Liquid cooling micro-channel heat dissipation device for remote radio unit

Abstract

The utility model provides a liquid-cooled micro-channel heat dissipation device for a remote radio unit (RU), which comprises a communication module, a duplexer, a heat dissipation device shell and a liquid-cooled circulating pump, a micro-channel system is arranged in the heat dissipation device shell, a channel is filled with a cooling liquid medium, the liquid-cooled circulating pump enables the cooling liquid medium to circularly flow in the micro-channel system in a reciprocating manner, and the liquid-cooled micro-channel system is communicated with the communication module. Wherein the micro-channel system in the radiator can be designed and arranged according to the specific condition of a project. Compared with a traditional communication base station, the communication base station not only can meet the heat dissipation requirement of the high-power power amplifier chip, but also is low in power consumption, and more effectively utilizes the radiator shell to dissipate heat.

Description

Technical Field

[0001] The invention belongs to the technical field of heat dissipation of liquid-cooled microchannel internal circulation of a high-power amplifier chip, and in particular relates to a liquid-cooled microchannel heat dissipation device for a radio remote unit (RU). Background Art

[0002] With the rapid development of communication technology, from 2G to the current promotion and application of 5G, the heat consumption of the radio remote unit (RU) of the communication base station is getting bigger and bigger, and it is becoming more and more severe. Among them, the chip with the largest heat consumption of the radio remote unit (RU) is the power amplifier chip in the communication module. Generally speaking, the environment in which the radio remote unit (RU) is located is relatively harsh. Most of them are placed on the top or roof of the communication tower, mounted on the wall or on a pole, where the sun can directly shine, and there is no sunshade. The layout of the power amplifier module inside the base station is also restricted by the signal transmission link. The communication module is generally located in the upper half of the radiator shell, and the duplexer is placed in the lower half. Under this layout, it is necessary to ensure that the power amplifier chip dissipates heat effectively, so the heat dissipation fins on the radiator shell are usually made very high. In particular, the current radio remote unit (RU) generally needs to meet the compatibility of 4G and 5G, and the volume and weight of the base station shell will be more restricted. Based on the above technical background, the heat dissipation of the communication module of the 4G / 5G dual-mode integrated communication base station is more severe.

[0003] At present, in the existing technology, the most common method for cooling the 4G / 5G dual-mode integrated power amplifier chip is to increase the height of the heat sink fins, which will take up a lot of space. When the fins are raised to 80mm, this method of raising the height can no longer effectively improve the heat dissipation. In addition, the market has higher and higher requirements for the signal transmission power of communication base stations, and the radiation range is getting farther and farther. Since communication base stations are placed on poles or walls and are in a natural air convection environment, after the heat sink fins of the shell are raised, the heat sink fins under the duplexer are raised to improve the heat dissipation of the power amplifier chip very little. If this continues, the size of the 4G / 5G dual-mode integrated communication base station will become larger and heavier. Summary of the invention

[0004] To solve the above problems, the purpose of the present invention is to provide a liquid-cooled microchannel heat sink for a radio remote unit (RU), which can more effectively utilize the heat sink shell for heat dissipation while meeting the heat dissipation requirements of a high-power amplifier chip.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a liquid-cooled microfluidic channel heat dissipation device for a radio frequency remote unit, comprising a communication module, a duplexer, a radiator shell and a liquid-cooled circulation pump, the communication module is arranged in the upper half of the inner cavity of the radiator shell, the duplexer is arranged in the lower half of the inner cavity of the radiator shell, and the liquid-cooled circulation pump is fixedly connected to the radiator shell and arranged at a corner of the outer side of the radiator shell.

[0006] A microchannel system is arranged inside the bottom plate of the radiator housing, and the microchannel system includes heat exchange fins and microchannels. The heat exchange fins are arranged below the high-power chip in the communication module, and the microchannels are filled with a coolant medium.

[0007] The coolant medium flows upward from the inlet of the microchannel under the action of the liquid cooling circulation pump, flows through a plurality of heat exchange fins from top to bottom after reaching the top, then passes under the duplexer and flows to the outlet along the vortex coil.

[0008] The working principle of a liquid-cooled microfluidic heat sink for a radio remote unit (RU) is as follows: a high-power chip generates heat, part of which is transferred to the surrounding environment through heat conduction on the shell below the chip; the other part is transferred to the coolant medium by the heat exchange fins below the chip, and the coolant medium quickly diffuses the heat to the entire microfluidic system. Figure 4 , Figure 5 As can be seen, the coolant medium is injected from port A by the liquid cooling circulation pump, and the coolant medium flows to the heat exchange fins under the high-power amplifier chip. The coolant medium takes away part of the heat emitted by the chip, and the coolant medium continues to flow into the flow channel under the duplexer. The heat in the coolant medium is exchanged to the surrounding environment by the radiator shell under the duplexer, and the coolant medium flows back to the liquid cooling circulation pump from port B, thereby realizing the reciprocating circulation of the coolant in the microchannel system. In this way, the heat of the high-power chip is evenly diffused to the radiator shell, and then exchanged to the surrounding environment.

[0009] Compared with the prior art, the beneficial effects of the present invention are: not only can the heat dissipation requirements of high-power amplifier chips be met, but also low power consumption and more effective use of the heat sink housing for heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a schematic diagram of the overall structure of the liquid-cooled microchannel heat sink of the present invention.

[0011] Figure 2 It is a schematic diagram of the outer side structure of the liquid-cooled microchannel heat sink of the present invention.

[0012] Figure 3 It is an exploded schematic diagram of the assembly of the liquid-cooled microchannel heat sink of the present invention.

[0013] Figure 4 It is a schematic diagram of the microfluidic system of the liquid-cooled microfluidic heat dissipation device of the present invention, and the arrow indicates the flow direction of the coolant medium.

[0014] Figure 5 It is a cross-sectional view of the microchannel system of the liquid-cooled microchannel heat dissipation device of the present invention.

[0015] Figure 6 It is a cross-sectional view below a high-power chip of the liquid-cooled microchannel heat sink of the present invention.

[0016] Reference numerals:

[0017] 1-communication module, 2-duplexer, 3-radiator housing, 4-liquid cooling circulation pump, 5-heat exchange fins, 6-microchannel. DETAILED DESCRIPTION

[0018] The present invention will be further explained below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following specific embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0019] like Figure 1 , Figure 2 As shown, a liquid-cooled microchannel heat dissipation device for a radio remote unit includes a communication module 1, a duplexer 2, a heat sink housing 3 and a liquid-cooled circulation pump 4. The communication module 1 is provided with two groups of upper chambers placed parallel to each other in the inner chamber of the heat sink housing 3, and a duplexer 2 is placed in the lower chamber of the heat sink housing 3; Figure 3 As shown, a liquid cooling circulation pump 4 is installed by screws at the lower outer side of the radiator housing 3. A plurality of support plates are arranged below the bottom plate of the radiator housing 3, and the support plates form a cavity between the bottom plate of the radiator housing 3 and the radiator placement platform, which is beneficial for the radiator to dissipate heat.

[0020] As a preferred structure of this embodiment, the support plates are arranged in parallel along the vertical direction.

[0021] As a preferred structure of this embodiment, the support plate uses heat exchange fins.

[0022] As a preferred structure of this embodiment, the height of the support plate is slightly greater than the thickness of the liquid-cooling circulation pump 4 .

[0023] As a preferred structure of this embodiment, Figure 4 , Figure 5 As shown, a microfluidic system is designed inside the substrate of the inner cavity of the heat sink housing 3, and the microfluidic system includes heat exchange fins 5 and microfluidic channels 6. The heat exchange fins 5 are arranged below the high-power chip in the communication module 1, and the microfluidic channel 6 is filled with a coolant medium. The microfluidic system form of this example includes but is not limited to this example, and the microfluidic system can be customized according to other cases.

[0024] In this embodiment, if Figure 4 , Figure 6 As shown, the coolant medium is injected from the A port of the microchannel 6 by the liquid cooling circulation pump 4, and flows rapidly along the path indicated by the arrow, taking away most of the heat of the heat exchange fins 5 below the high-power chip, and effectively achieving rapid diffusion of the heat generated by the high-power chip on the communication module 1. After cooling, the coolant medium flows back to the liquid cooling circulation pump 4 from the B port, and then flows out from the A port. The coolant medium circulates back and forth, thereby achieving uniform temperature of the radiator housing 3.

[0025] The technical means disclosed in the scheme of the present invention are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical schemes composed of any combination of the above-mentioned technical features. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications are also considered as the protection scope of the present invention.

Claims

1. A liquid-cooled microchannel heat sink for a radio remote unit, characterized in that: The invention comprises a communication module (1), a duplexer (2), a radiator housing (3) and a liquid cooling circulation pump (4); the communication module (1) is arranged in the upper half of the inner cavity of the radiator housing (3); the duplexer (2) is arranged in the lower half of the inner cavity of the radiator housing (3); and the liquid cooling circulation pump (4) is fixedly connected to the radiator housing (3).

2. The liquid-cooled microchannel heat sink for a radio remote unit according to claim 1, characterized in that: The liquid cooling circulation pump (4) is arranged at a corner outside the radiator housing (3).

3. The liquid-cooled microchannel heat sink for a radio remote unit according to claim 1, characterized in that: A plurality of support plates are arranged below the bottom plate of the radiator housing (3), and the support plates form a cavity between the bottom plate of the radiator housing (3) and the radiator placement platform, thereby facilitating heat dissipation by the radiator.

4. The liquid-cooled microchannel heat sink for a radio remote unit according to claim 3, characterized in that: The support plates are arranged in parallel along the vertical direction.

5. A liquid-cooled microchannel heat sink for a radio remote unit according to claim 3 or 4, characterized in that: The height of the support plate is slightly greater than the thickness of the liquid-cooling circulating pump (4).

6. The liquid-cooled microchannel heat sink for a radio remote unit according to claim 1, characterized in that: A microchannel system is arranged inside the bottom plate of the radiator housing (3), the microchannel system comprising heat exchange fins and microchannels, the heat exchange fins are arranged below the high-power chip in the communication module (1), and the microchannels are filled with a cooling liquid medium.

7. The liquid-cooled microchannel heat sink for a radio remote unit according to claim 6, characterized in that: The coolant medium flows upward from the inlet of the microchannel under the action of the liquid cooling circulation pump (4), and after reaching the top, flows from top to bottom through a plurality of heat exchange fins, then passes under the duplexer (2), and flows along the vortex coil to the outlet.

8. The liquid-cooled microchannel heat sink for a radio remote unit according to claim 1, characterized in that: The communication modules (1) are provided with two groups, and the two groups of communication modules (1) are arranged in parallel.

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