts 401 are filled by the filling part 510, and the surface of the filling part 510 facing away from the circuit board 100 and the surface of each brightness enhancement part 401 facing away from the circuit board 100 are covered by the flat part 520. The flat part 520 can ensure that the upper surface of the light-distributing layer 500 is flat, which is convenient for the arrangement of subsequent film layers and ensures that the surface of subsequent film layers is also flatter. The light-distributing layer 500 is located between the brightness enhancement part 401 and the anti-reflection layer 600, and more specifically, the filling part 510 is located between the light absorption layer 300 and the anti-reflection layer 600, and the flat part 520 is located between the brightness enhancement part 401 and the anti-reflection layer 600, and the flat part 520 also extends to the surface of the filling part 510.

[0048] Since the light-homogenizing layer 500 covers the brightening portion 401, the light generated by the light-emitting device 200 in the lamp panel first passes through the brightening portion 401 and then is emitted to the light-homogenizing layer 500. The brightening portion 401 increases the amount of front light emitted by the light-emitting device 200, and then the light is diffused through the light-homogenizing layer 500, thereby avoiding the light being concentrated at one point and reducing the glare of the light-emitting device 200.

[0049] Since there is a certain spacing distance between two adjacent brightness enhancement parts 401, the light-homogenizing layer 500 can also be filled between two adjacent brightness enhancement parts 401. For example, the filling part 510 is arranged between two adjacent brightness enhancement parts 401. It can also be understood that the filling part 510 separates the brightness enhancement parts 401 to form independent brightness enhancement structures, thereby reducing the light crosstalk between adjacent light-emitting devices 200. During injection molding, the brightness enhancement material is directly molded on the light-emitting device 200.

[0050] In addition, the orthographic projection of the brightness enhancement part 401 on the circuit board 100 is located within the orthographic projection range of the light-distributing layer 500 on the circuit board 100, and the light-distributing layer 500 can cover the brightness enhancement part 401, and the coverage area of ​​the light-distributing layer 500 is greater than or equal to the surface of the brightness enhancement part 401, thereby reducing the exposure of part of the structure of the brightness enhancement part 401 to the outside. In this way, the situation where part of the light-emitting device 200 is too bright is reduced, and the light emission of the entire upper surface of the light-emitting device 200 is more uniform.

[0051] Furthermore, the refractive index of the brightening portion 401 is greater than that of the light-distributing layer 500. Light is emitted from the brightening portion 401 of the optically dense medium to the light-distributing layer 500 of the optically sparse medium. After entering the light-distributing layer 500, the light will be dispersed, thereby ensuring that the light-distributing layer 500 can play the role of uniform light.

[0052] Multiple brightening parts 401 can also be connected to each other to form a whole. Generally, the refractive index of the brightening part 401 is between 1.60-1.72, and the refractive index of the light-homogenizing layer 500 is between 1.30-1.50. The refractive index of the brightening part 401 can be 1.60, 1.65, 1.70 or 1.72. The refractive index of the light-homogenizing layer 500 can be 1.30, 1.35, 1.40, 1.45 or 1.50. It can be further known that the minimum refractive index of the brightening part 401 is greater than the maximum refractive index of the light-homogenizing layer 500. By this method of transmitting light from a denser medium to a less dense medium, the diffusion of light can be effectively achieved.

[0053] See again Figure 2 As shown, the anti-reflection layer 600 is also called an anti-reflection layer. After the ambient light hits the anti-reflection layer 600, the light reflected from the inner and outer surfaces of the anti-reflection layer will cancel each other out according to the wave nature and interference of light, thereby reducing the light from being reflected again and entering the human eye, and reducing the interference of ambient light on the display screen of the light board. At the same time, the anti-reflection layer 600 also has a certain anti-transmission effect, ensuring that the light of the light emitting device 200 can be emitted more smoothly, increasing the light transmittance of the light board.

[0054] The light-homogenizing layer 500 in the present application can be formed by setting the light-homogenizing material on the brightening part 401 by molding or injection molding, and then solidifying. The area where the light-homogenizing layer 500 is set is above the brightening part 401, and the upper surface height of the light-homogenizing layer 500 is about 0.1mm to 0.2mm higher than the brightening part 401, such as 0.1mm, 0.15mm or 0.2mm. In addition to making the imaging of the light refracted by the brightening part 401 softer and more uniform, the light-homogenizing layer 500 can also carry the anti-reflection layer 600.

[0055] When the light-distributing layer 500 is provided, the molding can be performed by injection molding in one step or in two steps: the filling portion 510 is molded by injection molding in the first step and the flat portion 520 is molded by injection molding in the second step.

[0056] Generally, the light transmittance of the light-distributing layer 500 is 95% to 98%. For example, the light transmittance can be 95%, 96%, 97% or 98%. The light-distributing layer 500 can also be an optical packaging adhesive. For example, the light-distributing layer 500 mainly includes epoxy resin and modified resin thereof, and the light-distributing layer 500 also includes 0.5% to 2% of light-diffusing powder, and the light-diffusing powder is one or more materials of silicon dioxide, titanium dioxide, and silicone microspheres. The quantity ratio of the light-diffusing powder can be 0.5%, 1.0%, 1.5% or 2%.

[0057] The anti-reflection layer 600 of the present application can be disposed on the light-distributing layer 500 by magnetron sputtering, chemical vapor deposition or sol-gel method. The coating method can improve the film firmness and wear resistance of the anti-reflection layer 600 and increase the service life. Of course, the pasting method can also be adopted, which is simple to operate and easy to implement.

[0058] The anti-reflection layer 600 includes at least two dielectric layers, namely a first dielectric layer 610 and a second dielectric layer 620. The first dielectric layer 610 is disposed above the second dielectric layer 620, and the refractive index of the first dielectric layer 610 is less than the refractive index of the second dielectric layer 620. The anti-reflection layer 600 may also include a third dielectric layer, for example, the third dielectric layer is disposed below the second dielectric layer 620, to ensure that the refractive index of the dielectric increases from top to bottom.

[0059] Specifically, the refractive index of the first dielectric layer 610 is 1.21, and the refractive index of the second dielectric layer 620 is 1.33. The thickness of the anti-reflection layer 600 is 500-1000nm, and the visible light reflectivity is less than 1%. For example, the thickness of the anti-reflection layer 600 can be 500nm, 600nm, 633nm, 650nm, 700nm or 1000nm. The reflection of ambient light is reduced by the interference of reflected light at the upper and lower interfaces of the anti-reflection layer 600, and the light transmission of the light emitting device 200 is enhanced. When users watch the LED display screen, the LED display screen will not be reflected, glared or blurred due to ambient light, so that the display screen can clearly display the picture under the interference of ambient light.

[0060] Typically, the material of the anti-reflection layer 600 includes one or more of silicon nitride, magnesium fluoride, titanium dioxide, silicon dioxide, and silicon nitride.

[0061] In another embodiment of the present application, the circuit board 100 includes a main board body and a solder pad, which is arranged on the upper surface of the main board body. The light-emitting device 200 includes a light-emitting body and a pin, one end of the pin is connected to the light-emitting body, and the other end is connected to the solder pad. In order to further reduce reflected light, the light-absorbing layer 300 covers the solder pad and the pin.

[0062] The pin includes a cathode and an anode, and the cathode and the anode are respectively connected to the light-emitting body. During welding, the cathode and the anode of the light-emitting device 200 can be respectively welded to the pads of the circuit board 100 to complete the fixing of the light-emitting device 200 and the circuit board 100.

[0063] Among them, since the pins and pads are usually made of metal, the surface of the pins and pads is bright and can also reflect light, affecting the display screen. By setting the light absorption layer 300, the light absorption layer 300 absorbs the reflected light of the pins and pads, and can also cover the pads and pins to prevent external light from irradiating the pins or pads.

[0064] The light absorbing layer 300 can also absorb the reflected light from the pins and pads, further reducing the impact on the display image. Among them, improving the display effect mainly means reducing the reflection of the circuit board 100 and improving the contrast of the display image.

[0065] Injection molding can also be used when making the light absorbing layer 300. The material of the light absorbing layer 300 has a certain fluidity in the initial stage, and can flow and spread to the pins and pads, gradually covering the surface of the pins and pads, thereby reducing the reflected light of the pins and pads. Among them, the light emitting body can be understood as a structure that encapsulates the light emitting chip.

[0066] In combination with the above, the light absorbing layer 300 can be arranged around the side of the light emitting body, and the upper surface of the light absorbing layer 300 is located between the upper surface of the light emitting body and the lower surface of the light emitting body. In this way, the height of the light absorbing layer 300 is higher than the pin, but lower than the upper surface of the light emitting body, so that the light absorbing layer 300 can block the position space of the pin and the pad. In this way, it is also possible to make it difficult for the pin and the pad to receive external light, and it is also possible to reduce the reflected light of the pin and the pad.

[0067] In the process of making the light board, the light emitting device 200 is first welded and fixed on the circuit board 100, and then the light absorbing layer 300 is set. The light emitting layer is mainly black light absorbing ink, and the black light absorbing ink is sprayed to the periphery of the light emitting device 200. At this time, the black light absorbing ink has a certain fluidity and can flow to the position of the pins and pads to cover the pins and pads. In addition, the ink can be sprayed continuously, and the height of the black light absorbing ink becomes thicker until it submerges the lower surface of the light emitting body in the light emitting device 200. In this way, the external light can basically not irradiate the pins and pads, further reducing the reflected light of the pins and pads.

[0068] The present application also provides a display device, which includes a housing and a light board as described above, wherein the housing forms a protective space, and the light board is arranged in the protective space. The housing can be understood as a frame, which surrounds the light board and can protect the light board and reduce the damage caused by collision.

[0069] In the display device of this embodiment, the light absorbing layer 300 can absorb light and reduce the reflection of light. The anti-reflection layer 600 has the effect of reducing reflection and increasing transmittance. When ambient light is directed to the display device, the anti-reflection layer 600 can reduce the reflection of ambient light, prevent the reflected light from affecting the emitted light of the light emitting device 200, and increase the light transmittance of the light board. On this basis, the light absorbing layer 300 can also absorb the light that enters the interior of the light board, further reducing the impact on the display screen.

[0070] The specific implementation and beneficial effects of the display device refer to the content of the light board above, which will not be repeated here.

[0071] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any modification, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary technical means in the art that are not disclosed in the present application.

[0072] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A light board, characterized in that: The light board comprises: Circuit boards; A plurality of light emitting devices are installed on the circuit board at intervals; A light absorbing layer is mounted on the same side of the circuit board as the light emitting device, and the light absorbing layer is at least located between adjacent light emitting devices; The anti-reflection layer is arranged in the light emitting direction of the light emitting device and covers the light absorbing layer.

2. The light board according to claim 1, characterized in that: The light absorbing layer surrounds each of the light emitting devices.

3. The light board according to claim 2, characterized in that: The light absorbing layer has a light absorbing surface facing away from the circuit board, the light emitting device has a forward light emitting surface facing away from the circuit board, and the light absorbing surface of the light absorbing layer is closer to the circuit board than the forward light emitting surface of the light emitting device.

4. The light board according to claim 3, characterized in that: The light board further comprises a plurality of brightness enhancement parts, the brightness enhancement parts are located between the light emitting device and the anti-reflection layer, each of the brightness enhancement parts covers one of the light emitting devices, and each of the brightness enhancement parts comprises a top wall and a side wall, the top wall is located on the positive light emitting surface of the light emitting device, the side wall surrounds the light emitting device, one end of the side wall is connected to the top wall, and the other end of the side wall is connected to the light absorbing layer; The surface of the side wall away from the light emitting device is an inclined surface, and the side of the inclined surface facing the circuit board is inclined away from the light emitting device, so as to refract the inclined light emitted from the side of the light emitting device into light emitted vertically upward.

5. The light board according to claim 4, characterized in that: The inclination angle between the inclined surface and the light absorbing layer ranges from 50° to 60°.

6. The light board according to claim 5, characterized in that: Gaps are set between adjacent brightening parts, and the light board also includes a light-evening layer, which is located between the brightening part and the anti-reflection layer, and the light-evening layer includes a filling part and a flat part, wherein any gap between adjacent brightening parts is filled with the filling part, and the surface of the filling part facing away from the circuit board and the surface of each brightening part facing away from the circuit board are covered by the flat part.

7. The light board according to claim 6, characterized in that: The refractive index of the brightness enhancement portion is greater than the refractive index of the light homogenizing layer.

8. The light board according to claim 1, characterized in that: The light absorbing layer is black ink, and the visible light absorption rate of the light absorbing layer is 95.0%-99.5%.

9. The light board according to claim 1, characterized in that: The circuit board includes a main board body and a solder pad, wherein the solder pad is arranged on the surface of the main board body, the light-emitting device includes a light-emitting body and a pin, one end of the pin is connected to the light-emitting body, and the other end is connected to the solder pad, and the light-absorbing layer covers the solder pad and the pin.

10. A display device, characterized in that: The display device comprises a housing and a lamp board as claimed in any one of claims 1 to 9, wherein the housing forms a protection space, and the lamp board is arranged in the protection space.

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