High-thermal-conductivity ceramic substrate

Abstract

The utility model discloses a high thermal conductivity ceramic substrate, which comprises a ceramic plate, the upper surface of the ceramic plate is fixedly connected with an aluminum oxide layer, the upper surface of the aluminum oxide layer is fixedly connected with a copper foil layer, the bottom end of the ceramic plate is fixedly connected with a U-shaped plate, and the lower surface of the ceramic plate is provided with a plurality of grooves at equal intervals. A plurality of through holes are formed in the top of each groove, and heat conduction rods penetrating through the through holes are fixed to the lower surface of the aluminum oxide layer. According to the utility model, the ceramic plate, the aluminum oxide layer, the copper foil layer, the U-shaped plate, the heat conducting rod and the air pipe are arranged, the bottom of the ceramic plate is provided with a plurality of ventilated grooves, heat of the copper foil layer and the aluminum oxide layer can be guided into the grooves through the heat conducting rod, and air is blown out by matching with the air pipe, so that air flow in the grooves can be accelerated; therefore, better physical heat conduction and heat dissipation effects are achieved, and the ceramic substrate is simpler in structure and low in production and manufacturing difficulty. The U-shaped plate is clamped at the bottom of the ceramic plate, so that the strength of the ceramic plate can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of ceramic substrates, in particular to a high thermal conductivity ceramic substrate. Background Art

[0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface (single or double sides) of alumina or aluminum nitride ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft solderability and high adhesion strength. It can be etched with various patterns like PCB boards and has a large current carrying capacity. Therefore, ceramic substrate has become the basic material for high-power power electronic circuit structure technology and interconnection technology.

[0003] The patent with publication number CN219780508U discloses a high thermal conductivity ceramic substrate, which makes the thermal conductivity of the ceramic substrate body more efficient by setting a plurality of longitudinal aluminum bars and transverse aluminum bars. Secondly, by setting heat dissipation grooves, the heat conducted by the first aluminum plate and the second aluminum plate can be quickly dissipated, further making the ceramic substrate body efficiently cooled and improving the heat dissipation effect of the device.

[0004] However, the various aluminum strips, aluminum plates and heat sinks of the ceramic substrate are all located inside the ceramic substrate body, which makes the early production and processing of the ceramic substrate difficult, thereby increasing the production cost in disguise. Secondly, since the ceramic layer of the ceramic substrate is relatively brittle, the ceramic substrate does not have a structure to protect the ceramic layer, so further improvement is needed. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and proposes a high thermal conductivity ceramic substrate.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a high thermal conductivity ceramic substrate, including a ceramic plate, an aluminum oxide layer is fixedly connected to the upper surface of the ceramic plate, a copper foil layer is fixedly connected to the upper surface of the aluminum oxide layer, a U-shaped plate is fixedly connected to the bottom end of the ceramic plate, a plurality of grooves are equidistantly provided on the lower surface of the ceramic plate, a plurality of through holes are provided on the top of each of the grooves, a heat-conducting rod passing through the through holes is fixedly provided on the lower surface of the aluminum oxide layer, and an air duct is fixedly connected to one side of the U-shaped plate and located in the extension direction of the groove.

[0007] Furthermore, a plurality of connection holes are provided on both sides of the U-shaped plate and both sides of the ceramic plate, and bolts are provided inside the connection holes on the U-shaped plate and the connection holes on the ceramic plate.

[0008] Furthermore, a plurality of ridges are fixed to the inner bottom wall of the U-shaped plate, and the plurality of ridges are respectively snap-fitted into a plurality of grooves.

[0009] Furthermore, the bottom end of the heat-conducting rod extends through the through hole to the inside of the groove, and the heat-conducting rod is made of copper.

[0010] Furthermore, one end of the air duct is connected to a micro air pump, and a plurality of air holes are provided at equal distances on one side of the air duct close to the groove.

[0011] Beneficial effects of the utility model:

[0012] When the utility model is in use, the high thermal conductivity ceramic substrate is provided with a ceramic plate, an aluminum oxide layer, a copper foil layer, a U-shaped plate, a heat conducting rod and an air duct. A plurality of ventilation grooves are provided at the bottom of the ceramic plate. The heat conducting rod can guide the heat of the copper foil layer and the aluminum oxide layer into the grooves. The air duct blows out air, which can accelerate the air flow in the grooves, thereby achieving better physical heat conduction and heat dissipation. The ceramic substrate has a simpler structure and is easy to manufacture. The strength of the ceramic plate can be increased by clamping the U-shaped plate at the bottom of the ceramic plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the description of the specific implementation methods will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 : The overall stereogram of the utility model;

[0015] Figure 2 : An overall cross-sectional view of the utility model;

[0016] Figure 3 : A three-dimensional diagram of the air duct of the present utility model.

[0017] The reference numerals are as follows:

[0018] 1. Ceramic plate; 2. Alumina layer; 3. Copper foil layer; 4. U-shaped plate; 5. Groove; 6. Perforation; 7. Heat-conducting rod; 8. Ridge; 9. Connection hole; 10. Air duct; 11. Air hole. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] like Figure 1-Figure 3 As shown, it relates to a high thermal conductivity ceramic substrate, including a ceramic plate 1, an aluminum oxide layer 2 is fixedly connected to the upper surface of the ceramic plate 1, a copper foil layer 3 is fixedly connected to the upper surface of the aluminum oxide layer 2, a U-shaped plate 4 is fixedly connected to the bottom end of the ceramic plate 1, a plurality of grooves 5 are equidistantly provided on the lower surface of the ceramic plate 1, a plurality of through holes 6 are provided on the top of each groove 5, a heat conducting rod 7 passing through the through hole 6 is fixed to the lower surface of the aluminum oxide layer 2, and an air duct 10 is fixedly connected to one side of the U-shaped plate 4 and located in the extension direction of the groove 5.

[0021] like Figure 1 As shown, a plurality of connection holes 9 are provided on both sides of the U-shaped plate 4 and both sides of the ceramic plate 1 , and the connection holes 9 on the U-shaped plate 4 and the connection holes 9 on the ceramic plate 1 are connected together with bolts.

[0022] The ceramic plate 1 is located inside the U-shaped plate 4, and the side walls on both sides of the ceramic plate 1 are in contact with the inner wall of the U-shaped plate 4. By screwing bolts into the connecting holes 9, the U-shaped plate 4 and the ceramic plate 1 can be fixedly connected, and the U-shaped plate 4 plays a role in protecting the ceramic plate 1.

[0023] like Figure 1 and Figure 2 As shown, a plurality of ridges 8 are fixed to the inner bottom wall of the U-shaped plate 4 , and the plurality of ridges 8 are respectively engaged in the interior of a plurality of grooves 5 .

[0024] After the convex ridge 8 is inserted into the groove 5 , it can play a supporting role in the groove 5 , and further play a protective role for the ceramic plate 1 .

[0025] like Figure 1 and Figure 2 As shown, the bottom end of the heat-conducting rod 7 passes through the through hole 6 and extends into the inside of the groove 5. The heat-conducting rod 7 is made of copper.

[0026] The heat-conducting rod 7 made of copper has higher thermal conductivity. The heat of the aluminum oxide layer 2 and the copper foil layer 3 can be guided to the inside of the groove 5 through the heat-conducting rod 7. The groove 5 is equivalent to a heat dissipation channel, which can disperse the heat introduced into the groove 5.

[0027] like Figure 1 and Figure 3 As shown, one end of the air duct 10 is connected to the micro air pump, and a plurality of air holes 11 are formed at equal distances on one side of the air duct 10 close to the groove 5 .

[0028] Air is pumped into the air duct 10 and then discharged from the air holes 11. The discharged air passes through the groove 5, increasing the air flow speed in the groove 5, and then taking away the heat introduced into the groove 5, thereby achieving physical heat dissipation and improving the heat dissipation effect.

[0029] Working principle: When assembling the ceramic substrate, the aluminum oxide layer 2 is fixed on the surface of the ceramic plate 1. When fixing, the heat-conducting rod 7 at the bottom of the aluminum oxide layer 2 needs to pass through the perforation 6 on the ceramic plate 1, and then the copper foil layer 3 is fixed on the surface of the aluminum oxide layer 2. Finally, the ceramic plate 1 is placed in the U-shaped plate 4 and fixed by bolts. During the use of the ceramic substrate, the air duct 10 can be connected to a micro air pump to blow air into the groove 5 to accelerate the air flow in the groove 5, and the heat is dissipated through the groove 5 after the heat is conducted by the heat-conducting rod 7, thereby improving the heat conduction and heat dissipation effects.

[0030] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A high thermal conductivity ceramic substrate, comprising a ceramic plate (1), characterized in that: The upper surface of the ceramic plate (1) is fixedly connected to an aluminum oxide layer (2), the upper surface of the aluminum oxide layer (2) is fixedly connected to a copper foil layer (3), the bottom end of the ceramic plate (1) is fixedly connected to a U-shaped plate (4), the lower surface of the ceramic plate (1) is provided with a plurality of grooves (5) at equal distances, the top of each of the grooves (5) is provided with a plurality of through holes (6), the lower surface of the aluminum oxide layer (2) is fixedly connected to a heat conducting rod (7) passing through the through hole (6), and a wind duct (10) is fixedly connected to one side of the U-shaped plate (4) and located in the extension direction of the groove (5).

2. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: A plurality of connection holes (9) are provided on both sides of the U-shaped plate (4) and on both sides of the ceramic plate (1), and the connection holes (9) on the U-shaped plate (4) and the connection holes (9) on the ceramic plate (1) are internally connected with bolts.

3. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: A plurality of ridges (8) are fixed to the inner bottom wall of the U-shaped plate (4), and the plurality of ridges (8) are respectively clamped in the interior of a plurality of grooves (5).

4. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: The bottom end of the heat-conducting rod (7) passes through the through hole (6) and extends into the interior of the groove (5); the heat-conducting rod (7) is made of copper.

5. The high thermal conductivity ceramic substrate according to claim 1, characterized in that: One end of the air duct (10) is connected to a micro air pump, and a plurality of air holes (11) are provided at equal distances on a side of the air duct (10) close to the groove (5).

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