Alumina ceramic circuit board

Abstract

The utility model discloses an aluminum oxide ceramic circuit board, which comprises a main board, an electronic component board is arranged above the main board, the aluminum oxide ceramic circuit board also comprises a dismounting mechanism, the dismounting mechanism comprises mounting plates which are arranged above the main board and are positioned on two sides of the electronic component board, spring blocks are connected in the mounting plates in a sliding manner, and the spring blocks are connected with the mounting plates in a sliding manner. Clamping holes are formed in the outer surface of the mounting plate, and limiting assemblies are arranged on the two sides of the outer wall of the electronic element plate; the heat dissipation mechanism is arranged in the mainboard, the heat dissipation mechanism is used for conducting heat for the circuit board, the heat dissipation mechanism comprises a heat dissipation groove formed in the mainboard, a heat conduction block is fixedly connected to the interior of the heat dissipation groove, a conduction rod is fixedly connected to the top end of the heat conduction block, and the heat conduction rod is fixedly connected to the top end of the heat conduction block. The bottom end of the heat conduction block is fixedly connected with a heat dissipation pad. The aluminum oxide ceramic circuit board provided by the utility model has the technical effects of being convenient to disassemble, assemble and clean and good in heat dissipation effect.

Description

Technical Field

[0001] The utility model relates to the technical field of alumina ceramic circuit boards, in particular to an alumina ceramic circuit board. Background Art

[0002] Alumina ceramic circuit board refers to a special process board in which copper foil is directly bonded to the surface (single or double sides) of an alumina ceramic substrate at high temperature. The resulting ultra-thin composite substrate has excellent electrical insulation properties, high thermal conductivity, excellent soft solderability and high adhesion strength. It can also be etched with various patterns like a PCB board and has a large current-carrying capacity.

[0003] The patent document with application number 201820644897.5 discloses a high-temperature resistant alumina ceramic circuit board, including an alumina ceramic circuit board, a transition layer, a heat-conducting layer and a heat-conducting pipe, wherein the transition layer is fixedly connected to the bottom of the alumina ceramic circuit board, the heat-conducting layer is fixedly connected to the bottom of the transition layer, a placement hole is provided on the front of the heat-conducting layer, a heat-conducting pipe is movably installed on the inner wall of the heat-conducting layer through the placement hole, a groove is provided on the top of the alumina ceramic circuit board, and a top heat dissipation mechanism is movably connected to the inner wall of the alumina ceramic circuit board through the groove. The utility model provides a folding airbag, and dichloromethane is stored inside the folding airbag. The dichloromethane changes shape when heated, thereby changing the volume of the folding airbag, so that the folding airbag presses against the baffle to push the heat-absorbing block to slide in the groove, thereby increasing the contact area between the heat-absorbing block and the outside world, thereby increasing the heat dissipation speed of the heat-absorbing block, thereby achieving the effect of improving the high temperature resistance of the circuit board.

[0004] Disadvantages: For example, the knob in this solution uses screws to connect the circuit board. After long-term use, the screws are easily damaged, making it difficult to disassemble the circuit board, which brings great inconvenience to the user. Utility Model Content

[0005] The utility model discloses an alumina ceramic circuit board, aiming to solve the technical problem that after long-term use, screws are easily damaged, thereby making the circuit board difficult to disassemble and causing great inconvenience to users.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] An alumina ceramic circuit board comprises a main board, an electronic component board is arranged above the main board, and also comprises a disassembly and assembly mechanism: the disassembly and assembly mechanism comprises a mounting plate arranged above the main board and located on both sides of the electronic component board, a spring block is slidably connected inside the mounting plate, a clamping hole is opened on the outer surface of the mounting plate, and limiting components are arranged on both sides of the outer wall of the electronic component board; a heat dissipation mechanism: the heat dissipation mechanism comprises a heat dissipation mechanism arranged inside the main board, and the heat dissipation mechanism is used to conduct heat for the circuit board.

[0008] By setting up the disassembly and assembly mechanism and sliding the spring block downward, the spring block can be made to squeeze the limit assembly installed inside the card hole, which can facilitate the staff to disassemble and clean the electronic component board.

[0009] In a preferred embodiment, the heat dissipation mechanism includes a heat dissipation groove opened inside the mainboard, a heat conductive block is fixedly connected to the inside of the heat dissipation groove, a conduction rod is fixedly connected to the top of the heat conductive block, and a heat dissipation pad is fixedly connected to the bottom of the heat conductive block.

[0010] By setting up a heat dissipation mechanism, when the temperature of the electronic component board is too high, the heat dissipation can be promptly dissipated through the heat dissipation groove, the heat dissipation pad and the conductive rod, thereby preventing the electronic component board from being overheated and affecting the normal use of the electronic component board.

[0011] In a preferred embodiment, the limiting assembly includes spring clips arranged on both sides of the outer wall of the electronic component board, the size of the spring clips is adapted to the size of the clip holes, and the two sides of the outer wall of the electronic component board are evenly arranged on the outer surface of the electronic component board with the central axis of the electronic component board.

[0012] By setting the limit assembly, it is convenient for the staff to quickly disassemble and assemble the electronic component board

[0013] In a preferred solution, the spring block is horizontally and vertically arranged above the card hole, the conductive rod passes through the interior of the main board, and one end of the conductive rod extends to the outside through the main board.

[0014] By setting spring blocks and card holes, the temperature inside the mainboard can be conducted away.

[0015] As can be seen from the above, it includes a mainboard, an electronic component board is arranged above the mainboard, and also includes a disassembly mechanism: the disassembly mechanism includes a mounting plate arranged above the mainboard and located on both sides of the electronic component board, a spring block is slidably connected inside the mounting plate, a clamping hole is opened on the outer surface of the mounting plate, and both sides of the outer wall of the electronic component board are provided with a limit assembly; a heat dissipation mechanism: the heat dissipation mechanism includes a heat dissipation mechanism arranged inside the mainboard, and the heat dissipation mechanism is used to conduct heat for the circuit board. The alumina ceramic circuit board provided by the utility model has the technical effect of improving convenient disassembly, assembly and cleaning and good heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The utility model is a three-dimensional schematic diagram of an alumina ceramic circuit board.

[0017] Figure 2 The utility model is a schematic diagram of the internal heat dissipation structure of an alumina ceramic circuit board.

[0018] Figure 3 The utility model is a three-dimensional schematic diagram of an electronic component board of an alumina ceramic circuit board.

[0019] Figure 4 The utility model is a three-dimensional schematic diagram of a mounting plate of an alumina ceramic circuit board.

[0020] In the attached figure: 1. Main board; 2. Electronic component board; 3. Mounting board; 4. Heat sink; 5. Heat conduction block; 6. Heat dissipation pad; 7. Conductive rod; 8. Spring buckle; 9. Spring block; 10. Card hole. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0023] The alumina ceramic circuit board disclosed by the utility model is mainly used in scenarios where screws are easily damaged after long-term use, thereby making it difficult to disassemble the circuit board, which brings great inconvenience to users.

[0024] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 An alumina ceramic circuit board includes a main board 1, an electronic component board 2 is arranged above the main board 1, and also includes a disassembly and assembly mechanism: the disassembly and assembly mechanism includes a mounting plate 3 arranged above the main board 1 and located on both sides of the electronic component board 2, a spring block 9 is slidably connected inside the mounting plate 3, a card hole 10 is opened on the outer surface of the mounting plate 3, and limit components are arranged on both sides of the outer wall of the electronic component board 2; a heat dissipation mechanism: the heat dissipation mechanism includes a heat dissipation mechanism arranged inside the main board 1, and the heat dissipation mechanism is used to conduct heat for the circuit board.

[0025] By providing a disassembly mechanism and sliding the spring block 9 downward, the spring block 9 can be made to squeeze the limit assembly installed inside the clamping hole 10, so that the staff can disassemble and clean the electronic component board 2 conveniently.

[0026] Reference Figure 2 The heat dissipation mechanism includes a heat dissipation slot 4 opened inside the mainboard 1, a heat conduction block 5 is fixedly connected inside the heat dissipation slot 4, a conduction rod 7 is fixedly connected to the top of the heat conduction block 5, and a heat dissipation pad 6 is fixedly connected to the bottom of the heat conduction block 5.

[0027] By providing a heat dissipation mechanism, when the temperature of the electronic component board 2 is too high, the heat dissipation can be promptly performed through the heat dissipation slot 4, the heat dissipation pad 6 and the conductive rod 7, thereby preventing the temperature of the electronic component board 2 from being too high and affecting the normal use of the electronic component board 2.

[0028] Reference Figure 2 The limiting assembly includes spring buckles 8 arranged on both sides of the outer wall of the electronic component board 2. The size of the spring buckles 8 is compatible with the size of the card hole 10. The two sides of the outer wall of the electronic component board 2 are evenly arranged on the outer surface of the electronic component board 2 with the central axis of the electronic component board 2.

[0029] By setting the limit assembly, it is convenient for the staff to quickly disassemble and assemble the electronic component board 2.

[0030] Reference Figure 4 The spring block 9 is horizontally and vertically arranged above the card hole 10, the conductive rod 7 runs through the inside of the main board 1, and one end of the conductive rod 7 extends to the outside through the main board 1. By setting the spring block 9 and the card hole 10, the temperature inside the main board 1 can be conducted.

[0031] Working principle: When in use, by sliding the spring block 9 downward, the spring block 9 can squeeze the spring buckle 8 installed inside the card hole 10, thereby releasing the limiting connection formed by the mounting plate 3 and the electronic component board 2, which can facilitate the staff to disassemble and clean the electronic component board 2.

[0032] The above are only preferred specific implementations of the utility model, but the protection scope of the utility model is not limited to them. The replacement can be a replacement of part of the structure, device, method steps, or a complete technical solution. Equivalent replacement or changes based on the technical solution of the utility model and its utility model concept should be included in the protection scope of the utility model.

Claims

1. An alumina ceramic circuit board, comprising a main board (1), an electronic component board (2) being arranged above the main board (1); characterized in that: Also includes: Disassembly and assembly mechanism: the disassembly and assembly mechanism comprises a mounting plate (3) arranged above the main board (1) and located on both sides of the electronic component board (2); a spring block (9) is slidably connected inside the mounting plate (3); a clamping hole (10) is provided on the outer surface of the mounting plate (3); and limit assemblies are provided on both sides of the outer wall of the electronic component board (2); Heat dissipation mechanism: the heat dissipation mechanism is arranged inside the mainboard (1), and is used to conduct heat for the circuit board.

2. The alumina ceramic circuit board according to claim 1, characterized in that: The heat dissipation mechanism comprises a heat dissipation groove (4) provided inside the mainboard (1), a heat conduction block (5) being fixedly connected inside the heat dissipation groove (4), a conduction rod (7) being fixedly connected at the top end of the heat conduction block (5), and a heat dissipation pad (6) being fixedly connected at the bottom end of the heat conduction block (5).

3. The alumina ceramic circuit board according to claim 1, characterized in that: The limiting assembly comprises spring buckles (8) arranged on both sides of the outer wall of the electronic component board (2).

4. The alumina ceramic circuit board according to claim 3, characterized in that: The size of the spring buckle (8) is matched with the size of the clamping hole (10).

5. The alumina ceramic circuit board according to claim 3, characterized in that: Both sides of the outer wall of the electronic component board (2) are evenly arranged on the outer surface of the electronic component board (2) with the central axis of the electronic component board (2).

6. The alumina ceramic circuit board according to claim 1, characterized in that: The spring block (9) is arranged horizontally and vertically above the clamping hole (10).

7. The alumina ceramic circuit board according to claim 2, characterized in that: The conductive rod (7) passes through the interior of the main board (1), and one end of the conductive rod (7) extends to the outside through the main board (1).

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